1354135 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種相機模組，尤其涉及一種便於電路板 佈線之相機模組，以及所述相機模組之製造方法。 【先前技術】 隨著數位相機，手提電話及其它可照相或攝像之電子 産品越來越受到消費者之喜愛，這些産品正在漸漸地改變 著人們之生活。與此同時，人們對電子産品之要求也越來 越高，在滿足功能強大之同時，還要求外型美觀，便於攜 帶。廠家爲了滿足消費者之需要，製作出之電子産品曰趨 小型化。但由於狹小之内部空間，限制了相機模組内部元 件選擇之靈活性並給其製作精度帶來了更高之要求。 請參閱圖1，爲先前技術提供之一種相機模組1之半 剖視圖，圖2爲所述相機模組1之立體分解圖，其包括鏡 筒2、鏡座3、影像感測晶片5及電路板6。所述鏡筒2之 表面設有外螺紋7。所述鏡座3有一貫穿之容室，在所述 鏡座3之内壁設有内螺紋8。所述鏡筒2套接於所述鏡座 3,即所述鏡筒2之外螺紋7興所述鏡座3之内螺紋8相嚙 合。所述鏡座3容室内固定一玻璃片4。所述影像感測晶 片5黏接於所述電路板6表面，其感測區背對所述電路板 6。所述鏡座3與所述電路板6相黏接，並使所述影像感測 晶片5收容於所述鏡座3之所述容室中。所述鏡座3、所 述玻璃片4及所述電路板6構成對所述影像感測晶片5之 無塵密閉封裝。 6 1354135 所述相機模組1，在組裝到電路板6上時，直接將鏡 座3黏接到電路板6上，如此，不僅影像感測晶片5會佔 用電路板6表面之空間，而且鏡座3也會額外佔用電路板 6之表面空間。而電路板6之表面佈滿了導線及電子元件， 如再使用部分空間來黏接鏡座3，將使電路板6表面之佈 線複雜度增大，導線及電子元件之空間密度進一步加大， 在生産加工時需要非常高之精度，這會導致生産良率較 低，而生產費用升高。 【發明内容】 有鑒於此，有必要提供一種便於電路板佈線之相機模 組及該相機模組之製造方法以及一鏡頭模組。 一種相機模組，其包括：一個影像感測晶片，一個鏡 筒，一個鏡座，及一個電路板。所述鏡筒中收容至少一個 透鏡。所述鏡座有一貫穿之容室，所述鏡筒套接於所述鏡 座容室之一端。所述影像感測晶片黏附於所述電路板之表 面。所述鏡座相對於所述鏡筒之另一端有至少二個凸塊， 所述凸塊沿遠離鏡筒方向凸出所述鏡座，並黏接到所述電 路板之表面，使所述影像感測晶片收容於所述鏡座内。 一種相機模組之製造方法，其包括以下步驟：提供一 個電路板，將一個影像感測晶片黏附在所述電路板表面。 提供一個鏡筒及一個鏡座，所述鏡筒内部收容至少一個透 鏡，所述鏡座有一貫穿容室，所述鏡筒套接於所述鏡座容 室之一端，所述鏡座相對所述鏡筒之另一端有至少二個凸 塊，所述凸塊沿遠離鏡筒之方向凸出所述鏡座；將所述鏡 7 1354135 座通過凸塊固定到所述電路板上。 • 一種鏡頭模組，包括一個鏡筒與一個鏡座。所述鏡筒 ^ 内收容至少一個透鏡。所述鏡座有一貫穿之容室，所述鏡 筒套接於所述容室之一端，該鏡座相對鏡筒之另一端凸設 有至少兩個凸塊，所述凸塊沿遠離所述鏡筒方向凸出於鏡 座，所述鏡座能夠通過所述凸塊黏接到一個設置有影像感 測晶片之電路板上，並使所述影像感測晶片收容於鏡座内。 所述相機模組中之鏡座通過上述至少二個凸塊黏接到 ® 電路板表面，因此在組裝到電路板上時，只佔用較少電路 板表面空間，從而擴大了電路板之可利用面積，擴大了電 路板表面之佈線空間，降低了電路板表面之導線及電子元 件之.空間密度，便於提高電路板之生産良率及降低電路板 之製造成本。所述相機模組之製造方法，若保持先前技術 中電路板表面電子元件之空間密度，那麼依照本方法便可 以製作出更小尺寸之相機模組；若保持先前技術中相機模 組之尺寸，那麼依照本方法製作出之相機模組，會降低其 ® 電路板表面電子元件之空間密度，從而降低了加工精度， 進而提高了産品良率，降低了生産之成本。 【實施方式】 請參閱圖3，爲本發明實施例提供之相機模組100之 半剖視圖，圖4爲本實施例所提供之相機模組100之立體 分解圖。其包括：一個鏡筒10、一個鏡座20、一個影像感 測晶片50及一個電路板60。所述鏡筒10套接於所述鏡座 20之一端。所述影像感測晶片50黏接於所述電路板60表 8 1354135 面，所述影像感測晶片50之感測區背對所述電路板60。 所述電路板60固定於所述鏡座20之相對於所述鏡筒10之 另一端，並使位於所述電路板60表面之所述影像感測晶片 50收容於所述鏡座20内部。 所述鏡筒10外部有外螺紋11，其内部設置有一容室， 及至少一透鏡12收容於所述容室中。 所述鏡座20有一貫穿之容室，所述容室之一端有内螺 紋22，所述鏡筒10套接於所述鏡座20之一端，即該内螺 紋22與所述鏡筒10之外螺紋11相嚙合。所述鏡座20相 對於所述鏡筒10另一端有至少二個凸塊21，所述凸塊21 沿遠離所述鏡筒10方向凸出於鏡座20。所述凸塊21之數 量可以爲三個、四個、五個、六個等等，其形狀爲等高之 柱體。所述凸塊21與所述鏡座20可以爲一體結構，也可 以爲分開之不同元件，並可通過黏接或其他方式固定到所 述鏡座20上。在本實施例中爲四個凸塊21，該四個凸塊 21與所述鏡座20採用相同材料製成，並爲一體結構，其 形狀爲等高之四棱柱。本實施例中所述鏡座20設置有所述 四個凸塊21 —端爲方形結構。在所述方形結構之每個拐角 處設置一個所述凸塊21。 所述電路板60爲印刷電路板。所述影像感測晶片50 黏接到所述電路板60表面上，其感測區背對所述電路板 60，並與所述電路板60電性連接。所述鏡座20通過四個 凸塊21黏接到所述電路板60具有影像感測晶片50之表面 上，並使所述影像感測晶片50收容於所述鏡座20内。 9 1354135 一個透光7L件30固定於所述爭伧 1Π ^ ^ m 像感測晶片50與所述 鏡同10之間，用於保護所述影像 除丨士夕外甘-π X則日日片50之感測區’ 除此之外h可以對光線進行過濾。所 以黏接在所述鏡座20之内壁上透先70件30可 残測晶片50#而也了直接黏接於所述影像 表面。在本貫施例中’所述透光元 在所述鏡座20之内壁上。所述透光 接 ^ ^ it # ^ 九70件扣可以爲玻璃及 八匕透先材枓，在本實施例中爲—個紅外濾光片。1354135 IX. Description of the Invention: The present invention relates to a camera module, and more particularly to a camera module that facilitates wiring of a circuit board, and a method of manufacturing the same. [Prior Art] With digital cameras, mobile phones and other electronic products that can be photographed or photographed are increasingly popular with consumers, these products are gradually changing the lives of people. At the same time, people's requirements for electronic products are getting higher and higher. While satisfying the powerful functions, they also require beautiful appearance and easy carrying. In order to meet the needs of consumers, manufacturers have become more and more compact. However, due to the small internal space, the flexibility of the internal selection of the camera module is limited and the precision of the production is brought to a higher level. 1 is a half cross-sectional view of a camera module 1 provided by the prior art, and FIG. 2 is an exploded perspective view of the camera module 1 including a lens barrel 2, a lens holder 3, an image sensing chip 5, and a circuit. Board 6. The surface of the lens barrel 2 is provided with an external thread 7. The lens holder 3 has a chamber through which an internal thread 8 is provided on the inner wall of the lens holder 3. The lens barrel 2 is sleeved on the lens holder 3, that is, the external thread of the lens barrel 2 is engaged with the internal thread 8 of the lens holder 3. A glass piece 4 is fixed in the lens holder 3 in the chamber. The image sensing film 5 is adhered to the surface of the circuit board 6, and the sensing area is opposite to the circuit board 6. The lens holder 3 is bonded to the circuit board 6 and the image sensing chip 5 is received in the chamber of the lens holder 3. The lens holder 3, the glass sheet 4, and the circuit board 6 constitute a dust-tight sealed package of the image sensing wafer 5. 6 1354135 The camera module 1 directly attaches the lens holder 3 to the circuit board 6 when assembled on the circuit board 6, so that not only the image sensing wafer 5 occupies the space of the surface of the circuit board 6, but also the mirror The seat 3 also takes up extra space on the surface of the board 6. The surface of the circuit board 6 is covered with wires and electronic components. If some space is used to bond the lens holder 3, the wiring complexity of the surface of the circuit board 6 is increased, and the space density of the wires and electronic components is further increased. Very high precision is required in production and processing, which results in lower production yields and higher production costs. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a camera module that facilitates circuit board layout, a method of manufacturing the same, and a lens module. A camera module includes: an image sensing chip, a lens barrel, a lens holder, and a circuit board. At least one lens is housed in the lens barrel. The lens holder has a chamber through which the lens barrel is sleeved at one end of the lens housing chamber. The image sensing wafer is adhered to a surface of the circuit board. The lens holder has at least two protrusions on the other end of the lens barrel, the protrusion protrudes from the lens holder in a direction away from the lens barrel, and is adhered to the surface of the circuit board, so that the The image sensing chip is housed in the lens holder. A method of fabricating a camera module, comprising the steps of: providing a circuit board to adhere an image sensing wafer to a surface of the circuit board. Providing a lens barrel and a lens holder, the lens barrel internally housing at least one lens, the lens holder having a through chamber, the lens barrel being sleeved at one end of the lens holder chamber, the mirror holder opposite The other end of the lens barrel has at least two bumps protruding from the lens holder in a direction away from the lens barrel; the mirror 7 1354135 is fixed to the circuit board by bumps. • A lens module that includes a lens barrel and a lens holder. The lens barrel accommodates at least one lens. The lens holder has a chamber through which the lens barrel is sleeved at one end of the chamber, and the lens holder has at least two protrusions protruding from the other end of the lens barrel, the