TWI369368B - Epoxy resin, epoxy resin composition and cured object thereof - Google Patents

Epoxy resin, epoxy resin composition and cured object thereof

Info

Publication number
TWI369368B
TWI369368B TW094121119A TW94121119A TWI369368B TW I369368 B TWI369368 B TW I369368B TW 094121119 A TW094121119 A TW 094121119A TW 94121119 A TW94121119 A TW 94121119A TW I369368 B TWI369368 B TW I369368B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
cured object
resin composition
composition
cured
Prior art date
Application number
TW094121119A
Other languages
English (en)
Other versions
TW200610773A (en
Inventor
Masataka Nakanishi
Yasumasa Akatsuka
Katsuhiko Oshimi
Ryutaro Tanaka
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of TW200610773A publication Critical patent/TW200610773A/zh
Application granted granted Critical
Publication of TWI369368B publication Critical patent/TWI369368B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
TW094121119A 2004-06-25 2005-06-24 Epoxy resin, epoxy resin composition and cured object thereof TWI369368B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004188844 2004-06-25
JP2004188841 2004-06-25
PCT/JP2005/011670 WO2006001395A1 (ja) 2004-06-25 2005-06-24 エポキシ樹脂、エポキシ樹脂組成物及びその硬化物

Publications (2)

Publication Number Publication Date
TW200610773A TW200610773A (en) 2006-04-01
TWI369368B true TWI369368B (en) 2012-08-01

Family

ID=35781837

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121119A TWI369368B (en) 2004-06-25 2005-06-24 Epoxy resin, epoxy resin composition and cured object thereof

Country Status (7)

Country Link
US (1) US20080021173A1 (zh)
EP (1) EP1760101A1 (zh)
JP (1) JP5284586B2 (zh)
KR (1) KR20070034534A (zh)
CA (1) CA2570409A1 (zh)
TW (1) TWI369368B (zh)
WO (1) WO2006001395A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080204418A1 (en) * 2007-02-27 2008-08-28 Adam Cybart Adaptable User Interface and Mechanism for a Portable Electronic Device
JP4349424B2 (ja) * 2007-03-13 2009-10-21 セイコーエプソン株式会社 カラーフィルター用インク、カラーフィルター、画像表示装置、および、電子機器
US8902152B2 (en) * 2007-04-30 2014-12-02 Motorola Mobility Llc Dual sided electrophoretic display
JP2009019114A (ja) * 2007-07-12 2009-01-29 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
US8077154B2 (en) * 2007-08-13 2011-12-13 Motorola Mobility, Inc. Electrically non-interfering printing for electronic devices having capacitive touch sensors
JP5360055B2 (ja) * 2008-05-13 2013-12-04 日立化成株式会社 光導波路の製造方法及び光導波路
EP2486075A1 (en) * 2009-10-07 2012-08-15 Dow Global Technologies LLC Reducing impurities in solid epoxy resin
JP2013181124A (ja) * 2012-03-02 2013-09-12 Sumitomo Bakelite Co Ltd 一液型エポキシ樹脂組成物、硬化物、モータ及び発電機
US20140099456A1 (en) * 2012-10-09 2014-04-10 Venkatkrishna Raghavendran Fiber reinforced polymer strengthening system
JP6090784B2 (ja) * 2013-04-19 2017-03-08 日本化薬株式会社 エポキシ樹脂ワニス、エポキシ樹脂組成物、硬化性シート、プリプレグ、積層板、プリント配線板および半導体装置
US9472771B2 (en) * 2013-10-31 2016-10-18 Sabic Global Technologies B.V. Method of making axially fluorinated-phthalocyanines with an aprotic fluoride compound
JP2018003024A (ja) * 2013-11-12 2018-01-11 Jfeケミカル株式会社 エポキシ樹脂硬化物の中間体
JP6227505B2 (ja) 2013-11-12 2017-11-08 Jfeケミカル株式会社 エポキシ樹脂組成物およびエポキシ樹脂硬化物
US10138325B2 (en) * 2016-05-12 2018-11-27 Chang Chun Plastics Co., Ltd. Polyphenolic condensates and epoxy resins thereof
US11015818B1 (en) 2020-09-18 2021-05-25 The Gritchie Kitchen Company Limited Table having a heating appliance
EP4323589A1 (en) * 2021-04-11 2024-02-21 P.R.S Geo Tech Technologies Ltd. Cellular confinement system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0788418B2 (ja) * 1987-05-08 1995-09-27 宇部興産株式会社 エポキシ樹脂組成物
JPH0651777B2 (ja) * 1989-02-21 1994-07-06 株式会社日立製作所 熱硬化性樹脂組成物及びそれを用いたコイル、パネル
JPH02238018A (ja) * 1989-03-13 1990-09-20 Yuka Shell Epoxy Kk 封止用エポキシ樹脂組成物
JP2732162B2 (ja) * 1991-12-06 1998-03-25 日本化薬株式会社 高純度エポキシ樹脂の製造法
JP2004010877A (ja) * 2002-06-12 2004-01-15 Nippon Kayaku Co Ltd 結晶性エポキシ樹脂、及びその製法
JP4023594B2 (ja) * 2002-07-09 2007-12-19 日本化薬株式会社 エポキシ樹脂組成物、及びその硬化物

Also Published As

Publication number Publication date
CA2570409A1 (en) 2006-01-05
US20080021173A1 (en) 2008-01-24
KR20070034534A (ko) 2007-03-28
TW200610773A (en) 2006-04-01
WO2006001395A1 (ja) 2006-01-05
JPWO2006001395A1 (ja) 2008-04-17
EP1760101A1 (en) 2007-03-07
JP5284586B2 (ja) 2013-09-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees