TWI373482B - - Google Patents

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Publication number
TWI373482B
TWI373482B TW094134982A TW94134982A TWI373482B TW I373482 B TWI373482 B TW I373482B TW 094134982 A TW094134982 A TW 094134982A TW 94134982 A TW94134982 A TW 94134982A TW I373482 B TWI373482 B TW I373482B
Authority
TW
Taiwan
Prior art keywords
group
resin composition
alcohol
general formula
photocurable resin
Prior art date
Application number
TW094134982A
Other languages
English (en)
Chinese (zh)
Other versions
TW200621850A (en
Inventor
Hideto Kato
Michihiro Sugo
Tomoyuki Goto
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200621850A publication Critical patent/TW200621850A/zh
Application granted granted Critical
Publication of TWI373482B publication Critical patent/TWI373482B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387Polyamides or polyimides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
TW094134982A 2004-10-07 2005-10-06 Polyimide-based photo-curable resin composition, pattern forming method and substrate protecting film TW200621850A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004294470 2004-10-07

Publications (2)

Publication Number Publication Date
TW200621850A TW200621850A (en) 2006-07-01
TWI373482B true TWI373482B (enExample) 2012-10-01

Family

ID=37150117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134982A TW200621850A (en) 2004-10-07 2005-10-06 Polyimide-based photo-curable resin composition, pattern forming method and substrate protecting film

Country Status (2)

Country Link
KR (1) KR101117023B1 (enExample)
TW (1) TW200621850A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4751933B2 (ja) * 2006-09-26 2011-08-17 アルプス電気株式会社 プリント配線板の製造方法、プリント配線板、及びプリント配線板の製造装置
KR100932770B1 (ko) * 2007-12-18 2009-12-21 전북대학교산학협력단 포지형 감광성 폴리이미드 수지 및 이의 조성물
WO2010074269A1 (ja) * 2008-12-26 2010-07-01 日産化学工業株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
JP5593075B2 (ja) * 2010-01-13 2014-09-17 富士フイルム株式会社 パターン形成方法、パターン、化学増幅型レジスト組成物及びレジスト膜
WO2016060340A1 (ko) * 2014-10-15 2016-04-21 연세대학교 원주산학협력단 가압 조건 하에서 수행되는 폴리이미드 제조방법
JP6904245B2 (ja) * 2017-12-27 2021-07-14 信越化学工業株式会社 感光性樹脂組成物、パターン形成方法、及び光半導体素子の製造方法
JP7111031B2 (ja) * 2018-03-23 2022-08-02 信越化学工業株式会社 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
JP7276175B2 (ja) * 2020-01-24 2023-05-18 信越化学工業株式会社 感光性樹脂組成物、感光性ドライフィルム及びパターン形成方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1184653A (ja) 1997-09-11 1999-03-26 Hitachi Chem Co Ltd 耐熱性感光性重合体組成物及びパターンの製造法
WO2003038526A1 (fr) * 2001-10-30 2003-05-08 Kaneka Corporation Composition de resine photosensible et films et stratifies photosensibles ainsi obtenus

Also Published As

Publication number Publication date
TW200621850A (en) 2006-07-01
KR20060052077A (ko) 2006-05-19
KR101117023B1 (ko) 2012-03-15

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