TWI371077B - Stage apparatus - Google Patents

Stage apparatus

Info

Publication number
TWI371077B
TWI371077B TW096106641A TW96106641A TWI371077B TW I371077 B TWI371077 B TW I371077B TW 096106641 A TW096106641 A TW 096106641A TW 96106641 A TW96106641 A TW 96106641A TW I371077 B TWI371077 B TW I371077B
Authority
TW
Taiwan
Prior art keywords
stage apparatus
stage
Prior art date
Application number
TW096106641A
Other languages
English (en)
Other versions
TW200746347A (en
Inventor
Yasuzou Tanaka
Junpei Yuyama
Mitsuru Yahagi
Hirofumi Minami
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of TW200746347A publication Critical patent/TW200746347A/zh
Application granted granted Critical
Publication of TWI371077B publication Critical patent/TWI371077B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Coating Apparatus (AREA)
  • Machine Tool Units (AREA)
TW096106641A 2006-03-06 2007-02-27 Stage apparatus TWI371077B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006059836 2006-03-06

Publications (2)

Publication Number Publication Date
TW200746347A TW200746347A (en) 2007-12-16
TWI371077B true TWI371077B (en) 2012-08-21

Family

ID=38474760

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096106641A TWI371077B (en) 2006-03-06 2007-02-27 Stage apparatus

Country Status (6)

Country Link
US (1) US20090092467A1 (zh)
JP (1) JP5027108B2 (zh)
KR (1) KR100969554B1 (zh)
CN (1) CN101326625B (zh)
TW (1) TWI371077B (zh)
WO (1) WO2007102321A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009028525A1 (ja) * 2007-08-28 2009-03-05 Ulvac, Inc. ステージ装置組み立て方法
JP5274960B2 (ja) * 2008-09-26 2013-08-28 株式会社ディスコ 切削装置
JP4881965B2 (ja) * 2009-02-16 2012-02-22 株式会社日立ハイテクノロジーズ 液晶露光装置
JP5550255B2 (ja) * 2009-04-28 2014-07-16 株式会社日立製作所 ペースト塗布装置及び塗布方法
JP5525182B2 (ja) * 2009-05-14 2014-06-18 株式会社日立製作所 ペースト塗布装置及び塗布方法
CN108972627B (zh) * 2018-08-31 2019-05-31 南京涵铭置智能科技有限公司 一种便于进行安装机械臂用固定装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07124831A (ja) * 1993-06-11 1995-05-16 Mori Seiki Co Ltd リニアガイド装置
JP3011367B2 (ja) * 1997-11-11 2000-02-21 川崎重工業株式会社 ３次元自動計測装置
JP3701882B2 (ja) * 2001-05-25 2005-10-05 株式会社 日立インダストリイズ ペースト塗布機
TW200507946A (en) * 2003-07-18 2005-03-01 Sumitomo Heavy Industries Working table device for table type coating applicator
US20050020338A1 (en) * 2003-07-24 2005-01-27 Jeremy Stein Casino card game
US7077019B2 (en) * 2003-08-08 2006-07-18 Photon Dynamics, Inc. High precision gas bearing split-axis stage for transport and constraint of large flat flexible media during processing
WO2006020685A2 (en) * 2004-08-11 2006-02-23 Cornell Research Foundation, Inc. Modular fabrication systems and methods
US7255747B2 (en) * 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
JP4664117B2 (ja) * 2005-03-03 2011-04-06 住友重機械工業株式会社 搬送物浮上ユニット、搬送物浮上装置、及びステージ装置
WO2007105455A1 (ja) * 2006-02-28 2007-09-20 Ulvac, Inc. ステージ装置

Also Published As

Publication number Publication date
WO2007102321A1 (ja) 2007-09-13
TW200746347A (en) 2007-12-16
CN101326625B (zh) 2010-04-21
JP5027108B2 (ja) 2012-09-19
JPWO2007102321A1 (ja) 2009-07-23
US20090092467A1 (en) 2009-04-09
CN101326625A (zh) 2008-12-17
KR20080026539A (ko) 2008-03-25
KR100969554B1 (ko) 2010-07-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees