TWI333375B - Camera module and method for making the same and image sensor package structure - Google Patents

Description

133.3375 On August 26, 2008, the page is changed. The invention relates to a camera module, and more particularly to a camera module for effectively improving the consistency of an optical center. A manufacturing method and an image sensing chip package structure. [Previous Art] [0002] Referring to FIG. 1, a brake view of a camera module 1 provided by the prior art includes a lens barrel 2, a lens holder 3, an image sensing wafer 4, and a substrate 5. The lens holder 3 has a through chamber 7 which is internally threaded at one end of the inner wall of the lens holder chamber 7. The surface of the barrel 2 is provided with external threads. The external thread of the lens barrel 2 is engaged with the internal thread of the lens holder 3, so that the lens barrel 2 is sleeved on the lens holder 3. The image sensing chip 4 is adhered to the surface of a substrate 5. A light transmissive element 6 is adhered to the surface of the image sensing wafer 4 through a colloid layer 8 for sensing the sensing of the bb sheet 4 In the region, the light transmitting member 6 is a glass piece. The lens holder 3 is adhered to the light-transmitting member 6 away from one end of the lens barrel 2, and a part of the light-transmitting member 6 is received in the lens holder 3. [0003] The glass sheet 6 of the camera module 1 is connected to the surface of the image sensing wafer 4 through the colloid layer 8 and has a large amount of glue, and it is difficult to control the thickness of the wafer to be uniform. The surface of the wafer 4, which causes the glass sheet 6 to be adhered to the surface of the image sensing wafer 4, which causes tilting, which causes the mirror holder 3 mechanically positioned by the glass sheet 6 to tilt together, thereby causing the lens barrel 2 to The optical center A1 is offset from the optical center A2 of the sensing area, thereby affecting the quality of the captured image. [Invention] [0004] In view of this, it is necessary to provide an 096121808 form that effectively improves the optical center consistency.号Α0101 Page 5 of 21 Page 0993306808-0

1333375 _L August 26, 2008, the replacement of the page camera module and its manufacturing method and an image sensing chip package structure

[0005] A camera module includes a lens barrel, a lens holder, and an image sensor. The lens barrel is sleeved at one end of the lens holder. The image sensor includes a light transmissive element, an image sensing chip, and a circuit board. The image sensing wafer has a sensing region that is structurally and electrically connected to the surface of the circuit board. At least three colloidal particles are disposed on the periphery of the sensing region, and the light transmissive member is adhered to the surface of the image sensing wafer through the at least three colloidal particles. The lens holder is adhered to the image sensor away from the lens barrel end. The lens barrel surface is provided with an external thread, the lens holder has opposite first and second ends, the first end is provided with an internal thread, the internal thread is engaged with the external thread of the lens barrel, and the second end is The surface of the light transmissive element is in contact with the side wall. [0006] A method for manufacturing a camera module, comprising: providing a lens barrel and a lens holder, the lens barrel being sleeved at one end of the lens holder, the lens barrel surface being provided with an external thread, the lens holder having a relative a first end and a second end, the first end is provided with an internal thread, the first end is provided with an internal thread, the internal thread is engaged with the external thread of the lens barrel; and an image sensing having a sensing area is provided a wafer, at least three colloidal particles are disposed on a periphery of the sensing region, and the image sensing wafer is adhered to a circuit board; and a light transmitting component is bonded to the image sensing wafer through the at least three rubber particles The image sensing chip is electrically connected to the circuit board, the light transmitting component, the image sensing chip and the circuit board form an image sensor; the lens holder is away from the lens barrel end and the image sensing The two sides of the lens holder are in contact with the surface and the side wall of the light transmissive element. 096121808 Form No. A0101 Page 6 of 21 0993306808-0 1333375 Pick-up pin on August 26, 2008 [0007] The light-transmitting component of the camera module is bonded to the image sensing wafer surface by at least three rubber particles. It uses a small amount of glue, so it is easy to control, which allows the light-transmitting element to adhere to the surface of the image sensing wafer very smoothly, and then uses the conventional technology to make the center of the light-transmitting element and the image sensing wafer sensing area The center of the lens holder is mechanically positioned by the center of the sensing area, thereby ensuring that the optical center of the lens barrel coincides with the optical center of the sensing area. The sharpness of the captured image can be improved. Furthermore, the structure avoids the disadvantage of excessively large amount of glue and extending to the surface of the sensing area, which affects the sharpness of the captured image. 2 is a cross-sectional view of a camera module 1 according to a first embodiment of the present invention, including a lens barrel 1 , a lens holder 20 , and an image sensor 70 . . The lens barrel 10 is sleeved at one end of the lens holder 20. The lens holder 2 is bonded to the image sensor 70 with respect to the other end of the lens barrel 10. [0009] The lens barrel 10 has an external thread 11 on the outside, and at least one mirror 1 2 is accommodated therein. . The lens holder 20 has a through chamber 21 having an opposite first end 26 and a second end 27. The inner side of the first end 26 is provided with an internal thread 24'. The internal thread 24 and the barrel 10 The external thread 11 is engaged to engage the lens barrel 10 at one end of the lens holder 20. [0010] The image sensor 70 includes a light transmissive element, an image sensing wafer 30, and a circuit board 40. The image sensing chip 3 has a sensing portion 31, and the surface of the sensing portion 31 is bonded to the circuit board 40. The transparent component 50 is bonded to the image sensing chip 3. The surface of the sensing area 31 is 096121808. 0993306808-0 Form No.; A0101 7th True/Total 21 Page 1333375 Modified on August 26, 2017. [0011] The image sensing wafer 30 is provided with a plurality of wafer pads 3 4 and a periphery of the sensing region 31. The bonding area 35 is partially located between the sensing area 31 and the die pad 34 and surrounds the sensing area 31. At least three colloidal particles 32 are disposed in the bonding region 35. The colloidal particles 32 may be thermosetting adhesives, and the number may be four, five or six or the like. As shown in FIG. 4, in the embodiment, the sensing area 31 is square, and four adhesive particles 32 are disposed in the bonding area 35, and the four rubber particles 32 are respectively disposed on the bonding area 35. Four corners of the test area 31. Referring to FIG. 2, on the surface of the circuit board 40, the same number of circuit board pads 41 as the wafer pads 34 of the image sensing crystal β chip 30 are disposed. The wafer pad 34 is electrically connected to the circuit board pad 41 by the wire 33, so that the image sensing crystal 30 is electrically connected to the circuit board 40.

[0013] The light transmissive element 50 can be a glass piece or a filter or the like. In the embodiment, the light transmissive element 50 is a glass piece. The light transmissive element 50 is adhered to the image sensing chip 30 by the four rubber particles 32, and covers the sensing area 31 of the image sensing chip 30, and the light transmitting element 5 is made by a conventional technique such as detection. The center of 0 coincides with the center of the sensing area 31. Since the light transmissive element 50 is bonded to the image sensing chip 30 through the four rubber particles 32, the amount of glue used is small, and the light transmissive element 50 can be bonded to the image sensing wafer 30 relatively flat. The surface of the light transmissive element 50 passes through the center of the image sensing wafer sensing area 31. Further, the amount of the glue can be prevented from extending to the surface of the sensing area 31. [0014] A region of the surface of the image sensing wafer 30 surrounding the light transmissive element 50 is provided with a colloid layer 60 which can cover the wire 33 and the edge of the image sensing wafer 30, which may also only surround The light transmissive element 50 and 096121808 form number Α 0101 8th page / 21 pages 0993306808-0 099 August 26 correction replacement page 133.3375 The wire 33 and the edge of the image sensing wafer 30 are exposed, in this embodiment The colloid layer 60 surrounds the light transmissive element 50 and covers the wire 33 and the edge of the image sensing wafer 30 to achieve a dust-tight sealed package of the sensing region 31. The lens holder 20 is adhered to the image sensing chip 30 through the colloid layer 60, and the light transmissive element 50 is received in the lens housing chamber 21, thereby realizing the lens holder 20 and the image sensor 70. Adhesive. The side surface 51 of the light transmissive element 50 is in contact with the inner wall of the lens holder chamber 21 away from the end of the lens barrel 10, and functions as a mechanical positioning. The light transmissive element 50 is opposite to the second end 27 of the lens mount 20 opposite to the shadow φ image sensing wafer 30. The structure can be used to fix the mirror mount 20 opposite to the image sensor 70. The position can prevent the gel layer 60 from excessively overflowing to the surface of the light transmissive element to a certain extent. [0015] The camera module 100 can ensure that the optical center line B2 of the lens barrel 10 is on the same line as the axis B1 of the light transmitting element 50, and further because the light transmitting element 50 has the axis B1. The center of the wafer sensing area 31 is sensed by the image, thereby ensuring that the optical center B2 of the lens barrel 10 coincides with the optical center of the sensing area 31 of the image sensing wafer 30, thereby improving image clarity. [0016] Please refer to FIG. 4, which is a cross-sectional view of a camera module 200 according to a second embodiment of the present invention. It includes a lens barrel 110, a lens holder 120, and an image sensor 170. The image sensor 170 includes a light transmissive element 150 , an image sensing wafer 130 , and a circuit board 140 . [0017] The camera module 200 is basically the same as the camera module 100 provided in the first embodiment, and the difference is mainly that at least one recess can be disposed on the end surface of the lens holder 120 away from the lens barrel 110, and the recess can be Is one or 096121808 Form number Α0101 Page 9/Total 21 page 0993306808-0 1333375 On August 26, 099, the page is replaced by a plurality of grooves, which can also be one or multiple openings. Referring to FIG. 5, in the embodiment, the recess is two recesses 122. The lens holder 120 is square from one end of the lens barrel 110. The two recesses 122 are disposed on opposite sides of the square. Referring to FIG. 4, when the lens holder 120 is adhered to the image sensor 170, the lens holder groove 122 is filled with the colloid layer 160, which can enlarge the contact area between the lens holder 120 and the colloid layer 160, thereby improving the The adhesion reliability of the lens holder 120 and the image sensor 170 can prevent the glue from being overflowed. [0018] Please refer to FIG. 6 , which is a flowchart of the camera module 100 provided in the first embodiment. 2 is a cross-sectional view of the camera module 100, the manufacturing method including the following steps. [0019] Step 300: A lens barrel 10 and a lens holder 20 are provided, and the lens barrel 10 is sleeved at one end of the lens holder 20. [0020] The lens barrel 10 houses at least one lens 12, and its surface is provided with an external thread 11. The lens holder 20 has a chamber 21 therethrough. The reading frame 20 has an opposite first end 26 and a second end 27, and the inner side of the first end 26 is provided with an internal thread 24, and the internal thread 24 is engaged with the external thread 11 of the lens barrel 10, so that the lens barrel 10 sleeves are connected to one end of the lens holder 20. [0021] Step 400: Providing an image sensing wafer 30 having a sensing area 31 and bonding the image sensing wafer 30 to a circuit board 40. The periphery of the image sensing wafer sensing region 31 is dispensed to form at least three colloidal particles 32. [0022] The image sensing wafer 30 has a sensing region 31, a plurality of wafer pads 34 and an adhesive region 35. . The sensing area 31 is disposed on the image sensing chip 096121808 Form No. A0101 Page 10 / Total 21 Page 0993306808-0 1333375 On August 26, 2008, the shuttle is replacing the center position of one surface of the page 30, and Circuit board 40. The periphery of the sensing region 31 of the image sensing wafer 30 is provided with a plurality of wafer pads 34 and an adhesive region 35. The bonding region 35 is partially located between the sensing region 31 and the wafer pad 34 and surrounds the Sensing area 31. The circuit board 40 can be a printed circuit board, and the circuit board 40 is bonded to the surface of the image sensing chip 30, and the same number of circuit board pads as the wafer pads 34 of the image sensing chip 30 are disposed thereon. 41. The adhesive is applied to the adhesive region 35 to form at least three colloidal particles. In the embodiment, four adhesive particles 32 are disposed on the surface of the adhesive region 35. [0023] Step 500: Bonding a light transmissive element 50 to the image sensing wafer 30 through the at least three colloidal particles 32. [0024] The light transmissive element 50 can be a glass sheet or a filter. In the present embodiment, the light transmissive element 50 is a glass sheet. The light transmissive element 50 is adhered to the image sensing wafer 30 through the four colloidal particles 32 for protecting the sensing region 31. [0025] Step 600: The image sensing chip 30 is electrically connected to the circuit board 40. The light transmitting component 50, the image sensing chip 30, and the circuit board 40 form an image sensor 70. [0027] The wafer pad 34 is electrically connected to the circuit board pad 41 by a wire 33. [0027] Step 700: bonding the lens holder 20 away from the lens barrel 10 to the image sensor 70 . [0028] The surface of the image sensing wafer 30 provided with the sensing region 31 is provided with a colloid layer 60 surrounding the transparent component 50, which can be 096121808 Form No. A0101 Page 11 of 21 Page 0993306808-0 1333375 On August 26, 099, press the replacement page

To cover the edge of the wire 33 and the image sensing chip 30, the wire 3 3 and the edge of the image sensing chip 30 may be exposed only around the light transmitting element 50. In this embodiment, The colloid layer 60 surrounds the light transmissive element 50 and covers the wire 33 and the edge of the image sensing wafer 30. The lens holder 20 is adhered to the image sensor 70 through the colloid layer 60, and the light transmissive element 50 is received in the lens holder chamber 21, thereby realizing the lens holder 20 and the image sensor 70. Contact. The side surface 51 of the light transmitting member 50 is in contact with the inner wall of the lens holder chamber 21 away from the end of the lens barrel 10 to function as a mechanical positioning. The light transmissive element 50 is bonded to the second end 27 of the lens holder 20 opposite to the surface of the image sensing chip 30. The structure can fix the relative position of the lens holder 20 and the image sensor 70. In addition, the gel layer 60 can be prevented from overflowing to the surface of the light transmissive element to a certain extent. [0029] It can be understood that the above steps of the camera module manufacturing method may be performed after the step 400, the step 500, and the step 600 are performed, and then the processing of step 300 is performed. [0030] The light-transmitting component of the camera module is bonded to the surface of the image sensing wafer by at least three rubber particles, and the amount of glue used is small, so that it is easy to control, which enables the light-transmitting component to be bonded very smoothly. The image sensing wafer surface is aligned with the center of the image sensing wafer sensing region by conventional techniques, so that the central axis of the lens holder mechanically positioned by the light transmitting member can pass through the axis The center of the sensing area, thereby ensuring that the optical center of the lens barrel coincides with the optical center of the sensing area, can improve the sharpness of the captured image. Furthermore, the structure avoids excessive amount of glue and extends to the surface of the sensing area, thereby affecting the sharpness of the captured image. 096121808 Form No. A0101 Page 12/Total 21 Page 0993306808-0 1333375 | August 099 26曰 Corrected the replacement page factor. [0031] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the patent application scope of the present invention cannot be limited thereby. . Equivalent modifications or variations made by those skilled in the art will be encompassed by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0032] FIG. 1 is a cross-sectional view of a camera module provided by the prior art. 2 is a cross-sectional view of a camera module according to a first embodiment of the present invention. 3 is a top plan view showing the assembled structure of the light transmissive element, the image sensing chip, and the circuit board of FIG. 2. 4 is a cross-sectional view of a camera module according to a second embodiment of the present invention. [0036] FIG. 5 is a top plan view of the mirror mount of FIG. 2. 6 is a manufacturing flow chart of a camera module according to an embodiment of the present invention. [Description of main component symbols] [0038] Mirror base: 3, 20, 120 [0039] Wire: 33 [0040] Room: 7 , 21 [0041] Wafer pad: 34 [0042] Colloid layer: 8, 32, 60, 160 [0043] Bonding area: 35 096121808 Form number A0101 Page 13 / 21 pages 0993306808-0 1333375 [0044] Mirror Cartridge: 2, 10, 110 [0045] Circuit board: 40, 140 [0046] Substrate: 5 [0047] Circuit board pad: 41 [0048] External thread: 11 [0049] Light transmissive element: 6, 50, 150 Lens: 12 [0051] Side: 51 [0052] Internal thread: 24 [0053] Surface: 52 [0054] First end: 26 [0055] Image sensor: 70, 170 [0056] Second end :27 [0057] Camera Module: 1,100,200 [0058] Image Sensing Wafer: 4, 30, 130 [0059] Groove: 122 [0060] Sensing Zone. 31 [0061] Barrel Optical Centerline :Al,B2 [0062] The axis of the light-transmitting element: B1 096121808 Form No. A0101 Page 14/Total 21 Pages 099 August 26 Revision Replacement Page 0993306808-0

1333375 [0063] Sensing area optical center: A2 August 26, 2017 revised replacement page

096121808 Form No. A0101 Page 15 of 21 0993306808-0

Claims (1)

1333375 On August 26, 099, the replacement of the seven hundred seven, patent application scope: 1. A camera module, comprising a lens barrel, a lens holder and an image sensor, the lens barrel is sleeved at one end of the lens holder The image sensor includes a light transmissive component, an image sensing die, and a circuit board. The image sensing device has a sensing region. The image sensing chip is structurally and electrically connected to the surface of the circuit board. The improvement is that at least three colloidal particles are disposed on the periphery of the sensing area, and the light transmissive element is adhered to the surface of the image sensing wafer through the at least three colloidal particles, the mirror holder is away from the barrel end and the The image sensor is bonded, the surface of the lens barrel is provided with an external thread, the lens holder has an opposite first end and a second end, the first end is provided with an internal thread, the internal thread and the external thread of the lens barrel The second end is in contact with the surface and the side wall of the light transmissive element. The camera module of claim 1, wherein the image is sensed on the surface of the wafer and surrounds the light transmissive element. The area is set with a colloid The lens holder with the image sensor by bonding with the adhesive layer. 3. The camera module of claim 2, wherein the colloid layer is a thermosetting glue. 4. The camera module of claim 2, wherein the lens holder is provided with at least one recess from a corresponding colloid layer on an end surface of the lens barrel, and a part of the colloid layer is accommodated in the recess. 5. The camera module of claim 1, wherein: four rubber particles are disposed on a periphery of the sensing region, and the light transmitting member is adhered to the image sensing wafer through the four rubber particles. surface. 6. The camera module of claim 1 or 5, wherein: the colloidal particles are thermosetting adhesives. 096121808 Form No. A0101 Page 16 of 21 0993306808-0 1333375 _ August 26, 2008, 替换正换页7. A method of manufacturing a camera module, comprising: providing a lens barrel and a lens holder, The lens barrel is sleeved at one end of the lens holder, the surface of the lens barrel is provided with an external thread, the lens holder has opposite first and second ends, the first end is provided with an internal thread, and the first end is provided with an inner portion a thread, the internal thread is engaged with the external thread of the lens barrel; an image sensing wafer having a sensing area is provided, at least three rubber particles are disposed on the periphery of the sensing area, and the image sensing wafer is bonded To a circuit board; φ a light-transmitting component is adhered to the image sensing wafer through the at least three rubber particles, and the image sensing wafer is electrically connected to the circuit board, the light-transmitting component The image sensing chip and the circuit board form an image sensor; the lens holder is bonded to the image sensor away from the lens barrel end, and the second end of the lens holder and the light transmissive element are The surface is in contact with the side walls. 8. The method of manufacturing a camera module according to claim 7, wherein: the rubber particles are formed by dispensing by using a thermosetting glue. The manufacturing method of the camera module of claim 9, wherein: the image sensing the surface of the wafer and surrounding the area of the light transmissive element, forming a colloid layer by using a thermosetting glue, the lens holder The glue layer is adhered to the image sensor. 096121808 Form No. A0101 Page 17 of 21 0993306808-0