TW200621850A - Polyimide-based photo-curable resin composition, pattern forming method and substrate protecting film - Google Patents

Polyimide-based photo-curable resin composition, pattern forming method and substrate protecting film

Info

Publication number
TW200621850A
TW200621850A TW094134982A TW94134982A TW200621850A TW 200621850 A TW200621850 A TW 200621850A TW 094134982 A TW094134982 A TW 094134982A TW 94134982 A TW94134982 A TW 94134982A TW 200621850 A TW200621850 A TW 200621850A
Authority
TW
Taiwan
Prior art keywords
resin composition
polyimide
film
curable resin
forming method
Prior art date
Application number
TW094134982A
Other languages
Chinese (zh)
Other versions
TWI373482B (en
Inventor
Hideto Kato
Michihiro Sugo
Tomoyuki Goto
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200621850A publication Critical patent/TW200621850A/en
Application granted granted Critical
Publication of TWI373482B publication Critical patent/TWI373482B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains

Abstract

This invention provides a photosensitive resin composition capable of performing fine pattern formation in a thick film exceeding 20 μm and capable of providing a film excellent in reliability as a protective film, and to provide a cured film. The photocurable resin composition comprises: (A) a polyimide-based polymeric compound having a primary alcohol in its molecule with an alcoholic equivalent of ≤ 3,500 and having a weight average molecular weight of 5,000-500,000 as a compound having a polyimide skeleton soluble in an organic solvent; (B) a formalin modified amino condensate, melamine resin or urea resin or one or a mixture of phenolic compounds each having, on average, two or more methylol groups or alkoxy methylol groups per molecule; and (C) an acid generator capable of generating an acid upon irradiation with light of a wavelength of 240-500 nm.
TW094134982A 2004-10-07 2005-10-06 Polyimide-based photo-curable resin composition, pattern forming method and substrate protecting film TW200621850A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004294470 2004-10-07

Publications (2)

Publication Number Publication Date
TW200621850A true TW200621850A (en) 2006-07-01
TWI373482B TWI373482B (en) 2012-10-01

Family

ID=37150117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134982A TW200621850A (en) 2004-10-07 2005-10-06 Polyimide-based photo-curable resin composition, pattern forming method and substrate protecting film

Country Status (2)

Country Link
KR (1) KR101117023B1 (en)
TW (1) TW200621850A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008038663A1 (en) * 2006-09-26 2008-04-03 Alps Electric Co., Ltd. Method for manufacturing printed wiring board
KR100932770B1 (en) * 2007-12-18 2009-12-21 전북대학교산학협력단 Positive photosensitive polyimide resins and compositions thereof
JP5870487B2 (en) * 2008-12-26 2016-03-01 日産化学工業株式会社 Liquid crystal alignment agent, liquid crystal alignment film, and liquid crystal display element
JP5593075B2 (en) * 2010-01-13 2014-09-17 富士フイルム株式会社 Pattern forming method, pattern, chemically amplified resist composition, and resist film
WO2016060340A1 (en) * 2014-10-15 2016-04-21 연세대학교 원주산학협력단 Polyimide preparation method carried out under pressurized conditions
JP6904245B2 (en) * 2017-12-27 2021-07-14 信越化学工業株式会社 Photosensitive resin composition, pattern forming method, and manufacturing method of optical semiconductor device
JP7276175B2 (en) * 2020-01-24 2023-05-18 信越化学工業株式会社 Photosensitive resin composition, photosensitive dry film and pattern forming method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1184653A (en) 1997-09-11 1999-03-26 Hitachi Chem Co Ltd Heat resistant photosensitive polymer composition and production of pattern
WO2003038526A1 (en) * 2001-10-30 2003-05-08 Kaneka Corporation Photosensitive resin composition and photosensitive films and laminates made by using the same

Also Published As

Publication number Publication date
KR20060052077A (en) 2006-05-19
TWI373482B (en) 2012-10-01
KR101117023B1 (en) 2012-03-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees