KR101191485B1 - Cutter and device for cutting and peeling film - Google Patents

Abstract

An object of the present invention is to provide a film cutting peeling blade, a film cutting peeling device, and a display panel manufacturing method that reduce peeling at the corners of a film. Therefore, the film which has the bottom edge 13a which peels the film 23 adhere | attached on the board | substrate surface, and the side edge 13b and side edge 13c which cut | disconnect the film 23 at both ends of the bottom edge 13a. The film cutting peeling apparatus provided with the cut-out peeling tool 13, The film is cut | disconnected so that the outer surface of the side edge 13b and the side edge 13c may not contact the cut surface of the film 23, and the film 23 is cut | disconnected. It is set as the film cutting peeling apparatus to which the cutting | disconnection cutlery 13 was fixed.

Film, Missing, Side Blade, Base Blade, Board

Description

CUTTER AND DEVICE FOR CUTTING AND PEELING FILM}

The present invention is a film cutting peeling device for cutting and peeling a film, in which the film for a plurality of cell areas is adhered to a multi-faceted substrate, and the film and the substrate are divided into cells in a batch dividing method to cut and peel the film. And a display panel manufacturing method using the same.

As a representative example of the display panel, there is a liquid crystal display panel. As a manufacturing method of a liquid crystal display panel, there exists a method by the multiple odor which forms a some liquid crystal display cell with respect to a large board | substrate, and then divides into individual single liquid crystal display panels (in description of the manufacturing method of a liquid crystal display panel) Each display body before board | substrate division is called a liquid crystal display cell, and each display body after board | substrate division is called a liquid crystal display panel). In the manufacturing method of the liquid crystal display panel which has a medium size of about 5 inches, the bonded substrate containing a some liquid crystal display cell is formed initially. The bonded substrate includes two large glass substrates bonded together by a sealing material. This large bonded substrate is divided to form a rectangular bonded substrate.

Next, a liquid crystal is injected, sealed, or the like on a rectangular bonded substrate, and divided into a single liquid crystal display panel. Next, a film is adhere | attached on a main surface with respect to each single liquid crystal display panel. A film consists of a polarizing film, retardation film, a protective film, etc. In the adhesion of a film, the method of sticking a film one by one on the surface of such a single liquid crystal display panel was common.

By the way, in this method, since it is necessary to adhere | attach films one by one with respect to each liquid crystal display panel, there exists a problem that production efficiency is bad. Even if adhesion is carried out by using an exclusive film bonding apparatus, since the adhesion speed per film is limited by static electricity, there is a limit to speed-up. For this reason, high productivity cannot be ensured unless many film bonding apparatuses are introduced. As a result, there is a problem that facility investment for gluing the film is greatly expanded, which leads to an increase in the price of the liquid crystal display device, which is a final product.

In patent document 1, the manufacturing method of bonding a board | substrate by supplying a liquid crystal to the area | region inside the sealing material arrange | positioned annularly on one large board | substrate, or the area | region corresponding to the inside of a sealing material among other large board | substrates, and bonding board | substrates together. Is disclosed. A plurality of liquid crystal display cells are formed on this large bonded substrate. Next, a method of collectively bonding a large film to a bonded substrate and then dividing the film into individual liquid crystal display panels is disclosed.

FIG. 14 is a schematic plan view of a bonded substrate including a plurality of liquid crystal display cells, and a schematic cross-sectional view is shown in FIG. 15. In the bonded substrates shown in Figs. 14 and 15, 280 liquid crystal display cells are formed in 20 rows x 14 columns. The bonded substrate 22 is provided with two glass substrates bonded so as to face each other. The film 23 is bonded to the main surface of the bonding substrate 22. The bonded substrate 22 includes a plurality of liquid crystal display cells 25. The liquid crystal display cell 25 is formed so that a planar shape may become substantially rectangular, and each is arrange | positioned regularly. Each liquid crystal display cell 25 is arrange | positioned at intervals from each other. The film 23 is arrange | positioned so that all the liquid crystal display cells 25 formed in the bonding substrate 22 may be covered.

As shown in Fig. 16, in the step of dividing the bonded substrate on which a plurality of liquid crystal display cells are formed into individual liquid crystal display panels, a portion of the film 23 is removed in a band shape to expose the glass substrate in a band shape. The cutout portion 24 is a portion in which a part of the film 23 is cut off. The ablation part 24 is formed between the liquid crystal display cells formed in the bonding substrate 22. The film 23 becomes a shape corresponding to each liquid crystal display cell.

Next, a splitting crack is formed in the cutout 24 by a wheel cutter (not shown) for forming a glass scribe. Finally, along the crack formed, the bonding substrate 22 is divided to form individual liquid crystal display panels. An external drive device or the like is connected to each of the divided liquid crystal display panels, disposed on the object, and manufactured as a liquid crystal display device.

In the dividing apparatus which cut | disconnects the film around the liquid crystal display cell with respect to a bonded substrate, and forms a crack for dividing in a cutout part after that, and divides into individual liquid crystal display panels, the bonded substrate is fixed to a stage, A part of film is cut off by this, and a crack for parting is formed in a film cutting part by a wheel cutter. For example, in the bonded substrate shown in Fig. 16, the cutout portion 24 is formed, and the cutout portion 24 is formed with a crack for dividing.

In the ablation of the film of the bonded substrate in which the film is arranged on the surfaces of both sides of the substrate and the formation of cracks in the substrate, the bonded substrate is fixed to the stage, and a part of the film on one side is cut off by a wheel cutter. A crack for dividing is formed in a film cutting part. After that, the bonded substrate is inverted and fixed to the stage again, and a part of the film on the other side is similarly cut off, and a splitting crack is formed in the film cutting portion by a wheel cutter.

Patent Document 1: Japanese Unexamined Patent Application Publication No. 2004-4636

Fig. 17 is a schematic perspective view of the film cut and peeled by a conventional film cutting peeling apparatus. The film cutting peeling apparatus is provided with the film cutting peeling blade 103 which has the bottom blade which peels the film 23 bonded to the board | substrate surface, and the side blade which cuts the film 23 in the both ends of this bottom blade. have. After moving the film cutting peeling paste 103 in one direction (direction indicated by the arrow 52), cutting and peeling the film 23 between the liquid crystal display cells, the direction orthogonal to the direction [ In the direction indicated by the arrow 51], the film cut-off peeling blade 103 is moved to cut and peel the film between the liquid crystal display cells. At this time, peeling occurs in the corner portion 23b of the film 23 formed on the liquid crystal display cell. This is considered to be because the outer surface of the side edges is cut while contacting the cut surface of the film, and therefore a force for pushing the film 23 in the advancing direction of the blades acts on the cut surface of the film 23. 18 is a schematic plan view of a film cut and peeled by a conventional film cutting peeling apparatus. When the film 23 is cut and peeled by the conventional film cutting and peeling apparatus, the peeling of about 500 micrometers-about 1 mm arises in the corner part 23b of the film 23 formed on a liquid crystal display cell.

The detachment of the corner portion 23b is not only a matter of appearance, but also when the detached film remains on the substrate as debris and interferes with the running of the wheel cutter, or when the inverted substrate is inverted and fixed to the stage again, the stage The film which fell between and a bonding substrate is pinched | interposed, and a mark is made on the film formed on the liquid crystal display cell. This problem similarly arises not only in a liquid crystal display panel but also in manufacture of the organic electroluminescent display panel which has a film in a main surface.

An object of the present invention is to provide a film cutting peeling paste, a film cutting peeling device, and a manufacturing method of a display panel that reduce peeling of corner portions of a film formed on a display cell.

MEANS TO SOLVE THE PROBLEM In order to achieve the said objective, the film cutting peeling apparatus based on this invention is for film cutting peeling which has a bottom blade which peels the film bonded to the board | substrate surface, and a side blade which cuts the said film in both ends of the said bottom blade. It is a film cutting peeling apparatus provided with a cutlery, Comprising: The said blade is fixed so that the said film may be cut | disconnected, without the outer surface of the said side edge having a clearance angle with respect to the cut surface of the said film. By adopting this constitution, it is considered that the force for pushing the film in the advancing direction of the blade to the cut surface of the film does not act.

In the above invention, preferably, when viewed from a direction parallel to the stage for fixing the substrate and perpendicular to the advancing direction of the blade, in the state where the blade edge of the side edge and the substrate are at an angle of 30 ° to 60 ° The optical film cutting peeling paste is fixed with respect to a board | substrate so that the said optical film may be cut | disconnected. This is because the angle formed between the blade edge of the side edge and the substrate is better in cutting off while fixing the optical film to the substrate and preventing the force of peeling off the optical film from acting before cutting the optical film. If the angle formed by the blade tip of the blade and the substrate is too small, the cutting resistance to the optical film becomes large, which is not preferable.

In the above invention, preferably, when viewed from a direction parallel to the stage for fixing the substrate and perpendicular to the advancing direction of the blade, the inner surface of the bottom blade and the substrate have an angle of 60 ° or less. In this case, the cutlery for film cutting peeling is fixed with respect to the substrate so that the film is peeled off. This is better in securing a gap between the outer surface of the side blade and the cut surface of the film during cutting and peeling of the film. However, if the angle formed between the inner surface of the bottom blade and the substrate is too large, the film is peeled off and discharged. Since it becomes difficult and undesirable, it is a result which considered these.

In order to achieve the said objective, the film cutting peeling blade which based on this invention has a bottom blade which peels the film adhere | attached on the board | substrate surface, and the film cutting peeling which has a side blade which cuts the said film in both ends of the said bottom blade. It is a dragon blade, and the blade tip of the side blade and the inner surface of the bottom blade form an angle of 60 ° to 150 ° when viewed from the blade side. By adopting this shape, when viewed from the direction parallel to the stage for fixing the substrate and perpendicular to the advancing direction of the blade, the edge of the side edge and the substrate form an angle of 30 ° to 60 °, and the inner surface of the bottom blade. The film can be cut and peeled off with the substrate at an angle of 60 ° or less.

In the said invention, Preferably, the said side edge opens at the angle of 30 degrees-60 degrees with respect to the surface perpendicular | vertical to the blade edge | tip of the said bottom blade. In order to reduce the inclination of the cut surface of the film, the smaller the angle between the side perpendicular to the edge of the bottom edge and the side edge is better, but the angle between the side and the side edge perpendicular to the edge of the bottom edge is too small. When the film is cut and peeled off, it is difficult to secure a gap between the outer surface of the side edge and the cut surface of the film.

MEANS TO SOLVE THE PROBLEM In order to achieve the said objective, the manufacturing method of the display panel based on this invention is a film cutting peeling method which cuts and peels the film adhere | attached on the board | substrate surface, and does not apply external force to the cut surface of the said film, The process of cutting and peeling a part is included. By adopting this method, it is possible to reduce the slipping of the corner portion of the film formed on the liquid crystal display cell, and to reduce the substrate breakage caused by the fragments of the film remaining on the substrate. In addition, when inverting a bonded substrate and fixing it again to a stage, the film which fell between the stage and the bonded substrate is pinched | interposed, and the scarring defect which a mark generate | occur | produces on the film formed on the liquid crystal display cell can also be reduced.

According to this invention, the blade for film cut | disconnect peeling which reduces the peeling off of the corner part of the film formed on a liquid crystal display cell, a film cut | disconnect peeling apparatus, and the manufacturing method of a display panel can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows the mode which cuts and peels a polarizing plate from the bonding board | substrate mounted on the stage using the film cutting peeling blade provided in the movable part of the film cutting peeling apparatus in embodiment of this invention.

Fig. 2 is a schematic perspective view showing a state in which a film cutting peeling blade according to an embodiment of the present invention is cutting and peeling a film.

Fig. 3 is a schematic cross-sectional view showing a state in which the film is partially cut and peeled off using the film cutting and peeling blade fixed to the movable portion moving on the bonded substrate in the embodiment of the present invention.

4 is a schematic cross-sectional view taken along the line A-A of FIG. 3 of the film cutting peeling blade according to the embodiment of the present invention.

Fig. 5 is a schematic front view of the film cut-off peeling blade as seen from the direction parallel to the flat portion of the inner surface of the bottom blade in the embodiment of the present invention.

Fig. 6 is a schematic cross sectional view taken along the line B-B in Fig. 5 of the film cutting peeling blade according to the embodiment of the present invention.

Fig. 7 is a schematic perspective view showing a state in which a film cutting peeling cutlery cuts and peels a film in an embodiment of the present invention.

FIG. 8 is a schematic cross-sectional view showing a state in which the film is partially cut off using the film cutting peeling blade fixed to the movable portion moving on the bonded substrate in the embodiment of the present invention.

Fig. 9 is a schematic cross sectional view taken along the line A-A of Fig. 8 of the film cutting peeling paste according to the embodiment of the present invention.

Fig. 10 is a schematic front view of the film cut-off peeling blade as seen from the direction parallel to the flat portion of the inner surface of the bottom blade in the embodiment of the present invention.

Fig. 11 is a schematic cross sectional view taken along the line B-B in Fig. 10 of the optical film cutting peeling paste according to the embodiment of the present invention.

Fig. 12 is a schematic view of the side edge 13c of the film cutting peeling blade with an embodiment of the present invention as viewed from the direction perpendicular to the outer surface of the side edge 13c.

Fig. 13 is a schematic plan view of a film cut and peeled by the film cutting peeling apparatus in the embodiment of the present invention.

14 is a schematic plan view of a bonded substrate including a plurality of liquid crystal display cells.

15 is a schematic cross-sectional view of a bonded substrate including a plurality of liquid crystal display cells.

Fig. 16 is a schematic plan view of a bonded substrate in which a portion of the film is stripped to expose the glass substrate in a strip shape.

Fig. 17 is a schematic perspective view showing a state in which a film is cut off with a film cutting peeling device based on a conventional technique.

18 is a schematic plan view of a film cut and peeled by a film cutting peeling apparatus based on the prior art.

<Code description>

13, 103: cutlery for film cutting peeling

13a: Base blade

13b, 13c: side blade

13d: outer side

13e: medial side

15: movable part

22: bonded substrate

23: film

23a: film shavings

23b: film corner portion

24: film cutout

25: liquid crystal display cell

30: stage

50, 51, 52, 53, 54: cutting direction

α: blade angle

β: forward tilt angle

γ: opening angle

θ: peeling angle

ε: clearance angle

δ: blade tip tilt angle

V: normal vector

With reference to FIGS. 1-6 and 14-16, the blade for film cut | disconnection peeling in the embodiment based on this invention, a film cut | disconnect peeling apparatus, and the manufacturing method of a display panel are demonstrated.

The film cutting peeling apparatus in a present Example is an apparatus which removes the film between liquid crystal display cells in strip shape in the process of dividing a bonded substrate into individual liquid crystal display panels.

As shown in Figs. 14 and 15, two glass substrates are bonded to each other so that the bonded substrates 22 face each other. A plurality of liquid crystal display cells 25 are formed between two glass substrates. The liquid crystal display cell 25 is formed so that a planar shape may become substantially rectangular, and is arrange | positioned regularly. The film 23 is adhere | attached on the main surface of both sides of the bonding board | substrate 22. As shown in FIG. As shown in FIG. 16, the film cutting peeling apparatus in this Example is an apparatus for cutting the film 23 between liquid crystal display cells 25 in strip shape.

Fig. 1 shows a film (from the laminated substrate 22 loaded on the stage 30 using the film cutting peeling paste 13 provided on the movable portion 15 of the film cutting peeling apparatus in this embodiment). It is a schematic sectional drawing which shows the mode which cuts and peels 23). As the film 23, what consists of a polarizing film, retardation film, and a protective film can be used, for example. As a material of each film, a polarizing film can illustrate polyvinyl alcohol and triacetyl cellulose, a retardation film can polycarbonate, and a protective film can illustrate polyester. In addition, in the present Example, although multiple layers are used as mentioned above, it is not specifically limited to this. Therefore, in description, it is described as one thing, without distinguishing a layer. The movable part 15 is formed so that the blade cut-out 13 for film cutting may move on the bonding board | substrate 22. As shown in FIG. The film cutting peeling paste 13 is supported by the movable part 15 via the press means which is not shown so that a fixed pressing force may be applied with respect to the bonding substrate 22, when moving on the bonding substrate 22. As shown in FIG. As this pressurizing means, a spring etc. can be used, for example.

FIG. 2 is a perspective view showing a state in which the cut film 13 for film cutting peeling cuts off the film 23. The film cutting peeling blade 13 has a bottom blade 13a for peeling off the film 23 and a side blade 13b and a side blade 13c for cutting the film 23 at both ends of the bottom blade 13a. Equipped with. The side edge 13b and the side edge 13c are formed symmetrically about the bottom edge 13a (refer FIG. 5). The inner surface of the bottom blade 13a is formed so that a desired distance from the blade edge is flat, and then curved to extend upward. The film 23 is cut by the side edge 13b and the side edge 13c of the film cutting peeling blade 13 which moves on a bonding substrate, and is peeled off by the bottom edge 13a. The debris 23a of the peeled film moves along the inner surface of the bottom blade 13a and is then discharged to the outside of the apparatus by a vacuum discharging means (not shown).

FIG. 3 is a schematic cross-sectional view showing a state where a part of the film is cut off using a film cutting and peeling blade fixed to a movable portion moving on the bonded substrate, and FIG. 4 is a schematic view taken along line AA of FIG. Fig. 5 is a schematic front view of the film cut-off peeling blade as viewed from a direction parallel to a portion of the flat surface (hereinafter referred to as a flat portion) that extends from the bottom blade and is the inner side of the bottom blade. It is a schematic sectional drawing in the BB line of FIG. As for the bottom edge 13a, the side edge 13b, and the side edge 13c of the film cut-and-peel blade 13, an outer side surface is grind | polished and is formed at an acute angle.

Here, as shown in Fig. 6, the angle of the blade tip at which the outer side surface 13d and the inner side surface 13e of the side edge 13b or side edge 13c intersect is shown in the blade angle α and Fig. 3. As shown in FIG. 5, the angle between the edge of the side edge 13b or the side edge 13c and the bonding substrate 22 at the time of cutting and peeling of the film 23 is as shown in FIG. 5. The angle formed by the surface perpendicular to the blade tip of the blade 13a, the side blades 13b and the side blades 13c, and the angle of opening to the outside of the side blades 13b and the side blades 13c is an opening angle γ, As shown in Fig. 3, the angle formed between the flat portion of the inner surface of the bottom blade 13a and the bonding substrate 22 during the cutting and peeling of the film 23 is shown in the peeling angle θ, as shown in Fig. 4. As described above, the angle formed between the side surfaces 13b and the outer surfaces of the side edges 13c and the cut surface of the cut film 23 at the time of cutting and peeling of the film 23 is referred to as the clearance angle ε.

When the film 23 is cut, 500 μm to 1 mm formed in the corner portion 23b as a result of forming the side edge 13b and the outer surface of the side edge 13c and the cut surface of the cut film 23 so as not to contact each other. Deterioration of the degree was reduced. Therefore, as shown in Fig. 4, it can be said that the clearance angle ε is preferably 0 ° or more.

As shown in Fig. 3, the forward inclination angle β is such that the force of peeling the film 23 acts before the film 23 is cut even when the film 23 is fixed while being bonded to the bonding substrate 22. The smaller the better in preventing. However, if the front tilt angle β is too small, the cutting resistance to the film 23 becomes large, which is not preferable. As a result of repeated studies in consideration of these, it was found that the front tilt angle β is preferably 30 to 60 °.

As shown in FIG. 5, the opening angle (gamma) is so small that the inclination of the cut surface of the film 23 is small. However, if the opening angle γ is too small, it is difficult to secure the clearance angle ε, which is not preferable. As a result of repeated studies in consideration of these, it was found that the opening angle γ is preferably 30 to 60 °.

As shown in Fig. 3, the peeling angle θ is better in securing the clearance angle ε. However, when peeling angle (theta) is too big | large, it will be difficult to peel off and discharge the debris of the film 23, and it is unpreferable. As a result of repeated studies in consideration of these, it was found that the peeling angle θ is preferably 60 ° or less.

From the above, it can be said that the angle formed between the blade edge of the side blade and the inner surface of the bottom blade forms an angle of 60 ° to 150 ° when viewed from the side of the blade side (see FIG. 3).

As shown in Fig. 6, the smaller the cutting edge angle α, the better the cutting degree, and it is easy to secure the clearance angle ε. However, if it is too small, it will not be preferable because the blade pulls off.

7-13, the Example of the film cut-out peeling cutlery 13 is demonstrated. Fig. 7 is a perspective view showing a state in which a film cut peeling cutlery cuts and peels a film. Fig. 8 shows a state in which a film is partially cut and peeled using a film cut peeling cutlery fixed to a movable portion moving on a bonded substrate. Fig. 9 is a cross-sectional view taken along line AA of Fig. 8, Fig. 10 is a schematic front view of the film cutting peeling paste as viewed from a direction parallel to the flat portion of the inner surface of the bottom blade, and Fig. 11 It is schematic sectional drawing in the BB line | wire 10. 7 to 11, the substrate is fixed in a direction opposite to the advancing direction of the blades, in a direction parallel to the stage for fixing the substrate and extending vertically from the right to the left with respect to the advancing direction of the blades. A three-dimensional vector was defined with z as the direction extending vertically from the lower side to the upper stage.

In the present embodiment, as shown in Fig. 11, the blade angle? At which the outer side surface 13d and the inner side surface 13e of the side edge 13b or side edge 13c intersect is 17 ° and 8 degrees. As shown, the front inclination angle β between the edge of the side edge 13b or the side edge 13c and the bonding substrate 22 at the time of cutting and peeling of the film 23 is 45 ° and the angle of the film 23 At the time of cutting and peeling, the peeling angle θ formed between the flat part on the inner surface of the bottom blade 13a and the bonding substrate 22 is 35 ° and is perpendicular to the blade tip of the bottom blade 13a as shown in FIG. 10. The opening angle (gamma) which the surface, the side blade 13b, and the side blade 13c make becomes 40 degrees.

Next, the clearance angle ε formed between the outer surfaces of the side edges 13b and 13c and the cut surface of the cut film 23 during the cutting and peeling of the film 23 will be described. 12 is a schematic view of the side edge 13c as viewed from the direction perpendicular to the outer side of the side edge 13c (except for the portion corresponding to the outer side surface 13d of the blade edge). 12, only reference numeral 13c is described, and other portions are omitted. In addition, the dotted line shown in FIG. 12 shows the part which the inner surface of the side blade 13c and the inner surface of a bottom blade contact. Here, as shown in Fig. 12, a straight line intersecting perpendicularly to a portion (dotted line) where the inner surface of the side blade 13c and the inner surface of the bottom blade contact each other is an angle formed by the edge of the side edge 13c. The angle of tilting forward of the blade 13c is called the blade tilt angle δ. Then, the blade tilt angle δ is expressed by the following equation using the front tilt angle β, the opening angle γ, and the peeling angle θ based on the three-dimensional vector.

When each value is substituted into the above equation, the blade tilt angle δ is 7.7 °.

In addition, when this normal vector of the outer surface of the side edge 13c at the time of the cutting | disconnection and peeling of the film 23 is set to V, this normal vector V is a blade angle (alpha) based on the said three-dimensional vector, The front tilt angle β, the opening angle γ, the peeling angle θ, and the blade tip tilt angle δ are expressed by the following equation.

Substituting the respective values into the above equation, the x-axis component of the normal vector V is 0.707, the y-axis component is 0.132, and the z-axis component is -0.694. As shown in Fig. 9, since the x-axis component and the y-axis component of the normal vector V are positive values, the outer surface of the side edge 13c is rearward of the direction perpendicular to the advancing direction of the blade. I found myself heading. That is, it was found that a gap is secured between the outer surface of the side edge 13c and the cut surface of the film 23. Since the side edges 13c and the side edges 13b are formed symmetrically about the bottom edge 13a, a gap is similarly formed between the outer surface of the side edge 13b and the cut surface of the film 23. I knew it was secured. From this, in the case of the film cut-off peeling blade 13 in this embodiment, the outer surfaces of the side edges 13b and 13c do not contact the cut surface of the film 23 at the time of cutting and peeling the film 23. can do.

Moreover, the clearance angle (epsilon) is represented by the following formula from the X-axis direction component and the y-axis direction component of normal vector (V).

(법선 벡터(V)의 Y 방향 성분/법선 벡터(V)의 X방향 성분)

(Y-direction component of normal vector (V) / X-direction component of normal vector (V))

Substituting each value into the above formula calculates the clearance angle ε is 7.6 °.

In the Example which cut | disconnected and peeled off the film using the said film cut-off peeling tool and the film cut-off peeling apparatus, about 500 micrometers-about 1 mm fall off to the corner part 23b of the film formed on a liquid crystal display cell conventionally. This thing (refer FIG. 18) is reduced to about 0-500 micrometers (refer FIG. 13).

Although the blade paste for film cutting peeling in this Example is formed from high speed steel, it is not limited to this form, In the cutting peeling of a film, it does not matter as long as it is formed with the material with few chippings. For example, the blade member may be formed of alloy steel.

The film cut and peeling blade for cutting in this embodiment is formed so that the inner surface of the bottom blade has a desired distance and flatness from the bottom blade, and is then curved to extend to the upper edge of the blade, but is not limited to this form. The inner side surface of the shape may not be curved, but may be shaped to extend rearward, or may be shaped to be gradually curved from the blade edge without having a flat portion. In addition, about the peeling angle (theta) and the blade inclination-angle (delta) in the case of the blade with which a flat part does not have a flat part in the inner surface of a bottom blade, you may calculate it by substituting the tangent in the blade edge of an inner surface by a flat part.

As a board | substrate, it is not limited to the board | substrate for liquid crystal display panels, The film cutting peeling apparatus of a present Example can be used with respect to the arbitrary board | substrates which adhered the film. For example, even when manufacturing the organic electroluminescent display panel which has a film, the film cutting peeling apparatus of a present Example can be used.

As the film 23, it is not limited to the structure of a polarizing film, retardation film, and a protective film, The film cutting peeling apparatus of a present Example can be used with respect to the board | substrate which adhered arbitrary films. For example, the film cut-out peeling apparatus of a present Example can also be used also about the board | substrate which adhere | attached the film which does not have optical films, such as a polarizing film and retardation film. However, a display device using an optical film such as a polarizing film or a retardation film may be said to be a more suitable cutting and peeling object because the peeling of the corner portion 23b may affect the image quality.

In addition, the said embodiment disclosed this time is an illustration and restrictive at no points. It is intended that the scope of the invention be defined not by the foregoing description, but rather by the claims, and include all modifications within the meaning and equivalency of the claims.

The film cut-off peeling device of this invention, the film cutting peeling apparatus, and the manufacturing method of the display panel using these are the batch which adhere | attaches the film of multiple cell area to a multifaceted board | substrate, and divides a film and a board | substrate by a cell unit. It can use in a division | segmentation system.

Claims (11)

delete delete A blade having a bottom edge 13a for peeling the film 23 adhered to the substrate surface 22 and side edges 13b and 13c for cutting the film 23 at both ends of the bottom edge 13a. 13) is a film cutting peeling device, The outer side surfaces of the side edges 13b and 13c do not come into contact with the cut surface of the film 23 with a clearance angle ε, and the film is fixed with the blade 13 so that the film 23 is cut. Cutting peeling device. 4. The blade edges of the side edges 13b and 13c and the substrate 22 are parallel to the stage 30 for fixing the substrate 22 and are perpendicular to the advancing direction of the blade 13. The film cutting peeling apparatus in which the said blade (13) was fixed so that the said film (23) was cut | disconnected in the state (beta) of 30 degrees-60 degrees when it sees from the direction (x). 4. The direction according to claim 3, wherein the inner surface of the bottom blade 13a and the substrate 22 are parallel to the stage 30 that fixes the substrate 22 and are perpendicular to the advancing direction of the blade 13. When it sees from (x), in the state which formed the angle (theta) of 60 degrees or less, the said film cut-out peeling apparatus with which the said blade paste (13) was fixed so that the said film (23) could peel. 5. The direction according to claim 4, wherein the inner surface of the bottom blade 13a and the substrate 22 are parallel to the stage 30 that fixes the substrate 22 and perpendicular to the advancing direction of the blade 13. When it sees from (x), in the state which formed the angle (theta) of 60 degrees or less, the said film cut-out peeling apparatus with which the said blade paste (13) was fixed so that the said film (23) could peel. When the blade paste 13 in the film cutting peeling apparatus of Claim 3 sees the blade edge | tip of the said side blades 13b and 13c and the inner surface of the said bottom blade 13a from the blade side surface side, it is 60 degrees-150 The angle? Of 30 ° to 60 ° with respect to the surface of the film cutting peeling blade forming the angle of ° or the side edges 13b and 13c perpendicular to the blade edge of the bottom edge 13a. The film cutting peeling apparatus which consists of the blades for film cutting peeling which are made and opened to the outside. 60 degrees-150, when the blade 13 in the film cutting peeling apparatus of Claim 4 sees the blade edge | tip of the said side blades 13b and 13c and the inner surface of the said bottom blade 13a from the blade side surface side. The angle? Of 30 ° to 60 ° is set with respect to the surface of the film cutting peeling blade or the side edges 13b and 13c forming the angle of ° or perpendicular to the blade edge of the bottom edge 13a. The film cutting peeling apparatus which consists of the blades for film cutting peeling which are made and opened to the outside. 60 degrees-150, when the blade paste 13 in the film cutting peeling apparatus of Claim 5 sees the blade edge | tip of the said side blades 13b and 13c and the inner surface of the said bottom blade 13a from the blade side surface side. The angle? Of 30 ° to 60 ° with respect to the surface of the film cutting peeling blade forming the angle of ° or the side edges 13b and 13c perpendicular to the blade edge of the bottom edge 13a. The film cutting peeling apparatus which consists of the blades for film cutting peeling which are made and opened to the outside. In the film cut-off apparatus of Claim 6, when the blade edge | tip 13 of the said side edges 13b and 13c and the inner surface of the bottom edge 13a are seen from the blade side surface side, it is 60 degrees-150 The angle? Of 30 ° to 60 ° with respect to the surface of the film cutting peeling blade forming the angle of ° or the side edges 13b and 13c perpendicular to the blade edge of the bottom edge 13a. The film cutting peeling apparatus which consists of the blades for film cutting peeling which are made and opened to the outside. It is a manufacturing method of the display panel which cuts and peels the film 23 adhere | attached on the board | substrate surface using the film cutting peeling apparatus in any one of Claims 3-10, And removing a part of the film (23) without applying an external force to the cut surface of the film (23).

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