TWI371097B - - Google Patents

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Publication number
TWI371097B
TWI371097B TW096142092A TW96142092A TWI371097B TW I371097 B TWI371097 B TW I371097B TW 096142092 A TW096142092 A TW 096142092A TW 96142092 A TW96142092 A TW 96142092A TW I371097 B TWI371097 B TW I371097B
Authority
TW
Taiwan
Application number
TW096142092A
Other versions
TW200836321A (en
Inventor
Naoki Komai
Takuya Nakamura
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200836321A publication Critical patent/TW200836321A/zh
Application granted granted Critical
Publication of TWI371097B publication Critical patent/TWI371097B/zh

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    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
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