TWI369368B - Epoxy resin, epoxy resin composition and cured object thereof - Google Patents
Epoxy resin, epoxy resin composition and cured object thereofInfo
- Publication number
- TWI369368B TWI369368B TW094121119A TW94121119A TWI369368B TW I369368 B TWI369368 B TW I369368B TW 094121119 A TW094121119 A TW 094121119A TW 94121119 A TW94121119 A TW 94121119A TW I369368 B TWI369368 B TW I369368B
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- cured object
- resin composition
- composition
- cured
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title 2
- 229920000647 polyepoxide Polymers 0.000 title 2
- 239000000203 mixture Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004188844 | 2004-06-25 | ||
JP2004188841 | 2004-06-25 | ||
PCT/JP2005/011670 WO2006001395A1 (ja) | 2004-06-25 | 2005-06-24 | エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200610773A TW200610773A (en) | 2006-04-01 |
TWI369368B true TWI369368B (en) | 2012-08-01 |
Family
ID=35781837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094121119A TWI369368B (en) | 2004-06-25 | 2005-06-24 | Epoxy resin, epoxy resin composition and cured object thereof |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080021173A1 (zh) |
EP (1) | EP1760101A1 (zh) |
JP (1) | JP5284586B2 (zh) |
KR (1) | KR20070034534A (zh) |
CA (1) | CA2570409A1 (zh) |
TW (1) | TWI369368B (zh) |
WO (1) | WO2006001395A1 (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080204418A1 (en) * | 2007-02-27 | 2008-08-28 | Adam Cybart | Adaptable User Interface and Mechanism for a Portable Electronic Device |
JP4349424B2 (ja) * | 2007-03-13 | 2009-10-21 | セイコーエプソン株式会社 | カラーフィルター用インク、カラーフィルター、画像表示装置、および、電子機器 |
US8902152B2 (en) * | 2007-04-30 | 2014-12-02 | Motorola Mobility Llc | Dual sided electrophoretic display |
JP2009019114A (ja) * | 2007-07-12 | 2009-01-29 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
US8077154B2 (en) * | 2007-08-13 | 2011-12-13 | Motorola Mobility, Inc. | Electrically non-interfering printing for electronic devices having capacitive touch sensors |
JP5360055B2 (ja) * | 2008-05-13 | 2013-12-04 | 日立化成株式会社 | 光導波路の製造方法及び光導波路 |
EP2486075A1 (en) * | 2009-10-07 | 2012-08-15 | Dow Global Technologies LLC | Reducing impurities in solid epoxy resin |
JP2013181124A (ja) * | 2012-03-02 | 2013-09-12 | Sumitomo Bakelite Co Ltd | 一液型エポキシ樹脂組成物、硬化物、モータ及び発電機 |
US20140099456A1 (en) * | 2012-10-09 | 2014-04-10 | Venkatkrishna Raghavendran | Fiber reinforced polymer strengthening system |
JP6090784B2 (ja) * | 2013-04-19 | 2017-03-08 | 日本化薬株式会社 | エポキシ樹脂ワニス、エポキシ樹脂組成物、硬化性シート、プリプレグ、積層板、プリント配線板および半導体装置 |
US9472771B2 (en) * | 2013-10-31 | 2016-10-18 | Sabic Global Technologies B.V. | Method of making axially fluorinated-phthalocyanines with an aprotic fluoride compound |
JP2018003024A (ja) * | 2013-11-12 | 2018-01-11 | Jfeケミカル株式会社 | エポキシ樹脂硬化物の中間体 |
JP6227505B2 (ja) | 2013-11-12 | 2017-11-08 | Jfeケミカル株式会社 | エポキシ樹脂組成物およびエポキシ樹脂硬化物 |
US10138325B2 (en) * | 2016-05-12 | 2018-11-27 | Chang Chun Plastics Co., Ltd. | Polyphenolic condensates and epoxy resins thereof |
US11015818B1 (en) | 2020-09-18 | 2021-05-25 | The Gritchie Kitchen Company Limited | Table having a heating appliance |
EP4323589A1 (en) * | 2021-04-11 | 2024-02-21 | P.R.S Geo Tech Technologies Ltd. | Cellular confinement system |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0788418B2 (ja) * | 1987-05-08 | 1995-09-27 | 宇部興産株式会社 | エポキシ樹脂組成物 |
JPH0651777B2 (ja) * | 1989-02-21 | 1994-07-06 | 株式会社日立製作所 | 熱硬化性樹脂組成物及びそれを用いたコイル、パネル |
JPH02238018A (ja) * | 1989-03-13 | 1990-09-20 | Yuka Shell Epoxy Kk | 封止用エポキシ樹脂組成物 |
JP2732162B2 (ja) * | 1991-12-06 | 1998-03-25 | 日本化薬株式会社 | 高純度エポキシ樹脂の製造法 |
JP2004010877A (ja) * | 2002-06-12 | 2004-01-15 | Nippon Kayaku Co Ltd | 結晶性エポキシ樹脂、及びその製法 |
JP4023594B2 (ja) * | 2002-07-09 | 2007-12-19 | 日本化薬株式会社 | エポキシ樹脂組成物、及びその硬化物 |
-
2005
- 2005-06-24 EP EP05753292A patent/EP1760101A1/en not_active Withdrawn
- 2005-06-24 US US11/629,313 patent/US20080021173A1/en not_active Abandoned
- 2005-06-24 JP JP2006528643A patent/JP5284586B2/ja not_active Expired - Fee Related
- 2005-06-24 CA CA002570409A patent/CA2570409A1/en not_active Abandoned
- 2005-06-24 WO PCT/JP2005/011670 patent/WO2006001395A1/ja not_active Application Discontinuation
- 2005-06-24 KR KR1020067027673A patent/KR20070034534A/ko not_active Application Discontinuation
- 2005-06-24 TW TW094121119A patent/TWI369368B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2570409A1 (en) | 2006-01-05 |
US20080021173A1 (en) | 2008-01-24 |
KR20070034534A (ko) | 2007-03-28 |
TW200610773A (en) | 2006-04-01 |
WO2006001395A1 (ja) | 2006-01-05 |
JPWO2006001395A1 (ja) | 2008-04-17 |
EP1760101A1 (en) | 2007-03-07 |
JP5284586B2 (ja) | 2013-09-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |