TWI366872B - Apparatus and methods for spectrum based monitoring of chemical mechanical polishing - Google Patents

Apparatus and methods for spectrum based monitoring of chemical mechanical polishing

Info

Publication number
TWI366872B
TWI366872B TW099119185A TW99119185A TWI366872B TW I366872 B TWI366872 B TW I366872B TW 099119185 A TW099119185 A TW 099119185A TW 99119185 A TW99119185 A TW 99119185A TW I366872 B TWI366872 B TW I366872B
Authority
TW
Taiwan
Prior art keywords
methods
mechanical polishing
chemical mechanical
spectrum based
based monitoring
Prior art date
Application number
TW099119185A
Other languages
English (en)
Chinese (zh)
Other versions
TW201103085A (en
Inventor
Dominic J Benvegnu
Jeffrey Drue David
Bogdan Swedek
Harry Q Lee
Lakshmanan Karuppiah
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/213,674 external-priority patent/US7226339B2/en
Priority claimed from US11/261,742 external-priority patent/US7406394B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201103085A publication Critical patent/TW201103085A/zh
Application granted granted Critical
Publication of TWI366872B publication Critical patent/TWI366872B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW099119185A 2005-08-22 2006-08-22 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing TWI366872B (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US71068205P 2005-08-22 2005-08-22
US11/213,674 US7226339B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/213,675 US7306507B2 (en) 2005-08-22 2005-08-26 Polishing pad assembly with glass or crystalline window
US11/213,344 US7764377B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/261,742 US7406394B2 (en) 2005-08-22 2005-10-28 Spectra based endpointing for chemical mechanical polishing
US74776806P 2006-05-19 2006-05-19

Publications (2)

Publication Number Publication Date
TW201103085A TW201103085A (en) 2011-01-16
TWI366872B true TWI366872B (en) 2012-06-21

Family

ID=37560902

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099119185A TWI366872B (en) 2005-08-22 2006-08-22 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing

Country Status (4)

Country Link
JP (1) JP5534672B2 (enExample)
KR (1) KR101324644B1 (enExample)
TW (1) TWI366872B (enExample)
WO (1) WO2007024807A2 (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7998358B2 (en) 2006-10-31 2011-08-16 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
KR101678082B1 (ko) * 2007-02-23 2016-11-21 어플라이드 머티어리얼스, 인코포레이티드 연마 엔드포인트들을 결정하기 위한 스펙트럼 사용
US20090275265A1 (en) * 2008-05-02 2009-11-05 Applied Materials, Inc. Endpoint detection in chemical mechanical polishing using multiple spectra
US7967661B2 (en) 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
US8439723B2 (en) 2008-08-11 2013-05-14 Applied Materials, Inc. Chemical mechanical polisher with heater and method
US8414357B2 (en) 2008-08-22 2013-04-09 Applied Materials, Inc. Chemical mechanical polisher having movable slurry dispensers and method
JP5675617B2 (ja) * 2008-09-04 2015-02-25 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 加工時における基板の分光モニタリングを使用した研磨速度の調整
WO2010062497A2 (en) * 2008-10-27 2010-06-03 Applied Materials, Inc. Goodness of fit in spectrographic monitoring of a substrate during processing
US8751033B2 (en) * 2008-11-14 2014-06-10 Applied Materials, Inc. Adaptive tracking spectrum features for endpoint detection
US8579675B2 (en) * 2008-11-26 2013-11-12 Applied Materials, Inc. Methods of using optical metrology for feed back and feed forward process control
WO2011056485A2 (en) * 2009-11-03 2011-05-12 Applied Materials, Inc. Endpoint method using peak location of spectra contour plots versus time
JP5728239B2 (ja) 2010-03-02 2015-06-03 株式会社荏原製作所 研磨監視方法、研磨方法、研磨監視装置、および研磨装置
TWI496661B (zh) * 2010-04-28 2015-08-21 Applied Materials Inc 用於光學監測之參考光譜的自動產生
US9579767B2 (en) 2010-04-28 2017-02-28 Applied Materials, Inc. Automatic generation of reference spectra for optical monitoring of substrates
WO2011139571A2 (en) * 2010-05-05 2011-11-10 Applied Materials, Inc. Dynamically or adaptively tracking spectrum features for endpoint detection
US8834229B2 (en) 2010-05-05 2014-09-16 Applied Materials, Inc. Dynamically tracking spectrum features for endpoint detection
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
US8190285B2 (en) * 2010-05-17 2012-05-29 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing
JP2012019114A (ja) * 2010-07-08 2012-01-26 Tokyo Seimitsu Co Ltd 研磨終点検出装置、及び研磨終点検出方法
TWI478259B (zh) * 2010-07-23 2015-03-21 Applied Materials Inc 用於終點偵測之二維光譜特徵追蹤
JP5612945B2 (ja) 2010-07-23 2014-10-22 株式会社荏原製作所 基板の研磨の進捗を監視する方法および研磨装置
US8954186B2 (en) 2010-07-30 2015-02-10 Applied Materials, Inc. Selecting reference libraries for monitoring of multiple zones on a substrate
WO2012068428A2 (en) * 2010-11-18 2012-05-24 Cabot Microelectronics Corporation Polishing pad comprising transmissive region
JP5980476B2 (ja) 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法
US8547538B2 (en) * 2011-04-21 2013-10-01 Applied Materials, Inc. Construction of reference spectra with variations in environmental effects
KR101981814B1 (ko) * 2011-04-28 2019-05-23 어플라이드 머티어리얼스, 인코포레이티드 연마를 위한 모델 기반 스펙트럼 라이브러리의 생성
JP5715034B2 (ja) * 2011-11-30 2015-05-07 株式会社東京精密 研磨装置による研磨方法
US9289875B2 (en) * 2012-04-25 2016-03-22 Applied Materials, Inc. Feed forward and feed-back techniques for in-situ process control
US9221147B2 (en) * 2012-10-23 2015-12-29 Applied Materials, Inc. Endpointing with selective spectral monitoring
WO2014149330A1 (en) * 2013-03-15 2014-09-25 Applied Materials, Inc. Dynamic residue clearing control with in-situ profile control (ispc)
US10012494B2 (en) 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
JP7197999B2 (ja) 2018-05-11 2022-12-28 キオクシア株式会社 研磨装置および研磨パッド
KR102586252B1 (ko) * 2018-07-06 2023-10-11 주식회사 케이씨텍 기판의 실리콘 산화막 두께 검출 장치 및 방법
KR102808528B1 (ko) 2018-09-24 2025-05-16 어플라이드 머티어리얼스, 인코포레이티드 Cmp 프로세스 제어 알고리즘에 대한 입력으로서의 기계 시각
JP7253458B2 (ja) * 2019-06-27 2023-04-06 株式会社荏原製作所 光学式膜厚測定装置の最適な動作レシピを決定する方法、装置、およびシステム
JP7469032B2 (ja) * 2019-12-10 2024-04-16 株式会社荏原製作所 研磨方法および研磨装置
US11847776B2 (en) 2020-06-29 2023-12-19 Applied Materials, Inc. System using film thickness estimation from machine learning based processing of substrate images

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6271047B1 (en) * 1998-05-21 2001-08-07 Nikon Corporation Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
US6361646B1 (en) * 1998-06-08 2002-03-26 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
JP2000183001A (ja) * 1998-12-10 2000-06-30 Okamoto Machine Tool Works Ltd ウエハの研磨終点検出方法およびそれに用いる化学機械研磨装置
JP2000310512A (ja) * 1999-04-28 2000-11-07 Hitachi Ltd 薄膜の膜厚計測方法及びその装置並びにそれを用いた薄膜デバイスの製造方法及びその装置
JP3327289B2 (ja) * 2000-03-29 2002-09-24 株式会社ニコン 工程終了点測定装置及び測定方法及び研磨装置及び半導体デバイス製造方法及び信号処理プログラムを記録した記録媒体
JP3259225B2 (ja) * 1999-12-27 2002-02-25 株式会社ニコン 研磨状況モニタ方法及びその装置、研磨装置、プロセスウエハ、半導体デバイス製造方法、並びに半導体デバイス
JP2001287159A (ja) * 2000-04-05 2001-10-16 Nikon Corp 表面状態測定方法及び測定装置及び研磨装置及び半導体デバイス製造方法
JP3832198B2 (ja) * 2000-06-16 2006-10-11 日本電気株式会社 半導体ウェハの研磨終点検出方法ならびにその装置
US6676482B2 (en) * 2001-04-20 2004-01-13 Speedfam-Ipec Corporation Learning method and apparatus for predictive determination of endpoint during chemical mechanical planarization using sparse sampling
JP2002359217A (ja) * 2001-05-31 2002-12-13 Omron Corp 研磨終点検出方法およびその装置
JP3932836B2 (ja) * 2001-07-27 2007-06-20 株式会社日立製作所 薄膜の膜厚計測方法及びその装置並びにそれを用いたデバイスの製造方法
US6618130B2 (en) 2001-08-28 2003-09-09 Speedfam-Ipec Corporation Method and apparatus for optical endpoint detection during chemical mechanical polishing
US6942546B2 (en) * 2002-01-17 2005-09-13 Asm Nutool, Inc. Endpoint detection for non-transparent polishing member
US6806948B2 (en) * 2002-03-29 2004-10-19 Lam Research Corporation System and method of broad band optical end point detection for film change indication
JP4542324B2 (ja) * 2002-10-17 2010-09-15 株式会社荏原製作所 研磨状態監視装置及びポリッシング装置
JP2004165473A (ja) * 2002-11-14 2004-06-10 Seiko Epson Corp Ｃｍｐ装置、ｃｍｐ研磨方法、半導体装置及びその製造方法
US20050026542A1 (en) 2003-07-31 2005-02-03 Tezer Battal Detection system for chemical-mechanical planarization tool
JP2005159203A (ja) * 2003-11-28 2005-06-16 Hitachi Ltd 膜厚計測方法及びその装置、研磨レート算出方法並びにｃｍｐ加工方法及びその装置

Also Published As

Publication number Publication date
KR20080042895A (ko) 2008-05-15
WO2007024807A9 (en) 2009-09-03
WO2007024807A2 (en) 2007-03-01
JP2009505847A (ja) 2009-02-12
JP5534672B2 (ja) 2014-07-02
KR101324644B1 (ko) 2013-11-01
TW201103085A (en) 2011-01-16
WO2007024807A3 (en) 2007-07-12

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