protrusions being away from the The lens barrel protrudes from the lens holder, and the lens holder can be adhered to a circuit board on which the image sensing chip is disposed through the bump, and the image sensing chip is received in the lens holder. The lens holder in the camera module is bonded to the surface of the circuit board by the at least two bumps, so that when the circuit board is assembled, only a small amount of surface space of the circuit board is occupied, thereby expanding the availability of the circuit board. The area enlarges the wiring space on the surface of the circuit board, reduces the space density of the wires and electronic components on the surface of the circuit board, and is convenient for improving the production yield of the circuit board and reducing the manufacturing cost of the circuit board. In the manufacturing method of the camera module, if the spatial density of the electronic components on the surface of the circuit board in the prior art is maintained, a camera module of a smaller size can be produced according to the method; if the size of the camera module in the prior art is maintained, Then, the camera module manufactured according to the method reduces the spatial density of the electronic components on the surface of the circuit board, thereby reducing the processing precision, thereby improving the product yield and reducing the production cost. 3 is a half cross-sectional view of a camera module 100 according to an embodiment of the present invention. FIG. 4 is a perspective exploded view of the camera module 100 according to the embodiment. It includes a lens barrel 10, a lens holder 20, an image sensing wafer 50, and a circuit board 60. The lens barrel 10 is sleeved at one end of the lens holder 20. The image sensing chip 50 is adhered to the surface of the circuit board 60, and the sensing area of the image sensing chip 50 is opposite to the circuit board 60. The circuit board 60 is fixed to the other end of the lens holder 20 with respect to the lens barrel 10, and the image sensing wafer 50 located on the surface of the circuit board 60 is received inside the lens holder 20. The lens barrel 10 has an external thread 11 on the outside thereof, a chamber is disposed therein, and at least one lens 12 is received in the chamber. The lens holder 20 has a cavity through which one end has an internal thread 22, and the lens barrel 10 is sleeved at one end of the lens holder 20, that is, the internal thread 22 and the lens barrel 10 The external threads 11 are engaged. The lens holder 20 has at least two bumps 21 at the other end of the lens barrel 10, and the bumps 21 protrude from the lens holder 20 in a direction away from the lens barrel 10. The number of the bumps 21 may be three, four, five, six, etc., and the shape is a cylinder of equal height. The bump 21 and the lens holder 20 may be of a unitary structure, or may be separate and different components, and may be fixed to the lens holder 20 by bonding or other means. In the present embodiment, there are four bumps 21 which are made of the same material as the mirror base 20 and are of a unitary structure having a quadrangular prism of equal height. In the embodiment, the lens holder 20 is provided with the four bumps 21 at the ends and having a square structure. One of the bumps 21 is provided at each corner of the square structure. The circuit board 60 is a printed circuit board. The image sensing wafer 50 is adhered to the surface of the circuit board 60, and the sensing area is opposite to the circuit board 60 and electrically connected to the circuit board 60. The lens holder 20 is adhered to the surface of the circuit board 60 having the image sensing wafer 50 by four bumps 21, and the image sensing wafer 50 is received in the lens holder 20. 9 1354135 A light-transmissive 7L member 30 is fixed between the image sensing wafer 50 and the mirror 10, and is used to protect the image except for the gentleman 外---X X The sensing area of the slice 50' can be used to filter the light. Therefore, 70 pieces of 30 are adhered to the inner wall of the lens holder 20 to reject the wafer 50# and directly adhere to the image surface. In the present embodiment, the light transmitting element is on the inner wall of the lens holder 20. The light-transmitting connection ^ ^ it # ^ 九 70-piece buckle may be a glass and a gossip through material, in this embodiment, an infrared filter.
在所述鏡座20與所述電路板⑼之間之㈣中， :=4〇 ’該膠體層4〇環繞所述影像感測晶片5二所 述膠體層40可起到保護所述電路板6〇表面電子元件之作 用。在本實施例中’所述膠體層4〇爲熱固膠。In (4) between the lens holder 20 and the circuit board (9), :=4〇' the colloid layer 4 surrounds the image sensing wafer 5, the colloid layer 40 can serve to protect the circuit board 6〇 The role of surface electronic components. In the present embodiment, the colloid layer 4 is a thermosetting glue.
請-併參閱圖5與圖6。圖5爲本發明第二實施例提 供之相機模組20G之立體分解圖，其包括：鏡頭ιι〇、鏡 座12〇、影像感測晶片150及電路板16〇。圖6爲所述相機 模組200之鏡座設置有凸塊一端之平面圖。 所述相機模組200與本發明第一實施例提供之相機模 ，'且1〇〇之結構基本相同，其區別在於：所述鏡座12〇相對 於所述鏡筒110之另一端有二個凸塊121沿遠離所述鏡筒 110方向凸出於鏡座120。在本實施例中，所述二個凸塊 121與所述鏡座12〇爲一體結構，並採用相同材料製成。 本實施例中之所述鏡座12〇設置有所述二個凸塊121之一 端爲方形結構，所述凸塊121設置在所述方形結構之相對 之兩條邊上之_心位置，如圖6所示。所述二個凸塊i2i 爲兩個等咼之長方體，其長度不大於所述方形結構之邊 1354135 長，但長度不可以過短，需保證所述鏡座120可以通過所 述二個凸塊121平穩之黏接到所述電路板160表面。在所 述鏡座120與所述電路板160之間設置有一膠體層140， 該膠體層140環繞所述影像感測晶片150。 本發明中之鏡座設置有凸塊之一端還可以爲除方形外 之其他形狀，如圓形、三角形、四邊形或五邊形等等。只 要其不偏離本發明之技術效果，都應包含在本發明所要求 保護之範圍之内。 請參閱圖7,爲製造本發明第一實施例提供之相機模 組100之流程圖，其包括以下步驟。 步驟300 :提供一個電路板60，將一影像感測晶片50 黏附在所述電路板60表面。 將所述影像感測晶片50黏附於所述電路板60之表 面。在所述電路板60環繞所述影像感測晶片50之表面區 域，利用表面貼裝技術貼裝附屬電子元件。運用打線機將 所述影像感測晶片50與所述電路板60通過連接導線電性 連接。 步驟400:提供一個鏡座20及一個套接於所述鏡座20 之鏡筒10。 所述鏡筒10外部有外螺紋11，其内部設置有一容室， 及至少一透鏡12收容於所述容室中。 所述鏡座20有一貫穿之容室，所述容室之一端有内螺 紋22，所述鏡筒10套接於所述鏡座20係指該内螺紋22 與所述鏡筒10之外螺紋11相嚙合。所述鏡座20相對於所 11 1354135 述鏡筒10之另一端有至少二個凸塊21，所述凸塊21沿遠 離所述鏡筒10方向凸出於鏡座20。在本實施例中爲四個 凸塊21，該四個凸塊21與所述鏡座20採用相同材料，並 爲一體成型之方法製成。所述四個凸塊21之形狀爲等高之 四棱柱。本實施例中所述鏡座20設置有所述四個凸塊21 之一端爲方形結構。在所述方形結構之每個拐角處形成一 個所述凸塊21。 步驟500 :固定透光元件30。 提供一透光元件30，所述透光元件30可以爲玻璃或 其他材料，其主要用於保護所述影像感測晶片50之感測 區。所述透光元件30在本實施例中爲一紅外濾光片。所述 透光元件30可以黏接在所述鏡座20之内壁上，也可以黏 附在所述影像感測晶片50表面。在本實施例中，將所述透 光元件30黏接於所述鏡座20之内壁上。 步驟600 :形成膠體層40。 在所述電路板表面塗佈膠體，從而形成一膠體層40， 並使該膠體層40環繞所述影像感測晶片50，同時又包覆 所述電路板60之所述附屬電子元件以及所述連接導線。起 到保護所述影像感測晶片50與所述附屬電子元件以及所 述連接導線之作用，還可以固定所述附屬電子元件以及所 述連接導線之相對位置。在本實施例中所述膠體爲熱固膠。 步驟700 :固定鏡座20到電路板60。 將所述鏡座20通過所述膠體層40黏接到所述電路板 60，並使所述影像感測晶片50收容於所述鏡座20内，所 12 1354135 述鏡座20凸塊21黏接到所 20、所述膠體層40與所述透 之、。所述鏡座 測晶片如之無塵密封封ί仏件3〇形成對所述影像感 :述相機模組’之鏡座通過至少二 因此在組裝到電路板上時，只佔 = ;=線空間’降低了電路板表面之導線及電 :::度’便於提高電路板之生產良率及降低電路板之製 本㈣符合發明專利要件爰 利申Μ。惟，以上所述者僅為本發 权出寻 發明之範圍並不以上述實施方式為限，心技； 之人士援依本發明之精神所作之等 =木- 蓋於以下ΐ請專利範圍内。 文H切化，皆應涵 【圖式簡單說明】 圖1係先前技術提供之一種相機模組半剖視圖。 圖2係先前技術提供之相機模組之立體分解圖。 圖 圖3係本發明第一實施例提供之相機模組之半别視 圖 圖 圖4係本發明第—實施例提供之相機模經之立體分解 圖5係本發明第二實施例提供之相機模組之立體分解 圖6係本發明第二實施例提供之相機模組中鏡座設置 13 1354135 有凸塊一端之平面圖。 圖7係本發明提供之製造第一實施例中提供之相機模組之流 程圖。 【主要元件符號說明】Please - see also Figure 5 and Figure 6. FIG. 5 is an exploded perspective view of a camera module 20G according to a second embodiment of the present invention, which includes a lens ιι, a lens holder 12, an image sensing chip 150, and a circuit board 16A. Fig. 6 is a plan view showing the lens holder of the camera module 200 provided with one end of a bump. The camera module 200 is basically the same as the camera module provided by the first embodiment of the present invention, and the difference is that the lens holder 12 is opposite to the other end of the lens barrel 110. The bumps 121 protrude from the lens holder 120 in a direction away from the lens barrel 110. In this embodiment, the two bumps 121 are integrally formed with the mirror base 12 and are made of the same material. In the embodiment, the lens holder 12 is provided with one of the two protrusions 121 as a square structure, and the protrusion 121 is disposed on the opposite sides of the square structure, as shown in the figure. 6 is shown. The two protrusions i2i are two equal-shaped rectangular parallelepipeds, the length of which is not longer than the edge of the square structure 1354135, but the length may not be too short, and it is necessary to ensure that the lens holder 120 can pass the two convex blocks. 121 is smoothly bonded to the surface of the circuit board 160. A colloid layer 140 is disposed between the lens holder 120 and the circuit board 160, and the colloid layer 140 surrounds the image sensing wafer 150. The lens holder in the present invention is provided with one end of the bump and may be other shapes than a square, such as a circle, a triangle, a quadrangle or a pentagon. It should be included in the scope of the claimed invention as long as it does not depart from the technical effects of the present invention. Referring to Figure 7, a flow chart of a camera module 100 for manufacturing a first embodiment of the present invention includes the following steps. Step 300: A circuit board 60 is provided to adhere an image sensing wafer 50 to the surface of the circuit board 60. The image sensing wafer 50 is adhered to the surface of the circuit board 60. The circuit board 60 surrounds the surface area of the image sensing wafer 50, and the attached electronic components are mounted by surface mount technology. The image sensing wafer 50 and the circuit board 60 are electrically connected to each other through a connecting wire by a wire bonding machine. Step 400: Providing a lens holder 20 and a lens barrel 10 sleeved on the lens holder 20. The lens barrel 10 has an external thread 11 on the outside thereof, a chamber is disposed therein, and at least one lens 12 is received in the chamber. The lens holder 20 has a cavity through which one end of the chamber has an internal thread 22, and the lens barrel 10 is sleeved on the lens holder 20 to mean the external thread 22 and the external thread of the lens barrel 10. 11 phases are engaged. The lens holder 20 has at least two bumps 21 with respect to the other end of the lens barrel 10, and the bumps 21 protrude from the lens holder 20 in a direction away from the lens barrel 10. In the present embodiment, there are four bumps 21 which are made of the same material as the mirror base 20 and which are integrally formed. The four bumps 21 are in the shape of a quadrangular prism of equal height. In the embodiment, the lens holder 20 is provided with one end of the four bumps 21 as a square structure. One of the bumps 21 is formed at each corner of the square structure. Step 500: Fixing the light transmissive element 30. A light transmissive element 30 is provided. The light transmissive element 30 can be a glass or other material that is primarily used to protect the sensing area of the image sensing wafer 50. The light transmissive element 30 is an infrared filter in this embodiment. The light transmissive element 30 can be adhered to the inner wall of the lens holder 20 or adhered to the surface of the image sensing wafer 50. In the embodiment, the light transmitting element 30 is adhered to the inner wall of the lens holder 20. Step 600: Forming a colloid layer 40. Applying a colloid to the surface of the circuit board to form a colloid layer 40, and surrounding the image sensing wafer 50 with the colloid layer 40, while covering the auxiliary electronic component of the circuit board 60 and the Connect the wires. The protection of the image sensing wafer 50 and the auxiliary electronic components and the connecting wires can also be used to fix the relative positions of the auxiliary electronic components and the connecting wires. In the embodiment, the colloid is a thermosetting glue. Step 700: Fix the lens holder 20 to the circuit board 60. The lens holder 20 is adhered to the circuit board 60 through the colloid layer 40, and the image sensing chip 50 is received in the lens holder 20, and the lens holder 20 is adhered to the lens block 20 Receiving 20, the colloid layer 40 and the transparent layer. The mirror mount wafer, such as the dust-free seal seal 3, forms a sense of the image: the camera mount of the camera module passes at least two, so when assembled onto the circuit board, only the === line The space 'reduces the wire and electricity on the surface of the board:::degree' to improve the production yield of the circuit board and reduce the cost of the circuit board (4) in line with the invention patent requirements. However, the above description is only for the scope of the invention, and is not limited to the above-mentioned embodiments, and the person who is in accordance with the spirit of the present invention is covered by the following patents. . H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H 2 is an exploded perspective view of a camera module provided by the prior art. Figure 3 is a perspective view of a camera module according to a first embodiment of the present invention. Figure 4 is a perspective view of a camera module according to a first embodiment of the present invention. Figure 5 is a camera module according to a second embodiment of the present invention. The stereoscopic exploded view of the group is a plan view of the lens holder 13 in the camera module according to the second embodiment of the present invention. Fig. 7 is a flow chart showing the manufacture of the camera module provided in the first embodiment provided by the present invention. [Main component symbol description]
先前相機模組 1 鏡筒 2 鏡座 3 玻璃片 4 影像感測晶片 5 電路板 6 外螺紋 7 内螺紋 8 相機模組 100 AA- hfr 鏡同 10 外螺紋 11 透鏡 12 鏡座 20 凸塊 21 内螺紋 22 透光元件 30 膠體層 40 影像感測晶片 50 電路板 60 相機模組 200 鏡筒 110 鏡座 120 凸塊 121 膠體層 140 影像感測晶片 150 電路板 160 14Previous camera module 1 Lens barrel 2 Mirror holder 3 Glass plate 4 Image sensing chip 5 Circuit board 6 External thread 7 Internal thread 8 Camera module 100 AA- hfr Mirror with 10 external thread 11 Lens 12 Mirror holder 20 Bump 21 Thread 22 Light Transmissive Element 30 Colloidal Layer 40 Image Sensing Wafer 50 Circuit Board 60 Camera Module 200 Lens Tube 110 Mirror Holder 120 Bump 121 Colloidal Layer 140 Image Sensing Wafer 150 Circuit Board 160 14