TWI373093B - - Google Patents

Info

Publication number
TWI373093B
TWI373093B TW097119481A TW97119481A TWI373093B TW I373093 B TWI373093 B TW I373093B TW 097119481 A TW097119481 A TW 097119481A TW 97119481 A TW97119481 A TW 97119481A TW I373093 B TWI373093 B TW I373093B
Authority
TW
Taiwan
Application number
TW097119481A
Other versions
TW200903705A (en
Inventor
Abe Yoshihiro
Matsumura Shigeru
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200903705A publication Critical patent/TW200903705A/zh
Application granted granted Critical
Publication of TWI373093B publication Critical patent/TWI373093B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
TW097119481A 2007-05-31 2008-05-27 Fixing device of probe card TW200903705A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007145410 2007-05-31

Publications (2)

Publication Number Publication Date
TW200903705A TW200903705A (en) 2009-01-16
TWI373093B true TWI373093B (zh) 2012-09-21

Family

ID=40074958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097119481A TW200903705A (en) 2007-05-31 2008-05-27 Fixing device of probe card

Country Status (6)

Country Link
US (1) US8212579B2 (zh)
JP (1) JP5306192B2 (zh)
KR (1) KR101142760B1 (zh)
CN (1) CN101681861A (zh)
TW (1) TW200903705A (zh)
WO (1) WO2008146705A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5835722B2 (ja) * 2009-12-10 2015-12-24 オルボテック エルティ ソラー，エルエルシー 自動順位付け多方向直列型処理装置
JP4873083B2 (ja) * 2010-01-08 2012-02-08 横河電機株式会社 半導体試験装置
KR101688049B1 (ko) * 2010-12-03 2016-12-20 삼성전자 주식회사 테스터 및 그 테스터를 포함한 테스트 장치
US8736294B2 (en) * 2010-12-14 2014-05-27 Formfactor, Inc. Probe card stiffener with decoupling
US9134357B1 (en) * 2011-03-25 2015-09-15 Maxim Integrated, Inc. Universal direct docking at probe test
US8842057B2 (en) 2011-09-27 2014-09-23 Z124 Detail on triggers: transitional states
ITVI20110343A1 (it) * 2011-12-30 2013-07-01 St Microelectronics Srl Sistema e adattatore per testare chips con circuiti integrati in un package
JP6054150B2 (ja) * 2012-11-22 2016-12-27 日本電子材料株式会社 プローブカードケース及びプローブカードの搬送方法
CN103018496A (zh) * 2012-12-14 2013-04-03 深圳市天微电子有限公司 晶圆测试装置
TWI565951B (zh) * 2015-08-24 2017-01-11 旺矽科技股份有限公司 探針頭
TWI604198B (zh) * 2016-06-22 2017-11-01 思達科技股份有限公司 測試裝置、夾持組件及探針卡載具
CN108490925A (zh) * 2018-05-30 2018-09-04 苏州智华汽车电子有限公司 车载摄像头控制器功能检测治具
JP7129261B2 (ja) * 2018-07-27 2022-09-01 キオクシア株式会社 試験装置
KR102228162B1 (ko) * 2020-06-24 2021-03-15 오창준 프로브 홀더

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6972578B2 (en) * 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
JP3621938B2 (ja) 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
US7221430B2 (en) 2004-05-11 2007-05-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102004023987B4 (de) * 2004-05-14 2008-06-19 Feinmetall Gmbh Elektrische Prüfeinrichtung
JP4589710B2 (ja) * 2004-12-13 2010-12-01 株式会社日本マイクロニクス プローバ
JP4486880B2 (ja) * 2004-12-27 2010-06-23 日本電子材料株式会社 コンタクトプローブ
JP4642603B2 (ja) 2005-08-25 2011-03-02 東京エレクトロン株式会社 プローブカード

Also Published As

Publication number Publication date
JPWO2008146705A1 (ja) 2010-08-19
KR101142760B1 (ko) 2012-05-08
KR20100017810A (ko) 2010-02-16
TW200903705A (en) 2009-01-16
JP5306192B2 (ja) 2013-10-02
US8212579B2 (en) 2012-07-03
CN101681861A (zh) 2010-03-24
WO2008146705A1 (ja) 2008-12-04
US20100127726A1 (en) 2010-05-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees