200822721 九、發明說明： 【發明所屬之技術領域】 本發明涉及-種影像感簡組封裝結構，尤其靜及— 種數彳i相機用影像感測模組封裳結構。 、, 【先前技術】 在光學成像産品中，為達到較佳之成像效果，應盡量 保持鏡頭模組與晶片模組對位之精準。 請：閱圖丄所示’一習知影像感測模組封裝結構_ 包括-絲1〇、一晶片模組u、一鏡頭模組12及、钻著 ，13。該晶片模組n包括—用於感測光線之晶片⑴及 晶片頂面之蓋板113。該晶片模組u藉由表面招著 技術（SurfaCe-mount techn0l0gy，SMT)固定且電性連接 於基板10上。所述鏡頭模組12包括鏡頭座14及鏡頭15。 該鏡碩座14藉由枯著物13枯著於基板1〇上。鏡頭i 接於鏡頭座14上。 ” 組裝時，該晶片模組n固定於基板1〇上形成一中心 對位基準A1。鏡頭座14料於基板1Q上形成—中心對位 基準A2。惟，所述二中心對位基準A1及A2存在一定偏 差，影響鏡頭15與晶片模組〗i對位之精準。 【發明内容】 有鑒於此，有必要提供一種能夠有效提高鏡頭模組_與 晶片模組對位準確度之影像感測模組封裝結構。 種影像感測模組封裝結構，包括一基板、一晶片模 、、且及鏡頭杈組。該晶片模組設置於基板上。該鏡頭模組 200822721 設置於基板上且包括一容置室，該容置室收容晶片模組並 與該晶片模組之側部緊密配合。 相較習知技術，所述影像感測模組封裝結構由於鏡頭 模組之容置室與晶片模組之侧部緊密配合，即使組裝時晶 片模組稍有位移，鏡頭模組可跟隨晶片模組而調整其與基 板之裝配位置，即鏡頭座與晶片模組之中心對位基準位於 同一直線上。因此，所述影像感測模組封裝結構減小了鏡 頭核組與晶片模組之對位誤差’提南了對位精確度。 【實施方式】 請參閱圖2所示本發明之影像感測模組封裝結構第一 較佳實施例，該影像感測模組封裝結構200包括一基板 20、一晶片模組21、一鏡頭模組22、錫膏23及第一粘著 物24。 所述基板20係一平板體，具有一頂面（圖未標）及一底面 (圖未標）。該基板20包括複數設置於頂面之電性連接點 201，其用於與晶片模組21電性連接。 所述晶片模組21包括一晶片211及一蓋板213。該晶 片211頂面具有一感測光線之感測區214，其與頂面相對 之底面具有複數引腳215。該蓋板213係一透明板，其尺 寸與晶片211之頂面尺寸相當。該蓋板213蓋設於晶片211 上，以保護晶片211之感測區214。 - 該晶片模組21係藉由表面枯著技術（Surface-mount technology，SMT)與基板20相連接，其中晶片模組21 之複數引腳215與基板20之電性連接點201藉由錫膏23 7 200822721 固接及電性連接。 所述鏡頭模組22包括一鏡頭座25及一鏡頭26。 該鏡頭座25為一柱狀之中空筒體，其兩端開通並形成 一鏡礼255及一容置室257。該鏡孔255呈圓孔狀，其内 壁設有一内螺紋259。該容置室257之輪廓與該晶片模組 21之外輪廓相當。 所述鏡頭26包括一鏡筒261及至少一鏡片263。該鏡片 263固定於鏡筒261内。該鏡筒261外壁設置一外螺紋265。 , 鏡頭26藉由該外螺紋265與該鏡孔255之内螺紋259之配 合螺接於鏡頭座25上。 所述第一粘著物24係塗佈於鏡頭座25之底面，其粘 接鏡頭座25於基板20上。 組裝時，首先將晶片模組21設置於基板20上，然後 將所述裝配有鏡頭26之鏡頭座25與晶片模組21對準後罩 設於其上，此時，晶片模組21之外側部與容置室257之内 壁緊密配合且容置於容置室257内。由於容置室257與晶 片模組21緊密配合，即使晶片模組21稍有位移，鏡頭座 25亦可跟隨晶片模組21而調整其與基板20之裝配位置， 即鏡頭座25及晶片模組21之中心對位基準均位於B1上。 因此，所述影像感測模組封裝結構200可減小對位誤差， 提高對位精確度。 - 請參照圖3所示本發明之影像感測模組封裝結構第二 較佳實施例，該影像感測模組封裝結構300與影像感測模 組封裝結構200相似，其包括一基板20、一晶片模組21、 8 200822721 鏡頭模組32、錫貧23及第一粘著物24。所述鏡頭模組 32包括一鏡頭座35及一螺接於該鏡頭座35之鏡頭26。該 鏡頭座35具有一内壁351。其不同之處在於，該影像感測 模組身裝結構300還包括一環狀擋塊353及第二粘著物 27。該環狀擋塊353凸設於所述内壁351上，並抵持蓋板 213之頂面，其可防止鏡頭座25與基板2〇之間縫隙過小， 導致第一粘著物24溢出。該第二粘著物27係塗佈於擋塊 353與蓋板213之間，以增強模組結合強度。同時，由於設 有播塊353 ’可更佳更快速地定位鏡片263與晶片模組21 間之間距。易知，本實施例中之第二粘著物27可省去。 請參照圖4所示本發明之影像感測模組封裝結構第三 較佳實施例，該影像感測模組封裝結構4〇〇與影像感測模 組封裝結構300相似，其包括一基板4〇、一晶片模組21、 一鏡頭模組42、錫膏23、第一粘著物24及第二粘著物27。 所述鏡頭模組42包括一鏡頭座45及一螺接於該鏡頭座45 之鏡頭26。其不同之處在於，該鏡頭座45底端凸設有複 數第一腳針451’基板20相對應地設置複數凹槽4〇ι，第 一腳針451與凹槽術相喪合，且藉由第一點著物以相枯 ，，鏡頭座45更加牢固地固定於基板4〇上，另，此結構 還具有更好之遮蔽外界光線之效果。易知，本實施例中之 凸塊453及第二枯著物27可省去，亦可只省去第二枯著物 27 〇 請參照圖5所示之本發明之影像感測模組封裝結構第 四較佳實施例’該影像感測模組封裝結構與影像感測 200822721 模組封裝結構300相似，其包括一基板5〇、一晶片模組A -鏡頭模組52、錫膏23、第一粘著物24及第二粘著物”。 所述鏡頭额52包括—鏡㈣55及—螺接於賴頭座^ ，鏡頭26。其不同之處在於，鏡頭座％底端凸設複數第 一腳針551 ’基板50相對應地設置複數通孔，第二腳 針551與通孔501相谈合，且藉由第—枯著物24相點接， 鏡頭座55更加牢固地固定於基板％上，另，此結構還具 有更好，遮蔽外界光線之效果。易知，本實施财之凸塊 553及第二枯著物27可省去，亦可只省去第二枯著物 可以理解’上述較佳實施例中之鏡頭％可省去，而於 鏡㈣之鏡孔中直接蚊至少—鏡片以滿足成像需求。、 綜上所述，本發明符合發明專利要件，爰依法 利申請。m所述者僅為本發明之㈣實施例，舉凡 沾悉本案技#之人士，在援依本案創作精神所作之等效修 飾或變化，皆應包含於以下之中請專利範圍内。 【圖式簡單說明】 图1係習知影像感測模組封裝結構之剖視圖。 图2係本發明影像感測模組封裝結構第一較佳實施例 之剖視圖。 图3係本發明影像感測模組封裝結構第二較佳例 之剖視圖。 图4係本發明影像感測模組封裝結構第三較施例 之剖視圖。 图5係本發明影像感測模組封裝結構第四較佳實施例 200822721 之剖視圖。 【主要元件符號說明】 (習知） 影像感測模組封裝結構 晶片模組 蓋板 枯者物 鏡頭 f 鏡頭模組中心對位基準 (本發明） 影像感測模組封裝結構 電性連接點 晶片 感測區 鏡頭模組 ,第一粘著物 鏡孔 鏡孔内螺紋 鏡筒 鏡筒外螺紋 影像感測模組封裝結構 鏡頭模組 鏡頭座内壁 影像感測模組封裝結構 基板 10 晶片 111 鏡頭模組 12 鏡頭座 14 晶片模組中 心對位基準A1 基板 20 晶片模組 21 蓋板 213 引腳 215 錫膏 23 鏡頭座 25 容置室 257 鏡頭 26 鏡片 263 中心對位基準 B1 第'一枯著物 27 鏡頭座 35 擋塊 353 基板 40 11 200822721 鏡頭模組 42 擋塊 453 第一腳針 451 基板Λ 50 鏡頭座 55 通孔 501 鏡頭座 45 凹槽 401 影像感測模組封裝結構500 鏡頭模組 52 擋塊 553 第二腳針 551 12200822721 IX. Description of the Invention: [Technical Field] The present invention relates to an image sensing package structure, in particular, a static and a plurality of camera image sensing module sealing structures. [Previous Technology] In optical imaging products, in order to achieve better imaging results, the alignment of the lens module and the wafer module should be kept as accurate as possible. Please refer to the illustration of a conventional image sensing module package structure _ including - wire 1 〇, a wafer module u, a lens module 12 and drilled, 13. The wafer module n includes a wafer (1) for sensing light and a cover 113 for the top surface of the wafer. The wafer module u is fixed and electrically connected to the substrate 10 by a surface squeezing technique (SurfaCe-mount techn0g0gy, SMT). The lens module 12 includes a lens mount 14 and a lens 15 . The mirror stand 14 is dried on the substrate 1 by the dry matter 13. The lens i is attached to the lens mount 14. When assembled, the wafer module n is fixed on the substrate 1 to form a center alignment reference A1. The lens holder 14 is formed on the substrate 1Q to form a center alignment reference A2. However, the two center alignment reference A1 and A2 has a certain deviation, which affects the accuracy of the alignment between the lens 15 and the chip module. [Invention] In view of this, it is necessary to provide an image sensing that can effectively improve the alignment accuracy of the lens module _ and the wafer module. The package structure of the image sensing module includes a substrate, a wafer die, and a lens stack. The chip module is disposed on the substrate. The lens module 200822721 is disposed on the substrate and includes a The accommodating chamber houses the chip module and is closely matched with the side of the chip module. Compared with the prior art, the image sensing module package structure is due to the housing chamber and the wafer module of the lens module. The side of the group is tightly matched. Even if the wafer module is slightly displaced during assembly, the lens module can follow the wafer module to adjust its assembly position with the substrate, that is, the center alignment of the lens holder and the wafer module is in the same straight line. Therefore, the image sensing module package structure reduces the alignment error between the lens core group and the chip module, and improves the alignment accuracy. [Embodiment] Please refer to the image of the present invention shown in FIG. The first embodiment of the sensing module package structure includes a substrate 20, a wafer module 21, a lens module 22, a solder paste 23, and a first adhesive 24. The substrate 20 is a flat body having a top surface (not labeled) and a bottom surface (not labeled). The substrate 20 includes a plurality of electrical connection points 201 disposed on the top surface for use with the wafer module. The chip module 21 includes a wafer 211 and a cover plate 213. The top surface of the wafer 211 has a sensing region 214 for sensing light, and a bottom surface 215 opposite the top surface. The cover 213 is a transparent plate having a size corresponding to the top surface of the wafer 211. The cover 213 is disposed on the wafer 211 to protect the sensing region 214 of the wafer 211. - The wafer module 21 is Surface-mount technology (SMT) is connected to the substrate 20, wherein the wafer mold The electrical connection point 201 of the plurality of pins 215 of the group 21 and the substrate 20 is fixedly and electrically connected by a solder paste 23 7 200822721. The lens module 22 includes a lens holder 25 and a lens 26. The lens holder 25 The columnar hollow cylinder has two ends open to form a mirror 255 and a accommodating chamber 257. The mirror hole 255 has a circular hole shape, and an inner thread is provided on the inner wall thereof. The contour of the accommodating chamber 257 The lens 26 includes a lens barrel 261 and at least one lens 263. The lens 263 is fixed in the lens barrel 261. The outer wall of the lens barrel 261 is provided with an external thread 265. The external thread 265 is screwed to the lens mount 25 in cooperation with the internal thread 259 of the mirror hole 255. The first adhesive 24 is applied to the bottom surface of the lens holder 25, and is attached to the lens holder 25 on the substrate 20. In the assembly, the wafer module 21 is first disposed on the substrate 20, and then the lens holder 25 equipped with the lens 26 is aligned with the wafer module 21 and then placed thereon. At this time, the outer side of the wafer module 21 The portion is closely fitted with the inner wall of the accommodating chamber 257 and is received in the accommodating chamber 257. Since the accommodating chamber 257 is closely matched with the wafer module 21, even if the wafer module 21 is slightly displaced, the lens holder 25 can follow the wafer module 21 to adjust its assembly position with the substrate 20, that is, the lens holder 25 and the wafer module. The center alignment benchmark of 21 is located on B1. Therefore, the image sensing module package structure 200 can reduce the alignment error and improve the alignment accuracy. Referring to FIG. 3, a second preferred embodiment of the image sensing module package structure of the present invention is similar to the image sensing module package structure 200, and includes a substrate 20, A wafer module 21, 8 200822721 lens module 32, tin lean 23 and first adhesive 24. The lens module 32 includes a lens holder 35 and a lens 26 screwed to the lens holder 35. The lens mount 35 has an inner wall 351. The difference is that the image sensing module body structure 300 further includes an annular stop 353 and a second adhesive 27. The annular stopper 353 protrudes from the inner wall 351 and abuts against the top surface of the cover plate 213, which prevents the gap between the lens holder 25 and the substrate 2 from being too small, and causes the first adhesive 24 to overflow. The second adhesive 27 is applied between the stopper 353 and the cover 213 to enhance the bonding strength of the module. At the same time, since the broadcast block 353' is provided, the distance between the lens 263 and the wafer module 21 can be positioned more quickly and quickly. It is easy to know that the second sticker 27 in this embodiment can be omitted. Referring to FIG. 4 , a third preferred embodiment of the image sensing module package structure of the present invention is similar to the image sensing module package structure 300 , and includes a substrate 4 . A wafer module 21, a lens module 42, a solder paste 23, a first adhesive 24, and a second adhesive 27. The lens module 42 includes a lens holder 45 and a lens 26 screwed to the lens holder 45. The difference is that the bottom of the lens holder 45 is convexly provided with a plurality of first pins 451', and the substrate 20 is correspondingly provided with a plurality of grooves 4〇, and the first pin 451 is combined with the groove and borrowed From the first point of the object, the lens holder 45 is more firmly fixed on the substrate 4, and the structure also has the effect of better shielding external light. It is easy to know that the bump 453 and the second dry object 27 in this embodiment can be omitted, or only the second dead object 27 can be omitted. Please refer to the image sensing module package of the present invention shown in FIG. The image sensing module package structure is similar to the image sensing 200822721 module package structure 300, and includes a substrate 5A, a wafer module A-lens module 52, solder paste 23, The first sticker 24 and the second sticker ”. The lens amount 52 includes a mirror (four) 55 and a screw-on joint, and a lens 26. The difference is that the lens holder has a bottom end protruding at a plurality The first pin 551 'the substrate 50 is correspondingly provided with a plurality of through holes, the second pin 551 is in contact with the through hole 501, and the lens holder 55 is more firmly fixed by the first and second objects 24 On the substrate %, in addition, this structure also has a better effect of shielding external light. It is easy to know that the bump 553 and the second dry matter 27 of the present implementation can be omitted, or only the second dry matter can be omitted. It can be understood that the lens % in the above preferred embodiment can be omitted, and at least the lens is directly in the mirror hole of the mirror (4) to satisfy In summary, the present invention is in accordance with the invention patent requirements, and is applied according to law. m is only the (four) embodiment of the present invention, and the person who has learned the skill of the case is in the spirit of creation of the case. Equivalent modification or change should be included in the following patents. [Simplified illustration] Figure 1 is a cross-sectional view of a conventional image sensing module package structure. Figure 2 is an image sensing module of the present invention. Figure 3 is a cross-sectional view showing a second preferred embodiment of the image sensing module package structure of the present invention. Figure 4 is a cross-sectional view showing a third embodiment of the image sensing module package structure of the present invention. 5 is a cross-sectional view of a fourth preferred embodiment of the image sensing module package structure of the present invention 200822721. [Main component symbol description] (conventional) image sensing module package structure wafer module cover object lens f Lens module center alignment reference (invention) image sensing module package structure electrical connection point wafer sensing area lens module, first adhesive objective hole mirror hole internal thread barrel barrel external thread image Test module package structure lens module lens mount inner wall image sensing module package structure substrate 10 wafer 111 lens module 12 lens mount 14 wafer module center alignment reference A1 substrate 20 wafer module 21 cover 213 pin 215 tin Paste 23 Lens mount 25 accommodating chamber 257 Lens 26 Lens 263 Center alignment reference B1 No. 1 dry object 27 Lens mount 35 Stop 353 Substrate 40 11 200822721 Lens module 42 Stop 453 First foot pin 451 Substrate Λ 50 Lens mount 55 Through hole 501 Lens mount 45 Groove 401 Image sensing module package structure 500 Lens module 52 Stopper 553 Second pin 551 12