TW200621850A - Polyimide-based photo-curable resin composition, pattern forming method and substrate protecting film - Google Patents

Polyimide-based photo-curable resin composition, pattern forming method and substrate protecting film

Info

Publication number
TW200621850A
TW200621850A TW094134982A TW94134982A TW200621850A TW 200621850 A TW200621850 A TW 200621850A TW 094134982 A TW094134982 A TW 094134982A TW 94134982 A TW94134982 A TW 94134982A TW 200621850 A TW200621850 A TW 200621850A
Authority
TW
Taiwan
Prior art keywords
resin composition
polyimide
film
curable resin
forming method
Prior art date
Application number
TW094134982A
Other languages
English (en)
Chinese (zh)
Other versions
TWI373482B (enExample
Inventor
Hideto Kato
Michihiro Sugo
Tomoyuki Goto
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200621850A publication Critical patent/TW200621850A/zh
Application granted granted Critical
Publication of TWI373482B publication Critical patent/TWI373482B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
TW094134982A 2004-10-07 2005-10-06 Polyimide-based photo-curable resin composition, pattern forming method and substrate protecting film TW200621850A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004294470 2004-10-07

Publications (2)

Publication Number Publication Date
TW200621850A true TW200621850A (en) 2006-07-01
TWI373482B TWI373482B (enExample) 2012-10-01

Family

ID=37150117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134982A TW200621850A (en) 2004-10-07 2005-10-06 Polyimide-based photo-curable resin composition, pattern forming method and substrate protecting film

Country Status (2)

Country Link
KR (1) KR101117023B1 (enExample)
TW (1) TW200621850A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101606445B (zh) * 2006-09-26 2012-02-22 阿尔普士电气股份有限公司 印制线路板的制造方法
KR100932770B1 (ko) * 2007-12-18 2009-12-21 전북대학교산학협력단 포지형 감광성 폴리이미드 수지 및 이의 조성물
CN102317847B (zh) * 2008-12-26 2015-08-26 日产化学工业株式会社 液晶取向剂、液晶取向膜及液晶显示元件
JP5593075B2 (ja) * 2010-01-13 2014-09-17 富士フイルム株式会社 パターン形成方法、パターン、化学増幅型レジスト組成物及びレジスト膜
WO2016060340A1 (ko) * 2014-10-15 2016-04-21 연세대학교 원주산학협력단 가압 조건 하에서 수행되는 폴리이미드 제조방법
JP6904245B2 (ja) * 2017-12-27 2021-07-14 信越化学工業株式会社 感光性樹脂組成物、パターン形成方法、及び光半導体素子の製造方法
JP7111031B2 (ja) * 2018-03-23 2022-08-02 信越化学工業株式会社 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
JP7276175B2 (ja) * 2020-01-24 2023-05-18 信越化学工業株式会社 感光性樹脂組成物、感光性ドライフィルム及びパターン形成方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1184653A (ja) 1997-09-11 1999-03-26 Hitachi Chem Co Ltd 耐熱性感光性重合体組成物及びパターンの製造法
KR100589067B1 (ko) * 2001-10-30 2006-06-14 가부시키가이샤 가네카 감광성 수지 조성물, 이것을 이용한 감광성 필름 및 적층체

Also Published As

Publication number Publication date
KR101117023B1 (ko) 2012-03-15
KR20060052077A (ko) 2006-05-19
TWI373482B (enExample) 2012-10-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees