CN211744920U - Return flow carrier slewer - Google Patents
Return flow carrier slewer Download PDFInfo
- Publication number
- CN211744920U CN211744920U CN202020267360.9U CN202020267360U CN211744920U CN 211744920 U CN211744920 U CN 211744920U CN 202020267360 U CN202020267360 U CN 202020267360U CN 211744920 U CN211744920 U CN 211744920U
- Authority
- CN
- China
- Prior art keywords
- line
- carrier
- module
- pcb board
- belt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a reflow soldering field especially relates to a reflow soldering carrier slewer. Including the material loading module, the layering cooling line, the unloading module, carrier gyration line and reflow soldering line, PCB board assembly line and carrier gyration line are connected respectively to the material loading module, adsorb the PCB board with it assembles in the carrier, reflow soldering line's the end that spreads into is connected material loading module and is welded the PCB board, the end that spreads into of reflow soldering line connection reflow soldering line of layering cooling line cools off the PCB board, the end that spreads out of layering cooling line is connected to the input of unloading module, the unloading module is with the PCB board from the interior separation of carrier, convey follow-up assembly line with the PCB board, transmit the carrier to the carrier gyration line. Make PCB board after the welding board carrier can the backward flow recycle use through the carrier gyration line, material loading module, reflow soldering line and unloading module collaborative work realize full-automatic welding assembly line, simultaneously, utilize the layering cooling line can reduce PCB board temperature, ensure product quality.
Description
Technical Field
The utility model relates to a reflow soldering technical field especially relates to a reflow soldering carrier slewer.
Background
With the demand of miniaturization and light weight of electronic Products (PCB), sheet elements appear, and the traditional welding method cannot meet the demand. At first, a reflow soldering process was adopted only in the assembly of the hybrid integrated circuit board, and most of the components to be assembled and soldered are chip capacitors, chip inductors, surface-mounted transistors, diodes, and the like. With the development of the whole technology of SMT becoming more and more complete, and the appearance of various chip components (SMCs) and Surface Mount Devices (SMDs), reflow soldering process technologies and devices, which are part of the surface mount technology, have been developed accordingly, and their applications are becoming more and more extensive, and they have been applied almost in all electronic product fields.
However, with the demand for miniaturization and light weight of electronic products, the PCB boards used in the electronic products are thinner and thinner, and cannot be directly soldered by a reflow oven, and the PCB boards need to be placed in a carrier for reflow soldering. The existing product adopting the carrier to carry out reflow soldering needs to put the PCB into the carrier manually before soldering, and needs to take the PCB out of the carrier manually after reflow soldering, and carries the carrier manually to the front of a reflow furnace. The automatic loading, the automatic unloading and the cyclic use of the carrier rotation of the PCB cannot be realized, so that the manpower is wasted, and meanwhile, the frequent walking of personnel is inconvenient to manage; in addition, the welded electronic product often directly enters the next production line, and the welded electronic product is often not cooled, so that the quality of the welded electronic product is seriously affected.
SUMMERY OF THE UTILITY MODEL
In view of the above prior art's shortcoming, the utility model aims to provide a reflow soldering carrier slewer for solve the problem of current reflow soldering technology's artifical loading, uninstallation PCB, artifical transport carrier among the prior art.
For realizing above-mentioned purpose and other relevant purposes, the utility model provides a backward flow carrier slewer, including material loading module, layering cooling line, unloading module, carrier gyration line and reflow soldering line, PCB board assembly line and carrier gyration line are connected respectively to the input of material loading module, adsorb the PCB board assembles it in the carrier, reflow soldering line's the output that spreads into end connection material loading module has welded the PCB board, the end that spreads into of layering cooling line connects the end cooling that spreads out of reflow soldering line the PCB board, the input of unloading module is connected the end that spreads out of layering cooling line, the unloading module will the PCB board separates from in the carrier, will the PCB board conveys follow-up assembly line, will the carrier transmits to the carrier gyration line.
The utility model has the advantages that: make supplementary PCB board carrier after welding can the backward flow recycle use through the carrier gyration line, based on material loading module, reflow soldering line and unloading module collaborative work, realize full-automatic welding assembly line, simultaneously, utilize the layering cooling line can reduce the PCB board temperature after the welding, ensure product quality.
Optionally, the carrier includes a cover plate and a bottom plate, the cover plate is magnetically connected with the bottom plate, and grooves matched with the PCB are formed in the cover plate and the bottom plate.
Optionally, the feeding module comprises a PCB feeding buffer belt, a feeding module belt, a traversing assembly and a grabbing assembly, the PCB feeding buffer belt is arranged on the cabinet, the incoming end of the PCB feeding buffer belt is connected with a PCB assembly line, the incoming end of the traversing assembly is connected with a carrier rotating line transmission carrier, the outgoing end of the traversing assembly is connected with the feeding module belt, the grabbing assembly adsorbs a PCB on the PCB feeding buffer belt, an inner cover plate and a bottom plate of the carrier are separated to enable the PCB to be assembled in the carrier, and the feeding module belt transmits the carrier containing the PCB to a reflow soldering line.
Optionally, the PCB feeding buffer belt comprises a first base, a first support, a first line driving assembly, a first lead screw and a first line moving structure, wherein the first support is fixed on the first base, and supports the first line moving structure; the first line body driving assembly is arranged on the first base and located below the first line body moving structure and used for driving the first line body moving structure to move, and the first lead screw is arranged on the first base and located below the first line body moving structure and used for adjusting the track interval of the first line body moving structure.
Optionally, the first string moving structure includes a first string fixing side and a first string moving side, the first string moving side is disposed inside the first string fixing side, and the first string moving side is formed by a pulley and a belt.
Optionally, the feeding module belt comprises a second base and a second support fixed on the second base, a second line moving structure is arranged on the second support, a second line driving assembly is arranged below the second line moving structure, and a second lead screw for adjusting the track pitch of the second line moving structure is further arranged below the second line moving structure; and the second line moving structure is provided with a carrier pressing and positioning module, and a blocking module and a sensor are respectively arranged along the transmission direction of the second line moving structure.
Optionally, the material grabbing assembly comprises a transverse moving electric platform and a lifting electric platform, the lifting electric platform is installed on the transverse moving electric platform, a first gripper for adsorbing the PCB and a second gripper inserted into the limiting groove of the cover plate are respectively arranged on the lifting electric platform, and the first gripper is installed on the lifting electric platform through a lifting air cylinder.
The beneficial effect of adopting the above optional scheme is: the PCB to be welded can be automatically assembled in the cover plate and the bottom plate matched with the PCB to be welded, so that automatic feeding is realized, and the feeding efficiency is greatly improved; meanwhile, the assembled carrier can ensure accurate welding of the subsequent reflow soldering wire, and the product quality is ensured.
Optionally, the layering cooling line is including setting up consecutive first belt module that shifts from top to bottom, multilayer transmission cooling line and the second belt module that shifts from top to bottom in the frame, one side of multilayer transmission cooling line is equipped with a plurality of forced air cooling subassemblies, the first belt module that shifts from top to bottom is connected between reflow soldering line and multilayer transmission cooling line, the second belt module that shifts from top to bottom is connected between multilayer transmission cooling line and the unloading module.
The beneficial effect of adopting the above optional scheme is: the welded products are cooled respectively by matching the upper and lower deflection belt modules with the multi-layer transmission cooling lines, so that on one hand, the scattered cooling can be ensured, and the cooling efficiency is improved; on the other hand, multilayer transmission cooling line practices thrift the space, and the forced air cooling subassembly of being convenient for concentrates the enstrophe, promotes cooling efficiency, reduces the energy consumption.
Optionally, the feeding module and the discharging module have the same structure.
The beneficial effect of adopting the above optional scheme is: the welded carrier is separated from the PCB through the blanking module, the carrier is rotated to be continuously used, the welded PCB is transmitted to a subsequent production line, the purpose of automatic blanking is realized, and the blanking efficiency is greatly improved.
Optionally, the carrier rotation line comprises a line body moving structure arranged on the frame, and the line body moving structure is driven by a line body driving assembly; and a double-screw rod for adjusting the track interval is arranged on the rack and on one side of the line body moving structure.
The beneficial effect of adopting the above optional scheme is: the carrier after being used can be reflowed to continue to be used through the carrier rotating line, so that the circular work is realized.
Drawings
Fig. 1 is a schematic structural view of a reflow carrier rotation device according to an embodiment of the present invention;
fig. 2 is a schematic structural view of the feeding module in fig. 1 according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating a structure of the PCB feeding buffer belt in fig. 2 according to an embodiment of the present invention;
fig. 4 is a schematic view of a belt of the feeding module shown in fig. 2 according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of the material grabbing assembly shown in fig. 2 according to an embodiment of the present invention;
fig. 6 is an enlarged schematic view of the second gripper shown in fig. 5 according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of the layered cooling line of fig. 1 according to an embodiment of the present invention;
fig. 8 is a schematic structural view of a carrier rotation line in fig. 1 according to an embodiment of the present invention.
Part number description:
1. a feeding module; 2. a reflow soldering line; 3. a layered cooling line; 4. a blanking module; 5. a carrier rotation line; 10. a cabinet; 11. feeding a buffer belt for the PCB; 12. a feeding module belt; 13. a traversing assembly; 14. a material grabbing component; 110. a first base; 111. a first bracket; 112. a first string-securing side; 113. a first thread moving side; 114. a first bobbin driving assembly; 115. a first lead screw; 120. a second base; 121. a second bracket; 122. a second wire fixing side; 123. a second wire moving side; 124. a second lead screw; 125. the carrier compresses the positioning module; 126. a second linear drive assembly; 127. a blocking module; 128. a sensor; 140. a support; 141. transversely moving the electric platform; 142. lifting the electric platform; 143. a lifting cylinder; 144. a first hand grip 144; 145. a second gripper; 31. a first belt module with up-down displacement; 32. a plurality of layers of transmission cooling lines; 33. a second belt module with up-down displacement; 34. an air-cooled assembly; 35 a third lead screw; 36. an ion fan; 50. a frame; 51. A third support; 52. a wire body fixing side; 53. a linear body moving side; 54. a linear body driving assembly; 55. double lead screw.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
It should be noted that the terms "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for clarity of description only, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof are considered to be the scope of the present invention without substantial changes in the technical content.
As shown in figure 1, the reflow carrier rotary device of the utility model comprises a feeding module 1, a reflow soldering wire 2 (reflow soldering furnace), a layered cooling wire 3, a discharging module 4 and a carrier rotary wire 5, the feeding module 1 is respectively connected with a PCB assembly line and a carrier rotating line 5 from two different directions, the feeding module 1 adsorbs the PCB to assemble the PCB into the carrier, the incoming end of the reflow soldering wire 2 is connected with the output end of the upper material module 1 to be soldered with the PCB, the incoming end of the layered cooling line 3 is connected to the outgoing end of a reflow soldering line to cool the PCB board, the input end of the blanking module 4 is connected with the output end of the layered cooling line 3, the blanking module 4 takes out the PCB in the carrier (the cover plate is magnetically connected with the bottom plate to form the carrier), and the PCB is conveyed to a subsequent assembly line and is conveyed to the carrier rotating line.
In the embodiment, the PCB to be welded can be automatically assembled in the cover plate and the bottom plate matched with the PCB, so that automatic feeding is realized, and the feeding efficiency is greatly improved; meanwhile, the assembled carrier can ensure accurate welding of the subsequent reflow soldering wire, and the product quality is ensured.
As shown in fig. 2, in an embodiment, the feeding module 1 includes a PCB feeding buffer belt 11, a feeding module belt 12, a traverse module 13 and a material grabbing module 14, which are disposed on the cabinet 10, an incoming end of the PCB feeding buffer belt 11 is connected to a PCB board assembly line for transporting PCB boards to be processed, an incoming end of the traverse module 13 is connected to a carrier rotating line 5 transport carrier, an outgoing end of the traverse module 13 is connected to the feeding module belt 12, the material grabbing module 14 adsorbs the PCB boards on the PCB feeding buffer belt 11, a cover plate is separated from a base plate to complete the assembly of the PCB boards into carriers, and the feeding module belt 12 transports the carriers containing PCB boards to a reflow soldering line for subsequent soldering work.
It should be noted that the feeding module 1 and the discharging module 4 are respectively provided with a protective layer for protecting each component in the cabinet from normal operation, and simultaneously play a role in preventing dust and noise; in addition, the respective cabinets of the feeding module and the discharging module are integrated cabinets.
As shown in fig. 3, the PCB feeding buffer belt 11 includes a first base 110, a first bracket 111, a first thread driving assembly 114, a first lead screw 115, and a first thread moving structure (a first thread fixing side 112 and a first thread moving side 113), the first base 110 has the first bracket 111, the first thread moving structure is supported by the first bracket 111, the first thread moving side 113 is rotatably disposed inside the first thread fixing side 112, the first thread moving side 113 is composed of a pulley and a belt, and a transverse supporting strip is disposed below the belt to prevent the belt from being unable to support a carrier, thereby playing a supporting role; first body drive assembly 114 sets up on first base and is located first line body and moves structure below and be used for driving the motion of first line body removal side 113, and first lead screw 115 also sets up on first base and is located the track interval that line body removal structure below is used for adjusting first line body and moves the structure, the purpose of buffer memory belt is realized through placing first line body removal side 113 to the PCB board, and at the transmission direction front end of first line body removal side 113, and be located and be equipped with gear piece (not marked in the figure) on first line body fixed side 112, when the PCB transmission reaches gear piece, wait to grab the absorption of material subassembly 14.
As shown in fig. 4, the feeding module belt 12 includes a second base 120 and second brackets 121 fixed to the second base 120, in this embodiment, the number of the second brackets 121 is at least 4, a second line moving structure (including a second line fixing side 122 and a second line moving side 123) is disposed on the second brackets 121, a second line driving assembly 126 is disposed below the second line moving structure, and a second lead screw 124 for adjusting a track pitch of the second line moving structure is further disposed below the second line moving structure; a carrier pressing and positioning module 125 is arranged on the second wire moving structure and used for pressing the bottom plate to facilitate the disassembly of the carrier and the assembly of a subsequent PCB; a blocking module 127 and a sensor 128 are respectively arranged in front of the transmission of the second line moving structure, the blocking module 127 has a telescopic function, and blocks the movement of the carrier when the blocking module is extended, and the carrier retracts after being assembled with the PCB, so that the loading is facilitated; the sensor 128 detects the position of the vehicle.
It should be noted that the traverse component 13 and the feeding module belt 12 are located on the same horizontal line, but the tail of the transmission belt of the traverse component 13 is aligned with the feeding module belt, so that the carrier can be transmitted to the second line moving structure, and the carrier is pressed against the positioning module 125 to realize positioning, and in addition, the transmission belt of the traverse component 13 is higher than the belt of the feeding module belt 12, which is beneficial to accurate transmission of the carrier during transmission.
As shown in fig. 5, the material grabbing component 14 includes a traverse electric platform 141 (capable of moving horizontally) and a lifting electric platform 142 (capable of moving vertically) disposed on a third support 140, the lifting electric platform 142 is mounted on the traverse electric platform 141, a first gripper 144 for absorbing the PCB and a second gripper 145 inserted into a limit groove of the cover plate are respectively disposed on the lifting electric platform 142, the lifting cylinder 143 drives the first gripper 144 to move up and down, the traverse electric platform 141 controls the first gripper 144 to move horizontally, and the third support 140 is transversely disposed above the PCB feeding buffer belt 11, the feeding module belt 12 and the traverse component 13 to ensure a working range of the gripper.
Specifically, as shown in fig. 6, the second gripper 145 controls the horizontal and vertical movements of the second gripper through the traverse electric platform 141 and the lifting electric platform 142, the front end of the second gripper 145 is provided with two guide grooves, the two guide grooves are inserted into the corresponding limit grooves of the cover plate to separate the cover plate from the base plate, and meanwhile, the front end of the second gripper 145 is provided with an adjuster for adjusting the guide grooves to control the distance between the two guide grooves.
It should be noted that, in the feeding module 1, each of the components such as the PCB feeding buffer belt 11, the feeding module belt 12, the traverse moving component 13, and the material grabbing component 14 cooperates with each other through the control system (the PLC control chip, the touch screen, and the control circuit), so that the feeding module 1 can realize the assembly of the PCB board according to the control program.
In the present embodiment, the reflow soldering lines 2 are prior art in the field, and detailed description is omitted here, and the assembled PCB board can be soldered through the reflow soldering lines 2 (reflow soldering furnace). The PCB soldered by the reflow soldering furnace is generally about 110 degrees due to high temperature, and if it is not cooled, the PCB is directly processed in the next process, which may reduce the quality of the PCB.
In the embodiment, the cooling is realized through the layered cooling line 3, so that the problems are effectively overcome, and the quality of the PCB is improved; meanwhile, the whole production line speed cannot be influenced. The layered cooling line 3 comprises a first upper and lower displacement belt module 31, a multi-layer transmission cooling line 32 and a second upper and lower displacement belt module 33 which are arranged in the frame 20 and are sequentially connected, one side of the multi-layer transmission cooling line 32 (7 in the figure comprises 7 layers of transmission cooling lines) is provided with a plurality of air cooling assemblies 34, the first upper and lower displacement belt module 31 is connected between the reflow soldering wire 2 and the multi-layer transmission cooling line 32, the second upper and lower displacement belt module 33 is connected between the multi-layer transmission cooling line 32 and the blanking module 4, wherein the first upper and lower displacement belt module 31 and the second upper and lower displacement belt module 33 have the same structure and can slide up and down to change the position, each layer of transmission cooling line can contain four PCB boards, and when the first upper and lower displacement belt module 31 transmits four carriers containing the PCB boards, the positions are changed from high to low or from low to high in sequence, and in the same way, the two upper and lower displacement belt modules 33 sequentially receive carriers containing the PCB transmitted by the multi-layer transmission cooling line 32 according to the sequence transmitted by the first upper and lower displacement belt module 31, and as the multi-layer transmission cooling line 32 has a lower transmission speed (which is beneficial to cooling for sufficient time), carriers on the lower transmission cooling line are transmitted after the two upper and lower displacement belt modules 33 receive carriers on one transmission cooling line, so that the orderly transmission is realized. The air cooling assembly 34 is a fan device, the speed of the fan device can be adjusted, and the number of the fans can be adjusted according to requirements; an ion fan 36 is arranged above the second up-down displacement belt module 33 to blow away static carried after the PCB is welded; and one side of frame is equipped with a plurality of third lead screws 35, and a plurality of third lead screws 35 adopt hold-in range or chain connection for adjust the width of multilayer transmission cooling line.
As shown in fig. 8, the carrier reflow line 5 includes a line moving structure (line fixing side 52 and line moving side 53, as above), which is disposed on the rack 50, wherein the two line fixing sides 52 are respectively fixed at the top end of the bracket 51, the line moving side 53 is disposed at the inner side of the line fixing side 53, and the line moving side 53 is driven by a line driving assembly 54, i.e. belt transmission; a parallel screw 55 for adjusting the track interval is arranged on the machine frame 50 and on one side of the line body moving structure. The carrier after being used can be reflowed to continue to be used through the carrier rotating line, so that the circular work is realized.
In another embodiment, the feeding module and the discharging module have the same structure, and the only difference is that: the feeding and the discharging actions are different, the PCB in the carrier is separated during discharging, the PCB is conveyed to a subsequent assembly line, the carrier is conveyed to the carrier rotating line by the transverse moving assembly, the carrier is recycled without manual operation, the automatic discharging is realized, and the discharging efficiency is greatly improved.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A kind of backflow carrier slewing gear, characterized by that: including material loading module, layering cooling line, unloading module, carrier gyration line and reflow soldering line, PCB board assembly line and carrier gyration line are connected respectively to the input of material loading module, adsorb the PCB board assembles it in the carrier, reflow soldering line's the output that goes into end connection material loading module has welded to the end that goes into PCB board, the end that goes into of layering cooling line is connected reflow soldering line's the end cooling that spreads into PCB board, the input of unloading module is connected the end that spreads out of layering cooling line, the unloading module will the PCB board separates in the carrier, will the PCB board conveys follow-up assembly line, will the carrier transmit to the carrier gyration line.
2. The reflow carrier rotation apparatus of claim 1, wherein: the carrier comprises a cover plate and a bottom plate, and the cover plate is magnetically connected with the bottom plate.
3. The reflow carrier rotation apparatus of claim 2, wherein: including setting up PCB pan feeding buffer memory belt, pay-off module belt, sideslip subassembly and grabbing the material subassembly on the rack, PCB board assembly line is connected to the end of spreading into of PCB pan feeding buffer memory belt, the end of spreading into of sideslip subassembly is connected the carrier gyration line transmission carrier, the end of spreading out of sideslip subassembly is connected pay-off module belt, grab the material subassembly and adsorb PCB board on the PCB pan feeding buffer memory belt makes with apron and bottom plate separation in the carrier PCB board assembles in the carrier, the carrier that pay-off module belt will contain the PCB board transmits the reflow soldering line.
4. The reflow carrier rotation apparatus of claim 3, wherein: the PCB feeding cache belt comprises a first base, a first support, a first line body driving assembly, a first lead screw and a first line body moving structure, wherein the first support is fixed on the first base, and supports the first line body moving structure; the first line body driving assembly is arranged on the first base and located below the first line body moving structure and used for driving the first line body moving structure to move, and the first lead screw is arranged on the first base and located below the first line body moving structure and used for adjusting the track interval of the first line body moving structure.
5. The reflow carrier rotation apparatus of claim 4, wherein: the first string body moving structure comprises a first string body fixing side and a first string body moving side, the first string body moving side is arranged on the inner side of the first string body fixing side, and the first string body moving side is composed of a pulley and a belt.
6. The reflow carrier rotation apparatus of claim 3, wherein: the material grabbing component comprises a transverse moving electric platform and a lifting electric platform, the lifting electric platform is installed on the transverse moving electric platform, a first gripper for adsorbing the PCB and a second gripper inserted into a limiting groove of the cover plate are arranged on the lifting electric platform respectively, and the first gripper is installed on the lifting electric platform through a lifting air cylinder.
7. The reflow carrier rotation apparatus of claim 3, wherein: the feeding module belt comprises a second base and a second support fixed on the second base, a second line body moving structure is arranged on the second support, a second line body driving assembly is arranged below the second line body moving structure, and a second lead screw for adjusting the track interval of the second line body moving structure is further arranged below the second line body moving structure; and the second line moving structure is provided with a carrier pressing and positioning module, and a blocking module and a sensor are respectively arranged along the transmission direction of the second line moving structure.
8. The reflow carrier rotation apparatus of claim 1, wherein: the layered cooling line comprises a first upper and lower displacement belt module, a multilayer transmission cooling line and a second upper and lower displacement belt module which are sequentially connected in the frame, wherein one side of the multilayer transmission cooling line is provided with a plurality of air cooling assemblies, the first upper and lower displacement belt module is connected between the reflow soldering line and the multilayer transmission cooling line, and the second upper and lower displacement belt module is connected between the multilayer transmission cooling line and the blanking module.
9. The reflow carrier rotation apparatus of claim 1, wherein: the feeding module and the blanking module are identical in structure.
10. The reflow carrier rotation apparatus of claim 1, wherein: the carrier rotary line comprises a line body moving structure arranged on the rack, and the line body moving structure is driven by a line body driving assembly; and a double-screw rod for adjusting the track interval is arranged on the rack and on one side of the line body moving structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020267360.9U CN211744920U (en) | 2020-03-06 | 2020-03-06 | Return flow carrier slewer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020267360.9U CN211744920U (en) | 2020-03-06 | 2020-03-06 | Return flow carrier slewer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211744920U true CN211744920U (en) | 2020-10-23 |
Family
ID=72858543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020267360.9U Active CN211744920U (en) | 2020-03-06 | 2020-03-06 | Return flow carrier slewer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211744920U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490160A (en) * | 2020-12-23 | 2021-03-12 | 深圳新益昌科技股份有限公司 | Semiconductor packaging all-in-one machine |
| CN113247531A (en) * | 2021-04-30 | 2021-08-13 | 东莞和利诚智能科技有限公司 | Disc type carrier multilayer connecting line backflow transmission structure |
| CN113263240A (en) * | 2021-06-17 | 2021-08-17 | 东莞市冠佳电子设备有限公司 | Furnace-passing carrier cover plate return line |
| CN113353578A (en) * | 2021-06-29 | 2021-09-07 | 博众精工科技股份有限公司 | Carrier circulation device |
| CN114833418A (en) * | 2022-07-05 | 2022-08-02 | 江苏小牛自动化设备有限公司 | Welding table module circulating device, welding table module and method for welding battery strings |
| CN115527901A (en) * | 2022-10-24 | 2022-12-27 | 上海轩田工业设备有限公司 | One-time paster process whole line |
| CN115889920A (en) * | 2022-11-22 | 2023-04-04 | 浙江轩田智能科技有限公司 | Reflow furnace with primary and secondary tool separation matching function and reflow soldering method |
-
2020
- 2020-03-06 CN CN202020267360.9U patent/CN211744920U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490160A (en) * | 2020-12-23 | 2021-03-12 | 深圳新益昌科技股份有限公司 | Semiconductor packaging all-in-one machine |
| CN112490160B (en) * | 2020-12-23 | 2021-08-03 | 深圳新益昌科技股份有限公司 | Semiconductor packaging all-in-one machine |
| CN113247531A (en) * | 2021-04-30 | 2021-08-13 | 东莞和利诚智能科技有限公司 | Disc type carrier multilayer connecting line backflow transmission structure |
| CN113263240A (en) * | 2021-06-17 | 2021-08-17 | 东莞市冠佳电子设备有限公司 | Furnace-passing carrier cover plate return line |
| CN113353578A (en) * | 2021-06-29 | 2021-09-07 | 博众精工科技股份有限公司 | Carrier circulation device |
| CN114833418A (en) * | 2022-07-05 | 2022-08-02 | 江苏小牛自动化设备有限公司 | Welding table module circulating device, welding table module and method for welding battery strings |
| CN115527901A (en) * | 2022-10-24 | 2022-12-27 | 上海轩田工业设备有限公司 | One-time paster process whole line |
| CN115527901B (en) * | 2022-10-24 | 2023-08-25 | 上海轩田工业设备有限公司 | One-time chip mounting process whole line |
| CN115889920A (en) * | 2022-11-22 | 2023-04-04 | 浙江轩田智能科技有限公司 | Reflow furnace with primary and secondary tool separation matching function and reflow soldering method |
| CN115889920B (en) * | 2022-11-22 | 2023-08-08 | 浙江轩田智能科技有限公司 | Reflow oven with primary and secondary tooling separation matching function and reflow soldering method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211744920U (en) | Return flow carrier slewer | |
| CN104990934B (en) | Circuit board double-side detection equipment | |
| CN114590564B (en) | PCB detection device and detection method thereof | |
| CN101583242B (en) | Device and method for delivering material | |
| CN209506950U (en) | A kind of online turnover mechanism of pcb board | |
| US6079096A (en) | Component mounting apparatus | |
| CN218664051U (en) | PCB flitch loading attachment | |
| CN110149791A (en) | A kind of screening cover placement equipment | |
| CN207753999U (en) | A kind of SMT mounting devices of four module of double-station | |
| CN104202915A (en) | Chip mounter delivery mechanism allowing delivery of multi-size PCBs (Printed Circuit Board) | |
| KR20120084721A (en) | Electronic component mounting device and electronic component mounting method | |
| CN112158590B (en) | Full-automatic blanking machine | |
| CN115973706A (en) | Double-tray cyclic feeding and storing device and double-tray cyclic feeding and storing process thereof | |
| CN108861575A (en) | Defective products sorting mechanism and PCB automatic encapsulation device | |
| CN103193070A (en) | PCB (printed circuit board) transfer system | |
| CN212191611U (en) | Automatic change material feeding unit | |
| CN204031603U (en) | A kind of reinforcing machine | |
| CN114083080B (en) | Reflow soldering device for smt | |
| CN215363670U (en) | PCB board automatic feeding machine | |
| CN107813591B (en) | Multi-layer frame assembly with automatic material swinging function and sheet stock printing machine | |
| CN212629112U (en) | Three-dimensional overhead multi-flow-direction transplanter | |
| CN209635405U (en) | A kind of NGOK unloader with automatic switching function | |
| CN207854416U (en) | A kind of chip mounter with polaroid attaching head device | |
| CN211210370U (en) | Paster device for surface mounting device | |
| CN210709554U (en) | PCB board handling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210609 Address after: 621000 workshop 1-103, Bowei Industrial Park, Shiqiaopu, Mianyang high tech Zone, Mianyang City, Sichuan Province Patentee after: Mianyang Silian Electronic Technology Co.,Ltd. Address before: No.99, Tongxi Road, caijiagang Town, Beibei District, Chongqing 400700 Patentee before: CHUANYI MICROCIRCUIT Co.,Ltd. CH |
|
| TR01 | Transfer of patent right |