TWI373044B - - Google Patents
Info
- Publication number
- TWI373044B TWI373044B TW096106512A TW96106512A TWI373044B TW I373044 B TWI373044 B TW I373044B TW 096106512 A TW096106512 A TW 096106512A TW 96106512 A TW96106512 A TW 96106512A TW I373044 B TWI373044 B TW I373044B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/7207—Heating or cooling of the moulded articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
- B29L2017/003—Records or discs
- B29L2017/005—CD''s, DVD''s
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006055278 | 2006-03-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200809852A TW200809852A (en) | 2008-02-16 |
TWI373044B true TWI373044B (zh) | 2012-09-21 |
Family
ID=38458955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096106512A TW200809852A (en) | 2006-03-01 | 2007-02-26 | Substrate processing apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090294073A1 (zh) |
JP (1) | JP4203966B2 (zh) |
KR (1) | KR20080047371A (zh) |
CN (1) | CN101341537B (zh) |
TW (1) | TW200809852A (zh) |
WO (1) | WO2007099844A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4898248B2 (ja) * | 2006-03-09 | 2012-03-14 | 芝浦メカトロニクス株式会社 | スピン塗布装置及びスピン塗布方法 |
US8819673B1 (en) | 2007-05-24 | 2014-08-26 | United Services Automobile Association (Usaa) | Systems and methods for java virtual machine management |
US10559217B2 (en) | 2016-08-05 | 2020-02-11 | Intel Corporation | Methods and apparatus to develop in-vehicle experiences in simulated environments |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1505671A (en) * | 1924-02-20 | 1924-08-19 | Smith Annesley De Los | Method of heating and cooling plastic material and apparatus therefor |
KR940011708B1 (ko) * | 1990-04-09 | 1994-12-23 | 니찌덴 아네루바 가부시끼가이샤 | 기판온도제어기구 |
JPH10154359A (ja) * | 1996-11-21 | 1998-06-09 | Matsushita Electric Ind Co Ltd | 薄肉部品の成形方法およびその装置 |
JP3909944B2 (ja) * | 1998-01-12 | 2007-04-25 | キヤノンアネルバ株式会社 | 情報記録ディスク用基板の冷却機構及びこの冷却機構を備えた基板処理装置 |
JP2001052379A (ja) * | 1999-08-09 | 2001-02-23 | Matsushita Electric Ind Co Ltd | 光ディスクの製造方法及び装置 |
JP2002251803A (ja) * | 2001-02-26 | 2002-09-06 | Origin Electric Co Ltd | 光ディスク基板の貼り合わせ装置および光ディスク基板の貼り合わせ方法 |
JP2002358695A (ja) * | 2001-03-28 | 2002-12-13 | Origin Electric Co Ltd | ディスク基板の処理方法及び装置 |
JP2003048220A (ja) * | 2001-08-06 | 2003-02-18 | Dainippon Ink & Chem Inc | ディスク基板の冷却方法、ディスク基板冷却ユニット、ディスク基板冷却装置、およびディスク製造方法、ならびにディスク製造装置 |
JP3593660B2 (ja) * | 2001-12-05 | 2004-11-24 | オリジン電気株式会社 | ディスク基板の処理方法及び処理装置 |
JP4121763B2 (ja) * | 2002-04-08 | 2008-07-23 | Tdk株式会社 | 薄膜形成装置に対する基板の交換ユニットおよび基板交換方法 |
JP4653418B2 (ja) * | 2004-05-17 | 2011-03-16 | 芝浦メカトロニクス株式会社 | 真空処理装置および光ディスクの製造方法 |
-
2007
- 2007-02-22 WO PCT/JP2007/053260 patent/WO2007099844A1/ja active Application Filing
- 2007-02-22 US US11/997,284 patent/US20090294073A1/en not_active Abandoned
- 2007-02-22 CN CN2007800008730A patent/CN101341537B/zh not_active Expired - Fee Related
- 2007-02-22 JP JP2008502732A patent/JP4203966B2/ja not_active Expired - Fee Related
- 2007-02-22 KR KR1020087004643A patent/KR20080047371A/ko not_active Application Discontinuation
- 2007-02-26 TW TW096106512A patent/TW200809852A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200809852A (en) | 2008-02-16 |
JPWO2007099844A1 (ja) | 2009-07-16 |
US20090294073A1 (en) | 2009-12-03 |
JP4203966B2 (ja) | 2009-01-07 |
WO2007099844A1 (ja) | 2007-09-07 |
CN101341537B (zh) | 2011-04-06 |
KR20080047371A (ko) | 2008-05-28 |
CN101341537A (zh) | 2009-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |