TWI371118B - Optoelectronic component and illumination device - Google Patents
Optoelectronic component and illumination deviceInfo
- Publication number
- TWI371118B TWI371118B TW096123495A TW96123495A TWI371118B TW I371118 B TWI371118 B TW I371118B TW 096123495 A TW096123495 A TW 096123495A TW 96123495 A TW96123495 A TW 96123495A TW I371118 B TWI371118 B TW I371118B
- Authority
- TW
- Taiwan
- Prior art keywords
- illumination device
- optoelectronic component
- optoelectronic
- component
- illumination
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006030253 | 2006-06-30 | ||
| DE102006050880A DE102006050880A1 (de) | 2006-06-30 | 2006-10-27 | Optoelektronisches Bauteil und Beleuchtungseinrichtung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200810158A TW200810158A (en) | 2008-02-16 |
| TWI371118B true TWI371118B (en) | 2012-08-21 |
Family
ID=38523529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096123495A TWI371118B (en) | 2006-06-30 | 2007-06-28 | Optoelectronic component and illumination device |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8172433B2 (enExample) |
| EP (1) | EP2036136A2 (enExample) |
| JP (1) | JP2009542017A (enExample) |
| KR (1) | KR20090026204A (enExample) |
| CN (2) | CN102544335B (enExample) |
| DE (1) | DE102006050880A1 (enExample) |
| TW (1) | TWI371118B (enExample) |
| WO (1) | WO2008000244A2 (enExample) |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US8541795B2 (en) | 2004-10-12 | 2013-09-24 | Cree, Inc. | Side-emitting optical coupling device |
| DE102006050880A1 (de) * | 2006-06-30 | 2008-04-17 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Beleuchtungseinrichtung |
| DE102008005120A1 (de) * | 2008-01-18 | 2009-09-10 | Osram Gesellschaft mit beschränkter Haftung | LED-Modul mit einer Linse |
| DE102008006229B4 (de) | 2008-01-25 | 2013-08-29 | We-Ef Leuchten Gmbh & Co. Kg | Straßenbeleuchtungseinrichtung |
| US9557033B2 (en) | 2008-03-05 | 2017-01-31 | Cree, Inc. | Optical system for batwing distribution |
| JP2009218243A (ja) * | 2008-03-07 | 2009-09-24 | Stanley Electric Co Ltd | 光学レンズと、この光学レンズを使用した照明装置及び受光装置 |
| JP5336879B2 (ja) * | 2009-02-23 | 2013-11-06 | 日東光学株式会社 | 光学素子および発光装置ならびに道路灯 |
| US8293548B2 (en) * | 2009-03-04 | 2012-10-23 | Unilumin Group Co., Ltd. | LED light module for street lamp and method of manufacturing same |
| DE102009015313B4 (de) * | 2009-03-27 | 2022-02-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Anzeigeeinrichtung |
| CH701116A1 (fr) | 2009-05-25 | 2010-11-30 | Code Lighting Sa | Dispositif d'eclairage d'une surface, comportant au moins une source lumineuse du type a diode electroluminescente. |
| JP5138813B2 (ja) * | 2009-06-30 | 2013-02-06 | シャープ株式会社 | 照明装置、表示装置、及びテレビ受信装置 |
| WO2011001749A1 (ja) * | 2009-06-30 | 2011-01-06 | シャープ株式会社 | 照明装置、表示装置、及びテレビ受信装置 |
| US20110141729A1 (en) | 2009-12-11 | 2011-06-16 | Osram Sylvania Inc. | Retrofit-Style Lamp and Fixture, Each Including a One-Dimensional Linear Batwing Lens |
| US8434914B2 (en) * | 2009-12-11 | 2013-05-07 | Osram Sylvania Inc. | Lens generating a batwing-shaped beam distribution, and method therefor |
| WO2011086652A1 (ja) * | 2010-01-13 | 2011-07-21 | パナソニック株式会社 | 発光装置およびこれを用いた面光源装置 |
| US8743315B2 (en) | 2010-02-02 | 2014-06-03 | Panasonic Corporation | Surface light source device, liquid crystal display device, and lens |
| DE102010007751B4 (de) * | 2010-02-12 | 2020-08-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Linse, optoelektronisches Halbleiterbauelement und Beleuchtungseinrichtung |
| US20110228528A1 (en) * | 2010-03-17 | 2011-09-22 | Osram Sylvania Inc. | Retrofit-style lamp and fixture, each including a one-dimensional linear batwing lens |
| DE102010027875A1 (de) * | 2010-04-16 | 2011-10-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
| DE102010028416A1 (de) * | 2010-04-30 | 2011-11-03 | Tridonic Jennersdorf Gmbh | LED-Modul mit Linse zum Erzeugen einer nicht rotationssymmetrischen Lichtverteilung |
| US8431942B2 (en) * | 2010-05-07 | 2013-04-30 | Koninklijke Philips Electronics N.V. | LED package with a rounded square lens |
| JP5673923B2 (ja) * | 2010-06-09 | 2015-02-18 | コニカミノルタ株式会社 | 照明装置 |
| DE102010027212A1 (de) * | 2010-07-15 | 2012-01-19 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement |
| CN103154604A (zh) * | 2010-12-16 | 2013-06-12 | 松下电器产业株式会社 | 背光装置以及液晶显示装置 |
| ITVI20110038A1 (it) * | 2011-03-02 | 2012-09-03 | Beghelli Spa | Apparecchio illuminante ad emissione fotometrica controllata |
| US20130135876A1 (en) * | 2011-05-26 | 2013-05-30 | William E. Phillips, III | Extended led light source with color distribution correcting optics |
| KR20120131955A (ko) * | 2011-05-27 | 2012-12-05 | 삼성전자주식회사 | 발광장치 |
| DE102012102119A1 (de) | 2012-03-13 | 2013-09-19 | Osram Opto Semiconductors Gmbh | Flächenlichtquelle |
| JP6035793B2 (ja) * | 2012-03-14 | 2016-11-30 | ソニー株式会社 | 画像表示装置及び画像生成装置 |
| CN102818216B (zh) * | 2012-06-05 | 2014-08-06 | 佛山市国星光电股份有限公司 | 一种大角度透镜及大角度出光的led光源模块 |
| DE102012110403A1 (de) | 2012-10-30 | 2014-04-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| EP2958097B1 (en) * | 2013-02-14 | 2019-09-18 | LG Electronics Inc. | Display apparatus |
| KR102060790B1 (ko) | 2013-06-19 | 2019-12-31 | 삼성디스플레이 주식회사 | 광학 구조체 및 백라이트 유닛 |
| USD774006S1 (en) * | 2014-08-27 | 2016-12-13 | Mitsubishi Electric Corporation | Light source module |
| USD780704S1 (en) * | 2014-08-27 | 2017-03-07 | Mitsubishi Electric Corporation | Light source module |
| USD768584S1 (en) * | 2014-11-13 | 2016-10-11 | Mitsubishi Electric Corporation | Light source module |
| EP3279555B1 (en) * | 2015-03-31 | 2021-09-01 | Sony Group Corporation | Lens for light source, illumination device, and display device |
| USD779112S1 (en) | 2015-04-24 | 2017-02-14 | Abl Ip Holding Llc | Tri-lobe light fixture optic |
| US10393341B2 (en) | 2015-04-24 | 2019-08-27 | Abl Ip Holding Llc | Tri-lobe optic and associated light fixtures |
| CN109073189A (zh) * | 2015-06-01 | 2018-12-21 | 亮锐控股有限公司 | 具有细长的辐射图案的透镜 |
| WO2017061370A1 (ja) * | 2015-10-07 | 2017-04-13 | 株式会社エンプラス | 光束制御部材、発光装置、面光源装置および表示装置 |
| JP6714988B2 (ja) * | 2015-10-07 | 2020-07-01 | 株式会社エンプラス | 光束制御部材、発光装置、面光源装置および表示装置 |
| JP2018036407A (ja) * | 2016-08-30 | 2018-03-08 | 株式会社エンプラス | 光束制御部材、発光装置、面光源装置および表示装置 |
| TWI610470B (zh) * | 2016-06-13 | 2018-01-01 | 隆達電子股份有限公司 | 發光二極體晶片級封裝結構、直下式背光模組及發光裝置的製造方法 |
| DE102016115918B4 (de) * | 2016-08-26 | 2024-12-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauteil mit einem Streuelement |
| KR102409632B1 (ko) * | 2016-11-09 | 2022-06-16 | 루미리즈 홀딩 비.브이. | 교환 가능한 조명 캡을 갖는 조명 배열 |
| DE202016107411U1 (de) * | 2016-12-28 | 2018-04-03 | Zumtobel Lighting Gmbh | Refraktive Optik mit Freiformkörper |
| CN107340552A (zh) * | 2017-08-22 | 2017-11-10 | 广州创维平面显示科技有限公司 | 一种透镜以及直下式背光模组 |
| US10851967B2 (en) * | 2017-11-17 | 2020-12-01 | Osram Gmbh | Lens, corresponding lighting device, lighting installation and method |
| CN108180408B (zh) * | 2017-11-30 | 2020-11-03 | 北京灵犀微光科技有限公司 | 中继镜头及照明系统 |
| CN114017744A (zh) * | 2021-11-26 | 2022-02-08 | 欧普照明股份有限公司 | 一种透镜、透镜的设计方法及光源模组 |
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-
2006
- 2006-10-27 DE DE102006050880A patent/DE102006050880A1/de not_active Withdrawn
-
2007
- 2007-06-28 KR KR1020097001919A patent/KR20090026204A/ko not_active Ceased
- 2007-06-28 CN CN201210016842.7A patent/CN102544335B/zh not_active Expired - Fee Related
- 2007-06-28 EP EP07785582A patent/EP2036136A2/de not_active Withdrawn
- 2007-06-28 JP JP2009516891A patent/JP2009542017A/ja active Pending
- 2007-06-28 TW TW096123495A patent/TWI371118B/zh not_active IP Right Cessation
- 2007-06-28 US US12/305,491 patent/US8172433B2/en not_active Expired - Fee Related
- 2007-06-28 WO PCT/DE2007/001149 patent/WO2008000244A2/de not_active Ceased
- 2007-06-28 CN CN2007800242206A patent/CN101479859B/zh not_active Expired - Fee Related
-
2012
- 2012-05-07 US US13/465,170 patent/US8672500B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US8672500B2 (en) | 2014-03-18 |
| KR20090026204A (ko) | 2009-03-11 |
| JP2009542017A (ja) | 2009-11-26 |
| TW200810158A (en) | 2008-02-16 |
| WO2008000244A3 (de) | 2008-07-31 |
| US8172433B2 (en) | 2012-05-08 |
| US20090284951A1 (en) | 2009-11-19 |
| US20120218739A1 (en) | 2012-08-30 |
| CN102544335B (zh) | 2014-10-08 |
| DE102006050880A1 (de) | 2008-04-17 |
| CN102544335A (zh) | 2012-07-04 |
| CN101479859A (zh) | 2009-07-08 |
| WO2008000244A2 (de) | 2008-01-03 |
| CN101479859B (zh) | 2012-03-28 |
| EP2036136A2 (de) | 2009-03-18 |
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| Date | Code | Title | Description |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |