1351537 九、發明說明： 【發明所屬之技術領域】 • 本發明涉及一種相機模組，尤其涉及一種組裝到電路 • 板上時，佔用較少之電路板表面積之相機模組。 【先前技術】 數位相機越來越受到消費者之喜愛，它正在漸漸地改 變著人們之生活。與此同時，人們對數位相機之要求也越 來越高，在滿足功能強大之同時，還要求外型美觀，便於 > 攜帶。廠家爲了滿足消費者之需要，製作出之相機曰趨小 型化。但由於狹小之内部空間，限制了相機内部元件選擇 之靈活性並給製作相機之精度帶來了更高之要求。 請參閱圖1，一種先前之相機模組1，包括鏡座2、鏡 筒3及影像感測晶片4。所述鏡筒3之表面設有外螺紋， 其内至少收容一個透鏡。所述鏡座2有一貫通之容室5， 在所述容室5之周邊形成有内螺紋，並在該容室5中黏接 _ 有一玻璃片6。所述鏡座2之内螺紋與所述鏡筒3之外螺 紋相嚙合。所述影像感測晶片4黏接在一個電路板7表面， 其感測區背對所述電路板7。所述鏡座2黏接在所述電路 板7表面，並使所述影像感測晶片4收容在所述鏡座2内。 所述相機模組1，在組裝到電路板7上時，直接將鏡 座2黏接到電路板7上，如此，不僅影像感測晶片4會伯 用電路板7表面之空間，而且鏡座2也會額外佔用電路板 7之表面空間。而電路板7之表面佈滿了導線及電子元件， 如再使用部分表面來黏接鏡座2，將使電路板7表面之導 6 1351537 線及電子元件之空間密度進一步加大，生産加工時需要非 常高之精度，這會導致生産良率較低，而生産費用升高。 【發明内容】 有鑒於此，有必要提供一種在組裝到電路板上時，佔 用較少之電路板表面積之相機模組。 一種相機模組，包括一個鏡筒、一個鏡座和一個影像 感測晶片。所述鏡筒内收容至少一個透鏡，所述鏡筒套接 於所述鏡座之一端。所述影像感測晶片具有一個感測區。 所述鏡座遠離所述鏡筒之端部設有一個接著部件，所述鏡 座通過所述接著部件與所述影像感測晶片相接，所述影像 感測晶片之感測區面向所述鏡筒。 一種相機模組，包括一個鏡筒、一個鏡座、一個影像 感測晶片與一個電路板。所述鏡筒内收容至少一個透鏡。 所述鏡筒套接於所述鏡座之一端。所述影像感測晶片具有 一個感測區。所述電路板與所述影像感測晶片相黏接，所 述影像感測晶片之感測區背對所述電路板。所述鏡座遠離 所述鏡筒之端部設有一個接著部件，所述接著部件貼附在 所述影像感測晶片表面。 所述相機模組中之鏡座黏接於影像感測晶片，因此在 組裝到電路板上時，無需在電路板上爲黏接鏡座而額外留 出空間，從而擴大了電路板之可利用面積，降低了電路板 表面之導線及電子元件之空間密度，便於提高電路板之生 産良率及降低電路板之製造成本。再者，當與其他産品採 用相同大小之影像感測晶片時，所述相機模組會更小一 7 1351537 些。而且，當相機模組之尺寸與習知技術相同時，可以採 用更大之影像感測晶片。 【實施方式】 請參閱圖2，爲本發明第一實施例提供之相機模組 100，其包括：一個鏡筒10、一個鏡座20及一個影像感測 晶片30。所述鏡筒10套接於所述鏡座20之一端。所述鏡 座20在遠離鏡筒10之端部有一接著部件沿遠離鏡筒10之 方向凸出於所述鏡座20，所述鏡座20通過所述接著部件 黏接至所述影像感測晶片30表面。本實施例中，所述接著 部件爲一個凸緣25。 所述鏡筒10外部有外螺紋，内部設置有一容腔11， 及至少一透鏡12收容于所述容腔11中。所述鏡座20有一 貫穿之容室，所述容室之一端有内螺紋，所述鏡筒10套接 於所述鏡座20具有内螺紋之一端，即該内螺紋與所述鏡筒 10之外螺紋相嚙合。所述凸緣25與所述鏡座20可以爲單 獨分開之兩個元件也可以爲一體結構，本實施例十所述凸 緣25與所述鏡座20爲一體結構。該凸緣25向軸心凸出於 所述鏡座内表面21，並沿著中軸線以遠離所述鏡筒10方 向凸出於鏡座底面22。所述凸緣25有一面向所述鏡筒10 之凸緣第一表面26,以及一與凸緣第一表面相對之凸緣第 二表面27。一透光元件40黏附於所述凸緣25之凸緣第一 表面26上。優選地，所述凸緣25可以有一臺階狀凹陷28， 如圖3所示，所述臺階狀凹陷28可以位於所述凸緣第一表 面26上；如圖4所示之結構，該臺階狀凹陷28也可以位 8 1351537 於所述凸緣第二表面27上。所述臺階狀凹陷28用於黏接 透光元件40，本實施例中所述臺階狀凹陷28位於所述凸 緣第一表面26上。所述透光元件40可以係一個濾光片或 一個玻璃片，在本實施例中所述透光元件40爲一個玻璃 所述影像感測晶片30有一個擁有感測區31及複數個 晶片焊墊32之第一表面33和一個與第一表面33相對之第 二表面34。所述複數個晶片焊墊32位於所述影像感測晶 片30之第一表面33之邊緣。所述影像感測晶片30之第一 表面33上可以有一層透明之樹脂，所述接著部件與影像感 測晶片相接，可以爲所述凸緣第二表面27黏接到所述樹脂 表面，也可以爲所述凸緣第二表面27與所述樹脂表面相貼 附而不黏接。同樣之所述接著部件與影像感測晶片30相 接，可以係所述凸緣第二表面27直接黏接在所述影像感測 晶片30上，也可以係所述凸緣第二表面27與所述影像感 測晶片30表面相貼附而不黏接。在本實施例中所述鏡座 20通過所述凸緣第二表面27黏接於該影像感測晶片30之 第一表面33之感測區31與複數個焊墊32之間。所述透光 元件40以及所述凸緣25連同所述影像感測晶片30 —同實 現對所述影像感測晶片30之感測區31之無塵密封封裝。 所述影像感測晶片30之第二表面34黏接到一個印刷 電路板50表面。在所述影像感測晶片30之周緣設置有與 所述影像感測晶片30之複數個晶片焊墊32相同數量之電 路板焊墊51，並用導線60將所述電路板焊墊51與所述晶 9 1351537 片焊墊32連接起來。所述電路板50與所述鏡座20之間有 一間隙，所述導線60收容於該間隙中。沿著該間隙開口形 成一膠體層70,本實施例中該膠體層70包覆所述導線60。 所述膠體層70可起到保護所述導線60以及所述電路板50 表面之電子元件之作用。所述導線60爲金屬導線。所述膠 體層70爲熱固膠。 請參閱圖5，爲本發明第二實施例提供之相機模組 200，包括：一個鏡筒110、一個鏡座120及一個影像感測 晶片130。 所述相機模組200與本發明第一實施例提供之相機模 組100基本相同，其區別主要在於：所述鏡座120有一個 接著部件，該接著部件爲一個凸緣125，所述凸緣125僅 沿著所述鏡座120之中軸線以背對所述鏡筒110方向凸出 於鏡座底面121，即爲一筒體。所述凸緣125有一背對於 所述鏡筒110之凸緣表面126，該凸緣表面126黏接到所 述影像感測晶片130感測區131與晶片焊墊132之間。 所述透光元件140黏接於所述影像感測晶片130與鏡 筒110之間，用於保護所述影像感測晶片130之感測區 131，此外，還可以對光線進行過濾。所述透光元件140可 以直接黏接在所述鏡座120之内表面122上，或直接黏接 在所述影像感測晶片130表面，還可以黏接在所述鏡座120 之内表面122之同時也黏接在所述影像感測晶片130之表 面。本實施例中，採用將所述透光元件140黏接於所述鏡 座120内表面122之同時也黏接在所述影像感測晶片130 10 1351537 表面之方式，並覆蓋所述影像感測晶片130之感測區131。 當採用將所述透光元件140黏接在所述影像感測晶片130 之表面之方式時，所述透光元件140可以爲透光樹脂。 請參閱圖6，爲本發明第三實施例提供之相機模組 300，包括：一個鏡筒210，一個鏡座220和一個影像感測 晶片230。 所述相機模組300與本發明第一實施例提供之相機模 組100基本相同，其區別主要在於：所述鏡座210有一個 接著部件，該接著部件爲一個墊片221，所述墊片221黏 接在所述鏡座220遠離所述鏡筒210之端部，並向軸心方 向凸出於所述鏡座内表面222。 所述影像感測晶片230表面有一個黏膠體231，該黏 膠體231環繞所述影像感測晶片230之感測區232。所述 墊片221和一個透光元件240通過所述黏膠體231 —同黏 接到所述影像感測晶片230。所述墊片221環繞所述透光 元件240，所述透光元件240與所述黏膠體231構成對所 述影像感測晶片230之感測區232之無塵密封封裝。本實 施例中所述透光元件240爲一個紅外濾光片，所述黏膠體 231爲雙面膠。 所述影像感測晶片230與感測區232相對之表面黏接 到一個電路板270，所述墊片221與所述電路板270之間 有一間隙，所述導線260收容於該間隙中。沿著該間隙開 口形成一膠體層250，本實施例中該膠體層250包覆所述 導線260。所述膠體層250可起到保護所述導線260之作 11 135153.7 用。所述導線260爲金屬導線。所述膠體層250爲熱固膠。 所述相機模組中之鏡座直接黏接於影像感測晶片表 面，因此在組裝到電路板上時，無需在電路板上爲黏接鏡 座而額外留出空間，從而擴大了電路板之可利用面積，降 低了電路板表面之導線及電子元件之空間密度，便於提高 電路板之生産良率及降低電路板之製造成本。再者，當與 習知相機模組封裝結構採用相同大小之影像感測晶片時， 所述相機模組會更小一些。而且，當相機模組之尺寸與習 知之尺寸相同時，可以採用更大之影像感測晶片。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施方式，本 發明之範圍並不以上述實施方式為限，舉凡熟習本案技藝 之人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係先前技術提供之一種相機模組剖視圖。 圖2係本發明第一實施例提供之一種相機模組剖視圖。 圖3係本發明第一實施例提供之一種鏡座之剖視圖。 圖4係圖2中之鏡座另一種結構之剖視圖。 圖5係本發明第二實施例提供之一種相機模組之剖視圖。 圖6係本發明第三實施例提供之一種相機模組之剖視圖。 【主要元件符號說明】 相機模組 1 鏡座 2 鏡筒 3 影像感測晶片 4 12 13515371351537 IX. Description of the Invention: [Technical Field] The present invention relates to a camera module, and more particularly to a camera module that occupies less surface area of a circuit board when assembled on a circuit board. [Prior Art] Digital cameras are increasingly popular with consumers, and it is gradually changing the lives of people. At the same time, people are increasingly demanding digital cameras. While satisfying the powerful functions, they also require beautiful appearance and easy to carry. In order to meet the needs of consumers, manufacturers have become smaller cameras. However, due to the small internal space, the flexibility of the internal component selection of the camera is limited and the precision of the camera is brought to a higher level. Referring to FIG. 1, a prior camera module 1 includes a lens holder 2, a lens barrel 3, and an image sensing wafer 4. The surface of the lens barrel 3 is provided with an external thread, and at least one lens is accommodated therein. The lens holder 2 has a through chamber 5, an internal thread is formed around the chamber 5, and a glass sheet 6 is adhered in the chamber 5. The internal thread of the lens holder 2 is engaged with the outer thread of the lens barrel 3. The image sensing die 4 is bonded to the surface of a circuit board 7 with its sensing area facing away from the circuit board 7. The lens holder 2 is adhered to the surface of the circuit board 7 and the image sensing wafer 4 is housed in the lens holder 2. The camera module 1 directly attaches the lens holder 2 to the circuit board 7 when assembled on the circuit board 7, so that not only the image sensing chip 4 but also the surface of the circuit board 7 is used, and the lens holder 2 will also occupy the surface space of the circuit board 7. The surface of the circuit board 7 is covered with wires and electronic components. If a part of the surface is used to bond the lens holder 2, the space of the surface of the circuit board 7 and the space density of the electronic components are further increased. Very high precision is required, which leads to lower production yields and higher production costs. SUMMARY OF THE INVENTION In view of the above, it is desirable to provide a camera module that occupies less surface area of a board when assembled onto a circuit board. A camera module includes a lens barrel, a lens holder and an image sensing wafer. The lens barrel houses at least one lens, and the lens barrel is sleeved at one end of the lens holder. The image sensing wafer has a sensing region. An end piece is disposed at an end of the lens holder away from the lens barrel, and the lens holder is connected to the image sensing wafer through the connecting member, and a sensing area of the image sensing chip faces the The lens barrel. A camera module includes a lens barrel, a lens holder, an image sensing chip and a circuit board. At least one lens is housed in the lens barrel. The lens barrel is sleeved at one end of the lens holder. The image sensing wafer has a sensing area. The circuit board is bonded to the image sensing chip, and the sensing area of the image sensing chip is opposite to the circuit board. The end of the lens holder away from the barrel is provided with an attachment member attached to the surface of the image sensing wafer. The lens holder in the camera module is adhered to the image sensing chip, so that when the circuit board is assembled, there is no need to leave extra space on the circuit board for bonding the lens holder, thereby expanding the availability of the circuit board. The area reduces the spatial density of the wires and electronic components on the surface of the board, which is convenient for improving the production yield of the board and reducing the manufacturing cost of the board. Furthermore, when the same size image sensing wafer is used with other products, the camera module will be smaller by 7 1351537. Moreover, when the size of the camera module is the same as in the prior art, a larger image sensing wafer can be used. 2 is a camera module 100 according to a first embodiment of the present invention. The camera module 100 includes a lens barrel 10, a lens holder 20 and an image sensing chip 30. The lens barrel 10 is sleeved at one end of the lens holder 20. The lens holder 20 protrudes from the end portion away from the lens barrel 10 from the lens holder 20 in a direction away from the lens barrel 10, and the lens holder 20 is adhered to the image sensing through the adhesive member. The surface of the wafer 30. In this embodiment, the attachment member is a flange 25. The lens barrel 10 has an external thread on the outside, a cavity 11 is disposed therein, and at least one lens 12 is received in the cavity 11. The lens holder 20 has a chamber through which one end has an internal thread, and the lens barrel 10 is sleeved on one end of the lens holder 20 having an internal thread, that is, the internal thread and the barrel 10 The external threads are engaged. The flange 25 and the lens holder 20 may be two separate components or a single structure. The flange 25 and the lens holder 20 are integrated in the tenth embodiment. The flange 25 projects from the shaft center to the inner surface 21 of the mirror base and protrudes from the bottom surface 22 of the mirror base in a direction away from the lens barrel 10 along the central axis. The flange 25 has a flange first surface 26 facing the barrel 10 and a flange second surface 27 opposite the first surface of the flange. A light transmissive element 40 is adhered to the flange first surface 26 of the flange 25. Preferably, the flange 25 may have a stepped recess 28, as shown in FIG. 3, the stepped recess 28 may be located on the first surface 26 of the flange; as shown in FIG. The recess 28 can also be positioned 8 1351537 on the flange second surface 27. The stepped recess 28 is for bonding the light transmissive element 40. In the embodiment, the stepped recess 28 is located on the first surface 26 of the flange. The light transmissive element 40 can be a filter or a glass piece. In the embodiment, the light transmissive element 40 is a glass. The image sensing chip 30 has a sensing area 31 and a plurality of wafer soldering. The first surface 33 of the pad 32 and a second surface 34 opposite the first surface 33. The plurality of wafer pads 32 are located at edges of the first surface 33 of the image sensing wafer 30. The first surface 33 of the image sensing wafer 30 may have a transparent resin thereon, and the bonding member is connected to the image sensing wafer, and the second surface 27 of the flange may be adhered to the surface of the resin. It is also possible that the flange second surface 27 is attached to the resin surface without being bonded. Similarly, the subsequent component is connected to the image sensing wafer 30, and the second surface 27 of the flange may be directly bonded to the image sensing wafer 30, or the second surface 27 of the flange may be The surface of the image sensing wafer 30 is attached without bonding. In the embodiment, the lens holder 20 is adhered between the sensing region 31 of the first surface 33 of the image sensing wafer 30 and the plurality of pads 32 through the second surface 27 of the flange. The light transmissive element 40 and the flange 25, together with the image sensing wafer 30, implement a dust-free sealed package of the sensing region 31 of the image sensing wafer 30. The second surface 34 of the image sensing wafer 30 is bonded to the surface of a printed circuit board 50. The same number of circuit board pads 51 as the plurality of wafer pads 32 of the image sensing wafer 30 are disposed on the periphery of the image sensing wafer 30, and the circuit board pads 51 are electrically connected to the board by the wires 60. The crystal 9 1351537 chip pads 32 are connected. There is a gap between the circuit board 50 and the lens holder 20, and the wire 60 is received in the gap. A colloid layer 70 is formed along the gap opening, and the colloid layer 70 covers the wire 60 in this embodiment. The colloid layer 70 can function to protect the wires 60 and the electronic components on the surface of the circuit board 50. The wire 60 is a metal wire. The colloid layer 70 is a thermosetting glue. Referring to FIG. 5, a camera module 200 according to a second embodiment of the present invention includes a lens barrel 110, a lens holder 120, and an image sensing chip 130. The camera module 200 is substantially the same as the camera module 100 provided by the first embodiment of the present invention, and the difference is mainly that the lens holder 120 has an following component, and the subsequent component is a flange 125, the flange 125 protrudes from the central axis of the lens holder 120 only in a direction away from the lens barrel 110 from the bottom surface 121 of the lens holder, that is, a cylinder. The flange 125 has a flange surface 126 opposite the lens barrel 110 that is bonded between the image sensing wafer 130 sensing region 131 and the wafer pad 132. The light transmissive element 140 is adhered between the image sensing chip 130 and the lens barrel 110 for protecting the sensing area 131 of the image sensing chip 130. In addition, the light can be filtered. The light transmissive element 140 can be directly adhered to the inner surface 122 of the lens holder 120 or directly adhered to the surface of the image sensing wafer 130, and can also be adhered to the inner surface 122 of the lens holder 120. At the same time, it is also bonded to the surface of the image sensing wafer 130. In this embodiment, the light transmissive element 140 is adhered to the inner surface 122 of the lens holder 120 while being adhered to the surface of the image sensing wafer 130 10 1351537, and the image sensing is covered. Sensing area 131 of wafer 130. When the light transmissive element 140 is adhered to the surface of the image sensing wafer 130, the light transmissive element 140 may be a light transmissive resin. Referring to FIG. 6, a camera module 300 according to a third embodiment of the present invention includes a lens barrel 210, a lens holder 220, and an image sensing wafer 230. The camera module 300 is substantially the same as the camera module 100 provided by the first embodiment of the present invention, and the difference is mainly that the lens holder 210 has a follow-up component, and the subsequent component is a spacer 221, the spacer The lens 221 is adhered to the end of the lens holder 220 away from the lens barrel 210 and protrudes from the lens holder inner surface 222 in the axial direction. The image sensing wafer 230 has an adhesive body 231 on its surface, and the adhesive body 231 surrounds the sensing region 232 of the image sensing wafer 230. The spacer 221 and a light transmissive element 240 are bonded to the image sensing wafer 230 through the adhesive body 231. The spacer 221 surrounds the transparent component 240, and the transparent component 240 and the adhesive 231 form a dust-free sealed package for the sensing region 232 of the image sensing wafer 230. In the embodiment, the light transmissive element 240 is an infrared filter, and the adhesive body 231 is a double-sided tape. The surface of the image sensing die 230 opposite to the sensing region 232 is bonded to a circuit board 270. A gap is formed between the spacer 221 and the circuit board 270. The wire 260 is received in the gap. A colloid layer 250 is formed along the gap opening, and the colloid layer 250 covers the wire 260 in this embodiment. The colloid layer 250 can function to protect the wire 260 11 135153.7. The wire 260 is a metal wire. The colloid layer 250 is a thermosetting glue. The lens holder in the camera module directly adheres to the surface of the image sensing chip, so that when the circuit board is assembled, there is no need to leave extra space on the circuit board for bonding the lens holder, thereby expanding the circuit board. The available area reduces the spatial density of the wires and electronic components on the surface of the board, which is convenient for improving the production yield of the board and reducing the manufacturing cost of the board. Moreover, when the same size image sensing wafer is used with the conventional camera module package structure, the camera module will be smaller. Moreover, when the size of the camera module is the same as the conventional size, a larger image sensing wafer can be used. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or changes in accordance with the spirit of the present invention. It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a camera module provided by the prior art. 2 is a cross-sectional view of a camera module according to a first embodiment of the present invention. 3 is a cross-sectional view of a lens holder according to a first embodiment of the present invention. Figure 4 is a cross-sectional view showing another structure of the mirror holder of Figure 2. FIG. 5 is a cross-sectional view of a camera module according to a second embodiment of the present invention. FIG. 6 is a cross-sectional view of a camera module according to a third embodiment of the present invention. [Main component symbol description] Camera module 1 Mirror base 2 Mirror tube 3 Image sensing chip 4 12 1351537
容室 5 玻璃片 6 電路板 7 相機模組 100 鏡同 10 容腔 11 透鏡 12 鏡座 20 鏡座内表面 21 鏡座底面 22 凸緣 25 凸緣第一表面 26 凸緣第二表面 27 台階狀凹陷 28 影像感測晶片 30 感測區 31 晶片焊墊 32 第一表面 33 第二表面 34 透光元件 40 電路板 50 電路板焊墊 51 導線 60 膠體層 70 相機模組 200 鏡同 110 鏡座 120 鏡座底面 121 鏡座内表面 122 凸緣 125 凸緣表面 126 影像感測晶片 130 感測區 131 晶片焊墊 132 透光元件 140 相繼模組 300 領^向 210 鏡座 220 墊片 221 鏡座内表面 222 影像感測晶片 230 黏膠體 231 感測區 232 透光元件 240 膠體層 250 導線 260 電路板 270 13Room 5 Glass plate 6 Circuit board 7 Camera module 100 Mirror same 10 Cavity 11 Lens 12 Mirror base 20 Mirror base inner surface 21 Mirror base bottom 22 Flange 25 Flange first surface 26 Flange second surface 27 Stepped Depression 28 Image Sensing Wafer 30 Sensing Area 31 Wafer Pad 32 First Surface 33 Second Surface 34 Light Transmissive Element 40 Circuit Board 50 Circuit Board Pad 51 Wire 60 Colloid Layer 70 Camera Module 200 Mirror Same 110 Mirror Holder 120 Mirror base bottom 121 Mirror base inner surface 122 Flange 125 Flange surface 126 Image sensing wafer 130 Sensing area 131 Wafer pad 132 Light transmissive element 140 Successive module 300 Collar 210 Mirror holder 220 Shim 221 Inside the mirror holder Surface 222 image sensing wafer 230 adhesive 231 sensing area 232 light transmitting element 240 colloid layer 250 wire 260 circuit board 270 13