1362217 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種影像感測模組封裝結構，尤其係涉及一 種數位相機用影像感測模組封裝結構。 【先前技術】 在光學成像産品中，為達到較佳之成像效果，應盡量 保持鏡頭模組與晶片模組對位之精準。 凊參閱圖1所示，—習知影像感測模組封農結構⑽ 包括一基板10、一晶片模組u、一鏡頭模組12及一粘著 ，13。該晶片模組n包括一用於感測光線之晶片丨"及 蓋設於晶片頂面之蓋板113。該晶片模組u藉由表面枯著 技術（Surface-mount technology，SMT)固定且電性連接 於f板10上。所述鏡頭模組12包括鏡頭座14及鏡頭15。 該名兄頭座14藉由粘著物丨3粘著於基板丨〇上。鏡頭1 $螺 接於鏡頭座14上。 ' 組裝時，該晶片模組U固定於基板1〇上形成一中心 對位基準A1。鏡頭座14㈣於基板10上形成-中心對位 基準A2。惟，所述二中心對位基準A1及A2存在一定偏 差，影響鏡頭15與晶片模組n對位之精準。 【發明内容】 有鑒於此，有必要提供一種能夠有效提高鏡頭模組盘 晶片模組對位準確度之影像感測模組封裝結構。 〃 種影像感測模組封裝結構，包括一基板、一晶片模 3 1362217 組及-鏡頭模組。該晶片模組設置於基板上，該晶片模组 包括-晶片。該鏡頭模組設置於基板上且包括一鏡頭座， 該鏡頭座包括-容置室及一與該容置室相貫通的鏡孔，該 容置室收容晶片模組並與該晶片模組之側部緊密配合，該 容置室周壁凸設-擋塊’該擋塊抵持晶片模組之頂面，該 擋塊與晶片模組之間涂覆一粘著物。 ~ 相較習知技術，所述影像感測模組封裝結構由於鏡頭 杈組之容置室與晶片模組之側部緊密配合，即使組裝時晶 片模組稍有位移，鏡頭模組可跟隨晶片模組而調整^與^ 板之裝配位置，即鏡頭座與晶片模組之中心對位基準 同一直線上。因此，所述影像感測模組封裝結構減小了鏡 頭模組與晶片模組之對位誤差，提高了對位精確度。 【實施方式】 請參閱圖2所示本發明之影像感測模組封裝結構第一 較佳實施例，該影像感測模組封裝結構2〇〇包括—美板 20、一晶片模組21、一鏡頭模組22、錫膏23及第—粘著 物24。 所述基板20係一平板體，具有一頂面（圖未標）及—底面 (圖未標）。該基板20包括複數設置於頂面之電性連接點 201 ’其用於與晶片模組21電性連接。 ‘” 所述晶片模組21包括一晶片211及一蓋板213。該晶 片211頂面具有一感測光線之感測區214，其與頂面相對 之底面具有複數引腳215。該蓋板213係一透明板，其尺 寸與晶片211之頂面尺寸相當。該蓋板213蓋設於晶片Μ! 4 1362217 上’以保護晶片211之感測區2 i 4。 /日日片模組21係藉由表面钻著技術（surface_m〇unt technoiogy，SMT)與基板2〇相連接，其中晶片模組2i 之複數引腳215與基板20之電性連接點2〇1藉由錫膏23 固接及電性連接。 所述鏡頭模組22包括一鏡頭座25及一鏡頭26。 忒鏡頭座25為一柱狀之中空筒體，其兩端開通並形成 一鏡孔255及一容置室257。該鏡孔255呈圓孔狀，其内 壁設有-内螺紋259。該容置室257之輪廓與該晶片模組 21之外輪廓相當。 所述鏡頭26包括一鏡筒261及至少一鏡片263。該鏡片 263固定於鏡筒261内。該鏡筒261外壁設置一外螺紋265。 鏡頭26藉由該外螺紋265與該鏡孔255之内螺紋259之配 合螺接於鏡頭座25上。 所述第一粘著物24係塗佈於鏡頭座25之底面，其粘 接鏡頭座25於基板2〇上。 ’ 組裝時，首先將晶片模組21設置於基板2〇上，然後 將所述裝配有鏡頭26之鏡頭座25與晶片模組21對準後罩 設於其上，此時，晶片模組21之外側部與容置室257之内 壁f密配合且容置於容置室257 β。由於容置室257與晶 片模組21緊密配合，即使晶片模組21稍有位移，鏡頭2 25亦可跟隨晶片模組21而調整其與基板川之装配位置， 即鏡頭座25及晶片模組21之中心對位基準均位於μ上。 因此，所述影像感测模組封裝結構200可減小對位誤差， 5 1362217 提高對位精確度。 請參照圖3所示本發明之影像感測模組封裝結構第二 較佳實施例，該影像感測模組封裝結構3〇〇與影像感測模 組封褒結構200相似，其包括一基板2〇、一晶片模組21、 一鏡頭模組32、錫膏23及第一粘著物24。所述鏡頭模組 32包括一鏡頭座35及一螺接於該鏡頭座35之鏡頭26。該 鏡頭座35具有，351。其不同之處在於，該影像感： 模組封裝結構300還包括一環狀擋塊353及第二粘著物 27。該環狀擋塊353凸設於所述内壁351上，並抵持蓋板 213,頂面，其可防止鏡頭座25與基板2〇之間縫隙過小， 導致第一粘著物24溢出。該第-钍基輪 忒弟一拈者物27係塗佈於擋塊 3”盍板213之間’以增強模組結合強度。同時，由於讲 353 ’可更佳更快速地定位鏡片加與晶片模二 間之間距。易知，本實施例中之第二枯著物27可省去。 睛參照圖4所示本發明之影像感測模組封裝 較佳實施例，該影像感測模㈣裝 ^ ^ 組封裝結構3⑼相似，其包括一基板4〇、一晶=模 一鏡頭模組42、錫膏23、第—粘著物24 、汲21、 所述鏡頭模組42包括—鏡弟一粘著物27。 ^ ^ 鏡碩座45及一螺接於該鏡頭座45 之鏡碩26。其不同之處在於， 兄碩厘45 數第—腳針451，其；/…兄1座45底端凸設有複 土板20相對應地設置複 —腳針451與凹槽4〇u日电人 置複數凹槽40卜第 接，浐-s 嵌合，且藉由第一粘著物24相钻 還1更加牢固地固定於基板40上，另…士接 遏"有更好之遮蔽外界光 此、，·。構 效果易知，本實施例f之 6 1362217 •二塊453及第二枯著物27可省去，亦可只省去第二枯著物 請參照圖5所示之本發明之影像感測模組封裝 影像感測模組封裝結構5〇。與影糊 模二封裝、..。構遍相似，其包括—基板％、一晶片模組21、 :鏡頭模組52、錫膏23、第一點著物24及第 物 莫r包括一鏡頭座55及一螺接於該鏡… 其？之處在於’鏡頭座55底端凸設刪 一腳針⑸，基I 50相對應地設置複數通孔5〇1，第 =551與通孔501相丧合，且藉由第一枯著物μ相_， 55更加牢固地固^於基板％上另，此 有更好之遮蔽外界光線之效果。易知，本實施例中之凸塊 ^第二㈣物27可省去’亦可只省去第二”物27。 «以理解’上述較佳實施例中之鏡頭％可省去，而 鏡頭接固定至少一鏡片以滿足成像需求。 '、·不上料，本發明符合發明專财件，爰依 宰：蓺以上所述者僅為本發明之較佳實施例，舉凡 飾或變化，；=二:口作精神所作之等效修 應巴3於以下之申請專利範圍内。 【圖式簡單說明】 圖1係習知影像感龍組封裝結構之剖視圖。 之剖Γ圖係本發明影像感測模組封裝結構第—較佳實施例 圖3係本發明影像感測模組封裝結構第二較佳實施例 7 1362217 組封裝結構第 三較佳實施例 組封裝結構第 四較佳實施例 基板 10 晶片 111 鏡頭模組 12 鏡頭座 14 晶片模組中心 對位基準A1 基板 20 晶片模組 21 蓋板 213 引腳 215 錫膏 23 鏡頭座 25 容置室 257 鏡頭 26 鏡片 263 B1 之剖視圖。 圖4係本發明影像感測模 之剖視圖。 圖5係本發明影像感測模 之剖視圖。 【主要元件符號說明】 (習知） 影像感測模組封裝結構 100 晶片模組 11 蓋板 113 粘著物 13 鏡頭 15 鏡頭模組中心對位基準 A2 (本發明） 影像感測模組封裝結構 200 電性連接點 201 晶片 211 感測區 214 鏡頭模1且 22 第一粘著物 24 鏡孔 255 鏡孔内螺紋 259 鏡筒 261 鏡筒外螺紋 265 中心對位基準 8 1362217 影像感測模組封裝結構300 鏡頭模組 32 鏡頭座内壁 351 影像感測模組封裝結構400 鏡頭模組 42 擋塊 453 第一腳針 451 基板 50 鏡頭座 55 通孔 501 第二粘著物 27 鏡頭座 35 撞塊 353 基板 40 鏡頭座 45 凹槽 401 影像感測模組封裝結構500 鏡頭模組 52 擋塊 553 第二腳針 551 91362217 VI. Description of the Invention: [Technical Field] The present invention relates to an image sensing module package structure, and more particularly to an image sensing module package structure for a digital camera. [Prior Art] In optical imaging products, in order to achieve better imaging results, the alignment of the lens module and the wafer module should be kept as precise as possible. Referring to FIG. 1 , the conventional image sensing module sealing structure (10) includes a substrate 10, a wafer module u, a lens module 12, and a sticker 13 . The wafer module n includes a wafer 感 for sensing light and a cover 113 covering the top surface of the wafer. The wafer module u is fixed and electrically connected to the f-plate 10 by a surface-mount technology (SMT). The lens module 12 includes a lens mount 14 and a lens 15 . The dude 14 is adhered to the substrate by the adhesive 丨3. The lens 1$ is screwed onto the lens mount 14. When assembled, the wafer module U is fixed on the substrate 1 to form a center registration reference A1. The lens mount 14 (four) forms a center-alignment reference A2 on the substrate 10. However, there is a certain deviation between the two center alignment references A1 and A2, which affects the accuracy of the alignment between the lens 15 and the wafer module n. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an image sensing module package structure capable of effectively improving the alignment accuracy of a lens module disk chip module. The image sensing module package structure comprises a substrate, a wafer module 3 1362217 group and a lens module. The wafer module is disposed on a substrate, and the wafer module includes a wafer. The lens module is disposed on the substrate and includes a lens holder. The lens holder includes a receiving chamber and a mirror hole extending through the receiving chamber. The receiving chamber houses the wafer module and is coupled to the wafer module. The side portion is tightly fitted, and the peripheral wall of the accommodating chamber protrudes-stops. The stopper abuts against the top surface of the wafer module, and an adhesive is applied between the stopper and the wafer module. Compared with the prior art, the image sensing module package structure is closely matched with the side of the wafer module by the housing of the lens unit, and the lens module can follow the wafer even if the wafer module is slightly displaced during assembly. The assembly position of the ^ and ^ boards is adjusted on the same line as the center alignment of the lens holder and the wafer module. Therefore, the image sensing module package structure reduces the alignment error between the lens module and the wafer module, and improves the alignment accuracy. [Embodiment] Please refer to the first preferred embodiment of the image sensing module package structure of the present invention shown in FIG. 2, the image sensing module package structure 2 includes a US board 20, a chip module 21, A lens module 22, a solder paste 23 and a first adhesive 24. The substrate 20 is a flat body having a top surface (not shown) and a bottom surface (not shown). The substrate 20 includes a plurality of electrical connection points 201 ′ disposed on the top surface for electrically connecting to the wafer module 21 . The wafer module 21 includes a wafer 211 and a cover plate 213. The top surface of the wafer 211 has a sensing region 214 for sensing light, and a bottom surface 215 opposite the top surface has a plurality of pins 215. The 213 is a transparent plate having a size corresponding to the top surface of the wafer 211. The cover 213 is disposed on the wafer Μ! 4 1362217 to protect the sensing area 2 i 4 of the wafer 211. The substrate is connected to the substrate 2 by surface drilling technology (SMT), wherein the electrical connection point 2 〇1 of the plurality of pins 215 of the chip module 2i and the substrate 20 is fixed by the solder paste 23 The lens module 22 includes a lens holder 25 and a lens 26. The lens holder 25 is a columnar hollow cylinder, and both ends thereof are opened to form a mirror hole 255 and a receiving chamber 257. The mirror hole 255 has a circular hole shape, and the inner wall is provided with an internal thread 259. The contour of the accommodating chamber 257 is equivalent to the outer contour of the wafer module 21. The lens 26 includes a lens barrel 261 and at least one lens. 263. The lens 263 is fixed in the lens barrel 261. The outer wall of the lens barrel 261 is provided with an external thread 265. The lens 26 is used by the external screw The 265 is screwed onto the lens holder 25 in cooperation with the internal thread 259 of the mirror hole 255. The first adhesive 24 is applied to the bottom surface of the lens holder 25, and the lens holder 25 is bonded to the substrate 2A. When assembling, the wafer module 21 is first placed on the substrate 2, and then the lens holder 25 equipped with the lens 26 is aligned with the wafer module 21 and then placed thereon. At this time, the wafer module 21 is The outer portion of the accommodating chamber 257 is closely matched with the inner wall f of the accommodating chamber 257 and is received in the accommodating chamber 257 β. Since the accommodating chamber 257 is closely matched with the wafer module 21, even if the wafer module 21 is slightly displaced, the lens 2 25 can also be The mounting position of the substrate and the substrate is adjusted to follow the wafer module 21, that is, the center alignment of the lens holder 25 and the chip module 21 is located on the μ. Therefore, the image sensing module package structure 200 can be reduced. The bit error, 5 1362217, improves the alignment accuracy. Please refer to FIG. 3 for the second preferred embodiment of the image sensing module package structure of the present invention, the image sensing module package structure and the image sensing mode. The package structure 200 is similar, and includes a substrate 2, a chip module 21, and a lens module. The lens module 32 includes a lens holder 35 and a lens 26 screwed to the lens holder 35. The lens holder 35 has a 351. The difference is the lens assembly 35. The image package structure 300 further includes an annular stop 353 and a second adhesive 27. The annular stop 353 protrudes from the inner wall 351 and abuts the cover 213. The surface prevents the gap between the lens holder 25 and the substrate 2 from being too small, causing the first sticker 24 to overflow. The first base of the first base of the 钍 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 涂布 213 213 213 213 213 213 213 213 213 213 213 213 213 213 213 213 213 213 213 213 213 The distance between the two dies of the wafer module is known. The second smear 27 in this embodiment can be omitted. The optical sensing module package of the present invention shown in FIG. (4) The package structure 3 (9) is similar, and includes a substrate 4, a crystal = mold lens module 42, solder paste 23, first adhesive 24, 汲 21, and the lens module 42 includes a mirror Brother a sticky object 27. ^ ^ Mirror master 45 and a mirror bolted to the lens mount 45. The difference is that the brother Shuli 45 number - foot 451, its; /... brother 1 The bottom end of the seat 45 is convexly disposed with the earth-removing plate 20 correspondingly provided with the multi-foot pin 451 and the groove 4〇u, the electric person is provided with a plurality of grooves 40, the 浐-s is fitted, and by the first stick The 24 phase drill of the object is also fixed on the substrate 40 more firmly, and the other is better to shield the external light. The structure is easy to know, and the embodiment f f 6 1362217 • two pieces 4 53 and the second dry object 27 can be omitted, or the second dead object can be omitted. Please refer to the image sensing module package image sensing module package structure of the present invention shown in FIG. The paste mold package, the composition is similar, and includes a substrate %, a wafer module 21, a lens module 52, a solder paste 23, a first point object 24, and a material lens r including a lens holder 55. And a screw is attached to the mirror... The ? is that the bottom end of the lens holder 55 is convexly provided with a foot pin (5), and the base I 50 is correspondingly provided with a plurality of through holes 5〇1, and the first = 551 is lost with the through hole 501. And, by the first dry matter μ phase _, 55 is more firmly fixed on the substrate %, which has a better effect of shielding external light. It is easy to know that the bump in the embodiment is the second (4) The object 27 can be omitted from the 'secondary only thing' 27 can be omitted. «Understanding" The lens % in the above preferred embodiment can be omitted, and the lens is fixed to at least one lens to meet imaging requirements. ', · Do not feed, the invention is in line with the invention of special wealth, according to the slaughter: 蓺 The above is only the preferred embodiment of the present invention, the decoration or change,; = 2: the equivalent of the spirit of oral work Xiu Ba 3 is within the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a conventional package structure of a sensory group. The image sensing module package structure of the present invention is a preferred embodiment. FIG. 3 is a second preferred embodiment of the image sensing module package structure of the present invention. Package Structure Fourth Preferred Embodiment Substrate 10 Wafer 111 Lens Module 12 Lens Mount 14 Chip Module Center Alignment Reference A1 Substrate 20 Wafer Module 21 Cover 213 Pin 215 Solder Paste 23 Lens Holder 25 Storing Room 257 Lens 26 Cross-sectional view of lens 263 B1. Figure 4 is a cross-sectional view showing the image sensing mode of the present invention. Figure 5 is a cross-sectional view of the image sensing mode of the present invention. [Main component symbol description] (General) Image sensing module package structure 100 Chip module 11 Cover 113 Adhesive 13 Lens 15 Lens module center alignment reference A2 (Invention) Image sensing module package structure 200 Electrical connection point 201 Wafer 211 Sensing area 214 Lens mode 1 and 22 First adhesive 24 Mirror hole 255 Mirror hole internal thread 259 Lens barrel 261 External barrel thread 265 Center alignment reference 8 1362217 Image sensing module Package Structure 300 Lens Module 32 Lens Seat Inner Wall 351 Image Sensing Module Package Structure 400 Lens Module 42 Stopper 453 First Foot Pin 451 Substrate 50 Lens Mount 55 Through Hole 501 Second Adhesive 27 Lens Holder 35 Crash Block 353 Substrate 40 Lens mount 45 Groove 401 Image Sensing Module Package Structure 500 Lens Module 52 Stopper 553 Second Foot Pin 551 9