TWI369716B - Resin composition for encapsulating semiconductor - Google Patents

Resin composition for encapsulating semiconductor

Info

Publication number
TWI369716B
TWI369716B TW094101867A TW94101867A TWI369716B TW I369716 B TWI369716 B TW I369716B TW 094101867 A TW094101867 A TW 094101867A TW 94101867 A TW94101867 A TW 94101867A TW I369716 B TWI369716 B TW I369716B
Authority
TW
Taiwan
Prior art keywords
resin composition
encapsulating semiconductor
encapsulating
semiconductor
resin
Prior art date
Application number
TW094101867A
Other languages
English (en)
Other versions
TW200537578A (en
Inventor
Hiroshi Noro
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004013396A external-priority patent/JP2005206664A/ja
Priority claimed from JP2004013405A external-priority patent/JP4417122B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200537578A publication Critical patent/TW200537578A/zh
Application granted granted Critical
Publication of TWI369716B publication Critical patent/TWI369716B/zh

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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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TW200923006A (en) * 2007-07-11 2009-06-01 Nissan Chemical Ind Ltd Liquid epoxy resin forming formulation containing inorganic particles
US8759957B2 (en) * 2008-02-07 2014-06-24 Sumitomo Bakelite Company Limited Film for use in manufacturing semiconductor device, method for producing semiconductor device and semiconductor device
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JP4801127B2 (ja) * 2008-09-01 2011-10-26 日東電工株式会社 ダイシング・ダイボンドフィルムの製造方法
US20100244286A1 (en) * 2008-10-06 2010-09-30 Lagsa Earl Vincent B Nanocomposites for optoelectronic devices
JP5234029B2 (ja) * 2009-08-05 2013-07-10 山栄化学株式会社 無洗浄活性樹脂組成物及び表面実装技術
DE102010032555A1 (de) * 2010-07-29 2012-02-02 Siemens Aktiengesellschaft Isolierung für rotierende elektrische Maschinen
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JP6135991B2 (ja) * 2012-10-11 2017-05-31 パナソニックＩｐマネジメント株式会社 封止用エポキシ樹脂無機複合シート
DE102014219765A1 (de) * 2014-09-30 2016-03-31 Siemens Aktiengesellschaft Formulierung für ein Isoliersystem und Isoliersystem
KR101922296B1 (ko) * 2016-06-23 2018-11-26 삼성에스디아이 주식회사 고체상 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 포함하는 봉지재 및 반도체 패키지

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KR20050076660A (ko) 2005-07-26
EP1557880A1 (en) 2005-07-27
TW200537578A (en) 2005-11-16
US20050158557A1 (en) 2005-07-21

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