WO2008038663A1

WO2008038663A1 - Method for manufacturing printed wiring board

Info

Publication number: WO2008038663A1
Application number: PCT/JP2007/068676
Authority: WO
Inventors: Hajime Sato; Kazuo Obara; Yoshihiro Taguchi; Kunio Mori; Hidetoshi Murakami
Original assignee: Alps Electric Co., Ltd.; Daisho Denshi Co., Ltd.
Priority date: 2006-09-26
Filing date: 2007-09-26
Publication date: 2008-04-03
Also published as: CN101606445B; KR101127547B1; CN101606445A; JP4751933B2; KR20090099049A; JPWO2008038663A1

Abstract

Provided is a method for manufacturing printed wiring boards, by which the printed wiring boards can be quickly and easily obtained. The method is provided with a degreasing step of degreasing a substrate section; a step of irradiating the substrate section, which has been degreased in the degreasing step, with ultraviolet in an area equivalent to a position where no conductive pattern is to be formed; a catalyst adhering step of adhering a catalyst on the substrate section after ultraviolet irradiation; and a plating step of plating the substrate section whereupon the catalyst has been adhered in the catalyst adhering step.

Description

Specification

Method for manufacturing printed wiring board

Technical field

The present invention relates to a method for manufacturing a printed wiring board on which various electronic components are mounted.

This application (together, September 26, 2006, Japanese Patent Application No. 2006-260800 filed, claims priority, and the contents thereof are incorporated herein by reference.

Background art

[0002] Conventionally, various printed wiring boards provided with various electronic components and provided in electronic devices and the like have been used! (See, for example, Patent Document 1).

Of these printed wiring boards, printed wiring boards with through holes are generally manufactured by the following procedure.

First, as shown in FIG. 6, a copper clad laminate 4 having a copper foil 3 provided on both main surfaces of a substrate portion (substrate body) 2 made of epoxy resin or the like is prepared. Then, as shown in FIG. 7, films 8 are provided on both surfaces of the copper foil 3.

Furthermore, as shown in FIG. 8, pattern films 9 for forming a conductor pattern are provided on both surfaces of the film 8. In the exposure step, ultraviolet rays (UV) are irradiated through the pattern film 9. Part of this ultraviolet light is blocked by the pattern film 9, and the other part reaches the film 8 through the transmission part 10. The portion of the film 8 where the ultraviolet rays have reached is cured. Then, as shown in Fig. 9, the pattern film 9 is removed. In FIG. 9, reference numeral 12 denotes a cured portion that is a cured portion of the film 8.

Next, as shown in FIG. 10, the film 8 other than the cured portion 12 and the copper foil 3 other than the cured portion 12 are removed through a development process and an etching process. Further, as shown in FIG. 11, the hardened portion 12 is peeled off. Then, as shown in FIG. 12, a layer portion 14 made of an epoxy resin is provided on both main surfaces of the substrate portion 2 so as to cover the copper foil 3. Then, as shown in FIG. 13, copper foils 15 are provided on both surfaces of the layer portion 14.

[0005] Then, as shown in FIG. 14, in the through-hole forming process, the substrate portion 2, the copper foil 3, A through-hole 17 is formed that penetrates the layer portion 14 and the copper foil 15 in the vertical direction (thickness direction) in FIG. Then, the through hole 17 is washed.

Next, the substrate portion 2 and the like are degreased to attach the catalyst. Then, as shown in FIG. 15, the entire surface is plated with copper to provide a plating layer 18. As a result, the clasp layer 18 is also provided on the inner wall of the through hole 17 so that the front and back surfaces are conductive.

Further, as shown in FIG. 16, a pattern layer 20 is provided on the entire front and back surfaces of the substrate portion 2 provided with the plating layer 18. Then, as shown in FIG. 17, a pattern film 21 for forming a conductor pattern is provided on the surface of the pattern layer 20. In the exposure step, ultraviolet rays (UV) are irradiated through the pattern film 21. Then, as shown in FIG. 18, when the pattern film 21 is removed, a cured portion 22 is generated in a part of the pattern layer 20 as described above.

Next, as shown in FIG. 19, in the development step and the etching step, the pattern layer 20 other than the cured portion 22 and the plating layer 18 other than the cured portion 22 are removed. Further, as shown in FIG. 20, the hardened portion 22 is peeled off.

Thereby, the printed wiring board 1 shown in FIG. 20 is obtained. Further, if necessary, the above series of steps is repeated to laminate each layer into several layers.

However, in the method for producing a printed wiring board as described above, after forming the through hole, degreasing, catalyst adhesion, plating, pattern layer formation, pattern film installation, exposure, development, etching and patterning are further performed. A process such as film peeling is required. For this reason, there is a problem that the manufacturing work of the printed wiring board is very troublesome and the work load increases.

Patent Document 1: Japanese Patent Application Laid-Open No. 2003-338690

Disclosure of the invention

[0009] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a method for manufacturing a printed wiring board capable of quickly and easily obtaining a printed wiring board.

In order to solve the above-described problems, the present invention has the following aspects, for example.

A first aspect is a method for manufacturing a printed wiring board, which includes a degreasing process for degreasing a board body, and a conductive pattern formed on the board body degreased by the degreasing process. A step of irradiating ultraviolet rays to a position corresponding to the position where the body pattern is not formed, a catalyst attaching step of attaching a catalyst to the substrate body after the ultraviolet irradiation, and a substrate body on which the catalyst is attached by the catalyst attaching step And a plating process for plating.

[0011] In the method for producing a printed wiring board, the substrate body is degreased by the degreasing step, and the ultraviolet light is irradiated to the portion corresponding to the position where the conductor pattern of the substrate body is not formed, and the catalyst attaching step. As a result, the catalyst adheres to the substrate body. Furthermore, the substrate body is plated by a plating process.

As a result, the number of processes can be drastically reduced as compared with the prior art, and therefore a printed wiring board can be obtained quickly and easily.

[0012] The second aspect is a method for producing the printed wiring board, preferably the catalyst is a Sn-Pd colloid.

[0013] According to the method for producing a printed wiring board, the catalyst can be reliably attached to the substrate body, and the nail can be easily provided via the catalyst.

[0014] Further, the third aspect is a method for manufacturing the printed wiring board, and preferably, the plating force is electroless copper plating or electroless nickel plating.

[0015] According to the method for manufacturing a printed wiring board, plating can be reliably provided.

[0016] The fourth aspect is a method for producing the printed wiring board, wherein the substrate body is preferably an epoxy substrate, polybutylene terephthalate, polyphenylene sulfide, polysulfone sulfide, polyethylene terephthalate, polyarylate. , Polyimide, polyamide, liquid crystal polymer, glass or ceramics.

[0017] According to the present invention, the number of processes can be drastically reduced by irradiating ultraviolet rays onto the substrate body on which the pattern film is installed, and applying the plating with the force and catalyst attached thereto. Therefore, a printed wiring board can be obtained quickly and easily.

Brief Description of Drawings

FIG. 1 is a diagram showing an embodiment of a method for producing a printed wiring board according to the present invention, and is a side cross-sectional view of a printed wiring board showing a state where a copper layer portion is removed by an etching process It is a figure.

[Figure 2] Figure 2 shows a pattern film placed in the layered area of Figure 1 and It is a sectional side view of the printed wiring board which shows a mode that an ultraviolet-ray is irradiated.

FIG. 3 is a side sectional view of a printed wiring board showing a state where the pattern film of FIG. 2 is removed and plating is performed.

4] FIG. 4 is an explanatory diagram showing a state in which the coating layer disappears due to the irradiation of ultraviolet rays and the plating layer is not formed.

FIG. 5 is an explanatory view showing a state in which a plating layer is formed in a layer portion.

FIG. 6 is a view showing a conventional method for manufacturing a printed wiring board, and is a side sectional view showing a copper-clad laminate.

FIG. 7 is a side sectional view showing a state in which a film is provided on the surface of the copper foil of FIG.

FIG. 8 is a side sectional view showing a state in which a pattern film is placed on the surface of the film of FIG. 7, and ultraviolet rays are irradiated through the pattern finer.

FIG. 9 is a side sectional view showing a state where the pattern film of FIG. 8 is removed.

FIG. 10 is a side sectional view showing a state in which a predetermined portion of film and copper foil are removed from the substrate of FIG. 9 and the like by development and etching.

FIG. 11 is a side sectional view showing a state where the hardened portion of FIG. 10 is peeled off.

12] FIG. 12 is a side sectional view showing a state in which a layer portion is provided on the substrate of FIG.

13 is a side sectional view showing a state in which a copper layer portion is provided on the surface of the layer portion in FIG.

FIG. 14 is a side sectional view showing a state in which through holes are formed in the substrate of FIG.

FIG. 15 is a side sectional view showing a state in which a plating layer is provided in the through hole of FIG.

FIG. 16 is a side sectional view showing a state in which pattern layers are provided on both surfaces of the plating layer in FIG.

FIG. 17 is a side sectional view showing a state in which a pattern film is placed on the surface of the pattern layer in FIG. 16, and ultraviolet rays are irradiated through the pattern film.

FIG. 18 is a side sectional view showing a state where the pattern film of FIG. 17 is removed!

[FIG. 19] FIG. 19 shows a pattern of a predetermined portion by development and etching on the substrate of FIG. It is a sectional side view which shows a mode that the layer and the plating layer were removed.

FIG. 20 is a side sectional view showing a state where the hardened portion in FIG. 19 is peeled off.

Explanation of symbols

1 ... 'Printed wiring board

2 • Board part (board body)

3. Copper foil

4 ... Copper clad laminate

8 '' Finorem

9 ... 'Pattern film

10 ... Transparent part

12 ... Hardening part

14 ··· Hierarchy

15 ... Copper foil

17 · • 'Snow and Honoré

18 ... Plating layer

20 ... Pattern layer

21 .. Pattern film

22 ··· Hardened part

26 .. Pattern film

27 ··· Coating layer

29 ... Plating layer

30 ... Printed wiring board

• Catalyst

BEST MODE FOR CARRYING OUT THE INVENTION

(Embodiment)

Hereinafter, the following embodiment which is an example of the present invention will be described. In the present embodiment, a method for manufacturing a printed wiring board having a through hole will be described with reference to the drawings. In the method for manufacturing a printed wiring board in the present embodiment, first, a conventional copper-clad laminate 4 shown in FIG. 6 is prepared. Henceforth, since this embodiment and the conventional process are the same up to the process of forming the through hole 17 shown in FIG. 14, the description thereof is omitted.

Note that, as shown in FIG. 14, the explanation will be made assuming that the snorkel wheel 17 is formed by the through hole forming step.

In this embodiment, an etching process is provided as shown in FIG. 1 either before or after the through-hole forming process. In this etching process, the copper foil 15 is removed by etching. And in the degreasing process, the whole is degreased. Thus, as shown in FIG. 5, a coating layer 27 made of an amine such as triethanolamine is provided on the surface of the layer portion 14. The coating layer 27 is provided for attaching the catalyst.

Then, as shown in FIG. 2, in the film installation process, the pattern film 26 is installed on the film layers 27 on both surfaces of the layer portion 14. In FIG. 2, the coating layer 27 is omitted, but actually, the coating layer is provided on both surfaces of the layer portion 14 as shown in FIG. Next, in the ultraviolet irradiation step, the layer portion 14 is irradiated with ultraviolet rays (UV) through the pattern film 26. At this time, the ultraviolet rays do not reach the through hole 17 and its surroundings by the mask formed by the pattern film 26.

[0023] Then, the pattern film 26 is removed, and the entire substrate is immersed in a catalyst such as Sn—Pd colloid. Thereby, a catalyst adheres to a predetermined part. Furthermore, as shown in Fig. 3, electroless copper plating is applied to the entire substrate in the plating process. As a result, the plated layer 29 is formed in the portion not irradiated with the ultraviolet ray, and the printed wiring board 30 in which the conductive pattern is formed on the front and back surfaces is obtained.

Here, the action of forming the plating layer 29 in a predetermined portion by irradiating with ultraviolet rays is considered as follows.

That is, in the part where the coating layer 27 is provided by degreasing, the catalyst adheres on the coating layer 27, and in the part where the catalyst adheres, the plating layer 29 by electroless copper plating is provided, The catalyst does not adhere to the part where the coating layer 27 is not provided, so the plating Layer 29 is also not formed.

4 and 5 are diagrams for explaining these processes.

FIG. 4 is an explanatory view showing a state in which the coating layer 27 disappears due to ultraviolet irradiation.

First, when ultraviolet rays reach a predetermined portion of the coating layer 27 provided by the degreasing process, the ultraviolet energy and ozone generated by the ultraviolet rays (03

) Etc., the coating layer 27 is decomposed into carbon dioxide (C02) and water (H20) and disappears.

Therefore, even if the entire substrate portion 2 and the like are immersed in the catalyst in the catalyst attaching step, the catalyst S does not adhere to the surface of the layer portion 14. Therefore, even if electroless copper plating is applied in the plating step, the plating layer 29 is not formed in the portion where the catalyst S without the coating layer 27 does not adhere.

FIG. 5 is an explanatory view showing a state in which the plating layer 29 is formed.

The ultraviolet rays do not reach the other predetermined portion of the coating layer 27 provided by the degreasing process due to the mask of the pattern film 26. Therefore, the coating layer 27 is left on the layer portion 14.

Therefore, when the entire substrate portion 2 and the like are immersed in the catalyst in the catalyst attaching step, the catalyst S adheres to the surface of the remaining coating layer 27. Accordingly, the electroless copper plating is applied in the plating process, whereby the plating layer 29 is formed on the coating layer 27 via the catalyst S.

In the present embodiment, the mask with the pattern film 26 prevents the ultraviolet rays from reaching the through hole 17 and its periphery, so that the through hole 17 and the surrounding coating layer 27 remain. Thus, the other coating layer 27 is lost. Therefore, in the catalyst adhesion process, the catalyst adheres to the through hole 17 and the surrounding coating layer 27, and the catalyst does not adhere to the other portions. Therefore, as shown in FIG. 3, in the plating process, the adhesion layer 29 is formed in the through hole 17 and its periphery via the catalyst, and is not formed in the other portions.

[0028] As described above, according to the method for manufacturing a printed wiring board in the present embodiment, after the degreasing step and the film installation step, irradiation with ultraviolet rays is performed, and then the process proceeds to the catalyst attaching step and the mating step. The number of processes can be drastically reduced as compared with the prior art. That is, in the past If there is, after the through-hole formation process, 1) degreasing, 2) catalyst adhesion, 3) plating, 4) pattern layer formation, 5) pattern film installation, 6) exposure, 7) development, 8) etching, 9) pattern Processes such as film peeling were necessary. However, according to the method for manufacturing a printed wiring board in the present embodiment, after the through-hole forming step, 1) etching step, 2) degreasing step, 3) pattern film setting step, 4) ultraviolet irradiation step, 5) catalyst adhesion Process, 6) Only plating process is required. Therefore, the printed wiring board 30 can be obtained quickly and easily.

In addition, since the catalyst is a Sn—Pd colloid, the catalyst can be reliably attached to the coating layer 27, and the plating layer 29 can be easily provided.

In addition, since the plating is electroless copper plating, the plating layer 29 can be reliably provided.

The substrate portion 2 in the present embodiment is made of at least one of an epoxy substrate, polybutylene terephthalate, polyphenylene sulfide, polysulfone sulfide, polyethylene terephthalate, polyarylate, polyimide, polyamide, liquid crystal polymer, glass, or ceramics. is there. Thereby, the printed wiring board 1 can be obtained reliably.

[0030] It should be noted that the above-described force was a description of the method of manufacturing a printed wiring board. A printed wiring board manufacturing apparatus that automatically executes the processes performed in the above steps may be provided! /, . The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

Industrial applicability

[0031] According to the present invention, a printed wiring board can be obtained quickly and easily.

Claims

The scope of the claims

[1] a degreasing process for degreasing the substrate body;

Irradiating a portion corresponding to a position where the conductor pattern is not formed with ultraviolet rays to form a conductor pattern on the substrate body degreased by the degreasing step;

A catalyst attachment step for attaching the catalyst to the substrate body after ultraviolet irradiation;

And a plating step of plating the substrate body to which the catalyst is adhered in the catalyst adhesion step.

[2] The method for producing a printed wiring board according to claim 1, wherein the catalyst is a Sn—Pd colloid.

[3] The method for producing a printed wiring board according to claim 1, wherein the plating is electroless copper plating or electroless nickel plating.

[4] The substrate body is

2. The method for producing a printed wiring board according to claim 1, comprising at least one of an epoxy substrate, polybutylene terephthalate, polyphenylene sulfide, polysulfonate sulfide, polyethylene terephthalate, polyarylate, polyimide, polyamide, liquid crystal polymer, glass, or ceramics. .

[5] A printed wiring board produced by the method for producing a printed wiring board according to claim 1.

[6] a degreasing portion for degreasing the substrate body provided with the through hole;

An ultraviolet irradiation unit that irradiates ultraviolet rays to a portion corresponding to a position where a conductor pattern is not formed on the substrate body degreased by the degreasing unit;

A catalyst adhering portion for adhering the catalyst to the substrate body after ultraviolet irradiation;

A printed wiring board manufacturing apparatus comprising: a plating unit that performs plating on the substrate body to which the catalyst is adhered by the catalyst adhesion unit.