1376536 九、發明說明： 【發明所屬之技術領域】 本發明疋有關於一種液晶面板的製造方法，且特別是 關於一種將母板切割成面板單元之方法。 【先前技術】 液晶顯示器具有高畫質、體積小、重量輕、低電壓驅 φ 動、低消耗功率及應用範圍廣等優點，因此已廣泛地應用 於可攜式電視、行動電話、攝錄放影機、筆記型電腦、桌 上型顯不器、以及投影電視等消費性電子或電腦產品中， 成為顯示器的主流。 液晶面板為液晶顯示器的關鍵零組件之一。傳統上， 製造者大多是纽玻璃切割成—塊塊的面板單元，接著 才進行後續粒液晶等製程。然而，隨著現今消費市場的 要求越來越高’這種傳統製程也被迫面臨一系列嚴峻的挑1376536 IX. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing a liquid crystal panel, and more particularly to a method of cutting a mother board into a panel unit. [Prior Art] Liquid crystal displays have high image quality, small size, light weight, low voltage drive, low power consumption and wide application range, so they have been widely used in portable TVs, mobile phones, and video recorders. It is the mainstream of displays in consumer electronics or computer products such as video players, notebook computers, desktop displays, and projection TVs. The liquid crystal panel is one of the key components of the liquid crystal display. Traditionally, most of the makers have been panel-cut units that have been cut into blocks, and then the subsequent process of liquid crystal is performed. However, as the demands of today's consumer market are getting higher, this traditional process is also forced to face a series of severe challenges.
戰。 舉例來說’由於現今t小尺寸的液晶面板大多為客製 化規格’因此生產線上往往需要同時生產許多不同尺寸的 液晶面板。若按傳統製程先將玻璃板切割成-塊塊的不同 ^寸的面板單元’那麼在灌注液晶等製程中，製造商勢必 :針對每-種尺寸的液晶面板提供其專用的治具。顯而易 法勢必會大幅增加製料本，無法滿足消費 市場的需求。 5war. For example, since most of today's t-sized liquid crystal panels are custom-made specifications, it is often necessary to simultaneously produce a plurality of liquid crystal panels of different sizes on a production line. If the glass plate is first cut into a different block of the panel unit according to the conventional process, then in the process of pouring the liquid crystal, the manufacturer is bound to: provide a special jig for each size of the liquid crystal panel. Obviously, the law will definitely increase the cost of the material and will not meet the needs of the consumer market. 5
VV
/ KJUJKJ 【發明内容】 2 ’本發明之—技術態樣就是在提供—種液晶面板 ^方法’用以解決上述傳統製程所面臨的問題。 根據本發明一實施例，一種 含下列步驟：㈣日a面板的製造方法’包 ⑴提供至少-特，此母板包含彼此相對之 板與一第二基板。 土/ KJUJKJ [Summary of the Invention] 2 The technical aspect of the present invention is to provide a liquid crystal panel method for solving the problems faced by the above conventional processes. According to an embodiment of the present invention, a method comprising the following steps: (4) a method of manufacturing a panel of a panel (1) provides at least a feature, the motherboard comprising a board opposite to each other and a second substrate. earth
㈠於第基板上形成複數個第一切割線與複數個第 二切割線’其中第一切割線與第二切割線相互垂直。 (3)沿著第一切割線與第二切割線裂開第一基板。 ()於第一基板上形成複數個第三切割線與複數個第 四切割線’其中第三切割線分別與第—切割線平行，而第 四切割線則分別與第二切割線平行。(1) forming a plurality of first cutting lines and a plurality of second cutting lines on the first substrate, wherein the first cutting line and the second cutting line are perpendicular to each other. (3) Cracking the first substrate along the first cutting line and the second cutting line. () forming a plurality of third cutting lines and a plurality of fourth cutting lines on the first substrate, wherein the third cutting lines are respectively parallel to the first cutting line, and the fourth cutting lines are respectively parallel to the second cutting lines.
⑺沿著第三㈣線裂開第二基板，使得母板分割成複 數個條狀板’其中每—條狀板包括複數個面板單元，以及 至少-空白區塊’其中每一面板單元均具有一液晶注入口。 ⑹經由液晶注入口灌注液晶至第一基板與第二基板 (7)沿著第四切割線裂開第二基板，使得面板單元與空 白區塊自條狀板十分割出來β 根據本發明另一實施例，一種液晶面板的製造方法， 包含下列步騾： ⑷將液晶滴注至—第—基板與—第三基板之間。 (b)將第一基板與第二基板組合成一母板。 6 -v (c)於第一基板上形 二切割線，成複數個第一切割線與複數個第 …中第-切割線與第二切割線相互垂直。 )沿著第-切割線與第二切割線裂開第一基板。 四切却⑯U板上形錢數個第三㈣線與複數個第 四切2 ’其中第三切割線分別與第—切割線平行，而第 切割線則分別與第二切割線平行。 數個著第—切割線裂開第二基板’使得母板分割成複 、板’其中每-條狀板包括複數個面板單元，以及 至少一空白區塊。 (g)沿著第四切割線裂開第二基板，使得面板單元與空 白區塊自條狀板中分割出來。 總結而t ’本發明丨述實施例係將母板先分割成複數 個條狀板’然後再對條狀板進行後段製程（back_end〇f_iine; BEOL)。因此製造者僅需對條狀板提供適配的治具，而無 須針對個別面板單元設計其專用的治具。(7) splitting the second substrate along the third (four) line such that the mother board is divided into a plurality of strip-shaped sheets each of which includes a plurality of panel units, and at least - a blank block, wherein each of the panel units has A liquid crystal injection port. (6) perfusing liquid crystal through the liquid crystal injection port to the first substrate and the second substrate (7) to split the second substrate along the fourth cutting line, so that the panel unit and the blank block are separated from the strip plate β. According to another aspect of the present invention Embodiments of a method for manufacturing a liquid crystal panel include the following steps: (4) dropping a liquid crystal between a first substrate and a third substrate. (b) combining the first substrate and the second substrate into a mother board. 6 - v (c) forming a second cutting line on the first substrate, the plurality of first cutting lines and the plurality of the first cutting lines and the second cutting line being perpendicular to each other. The first substrate is split along the first cutting line and the second cutting line. The four cuts have a number of third (four) lines and a plurality of fourth cuts 2', wherein the third cut line is parallel to the first cut line, and the first cut line is parallel to the second cut line, respectively. A plurality of first-cut lines split the second substrate 'to divide the mother board into a plurality of boards, wherein each of the strips includes a plurality of panel units, and at least one blank block. (g) splitting the second substrate along the fourth cutting line so that the panel unit and the blank block are separated from the strip. In summary, the embodiment of the present invention divides the motherboard into a plurality of strips and then performs a back-end process (back_end〇f_iine; BEOL) on the strips. Therefore, the manufacturer only needs to provide the fitting jig for the strip plate without designing a special jig for the individual panel unit.
此外本發明之上述實施例在條狀板的兩側仍保留空 白區塊，因此縱使在後段製程中，條狀板之邊緣無可避免 地遭受些微的碰撞，面板單元會因為空白區塊的存在，而 不致產生真正危及產品強度的損傷。 【實施方式】 第1A-7圖繪示依照本發明一實施例之液晶面板的製造 方法。應瞭解到，在本實施例中所提及的步驟，除特別敘 明其順序者外，均可依實際需要調整其前後順序，甚至可 7 1376536 :同時或部分同時執行。 * 請先參照第1A圖，製造者可先提供一母板丨〇〇,母板 100之形狀舉例為矩形片狀或是正方形片狀等等，母板100 之形狀並不用以限制本發明之範圍，此母板1〇〇可由一玻 璃板切割而得。舉例來說，一般35代廠所使用的玻璃板尺 寸為620 mmx750 mm(或610 mmx720 mm)。製造者可先在 玻璃板上完成前段製程，前段製程舉例為成膜製程，接著 • 將此玻璃板平均切成四塊母板100,其中每一母板100的尺 寸為 310 mm>075 mm(或 305 mmx360 mm)。第 1B 圖繪示 第1A圖之母板loo的側視圖。如圖所示，母板i 〇〇可包含 彼此相對之一第一基板110與一第二基板12〇。 參照第2圖，接著製造者可於第一基板u〇上形成複 數個第一切割線210與複數個第二切割線22〇，在本圖中係 以虛線表示複數個第一切割線21〇與複數個第二切割線 220 ’其中第一切割線210與第二切割線22〇相互垂直，以 .料板HK)(I分為複數個面板單元3⑽，以及圍繞所有面板 單元300之4白區塊侧，如圖所示，空白區塊侧係位 在母板⑽之週邊位置，然而空白區塊·並不揭限於必 須位在母板_之週邊位置，也可以僅位在母板1〇〇之一 邊、兩邊或三邊上。在此步驟中，製造者可利用切割輪、 刀或雷射光劃過第-基板110的表面，使得第一基板ιι〇 的表面產生裂痕（median crack)作為第一切割線2ι〇或第二 切割線220。 — 參照第3圖’然後製造者可沿著第—切割線細與第 切割線220裂開第一基板11〇 _ 畑"丨丨s，农這有。j對第 土 120相對第一切割線210及/或第二切割線220的位 施^壓力，此時㈣第-基板u。的表面已具有裂痕(亦 卜第-切割線21〇及/或第二切割線22〇)，因此第—基板 110將會沿著此裂痕裂開。 應瞭解到，在第2圖、第3圖以及後續相關圖式中， 虛線所表示的是基板表面上尚未裂開的裂痕。至於已經裂 開的部分則將以實線繪示之。 參照第4圖，接著製造者可於第二基板12〇上形成複 數個第一切割線230與複數個第四切割線24〇，其中第三切 線230分別與第3圖之第—切割線，平行，而第四切 割線240則分別與第3圖之第二切割線22〇平行。同樣地， 在此v驟中，製造者可利用切割輪、刀或雷射光劃過第二 基板120的表面，使得第二基板12〇的表面產生裂痕作為 第二切割線230/第四切割線240。 凊繼續參照第4圖，當第一基板11〇為薄膜電晶體基 板，且第二基板12〇為彩色濾光片基板時，製造者可在此 時另外於第二基板120上形成複數個第五切割線25〇。這些 第五切割線250對每一面板單元3〇〇中之第一基板11〇劃 为出—外引腳接合區（outer lead bonding ; OLB)310與一顯 不區320。 參照第5圖’然後製造者可沿著第三切割線23〇裂開 第二基板120，使得母板1〇〇分割成複數個條狀板1〇5，其 中每一條狀板1〇5均包括複數個面板單元300,以及位於條 1376536 狀板Η>5^侧之空白區塊4〇〇,然而，空白區塊爛可僅位 _、 於條狀板105之至少-側。同樣地，在此步驟中，製造者 • 可對第一基板110相對第三切割線230的位置施加壓力， • 使得第二基板120沿著第三切割線230裂開。惟應瞭解到， 製造者於此時僅沿著第三切割線23〇做裂開的動作，至於 第四切割線240與第五切割線25〇於此時均尚未裂開。 參照第6 ，接著製造者可對條狀板1〇5進行後段製 φ 程。一般而言，在此時所進行的後段製程包含但不限於： 灌庄液a日、間隙調整製程（re_gap pr〇cess)與封口製程。具體 而言，製造者於此時可先經由液晶注入口將液晶灌注至第 一基板110與第二基板120之間。接著，製造者可對條狀 板105實施間隙調整製程，以調整第一基板11〇與第二基 板120之間的間隙。於間隙調整製程後，製造者可對條狀 板105實施封口製程，其舉例係利用紫外光密封膠 (ultraviolet sealant)密封面板單元3〇〇之液晶注入口。 • 由於本實施例係對條狀板1〇5進行後段製程，因此製 ia者僅需對條狀板105提供其適配的治具，而無須針對個 別面板單元300設計其專用的治具。舉例來說，在本實施 例中，由於每一條狀板1〇5的長度都是一樣的（31〇 mm或 305 mm) ’因此縱使個別面板單元3〇〇的尺寸不同，後段製 程所使用的治具也無須有所不同，只要適配條狀板1〇5即 *5J~ 〇 此外’本實施例在條狀板105的兩側仍保留空白區塊 * 400，因此縱使在後段製程中，條狀板105無可避免地遭受 1376536 些微的碰撞，面板單元300仍會受到空白區塊4〇〇的保護， '而不致產生真正危及產品強度的損傷。 接著’製造者可沿著第四切割《240裂開第二基板 120,使得面板單元300與空白區塊彻自條狀板1〇5中分 割出來（如第7圖所繪示）。同樣地，在此步驟中，製造者可 $第一基板110相對第四切割線240的位置施加壓力，使 得第二基板120沿著第四切割線24〇裂開。或者，製造者 籲巾可直接順著第四切割線240辩斷條狀板1〇5，以獲得一塊 塊的面板單元300。In addition, the above embodiment of the present invention still retains blank blocks on both sides of the strip plate, so that even in the latter stage process, the edge of the strip plate inevitably suffers a slight collision, and the panel unit may exist due to the blank block. Without causing damage that truly jeopardizes the strength of the product. [Embodiment] FIG. 1A-7 illustrates a method of manufacturing a liquid crystal panel according to an embodiment of the present invention. It should be understood that the steps mentioned in this embodiment can be adjusted according to actual needs, except that the order is specifically described, and even 7 1376536: simultaneous or partial simultaneous execution. * Referring to FIG. 1A first, the manufacturer may first provide a mother board. The shape of the mother board 100 is exemplified by a rectangular sheet or a square sheet. The shape of the motherboard 100 is not intended to limit the present invention. Range, this motherboard 1 can be cut from a glass plate. For example, the glass plates used in the 35th generation are typically 620 mm x 750 mm (or 610 mm x 720 mm). The manufacturer can first complete the front-end process on the glass plate. The front-end process is exemplified by the film-forming process, and then • the glass plate is cut into four mother boards 100 on average, each of which has a size of 310 mm > 075 mm ( Or 305 mm x 360 mm). Figure 1B shows a side view of the motherboard loo of Figure 1A. As shown, the motherboard i 〇〇 may include a first substrate 110 and a second substrate 12 彼此 opposite to each other. Referring to FIG. 2, the manufacturer can then form a plurality of first cutting lines 210 and a plurality of second cutting lines 22〇 on the first substrate u〇, and a plurality of first cutting lines 21 are indicated by broken lines in the figure. And a plurality of second cutting lines 220 ′ wherein the first cutting line 210 and the second cutting line 22 〇 are perpendicular to each other, to the panel HK) (I is divided into a plurality of panel units 3 ( 10 ), and 4 white around all panel units 300 On the block side, as shown in the figure, the blank block side is located at the peripheral position of the motherboard (10), but the blank block is not limited to be located at the peripheral position of the motherboard, or may be located only on the motherboard 1 One side, two sides or three sides of the crucible. In this step, the manufacturer can use the cutting wheel, the knife or the laser light to traverse the surface of the first substrate 110 to cause a median crack on the surface of the first substrate ιι. As the first cutting line 2 〇 or the second cutting line 220. - Referring to Figure 3, then the manufacturer can cleave the first substrate 11 along the first cutting line and the first cutting line 220 〇 _ 畑 " 丨丨 s , agriculture has this. j on the first soil 120 relative to the first cutting line 210 and / or the second cutting line The position of 220 is applied, and at this time, the surface of the (fourth) first substrate u has cracks (also the first-cut line 21〇 and/or the second cut line 22〇), so the first substrate 110 will follow this It should be understood that in the 2nd, 3rd and subsequent related drawings, the dotted line indicates the crack on the surface of the substrate that has not been cracked. The part that has been cracked will be drawn in solid lines. Referring to FIG. 4, the manufacturer can then form a plurality of first cutting lines 230 and a plurality of fourth cutting lines 24〇 on the second substrate 12, wherein the third tangent 230 and the third drawing are respectively cut. The lines are parallel, and the fourth cutting line 240 is parallel to the second cutting line 22A of Fig. 3. Similarly, in this step, the manufacturer can use the cutting wheel, the knife or the laser light to traverse the second substrate. The surface of the second substrate 12 is caused to be cracked as the second cutting line 230 / the fourth cutting line 240. 凊Continuing to refer to FIG. 4, when the first substrate 11 is a thin film transistor substrate, and the second substrate When 12 turns as a color filter substrate, the manufacturer may additionally add to the second substrate 120 at this time. Forming a plurality of fifth cutting lines 25〇. The fifth cutting lines 250 are scribed in the first substrate 11 of each of the panel units 3A as an outer lead bonding (OLB) 310 and a The display area 320. Referring to FIG. 5, the manufacturer can then split the second substrate 120 along the third cutting line 23 so that the mother board 1〇〇 is divided into a plurality of strips 1〇5, each of which is strip-shaped. The plates 1〇5 each include a plurality of panel units 300, and a blank block 4〇〇 located on the side of the strip 1376536, and the blank block may be at least _, at least the strip 105. side. Likewise, in this step, the manufacturer can apply pressure to the position of the first substrate 110 relative to the third cutting line 230, such that the second substrate 120 is split along the third cutting line 230. It should be understood that the manufacturer only performs the splitting action along the third cutting line 23 at this time, and the fourth cutting line 240 and the fifth cutting line 25 are not yet cracked at this time. Referring to the sixth, the manufacturer can then perform the back-end φ process on the strip 1〇5. In general, the back-end process performed at this time includes, but is not limited to, a potting liquid a day, a gap adjustment process (re_gap pr〇cess), and a sealing process. Specifically, the manufacturer may inject liquid crystal between the first substrate 110 and the second substrate 120 through the liquid crystal injection port at this time. Next, the manufacturer can perform a gap adjustment process on the strip plate 105 to adjust the gap between the first substrate 11'' and the second substrate 120. After the gap adjustment process, the manufacturer can perform a sealing process on the strip 105, which is exemplified by sealing the liquid crystal injection port of the panel unit 3 with an ultraviolet sealant. • Since the present embodiment performs the back-end manufacturing process for the strip-like sheets 1〇5, the makers only need to provide the strips 105 with their fitted jigs without having to design their own jigs for the individual panel units 300. For example, in the present embodiment, since the length of each strip 1〇5 is the same (31〇mm or 305mm) 'so that the dimensions of the individual panel units 3〇〇 are different, the latter stage process is used. The jig does not need to be different, as long as the strip plate 1〇5 is *5J~ 〇 In addition, this embodiment retains the blank block * 400 on both sides of the strip plate 105, so even in the latter stage process, The strip plate 105 inevitably suffers from a slight collision of 1376536, and the panel unit 300 is still protected by the blank block 4', without causing damage that truly jeopardizes the strength of the product. Next, the manufacturer can split the second substrate 120 along the fourth cut "240" so that the panel unit 300 and the blank block are completely separated from the strip 1b (as shown in Fig. 7). Similarly, in this step, the manufacturer can apply pressure to the position of the first substrate 110 relative to the fourth cutting line 240 such that the second substrate 120 is split along the fourth cutting line 24. Alternatively, the manufacturer can arbitrarily discriminate the strip 1 '5 along the fourth cutting line 240 to obtain a one-piece panel unit 300.
