1358382 100年:09与.07 ή俊正_頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及柔性電路板製作領域，尤其涉及用於柔性電 路板生產過程之基板轉移系統及方法。 【先前技術】 [0002] 隨著電子產品曰趨小型化和高速性能化，電路板已從單 面板發展為雙面板和多層板。其中，雙面電路板和多層 電路板具有較多之佈線面積、較高之裝配密度而得到廣 泛應用’參見文獻.Takahashi，A. ; High density multilayer printed circuit board for HITAC M-880; IEEE Trans, on Components, Packaging, and Manufacturing Technology; 1992 。 [0003] 多層電路板之製作包括内層線路製作、内層檢查、壓合 、鑽孔、電鍍、製作導電線路、線路電鍍、外層檢查、 防焊、表面加工和切割成型等工序。於實際生產中，為 提高生產效率，通常採用自動化收放裝置將上一工序製 作完成之電路基板堆疊整齊或蔣堆疊整齊之電路基板傳 輸至下一工序之工作臺加以製作。1358382 100 years: 09 and .07 ή俊正_Page VI, invention description: [Technical field of invention] [0001] The present invention relates to the field of flexible circuit board manufacturing, and more particularly to a substrate transfer system for a flexible circuit board production process and method. [Prior Art] [0002] As electronic products become more compact and high-speed performance, circuit boards have evolved from single-panels to double-panels and multi-layer boards. Among them, the double-sided circuit board and the multi-layer circuit board have a large wiring area and a high assembly density and are widely used [see document. Takahashi, A.; High density multilayer printed circuit board for HITAC M-880; IEEE Trans, On Components, Packaging, and Manufacturing Technology; 1992. [0003] The fabrication of a multilayer circuit board includes inner layer fabrication, inner layer inspection, press bonding, drilling, electroplating, fabrication of conductive traces, line plating, outer layer inspection, solder masking, surface processing, and cutting forming. In actual production, in order to improve the production efficiency, an automatic retractable device is usually used to stack the circuit boards which have been completed in the previous process or the circuit boards which are stacked and tidyed are transferred to the workbench of the next process.
[〇〇〇4]目前普遍使用之收放裝置包括機架和一組轉移機構，機 架設有水平設置之導軌。該轉移機構包括設於機架並位 於載料盤正上方之吸附裝置。該吸附裝置於驅動器之驅 動下可沿導轨水平滑動、垂直升降運動，將基板由一個 位置移栽到另一位置。一個移轉裝置循環進行，循環週 期較長。然而’隨著電路板生產各製程速度之提升，此 種收放裝置不能滿足生產之需要Q 097129215 表單編號A0101 第5頁/共24頁 1003326991-0 1358382 100年.09月07日梭正替換頁 [0005] 因此，有必要提供一種可提升電路板收放速度之基板轉 移系統。 【發明内容】 [0006] 以下將以實施例說明一種基板轉移系統及基板轉移方法 〇 [0007] —種基板轉移系統，用於將位於裝載位置之基板轉移至 卸料位置，該基板轉移系統包括：機架、第一滑動件、 第二滑動件、第一吸附裝置、第二吸附裝置、第一驅動 裝置、第二驅動裝置、第三驅動裝置、第四驅動裝置、 及一控制器。該機架包括位於同一水平面之第一導軌、 第二導執及位於同一水平面第三導軌、第四導轨，該第 一導軌與第二導執所確定之第一平面位于該第三導軌和 第四導執所確定之第二平面之下方且相距一段距離。該 第一滑動件滑動安裝於該第一滑轨及第二滑轨，該第二 滑動件滑動安裝於該第三滑轨及第四滑執。該第一吸附 裝置連接於該第一滑動件，該第一吸附裝置位於該第一 平面之下方。該第二吸附裝置連接於該第二滑動件。該 第一驅動裝置安裝於該第一滑動件，該第一驅動裝置用 於驅動該第一吸附裝置沿與水平方向垂直的豎直方向遠 離和靠近該基板運動從而該第一吸附裝置可吸附位於裝 載位置之基板。該第二驅動裝置連接於該第一滑動件， 該第二驅動裝置用於驅動該第一吸附裝置沿水年方向於 該裝載位置與該卸料位置之間移動。該第三驅動裝置安 裝於該第二滑動件，該第三驅動裝置用於驅動該第二吸 附裝置沿豎直方向靠近該基板運動以吸附位於裝載位置 097129215 表單編號A0101 第6頁/共24頁 1003326991-0 1358382 ldci年.09月〇y曰按正替換頁 之基板，以及驅動該第二吸附裝置沿豎直方向遠離該基 板運動至該第一平面與第二平面之間。該第四驅動裝置 連接於該第二滑動件，該第四驅動裝置用於驅動該第二 吸附裝置沿水平方向於該裝載位置與該卸料位置之間移 動。該控制器控制該第一吸附裝置、第二吸附裝置、第 一驅動裝置、第二驅動裝置、第三驅動裝置及第四驅動 裝置，使得該第一吸附裝置與第二吸附裝置交替吸附位 於裝載位置之基板並將吸附之基板交替轉移至卸料位置 放下。 [0008] —種利用上述基板轉移系統之基板轉移方法，包括以下 步驟：第一步，利用第二驅動裝置驅動第一吸附裝置自 卸料位置移動至裝載位置，進行基板之上載，同時第四 驅動裝置驅動第二吸附裝置自裝載位置移動至卸料位置 ，進行基板之下卸；第二步，利用第一驅動裝置驅動第 一吸附裝置自裝載位置上升移動至該第一平面下方之預 定高度，同時，第三驅動裝置控制第二吸附裝置自卸料 位置上升移動至該第一平面與第二平面之間；第三步， 利用第二驅動裝置驅動第一吸附裝置自裝載位置移動到 卸料位置，並下降進行基板之下卸，同時，利用第四驅 動裝置驅動第二吸附裝置自卸料位置移動到裝載位置， 並下降進行基板之上載；第四步，利用第一驅動裝置驅 動第一吸附裝置自卸料位置上升移動至該第一平面下方 之另一預定高度，同時，第三驅動裝置控制第二吸附裝 置自裝載位置上升移動至該第一平面與第二平面之間； 第五步，重複上述第一步至第四步。 097129215 表單編號A0101 第7頁/共24頁 1003326991-0 1358382 100年.09月0>日梭頁 麵*技術方案令之基板轉移系統和基板轉移方法可改善 基板收放過程中聊長之問題，大幅度之提升基板收放 之效率，滿足了電路板支撐速度提升之要求。 【實施方式】 [0010] 下面將結合附圖對本技術方案提供之作進一步之詳細說 明。 [0011] 請參閱圖1及圖2，本技術方案實施例提供一種基板轉移 系統100 ’其包括機架1〇、第一驅動裝置22、第二驅動裝 置23、第三驅動裝置32、第四驅動裝置33、第一吸附裝 置24、第二吸附裝置34、第一滑動件21和第二滑動件31 〇 [0012] 機架丨〇包括第一導軌101、第二導軌102、第三導轨103 、第四導軌104、四根支撐桿1〇5、第一連接桿1〇6和第 二連接桿107。 [0013] 第一導轨1〇1、第二導軌102、第三導軌1〇3和第四導轨 104水平設置並相互平行，其中，第一導軌1〇1和第二導 軌102位於一個水平面内並且相距一段距離，第三導軌 103和第四導軌104位於一個水平面内，第一導執1〇1與 第二導轨102所確定之平面與第三導轨1〇3和第四導轨 104所處之水平面於垂直兩平面之方向上相距一段距離， 以保證安裝於其上之第一吸附裝置24與第二吸附裝置34 於其上運動時不產生相互干擾。 [0014] 第一連接桿106設置於第一導轨101和第二導轨1〇2之間 ’兩端固定連接於第一導軌101和第二導軌1〇2，該第二 097129215 表單编號A0101 第8頁/共24頁 1003326991-0 1358382 100年.09月07日核正替‘頁 連接桿107設置於第三導執103和第四導轨104之間，兩 端固定連接於第三導軌103和第四導執104。優選地，第 一連接桿106設置於第一導軌101和第二導軌102之同一 端，第二連接桿107設置於第三導執103和第四導軌104 之同一端。 [0015] 四根支撐桿105用於支撐導軌，其中二根支撐桿105連接 並垂直第一導轨101和第三導轨103，另二根支撐桿105 連接並垂直於第二導軌102和第四導軌104。當然，為使 整個機架10穩定，可根據實際需要設置更多支撐桿105。 [0016] 該第一滑動件21包括第一承載部211以及固定連接於承載 部211兩端之第一滑動部212。該兩個第一滑動部21 2分 別套接於第一導執101和第二導軌102。本實施例中，為 使滑動平穩，設置兩個第一滑動件21。 [0017] 當然，也可藉由於第一導轨101和第二導軌102上設置滑 槽，將第一承載部211之兩端嵌設於該滑槽中，從而實現 第一滑動件21於第一導軌101和第二導執102上之滑動。 [0018] 第一驅動裝置22用於驅動第一吸附裝置24產生升降運動 ，該第一驅動裝置22安裝於第一承載部211，本實施例中 ，為使第一吸附裝置24運動過程穩定可設置第一限位件 221，第一限位件221—端安裝於滑動件21之承載部211 ，另一端通過承載部211上設置之通扎（圖未示）貫穿承 載部211，連接於第一吸附裝置24。本實施例中，為使第 一吸附裝置24於運動過程中保持平衡，設置四個第一限 位件221。該第一驅動裝置22可為電機或氣缸。 097129215 表單編號A0101 第9頁/共24頁 1003326991-0 1358382 100年.09月0·7日修正替換頁 [0019] 第一吸附裝置24用於吸附基板，其與真空裝置相連（圖 未示）。本實施例中，該第一吸附裝置24為真空吸盤。 [0020] 第二驅動裝置23固定於第一連接桿106，第二驅動裝置23 包括第二驅動器231和第二傳動件232，該第二傳動件 232連接第二驅動器231和第一承載部211。於第二驅動 器231之驅動下，第一承載部211沿著第一導軌101和第 二導轨102水平滑動。第二驅動器231可為電機或氣缸， 第一傳動件232可為本領域常見之伸縮軸承。 [0021] 第二滑動件31包括第二承載部311以及固定連接於第二承 載部311兩端之第二滑動部312。第二滑動部312分別套 接於第三導轨103和第四導軌104。 [0022] 第三驅動裝置32用於驅動第二吸附裝置34產生垂直於第 三導軌103和第四導軌104所定義平面之升降運動，第三 驅動裝置32安裝於第二承載部311，本實施例中，為使第 二吸附裝置34於運動過程中具有穩定性，設置了四個第 二限位件321，第二限位件321之一端安裝於第二承載部 311，另一端通過第二承載部311上設置之通孔（圖未示 )貫穿第二承載部311，連接於第二吸附裝置34。第二限 位件321之長度應足夠長，以使得與其連接之第二吸附裝 置34下降足夠之距離，從而到達待吸附之基板之表面。 該第三驅動裝置32可為電機或氣缸。第二吸附裝置34用 於吸附基板，其與真空裝置相連（圖未示）。本實施例 中，該第二吸附裝置341為真空吸盤。 [0023] 第四驅動裝置33固定於第二連接桿107，第四驅動裝置33 097129215 表單編號Α0101 第10頁/共24頁 1003326991-0 097129215 [0024] [0025] [0026] 表單編號A0101 1003326991-0 日接正_頁] "括第四驅動器331和第四傳動件332，第四傳動件332 連接第四驅動器331和第二承載部311。於第四聪動器 331之驅動下’第二滑動邹312帶動第二承載部311沿著 第三導轨103和第四導軌1Q4水平滑動。第四駆動裝㈣ 可為電機或氣缸，第四傳動件332可為本領域常見之伸縮 軸承。 _· 第吸附裝置21、第二吸附裝置31、第一驅動裝置22、 第-驅動裝置23、第三驅動裝置32、第四㈣裝置⑺和 抽氣裳置均連接於控制器4〇，控制器4〇控制該第一驅動 裝置22、第二驅動裝置23、第三驅動裝置32及第四驅動 裝置33，使得第一吸附裝置21與第二吸附裝置3丨交替吸 附位於震載位置之基板並將吸附之基板轉移至抑料位置 放下。 °月參閱圖2至圖6 ’下面以實施例說明採用基板轉移系統 轉移基板之方法。 |μ V ’利用第二驅動裝置23驅動第一吸附裝置24自卸 料位置B移動至I載位置A，進行基板2〇〇之上栽，同時第 四驅動裝置33驅動第二吸附裝置34自裝載位置A移動至卸 料位置B，進行基板之下卸；如圖2所示’於控制器40之 控制下’使得第—吸附裝置24和第二吸附裝置34分別位 於裝載位置A和卸料位置B，通過控制器4〇控制第一驅動 裝置22驅動第1附裝置24下降到位於裝載位置A待收基 板200之表面。控制器40控制第三驅動裝置32驅動第二吸 附裝置34下降到位於裝載位置a待收基板2〇〇之表面。如 圖3所7F ’第及附裝置24將基板200吸起，第二吸附裝 第II頁/共24頁 1358382 100年09月07日核正替換頁 置34將吸附之基板200放下， [0027] 第二步，利用第一驅動裝置22驅動第一吸附裝置24自裝 載位置A上升移動第一高度，同時，第三驅動裝置32控制 第二吸附裝置34自卸料位置B上升移動第二高度，該第一 高度小於第二高度。第一吸附裝置之4和第二吸附裝置34 上升。通過控制器40啟動抽氣裝置，第一吸附裝置24之 吸嘴吸起基板200 ;同時控制器40控制第三驅動裝置32， 驅動第二吸附裝置34下降至位於卸料位置B之基板200堆 疊處，此時，與第二吸附裝置34相連之抽氣裝置關閉， 將第二吸附裝置34吸附之基板200放於基板200之堆疊處 B。然後，控制器40控制第一驅動裝置22和第三驅動裝置 32，使第一驅動裝置22驅動第一吸附裝置24及其吸附之 基板200上升；同時，可使第三驅動裝置32驅動第二吸附 裝置34上升。 [0028] 第三步，利用第二驅動裝置23驅動第一吸附裝置24於第 一高度處自裝載位置A移動到卸料位置並下降，進行基板 200之下卸，同時，利用第四驅動裝置33驅動第二吸附裝 置34自卸料位置B移動到裝載位置A並下降，進行基板200 之上載；如圖4所示，兩移載裝置相對導執滑動，使得第 一吸附裝置24位於卸料位置B，第二吸附裝置34位於裝載 位置A。然後，控制器40控制第二驅動裝置23和第四驅動 裝置33，使得第二驅動裝置23驅動第一滑動件21安裝於 其上之第一吸附裝置24和第一驅動裝置22沿著第一導軌 101和第二導軌102由裝載位置A滑動到卸料位置B，同時 ，控制器40控制第四驅動裝置33，使得第四驅動裝置33 097129215 表單編號A0101 第12頁/共24頁 1003326991-0 1358382 1.100年·〇9月 〇y 日 驅動第二滑動件31安裝於其上之第二吸附裝置34和第二 驅動裝置3 2沿著第三導執1 〇 3和第四導軌1 〇 4由卸料位置 B滑動到裝載位置A。 [0029] [0030] [0031] [0032] 如圖5所示，第一吸附裝置24和第二吸附裝置34下降，第 一吸附裝置24將基板200放下，第二吸附裝置34將基板 200吸起》控制器40控制第一驅動裝置22驅動第一吸附裝 置24下降，同時，控制器40控制第三驅動裝置32驅動第 二吸附裝置24下降。然後，控制器4〇控制與第一吸附裝 置24相連之抽氣裝置關閉’使得吸附之基板2〇〇堆疊於卸 料位置B。同時控制器4〇控制與第二吸附裝置34相連之抽 氣裝置開啟’吸附起位於裝載位置A之基板2〇〇。 第四步，利用第一驅動裝置22驅動第一吸附裝置24自卸 料位置B上升移動該第一高度，同時，第三驅動裝置32控 制第二吸附裝置34自裝載位置a上升移動該第二高度。 第五步，重複上述第一步至第四步，即可將基板由裝載 位置轉移到卸料位置並且堆疊整齊。當然，上述之基板 轉移系統100也可應用於將堆疊電路板投放於預進行製程 之傳送帶上。 由於基板轉移系統100通過控制兩個吸附裝置交替吸附並 投放基板，可改善基板收放過程中週期長之問題，大幅 度之提升基板收放之效率，可滿足電路板製程速度提升 之要求° [0033] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申请。惟，以上所述者僅為本發明之較佳實施方 097129215 表單编號A0101 第13頁/共24頁 1003326991-0 1358382 100年.09月07日修i替換頁 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0034] 圖1係本技術方案實施例提供之基板轉移系統之示意圖。 [0035] 圖2至圖6係本技術方案提供之基板轉移系統轉移基板過 程示意圖。 【主要元件符號說明】 [0036] 機架：10 [0037] 第一滑動件：21 [0038] 第一驅動裝置：22 [0039] 第二驅動裝置*· 23 [0040] 第一吸附裝置：24 [0041] 第二滑動件：31 [0042] 第三驅動裝置：32 [0043] 第四驅動裝置：33 [0044] 第二吸附裝置：34 [0045] 控制器：40 [0046] 基板轉移系統：100 [0047] 第一導執：101 [0048] 第二導轨：102 097129215 表單編號A0101 第14頁/共24頁 1003326991-0 1358382 [0049] 第三導轨：103 [0050] 第四導轨：104 [0051] 支撐桿：105 [0052] 第一連接桿： 106 [0053] 第二連接桿： 107 [0054] 基板：200 [0055] 第一承載部： 211 [0056] 第一滑動部： 212 [0057] 第一限位件： 221 [0058] 第二驅動器： 231 [0059] 第二傳動件： 232 [0060] 第二承載部： 311 [0061] 第二滑動部： 312 [0062] 第二限位件： 321 [0063] 第四驅動器： 331 [0064] 第四傳動件： 332 097129215 表單编號Α0101 第15頁/共24頁 100年.09月0·7日梭正_百 1003326991-0[〇〇〇4] The retractable device currently in common use includes a frame and a set of transfer mechanisms, and the frame is provided with horizontally disposed guide rails. The transfer mechanism includes an adsorption device disposed in the frame and positioned directly above the loading tray. The adsorption device can be horizontally slid and vertically moved along the guide rail under the driving of the driver to transplant the substrate from one position to another. A transfer device is cycled and the cycle period is longer. However, with the increase in the speed of each process of circuit board production, such a retractable device cannot meet the needs of production. Q 097129215 Form No. A0101 Page 5 / Total 24 Page 1003326991-0 1358382 100. September 07 Shuttle Replacement Page [0005] Therefore, it is necessary to provide a substrate transfer system that can increase the speed at which a circuit board can be retracted. SUMMARY OF THE INVENTION [0006] Hereinafter, a substrate transfer system and a substrate transfer method will be described by way of an embodiment [0007] a substrate transfer system for transferring a substrate at a loading position to a discharge position, the substrate transfer system including a frame, a first slider, a second slider, a first adsorption device, a second adsorption device, a first drive device, a second drive device, a third drive device, a fourth drive device, and a controller. The frame includes a first rail located at the same horizontal plane, a second guide, and a third rail and a fourth rail located at the same horizontal plane, where the first rail and the first plane determined by the second guide are located on the third rail and Below the second plane determined by the fourth guide and at a distance. The first sliding member is slidably mounted on the first sliding rail and the second sliding rail, and the second sliding member is slidably mounted on the third sliding rail and the fourth sliding bracket. The first adsorption device is coupled to the first slider, and the first adsorption device is located below the first plane. The second adsorption device is coupled to the second slider. The first driving device is mounted on the first sliding device, and the first driving device is configured to drive the first adsorption device to move away from and close to the substrate in a vertical direction perpendicular to the horizontal direction, so that the first adsorption device can be adsorbed at The substrate at the loading position. The second driving device is coupled to the first sliding member for driving the first adsorption device to move between the loading position and the discharging position in the water year direction. The third driving device is mounted on the second sliding device, and the third driving device is configured to drive the second adsorption device to move in the vertical direction near the substrate to be adsorbed at the loading position 097129215. Form No. A0101 Page 6 of 24 1003326991-0 1358382 ldci year.09 〇y曰 The substrate of the replacement page is replaced, and the second adsorption device is driven to move away from the substrate in the vertical direction between the first plane and the second plane. The fourth drive unit is coupled to the second slider for driving the second adsorption unit to move between the loading position and the discharge position in a horizontal direction. The controller controls the first adsorption device, the second adsorption device, the first driving device, the second driving device, the third driving device and the fourth driving device, so that the first adsorption device and the second adsorption device are alternately adsorbed at the loading The substrate is positioned and the adsorbed substrate is alternately transferred to the discharge position for placement. [0008] A substrate transfer method using the above substrate transfer system includes the following steps: First, the second driving device is used to drive the first adsorption device to move from the unloading position to the loading position, and the substrate is uploaded, and at the same time, the fourth The driving device drives the second adsorption device to move from the loading position to the discharging position to perform the lowering of the substrate. In the second step, the first driving device drives the first adsorption device to move from the loading position to a predetermined height below the first plane. At the same time, the third driving device controls the second adsorption device to move from the unloading position to the first plane and the second plane; and in the third step, the second driving device drives the first adsorption device to move from the loading position to the unloading The material position is lowered and lowered to perform the unloading of the substrate. At the same time, the fourth driving device is used to drive the second adsorption device to move from the unloading position to the loading position, and the substrate is uploaded downward; and the fourth step is to drive the first driving device. An adsorption device moves from the discharge position to another predetermined height below the first plane, and at the same time, the third drive Means for controlling the second adsorption means moves upward from the stowed position to the first plane between the second plane; a fifth step of repeating the first step to the fourth step. 097129215 Form No. A0101 Page 7 / Total 24 Page 1003326991-0 1358382 100 years. 09 months 0> Risuo Page * Technical Plan The substrate transfer system and substrate transfer method can improve the problem of long-term substrate retraction process. Significantly improve the efficiency of substrate retraction, meeting the requirements of board support speed increase. [Embodiment] [0010] The present technical solution will be further described in detail below with reference to the accompanying drawings. [0011] Referring to FIG. 1 and FIG. 2, an embodiment of the present disclosure provides a substrate transfer system 100 that includes a chassis 1 , a first driving device 22 , a second driving device 23 , a third driving device 32 , and a fourth The driving device 33, the first adsorption device 24, the second adsorption device 34, the first sliding member 21 and the second sliding member 31 〇 [0012] The frame 丨〇 includes a first guiding rail 101, a second guiding rail 102, and a third guiding rail 103, a fourth guide rail 104, four support rods 1〇5, a first connecting rod 1〇6 and a second connecting rod 107. [0013] The first rail 1〇1, the second rail 102, the third rail 1〇3, and the fourth rail 104 are horizontally disposed and parallel to each other, wherein the first rail 1〇1 and the second rail 102 are located at a horizontal plane Inside and at a distance, the third rail 103 and the fourth rail 104 are located in a horizontal plane, the plane defined by the first guide 1〇1 and the second rail 102 and the third rail 1〇3 and the fourth rail The water level at which the 104 is located is at a distance in the direction perpendicular to the two planes to ensure that the first adsorption device 24 and the second adsorption device 34 mounted thereon do not interfere with each other when moving thereon. [0014] The first connecting rod 106 is disposed between the first rail 101 and the second rail 1〇2. The two ends are fixedly connected to the first rail 101 and the second rail 1〇2, and the second 097129215 form number A0101 Page 8 of 24 1003326991-0 1358382 100. On September 07, the nuclear replacement rod 107 is disposed between the third guide 103 and the fourth guide 104, and the ends are fixedly connected to the third. Guide rail 103 and fourth guide 104. Preferably, the first connecting rod 106 is disposed at the same end of the first rail 101 and the second rail 102, and the second connecting rod 107 is disposed at the same end of the third guide 103 and the fourth rail 104. [0015] Four support rods 105 are used to support the guide rails, wherein the two support rods 105 are connected and perpendicular to the first rail 101 and the third rail 103, and the other two support rods 105 are connected and perpendicular to the second rail 102 and the first Four guide rails 104. Of course, in order to stabilize the entire frame 10, more support bars 105 can be provided according to actual needs. [0016] The first sliding member 21 includes a first bearing portion 211 and a first sliding portion 212 fixedly coupled to both ends of the carrying portion 211. The two first sliding portions 21 2 are respectively sleeved on the first guide 101 and the second guide rail 102. In the present embodiment, in order to make the sliding smooth, two first sliders 21 are provided. [0017] Of course, by providing the chute on the first rail 101 and the second rail 102, the two ends of the first bearing portion 211 are embedded in the sliding slot, thereby realizing the first sliding member 21 Sliding on a guide rail 101 and a second guide 102. The first driving device 22 is configured to drive the first adsorption device 24 to generate a lifting motion. The first driving device 22 is mounted on the first bearing portion 211. In this embodiment, the first adsorption device 24 is stable during the movement process. The first limiting member 221 is disposed. The first limiting member 221 is connected to the bearing portion 211 of the sliding member 21, and the other end is connected to the bearing portion 211 through a through-connection (not shown) disposed on the bearing portion 211. An adsorption device 24. In the present embodiment, in order to balance the first adsorption device 24 during the movement, four first stoppers 221 are provided. The first drive 22 can be a motor or a cylinder. 097129215 Form No. A0101 Page 9 / Total 24 Page 1003326991-0 1358382 100. September 0. 7 Correction Replacement Page [0019] The first adsorption device 24 is used to adsorb the substrate, which is connected to the vacuum device (not shown) . In this embodiment, the first adsorption device 24 is a vacuum chuck. [0020] The second driving device 23 is fixed to the first connecting rod 106, and the second driving device 23 includes a second driver 231 and a second transmission member 232. The second transmission member 232 is connected to the second driver 231 and the first carrier portion 211. . The first carrier portion 211 is horizontally slid along the first rail 101 and the second rail 102 under the driving of the second driver 231. The second driver 231 can be a motor or a cylinder, and the first transmission member 232 can be a telescopic bearing that is common in the art. [0021] The second slider 31 includes a second carrier portion 311 and a second sliding portion 312 fixedly coupled to both ends of the second carrier portion 311. The second sliding portions 312 are respectively fitted to the third rail 103 and the fourth rail 104. [0022] The third driving device 32 is configured to drive the second adsorption device 34 to generate a lifting motion perpendicular to a plane defined by the third rail 103 and the fourth rail 104, and the third driving device 32 is mounted on the second carrier portion 311. For example, in order to make the second adsorption device 34 have stability during the movement, four second limiting members 321 are disposed, one end of the second limiting member 321 is mounted on the second bearing portion 311, and the other end is passed through the second A through hole (not shown) provided in the carrying portion 311 passes through the second carrying portion 311 and is connected to the second adsorption device 34. The length of the second stopper 321 should be long enough to lower the second adsorbing means 34 connected thereto to a sufficient distance to reach the surface of the substrate to be adsorbed. The third drive unit 32 can be a motor or a cylinder. The second adsorption unit 34 is for adsorbing a substrate which is connected to a vacuum unit (not shown). In this embodiment, the second adsorption device 341 is a vacuum chuck. [0023] The fourth driving device 33 is fixed to the second connecting rod 107, the fourth driving device 33 097129215 Form No. 1010101 Page 10/24 pages 1003326991-0 097129215 [0024] [0026] Form No. A0101 1003326991- The first transmission member 331 and the fourth transmission member 332 are connected to the fourth driver 331 and the second carrier portion 311. The second sliding cover 311 drives the second carrier portion 311 to slide horizontally along the third rail 103 and the fourth rail 1Q4 under the driving of the fourth actuator 331. The fourth movable device (4) may be a motor or a cylinder, and the fourth transmission member 332 may be a telescopic bearing that is common in the art. The first adsorption device 21, the second adsorption device 31, the first driving device 22, the first driving device 23, the third driving device 32, the fourth (four) device (7), and the pumping skirt are all connected to the controller 4〇, and are controlled. The first driving device 22, the second driving device 23, the third driving device 32, and the fourth driving device 33 are controlled so that the first adsorption device 21 and the second adsorption device 3 are alternately adsorbing the substrate at the seismic loading position. Transfer the adsorbed substrate to the reject position and put it down. Referring to Figures 2 to 6 below, a method of transferring a substrate using a substrate transfer system will be described below by way of example. |μ V 'the first driving device 24 is driven by the second driving device 23 to move from the unloading position B to the I-loading position A, and the substrate 2 is loaded, while the fourth driving device 33 drives the second adsorption device 34. The loading position A is moved to the discharging position B, and the substrate is unloaded; under the control of the controller 40, as shown in FIG. 2, the first adsorption device 24 and the second adsorption device 34 are respectively placed at the loading position A and discharged. At position B, the first driving device 22 is controlled by the controller 4 to drive the first attachment device 24 down to the surface of the substrate 200 to be received at the loading position A. The controller 40 controls the third drive unit 32 to drive the second suction unit 34 down to the surface of the substrate 2 to be received at the loading position a. As shown in Fig. 3, the 7F's and the attachment device 24 sucks up the substrate 200, and the second adsorption device is placed on page II/24 pages 1358382. On September 7, 2007, the replacement substrate 34 is placed to lower the adsorbed substrate 200, [0027] In the second step, the first driving device 22 is driven to drive the first adsorption device 24 to move from the loading position A to the first height, and the third driving device 32 controls the second adsorption device 34 to move from the discharging position B to the second height. The first height is less than the second height. The first adsorption device 4 and the second adsorption device 34 rise. The air suction device is activated by the controller 40, and the suction nozzle of the first adsorption device 24 sucks up the substrate 200; at the same time, the controller 40 controls the third driving device 32, and drives the second adsorption device 34 to descend to the substrate 200 stacked at the discharge position B. At this time, the air suction device connected to the second adsorption device 34 is closed, and the substrate 200 adsorbed by the second adsorption device 34 is placed on the stack B of the substrate 200. Then, the controller 40 controls the first driving device 22 and the third driving device 32 to cause the first driving device 22 to drive the first adsorption device 24 and its adsorbed substrate 200 to rise; meanwhile, the third driving device 32 can be driven to the second The adsorption device 34 rises. [0028] In the third step, the second driving device 23 is used to drive the first adsorption device 24 to move from the loading position A to the discharging position at the first height and descend, and the substrate 200 is unloaded, and at the same time, the fourth driving device is utilized. 33 drives the second adsorption device 34 to move from the discharge position B to the loading position A and descends, and uploads the substrate 200; as shown in FIG. 4, the two transfer devices slide relative to the guide, so that the first adsorption device 24 is placed at the discharge. Position B, the second adsorption device 34 is located at the loading position A. Then, the controller 40 controls the second driving device 23 and the fourth driving device 33 such that the second driving device 23 drives the first adsorption device 24 and the first driving device 22 on which the first slider 21 is mounted along the first The guide rail 101 and the second guide rail 102 are slid from the loading position A to the discharge position B, and at the same time, the controller 40 controls the fourth driving device 33 such that the fourth driving device 33 097129215 Form No. A0101 Page 12 / Total 24 Page 1003326991-0 1358382 1.100 years · 〇 〇 〇 y day driving the second adsorption device 34 and the second driving device 3 2 on which the second slider 31 is mounted, along the third guide 1 〇 3 and the fourth guide rail 1 〇 4 The discharge position B is slid to the loading position A. [0032] As shown in FIG. 5, the first adsorption device 24 and the second adsorption device 34 are lowered, the first adsorption device 24 lowers the substrate 200, and the second adsorption device 34 sucks the substrate 200. The controller 40 controls the first driving device 22 to drive the first adsorption device 24 to descend, while the controller 40 controls the third driving device 32 to drive the second adsorption device 24 to descend. Then, the controller 4 controls the suction device connected to the first adsorption device 24 to be turned off so that the adsorbed substrate 2 is stacked at the discharge position B. At the same time, the controller 4 is controlled to open the suction device connected to the second adsorption device 34 to 'adsorb the substrate 2' at the loading position A. In the fourth step, the first driving device 22 is driven to drive the first adsorption device 24 to move from the discharge position B to move the first height, and at the same time, the third driving device 32 controls the second adsorption device 34 to move from the loading position a to move the second height. In the fifth step, the first step to the fourth step are repeated to transfer the substrate from the loading position to the discharging position and stack them neatly. Of course, the substrate transfer system 100 described above can also be applied to placing a stacked circuit board on a pre-processed conveyor. Since the substrate transfer system 100 alternately adsorbs and deposits the substrate by controlling the two adsorption devices, the problem of long period in the process of substrate retraction and release can be improved, and the efficiency of substrate retraction and release can be greatly improved, which can meet the requirement of increasing the process speed of the circuit board. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above is only the preferred embodiment of the present invention 097129215 Form No. A0101 Page 13 / Total 24 pages 1003326991-0 1358382 100 years. September 07 repair i replace the page, since this can not limit the case The scope of the patent application. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0034] FIG. 1 is a schematic diagram of a substrate transfer system provided by an embodiment of the present technical solution. 2 to FIG. 6 are schematic diagrams showing a process of transferring a substrate of a substrate transfer system provided by the present technical solution. [Main component symbol description] [0036] Rack: 10 [0037] First slider: 21 [0038] First drive device: 22 [0039] Second drive device * 23 [0040] First adsorption device: 24 [0041] Second Slider: 31 [0042] Third Drive Device: 32 [0043] Fourth Drive Device: 33 [0044] Second Adsorption Device: 34 [0045] Controller: 40 [0046] Substrate Transfer System: 100 [0047] First Guide: 101 [0048] Second Rail: 102 097129215 Form No. A0101 Page 14 of 24 1003326991-0 1358382 [0049] Third Rail: 103 [0050] Fourth Rail : 104 [0051] Support rod: 105 [0052] First connecting rod: 106 [0053] Second connecting rod: 107 [0054] Substrate: 200 [0055] First bearing portion: 211 [0056] First sliding portion: 212 [0057] First limit member: 221 [0058] Second drive: 231 [0059] Second drive member: 232 [0060] Second load bearing portion: 311 [0061] Second sliding portion: 312 [0062] Two limit parts: 321 [0063] Fourth drive: 331 [0064] Fourth transmission: 332 097129215 Form number Α 0101 Page 15 / Total 24 pages 100 years. September 0· 7th shuttle is _ hundred 1003326991-0