201009419 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種液晶面板的製造方法，且特別是 關於一種將母板切割成面板單元之方法。 【先前技術】 液晶顯示器具有高晝質、體積小、重量輕、低電壓驅201009419 IX. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing a liquid crystal panel, and more particularly to a method of cutting a mother board into a panel unit. [Prior Art] Liquid crystal display has high enamel quality, small size, light weight, low voltage drive
動、低消耗功率及應用範圍廣等優點，因此已廣泛地應用 於可攜式電視、行動電話、攝錄放影機、筆記型電腦、桌 上型顯示器、以及投影電視等消費性電子或電腦產品中， 成為顯不is的主流。 液晶面板為液晶顯示器的關鍵零組件之一。傳統上， 製造者大多是s將玻璃板切割成—塊塊的面板單元，接著 才進行後續灌注液晶等製程。然'而，隨著現今消費市場的 要求越來越高，這種傳統製程也被迫面臨—系列嚴峻的挑 舉例來說，由於現今中小尺寸的液晶面板大多為客製 化規格，因此生產線上往往需要同時生產許多不同尺寸的 液晶面板。若按傳統製程先將玻璃板切割成一塊塊的不同 ί寸的面板單元，那麼在灌注液晶等製程中，製造商勢必 侍針對每一種尺寸的液晶 > 捉供再寻用的治具。顯而易 見地，运種作法勢必會大 市場的需求。 l加製造成本，無法滿足消費 5 201009419 【發明内容】 口此，本發明之一技術態樣就是在提供一種液晶面板 的製造方法’用以解決上述傳統製程所面臨的問題。 根據本發明-實施例，一種液晶面板的製造方法，包 含下列步驟： (1) 提供至少一母板’此母板包含彼此相對之一第一基 板與一第二基板。 (2) 於第基板上形成複數個第一切割線與複數個第 二切割 '線，其巾第一切割線與第二切割線相互垂直。 (3) 沿著第一切割線與第二切割線裂開第一基板。 (4) 於第二基板上形成複數個第三切割線與複數個第 四切割線，其中第三切割線分別與第—切割線平行，而第 四切割線則分別與第二切割線平行。 (5) 沿著第三切割線裂開第二基板，使得母板分割成複 數個條狀板’其中每-條狀板包括複數個面板單元，以及 至少-空白區塊’其中每—面板單元均具有―液晶注入口。 (6) 經由液晶注入口灌注液晶至第一基板與第二基板 之間。 (7) 沿著第四切割線裂開第二基板，使得面板單元與空 白區塊自條狀板甲分割出來。 根據本發明另一實施例，一種液晶面板的製造方法， 包含下列步驟： (a) 將液晶滴注至一第一基板與一第二基板之間。 (b) 將第一基板與第二基板組合成一母板。 201009419 ();第基板_L形成複數個第_切割線與複數個第 一切割線，其中第一切割線與第二切割線相互垂直。 ⑷沿著第-切割線與第二切割線裂開第一基板。 ()於第—基板上形成複數個第三切割線與複數個第 四切割線，其中第三切割線分別與第一切割線平行，而第 四切割線則分別與第二切割線平行。 ⑴沿著第三㈣線裂開第二基板’使得母板分割成複 .數個條狀板，其中每-條狀板包括複數個面板單元，以及 至少一空白區塊。 (g) 著第四切割線裂開第二基板’使得面板單元與空 白區塊自條狀板中分割出來。 «•息結而s，本發明上述實施例係將母板先分割成複數 個條狀板’然後再對條狀板進行後段製程(—“η“仰⑽; BEOL)。因此製造者僅需對條狀板提供適配的治具，而無 須針對個別面板單元設計其專用的治具。 ί 此外本發明之上述實施例在條狀板的兩側仍保留空 白區塊，因此縱使在後段製程中，條狀板之邊緣無可避免 地遭受些微的碰撞，面板單元會因為空白區塊的存在，而 不致產生真正危及產品強度的損傷。 【實施方式】 第1Α-7圖繪示依照本發明一實施例之液晶面板的製造 方法。應瞭解到，在本實施例中所提及的步驟，除特別敘 明其順序者外，均可依實際需要調整其前後順序，甚至可 201009419 同時或部分同時執行β 3青先參照第1Α圖，製造者可先提供一母板100，母板 100之形狀舉例為矩形片狀或是正方形 片狀等等，母板100 之形狀並不用以限制本發明之範圍，此母板100可由一玻 璃板切割而得。舉例來說’―般3·5代廠所使用的玻璃板尺 寸為620 mmx750 mm(或61〇 mmx72〇 。製造者可先在 *璃板上完成前段製程，前段製程舉例為成膜製程，接著 將此玻璃板平均切成四塊母板1〇〇，其中每一母板1〇〇的尺 寸為 310 mmx375 mm(或 305 mmx360 mm)。第 1B 圖繪示 第1A圖之母板ι00的側視圖。如圖所示，母板1〇〇可包含 彼此相對之一第一基板11〇與一第二基板12〇。 參照第2圖，接著製造者可於第-基板110上形成複 數個第一切割線210與複數個第二切割線22〇，在本圖中係 以虛線表示複數個第一切割線21〇與複數個第二切割線 220，其中第一切割線21〇與第二切割線22〇相互垂直，以 _ 冑母板⑽區分為複數個面板單元300,以&圍繞所有面板 單兀300之一空白區塊40〇，如圖所示，空白區塊4〇〇係位 在母板100之週邊位置，然而空白區塊4〇〇並不侷限於必 須位在母板100之週邊位置，也可以僅位在母板1〇〇之一 邊 '兩邊或三邊上。在此步驟甲，製造者可利用切割輪、 刀或雷射光劃過第一基板110的表面，使得第一基板ιι〇 的表面產生裂痕（median crack)作為第一切割線21〇或第二 切割線220。 參照第3 ，然後製造者可沿著第一切割線21〇與第 201009419 二切割線220裂開篦__甘丄 土板110。具體而言，製造者可對第 相對第一切割線21〇及/或第二切割線心 =壓二此時由於第-基…表面已具有裂痕(亦 即第-切割、線210及/或第二切 no將會沿著此裂痕m 目此第基板 應瞭解到，在第2圖、帛3圖以及後續相關圖式中，Dynamic, low power consumption and wide range of applications, it has been widely used in consumer electronics or computers such as portable TVs, mobile phones, video recorders, notebook computers, desktop displays, and projection TVs. In the product, it becomes the mainstream of the display. The liquid crystal panel is one of the key components of the liquid crystal display. Traditionally, manufacturers have mostly cut glass sheets into panel units, followed by subsequent liquid-filled processes. However, as the demands of today's consumer market are getting higher and higher, this traditional process is also forced to face a series of severe examples. As today's small and medium-sized LCD panels are mostly customized, the production line It is often necessary to produce many different sizes of liquid crystal panels at the same time. If the glass plate is cut into different pieces of different panel units according to the traditional process, then in the process of pouring liquid crystal, the manufacturer is bound to handle the liquid crystal for each size > Obviously, the operation is bound to meet the needs of the big market. l Adding manufacturing cost and failing to satisfy consumption 5 201009419 SUMMARY OF THE INVENTION One aspect of the present invention is to provide a method for manufacturing a liquid crystal panel to solve the problems faced by the above conventional processes. According to the present invention, there is provided a method of manufacturing a liquid crystal panel comprising the steps of: (1) providing at least one mother board. The mother board comprises a first substrate and a second substrate opposite to each other. (2) forming a plurality of first cutting lines and a plurality of second cutting lines on the first substrate, wherein the first cutting line and the second cutting line of the towel are perpendicular to each other. (3) Cracking the first substrate along the first cutting line and the second cutting line. (4) forming a plurality of third cutting lines and a plurality of fourth cutting lines on the second substrate, wherein the third cutting lines are respectively parallel to the first cutting line, and the fourth cutting lines are respectively parallel to the second cutting lines. (5) splitting the second substrate along the third cutting line, so that the mother board is divided into a plurality of strip-shaped boards, wherein each of the strip-shaped boards includes a plurality of panel units, and at least - a blank block, wherein each of the panel units Both have a "liquid crystal injection port." (6) The liquid crystal is poured through the liquid crystal injection port between the first substrate and the second substrate. (7) The second substrate is split along the fourth cutting line so that the panel unit and the blank block are separated from the strip plate. According to another embodiment of the present invention, a method of fabricating a liquid crystal panel includes the following steps: (a) dropping a liquid crystal between a first substrate and a second substrate. (b) combining the first substrate and the second substrate into a mother board. 201009419 (); the substrate_L forms a plurality of _cut lines and a plurality of first dicing lines, wherein the first cutting line and the second cutting line are perpendicular to each other. (4) Cracking the first substrate along the first cutting line and the second cutting line. () forming a plurality of third cutting lines and a plurality of fourth cutting lines on the first substrate, wherein the third cutting lines are respectively parallel to the first cutting lines, and the fourth cutting lines are respectively parallel to the second cutting lines. (1) Cracking the second substrate ' along the third (four) line causes the mother board to be divided into a plurality of strips, wherein each strip includes a plurality of panel units, and at least one blank block. (g) The fourth cutting line splits the second substrate ' so that the panel unit and the blank block are separated from the strip. «• 结 结 s, the above embodiment of the present invention divides the mother board into a plurality of strip-shaped sheets first and then performs a back-end process on the strip-shaped sheets (-"η" (10); BEOL). Therefore, the manufacturer only needs to provide the fitting jig for the strip plate without designing a special jig for the individual panel unit. Furthermore, the above-described embodiments of the present invention still retain blank blocks on both sides of the strip-shaped plate, so that even in the latter stage process, the edges of the strip-shaped plates inevitably suffer from slight collisions, and the panel unit may be blank because of the blank block. Exist, without causing damage that truly jeopardizes the strength of the product. [Embodiment] Figs. 1 to 7 are views showing a method of manufacturing a liquid crystal panel according to an embodiment of the present invention. It should be understood that the steps mentioned in the embodiment can be adjusted according to actual needs, except that the order is specifically described, and even 201009419 can be simultaneously or partially simultaneously executed. The manufacturer may first provide a motherboard 100. The shape of the motherboard 100 is exemplified by a rectangular sheet or a square sheet. The shape of the motherboard 100 is not intended to limit the scope of the present invention. The motherboard 100 may be made of a glass. The board is cut. For example, the size of the glass plate used in the 3-5 generations is 620 mm x 750 mm (or 61 〇 mm x 72 〇. The manufacturer can finish the front process on the * glazing, the front process is exemplified by the film forming process, and then The glass plate is evenly cut into four mother boards, each of which has a size of 310 mm x 375 mm (or 305 mm x 360 mm). Figure 1B shows the side of the mother board ι00 of Figure 1A. As shown in the figure, the motherboard 1A may include a first substrate 11A and a second substrate 12A opposite to each other. Referring to FIG. 2, the manufacturer may then form a plurality of numbers on the first substrate 110. a cutting line 210 and a plurality of second cutting lines 22 〇, in the figure, a plurality of first cutting lines 21 〇 and a plurality of second cutting lines 220 are indicated by dashed lines, wherein the first cutting line 21 〇 and the second cutting line The lines 22 are perpendicular to each other, and are divided into a plurality of panel units 300 by the _ 胄 mother board (10), and a blank block 40 围绕 around one of the panel 兀 300, as shown in the figure, the blank block 4 〇〇 system At the peripheral position of the motherboard 100, however, the blank block 4 is not limited to being located at the periphery of the motherboard 100. The position may also be located on only one side or three sides of the mother board 1 。. In this step, the manufacturer can use the cutting wheel, the knife or the laser light to traverse the surface of the first substrate 110 so that the first substrate The surface of the ιι is a median crack as the first cutting line 21〇 or the second cutting line 220. Referring to the third, the manufacturer can then split along the first cutting line 21〇 and the 201009419 second cutting line 220. __甘丄土板110. Specifically, the manufacturer may have a first relative cutting line 21〇 and/or a second cutting line center=pressure two at this time because the surface of the first base has cracks (ie, the first - cutting, line 210 and/or second tangent no will follow this crack m. This first substrate should be known, in Figure 2, Figure 3 and subsequent related figures,
虛線所表示的是基板表面上尚未裂開的裂痕。至於已經裂 開的部分則將以實線繪示之。 又 ^照第’接著製造者可於第二基板咖上形成複 第二切割線230與複數個第四切割線24〇，其中第三切 丄線230分別與第3圖之第一切割線平行，而第四切 割線240則分別與第3圖之第二切割線22〇平行。同樣地， 在此步驟中，製造者可利用切割輪、刀或雷射光劃過第二 基板12G的表面，使得第二基板m的表面產生裂痕作為 第二切割線23 0/第四切割線240。 請繼續參照第4圖，當第一基板11〇為薄膜電晶體基 板且第一基板120為彩色濾光片基板時，製造者可在此 時另外於第二基板i2〇上形成複數個第五切割線25〇。這些 /第五切割線25G對每-面板單元_中之第—基板ιι〇劃 分出一外引腳接合區（outer lead bonding ; OLB)31〇與一顯 示區320。 參照第5圖，然後製造者可沿著第三切割線23〇裂開 第二基板120’使得母板100分割成複數個條狀板1〇5，其 中每—條狀板105均包括複數個面板單元3〇〇，以及位於條 201009419 狀板105兩側之空白區塊4 in^ = I w而，工白區塊40〇可僅位 .於條狀板⑽之至少 可對第一基板110相對第=be & 取&考 對第—切割線230的位置施加堡力， 二基板120沿著第三切割線咖㈣。惟應_卜 “者於此％僅沿者第三切割線23()做裂開的動作，至於 第四切割線240與第五切割線㈣於此時均尚未裂開。 參 參照第6圖，接著製造者可對條狀板105進行後段製 程。-般而言，在此時所進行的後段製程包含但不限於. 灌注液晶、間隙調整製程（re_gap pr〇cess)與封口製程。且體 而言’製造者於此時可先㈣液晶注人口將液晶灌注至第 一基板110與第二基板120之間。㈣，製造者可對條狀 板105實施間隙調整製程，以調整第—基板11〇與第:基 板120之間的間隙。於間隙調整製程後，製造者可對條狀 板1〇5實施封口製程，其舉例係利用紫外光密封膠 (ultraviolet sealant)密封面板單元3〇〇之液晶注入口。 由於本實施例係對條狀板105進行後段製程，因此製 造者僅需對條狀板105提供其適配的治具，而無須針對個 別面板單元300設計其專用的治具《舉例來說，在本實施 例中，由於每一條狀板105的長度都是一樣的（31〇mm或 305 mm) ’因此縱使個別面板單元300的尺寸不同，後段製 程所使用的治具也無須有所不同，只要適配條狀板1〇5即 〇 此外，本實施例在條狀板105的兩側仍保留空白區塊 4〇〇，因此縱使在後段製程中，條狀板1〇5無可避免地遭受 10 201009419 些微的碰揸，面板單元3〇〇 而不致產生真正危及產品強度的:丨:白一的保護’ 接著，製造者可沿著第四切割線 =面板單元3。。與空白區塊4。。自條狀板 所繪示）。同樣地，在此步驟中，製造者可 = 相對第四切割線24。的位置施加壓力，使 寸第一基板120沿著第四切割線細裂開。或者，製造者 亦可直接順著第四切割線24〇 塊的面板單元300。 ’條狀板⑽’以獲得一塊 Φ 的邱Τ’製造者可將第二基板m覆蓋外引腳接合區310 保留到此時（亦即，在後段製程（例如：灌注液晶）完 =去二之。如此一來’在後段製程進行時，第二基板 將會覆蓋外引腳接合區⑽，並保護外引聊接合區310 中的線路不觉製程影響而產生到傷或斷路等問題。且體而 言’製造者可在沿著第四切割線24〇裂開第二基板12〇的 同時，亦沿著第五切割線25G裂開第二基板120,並隨即去 除第二基板120覆蓋外引腳接合區31〇的部分。 應瞭解到，雖然本實施例係以薄膜電晶體基板作為第 一基板110，並以彩色渡光片基板作為第二基板12(W曰本 發明所屬技術領域中具有通常知識者，應當能根據實際需 要，彈性調整第-基板11G與第二基板m的實施方式。 、舉例來說’在本發明另—實施财，第—基板可為彩 色遽光片基板，而第二基板則可為薄膜電晶體基板。此一 實施例的實施步驟均與上一實施例相同，因此不再重複贅 201009419The dotted line indicates the crack on the surface of the substrate that has not been cracked. The part that has been split will be shown in solid lines. Further, the manufacturer can form a second second cutting line 230 and a plurality of fourth cutting lines 24〇 on the second substrate, wherein the third tangent line 230 is parallel to the first cutting line of FIG. 3, respectively. And the fourth cutting line 240 is parallel to the second cutting line 22A of FIG. 3, respectively. Similarly, in this step, the manufacturer can use the cutting wheel, the knife or the laser light to traverse the surface of the second substrate 12G such that the surface of the second substrate m is cracked as the second cutting line 23 / the fourth cutting line 240 . Referring to FIG. 4, when the first substrate 11 is a thin film transistor substrate and the first substrate 120 is a color filter substrate, the manufacturer can form a plurality of fifths on the second substrate i2 at this time. The cutting line is 25 inches. The / fifth cutting line 25G divides an outer lead bonding (OLB) 31 and a display area 320 for the first substrate ιι in each panel unit. Referring to FIG. 5, the manufacturer can then split the second substrate 120' along the third cutting line 23 so that the motherboard 100 is divided into a plurality of strips 1〇5, wherein each strip 105 includes a plurality of The panel unit 3〇〇, and the blank block 4 in ^ = I w on both sides of the strip 201009419, and the white block 40〇 can be located only. The strip substrate (10) can be at least opposite to the first substrate 110. Relative to the =be & take & test the position of the first cutting line 230 to apply the fort, the second substrate 120 along the third cutting line (four). However, the movement of the third cutting line 23 () is only split along the third cutting line 23 (), and the fourth cutting line 240 and the fifth cutting line (four) have not been cracked at this time. Then, the manufacturer can perform the back-end process on the strip 105. In general, the back-end process performed at this time includes, but is not limited to, a liquid crystal filling, a gap adjustment process (re_gap pr〇cess), and a sealing process. In this case, the manufacturer can inject the liquid crystal into the first substrate 110 and the second substrate 120 at the same time. (4) The manufacturer can perform a gap adjustment process on the strip plate 105 to adjust the first substrate. 11〇 and the: gap between the substrate 120. After the gap adjustment process, the manufacturer can perform a sealing process on the strip plate 1〇5, which is exemplified by sealing the panel unit with an ultraviolet sealant (〇〇). Since the present embodiment performs the back-end manufacturing process on the strip-shaped board 105, the manufacturer only needs to provide the strip-shaped board 105 with the fitting jig thereof without designing a special jig for the individual panel unit 300. For example, in this implementation In this case, since the length of each strip 105 is the same (31 〇 mm or 305 mm) 'so that the dimensions of the individual panel units 300 are different, the jigs used in the latter process do not need to be different, as long as the splicing strips In addition, in this embodiment, the blank block 4〇〇 is still left on both sides of the strip plate 105, so even in the latter stage process, the strip plate 1〇5 inevitably suffers 10 201009419 The collision of the panel unit 3 does not cause the product to be truly endangered: 丨: protection of white one' Next, the manufacturer can follow the fourth cutting line = panel unit 3. With the blank block 4. Similarly, in this step, the manufacturer can apply pressure to the position of the fourth cutting line 24 to cause the first substrate 120 to be split along the fourth cutting line. The manufacturer can also directly follow the fourth cutting line 24 of the panel unit 300. The 'strip plate (10)' to obtain a piece of Φ's Τ Τ's manufacturer can retain the second substrate m covering the outer pin lands 310 to At this time (that is, in the back-end process (for example: pouring liquid crystal) Finish = go to the second. As a result, the second substrate will cover the outer pin junction area (10) during the back-end process, and protect the line in the external chat junction area 310 from the impact of the process, resulting in injury or open circuit. And the problem is that the manufacturer can split the second substrate 120 along the fifth cutting line 25G while cracking the second substrate 12〇 along the fourth cutting line 24, and then remove the second substrate The substrate 120 covers a portion of the outer lead land 31 〇. It should be understood that although the present embodiment uses a thin film transistor substrate as the first substrate 110 and a color light guide substrate as the second substrate 12 Those skilled in the art should be able to elastically adjust the embodiments of the first substrate 11G and the second substrate m according to actual needs. For example, in the present invention, the first substrate may be a color filter substrate, and the second substrate may be a thin film transistor substrate. The implementation steps of this embodiment are the same as those of the previous embodiment, and therefore are not repeated 赘 201009419
述之。惟在本實& 二 ** 一 (亦即’彩色濾另 如：灌注液晶）吳 板，並去除第一 雖然本發明已以實施例揭露如上，鈇 ,^ΒΒ …、再並非用以限定 發月’任何熟習此技藝者，在不脫離本發明之精神和範 圍内，當可作各種之更動與满飾。舉例來說，雖铁上述實 參_係採用灌注液晶來製造液晶面板，但本發明所屬技術 領域中具有通常知識者，亦可採用液晶滴注法（〇加 Fill ; ODF)來實施本發明所揭露的技術内容。亦即，製 造者可先將液晶滴注至第一基板與第二基板之間，也就是 說，將液晶滴注至第一基板或第二基板上，然後再將第一 基板與第二基板組合成母板，並接著進行如以上實施例所 揭露的後續步驟。總結而言，本發明之保護範圍當視後附 之申請專利範圍所界定者為準。 【圖式簡單說明】 第1Α-7圖繪示依照本發明一實施例之液晶面板的製造 流程不意圖。 【主要元件符號說明】 100 :母板 105 :條狀板 12 201009419 110 :第一基板 120 :第二基板 210 :第一切割線 220 :第二切割線 230 :第三切割線 240 :第四切割線 250 :第五切割線 300 :面板單元 310 :外引腳接合區 320 :顯示區 400 空白區塊Said. However, in the present & two ** (that is, 'color filter another: perfusion liquid crystal) Wu board, and remove the first, although the present invention has been disclosed by the above examples, 鈇, ^ ΒΒ ..., is not intended to be limited Anyone who is familiar with this skill can make various changes and ornaments without departing from the spirit and scope of the present invention. For example, although the above-mentioned iron-based embodiment uses liquid perfusion liquid crystal to manufacture a liquid crystal panel, those skilled in the art to which the present invention pertains can also implement the present invention by liquid crystal dropping method (Fill; ODF). Revealed technical content. That is, the manufacturer may first drop the liquid crystal between the first substrate and the second substrate, that is, drop the liquid crystal onto the first substrate or the second substrate, and then the first substrate and the second substrate. The master is assembled and the subsequent steps as disclosed in the above examples are followed. In summary, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1-7 is a schematic view showing a manufacturing process of a liquid crystal panel according to an embodiment of the present invention. [Main component symbol description] 100: mother board 105: strip board 12 201009419 110: first substrate 120: second substrate 210: first cutting line 220: second cutting line 230: third cutting line 240: fourth cutting Line 250: fifth cutting line 300: panel unit 310: outer pin landing area 320: display area 400 blank block