此外’製造者可將第二基板12〇覆蓋外引腳接合區31〇 的部分保留到此時（亦，在後段製程（例如：灌注液晶）完 成後）方去除之。如此一來，在後段製程進行時，第二基板 將會覆蓋外引聊接合區310，並保護外引腳接合區： 令的線路不$製程影響而產生刮傷或斷路等問題。具體而 言’製造者可在沿著第四切割線請裂開第二基板12〇的 同時’亦沿著第五切割線25G„第二基板i2G，並隨即去 除第二基板120覆蓋外引腳接合區31〇的部分。 一應瞭解到’雖然;本實施例係以薄膜電晶體基板作為》 一基板11G ’並以彩色遽光片基板作為第二基板120,但^ ^日月所屬技術領財具有通常知識者，應當能根據實㈣ 彈性調整第—基板110肖第二基板m时施方式。 舉例來說’在本發明另—實施例t，第—基板可為彩 ^光>i基板’而第二基板料為薄膜電晶體基板。此一 貫施例的實施步驟均與上—實施例相同，因此不再重 11 述之。惟在本實施财，第五㈣線將會形成於第一基板 (亦即’彩色瀘光片基板)上。此外’製造者在後段製程(例 如：灌注液晶)完成後’將會沿著第五切割線裂開第一基 板，並去除第一基板覆蓋外引腳接合區的部分。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明，任何此技藝者，在不脫離本發明之精神和範 圍内，當可作各種之更動與潤飾。舉例來說，雖然上述實 施例係採用f注液晶來製造液晶面板，但本發明所屬技術 領域中具有通常知識者，亦可採用液晶滴注法（one Drop Fill ; 〇DF)來實施本發明所揭露的技術内容。亦即，製 造者可先將液晶滴注至第一基板與第二基板之間，也就是 說，將液晶滴注至第一基板或第二基板上，然後再將第— 基板與第二基板組合成母板，並接著進行如以上實施例所 揭露的後續步驟。總結而言，本發明之保護範圍當視後附 之申請專利範圍所界定者為準。 【圖式簡單說明】 第1A-7圖繪示依照本發明一實施例之液晶面板的製造 流程示意圖® 【主要元件符號說明】 100 :母板 105 :條狀板 1376536 110 ： 第 -— 基板 120 ： 第 二 基板 210 ： 第 一 切割線 220 ： 第 二 切割線 230 ： 第 二 切割線 240 ： 第 四 切割線 250 ： 第 五 切割線 300 ： 面 板單元 310 ： 外引 腳接合區 320 ： 顯 示 區 400 ： 空 白 區塊Further, the manufacturer can remove the portion of the second substrate 12 that covers the outer lead land 31 〇 until this time (also, after the completion of the back-end process (for example, pouring liquid crystal)). In this way, when the back-end process is performed, the second substrate will cover the external chat joint area 310 and protect the outer pin joint area: the line is not affected by the process and causes scratches or open circuits. Specifically, the 'manufacturer can split the second substrate 12 沿着 along the fourth cutting line ′ while along the fifth cutting line 25G „the second substrate i2G, and then remove the second substrate 120 to cover the outer lead The portion of the junction region 31. It should be understood that 'although; this embodiment uses a thin film transistor substrate as a substrate 11G' and a color light-emitting sheet substrate as the second substrate 120, but ^^ For those who have the usual knowledge, it should be able to adjust the second substrate m of the first substrate 110 according to the actual (4) elasticity. For example, in the other embodiment, the first substrate can be a color light > The second substrate material is a thin film transistor substrate. The implementation steps of the conventional embodiment are the same as those of the above-described embodiment, and therefore will not be described again. However, in this implementation, the fifth (four) line will be formed in On the first substrate (ie, the 'color slab substrate'), the 'manufacturer' will break the first substrate along the fifth cutting line and remove the first substrate after the finishing process (eg, pouring liquid crystal) is completed. Covering the portion of the outer pin junction. Although the invention has been The embodiments are disclosed above, but are not intended to limit the invention, and various modifications and refinements can be made without departing from the spirit and scope of the invention. For example, although the above embodiments employ f Liquid crystal panels are used to manufacture liquid crystal panels, but those skilled in the art to which the present invention pertains can also implement the technical content disclosed by the present invention by using a liquid drop method (one drop fill; 〇DF). That is, the manufacturer can First, the liquid crystal is dripped between the first substrate and the second substrate, that is, the liquid crystal is dropped onto the first substrate or the second substrate, and then the first substrate and the second substrate are combined into a mother board, and The subsequent steps as disclosed in the above embodiments are summarized. In summary, the scope of the present invention is defined by the scope of the appended claims. [FIG. 1A-7] A schematic diagram of a manufacturing process of a liquid crystal panel according to an embodiment of the invention. [Description of main components] 100: Mother board 105: strip board 1376536 110: First - substrate 120: Second substrate 210: Cut line 220: second cut line 230: second cut line 240: fourth cutting line 250: fifth cutting line 300: side plate unit 310: an outer pin bonding region 320: the display region 400: blank blocks