1352401 九、發明說明： 【發明所屬之技術領域】 本發明關於一種例如於液晶顯示器（LCD)或電漿顯示器 (PDP)或軟性顯示器（Flexible Display)等平板顯示器之製造 過程中，被用於包含裝卸自如地保持由CF玻璃或TFT玻璃 等玻璃制基板或PES(Poly-Ether-Sulphone)等之塑夥薄膜等 而成之合成樹脂制基板並進行貼合之基板貼合機之基板組 裝裝置或搬送此類基板等之絕緣體、導電體或半導體晶片 等之工件（被處理體）之基板搬送裝置等之靜電吸盤之表面 電位控制方法》 詳細地關於一種第1電極部之層和第2電極部之層分別藉 由絕緣層被疊層配置’藉由對這些第1電極部及第2電極部 施加電壓，靜電吸附工件之靜電吸盤之表面電位控制方 法。 【先前技術】 過去’作爲這種靜電吸盤，於由絕緣材料而成之絕緣層 之兩面分別疊層配置由圖案狀形成之導電部而成之第1電 極部之層（第1電極層）和整個區域為導電部之第2電極部之 層（第2電極層），分別用絕緣性薄膜覆蓋那些電極層之表 面，藉由於這些第丨電極部及第2電極部施加不同極性之電 壓並在兩電極部之間產生電位差，使工件（被吸附體）吸 附於第1電極層側之絕緣性薄膜上（例如，參照專利文獻 1)。 專利文獻1 :專利公開2005-64105號公報（第4〜6頁、圖 132572.doc 1352401 第2發明是除第设明之效果以外，藉由基於工件吸附面 之表面電位之敎值設K自動調整第1電極部或第2電極 :P之施加電塵’實際上工件吸附面之表面電位被聯動設 疋。 因此，可以使玉件吸附面之表面電位確實地降低至〇伏 特附近。 第3發明為減小靜電吸附工件之工件吸附面之表面電 位，將第！電極部及第2電極部之形成圖案設定為規定形 狀，藉由消除施加這些兩電極部丨、2之電壓而導致之表面 電位之不平衡’確保靜電吸附力所需之兩電極部之電位 差，並且，工件吸附面不會偏向接近其之電極部之電位。 因此，可將工件吸附面之表面電位抑制在安全水準内。 其結果’在工件吸附面之表面不出現電位，即使在規定 之真空中靜電吸附工件，也可防止裝置特性之變化或放電 而導致之破壞，所以，安全性優越。 進一步，由於可將向第1電極部及第2電極部之施加電塵 量設為大致相同之絕對佶，路 _ ndt ^ „ 耵值所以，廷時容易抑制向兩電極 部之施加電壓。 第4發明是除第1發明、第2發明或第3發明之效果以外， 藉由只將靠近工件吸> 寺面之第1電極部之施加電壓可變， 而固定從工件吸附面遠之第2電極部之施加電壓，並將工 件吸附面之表面電位可變，從而，只有第!電極部之電屢 之可變4牛吸附面之表面電位正和負交替連續地可變 時’可進行與工件吸附面接觸之工件之除電。 132572.doc 1352401 因此’僅控制單側電極之電壓，可以進 1 J -X— 1 千 電 〇 其結果，與對於成對之兩電極部之電源分別調整電壓並 施加逆電位進行工件之除電之以往之除雷 示电万法相比，可簡 略化電壓控制構造，可謀求成本之減低化。 【實施方式】1352401 IX. Description of the Invention: [Technical Field] The present invention relates to a manufacturing process of a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP) or a flexible display, and is used for inclusion A substrate assembly apparatus for a substrate bonding machine that is bonded to a synthetic resin substrate made of a glass substrate such as CF glass or TFT glass or a plastic film such as a PES (Poly-Ether-Sulphone) A method for controlling the surface potential of an electrostatic chuck such as a substrate transfer device that transports a workpiece (such as a substrate) such as an insulator, a conductor, or a semiconductor wafer, etc., in detail, a layer of a first electrode portion and a second electrode portion The layer is laminated by the insulating layer. A method of controlling the surface potential of the electrostatic chuck by electrostatically adsorbing the workpiece by applying a voltage to the first electrode portion and the second electrode portion. [Prior Art] In the past, as the electrostatic chuck, a layer (first electrode layer) of a first electrode portion in which a conductive portion formed by a pattern is laminated on both surfaces of an insulating layer made of an insulating material and The entire region is a layer (second electrode layer) of the second electrode portion of the conductive portion, and the surfaces of the electrode layers are covered with an insulating film, respectively, by applying voltages of different polarities to the second electrode portion and the second electrode portion. A potential difference is generated between the two electrode portions, and the workpiece (adsorbed body) is adsorbed on the insulating film on the first electrode layer side (for example, see Patent Document 1). Patent Document 1: Patent Publication No. 2005-64105 (pp. 4 to 6, FIG. 132572. doc 1352401) The second invention is automatically adjusted by setting the value of the surface potential based on the surface of the workpiece adsorption surface in addition to the effect of the first embodiment. The first electrode portion or the second electrode: P is applied with electric dust. In fact, the surface potential of the workpiece adsorption surface is interlocked. Therefore, the surface potential of the jade material adsorption surface can be surely lowered to the vicinity of 〇VV. In order to reduce the surface potential of the workpiece adsorption surface of the electrostatically adsorbed workpiece, the formation pattern of the first electrode portion and the second electrode portion is set to a predetermined shape, and the surface potential caused by applying the voltages of the two electrode portions 丨, 2 is eliminated. The imbalance 'ensures the potential difference between the two electrode portions required for the electrostatic adsorption force, and the workpiece adsorption surface does not deviate toward the potential of the electrode portion thereof. Therefore, the surface potential of the workpiece adsorption surface can be suppressed to a safe level. As a result, 'the potential does not appear on the surface of the adsorption surface of the workpiece, and even if the workpiece is electrostatically adsorbed in a prescribed vacuum, the damage of the device characteristics or the discharge can be prevented. In addition, since the amount of electric dust applied to the first electrode portion and the second electrode portion can be set to be substantially the same as the absolute value, the path _ ndt ^ 耵 is 耵, so that it is easy to suppress the two electrodes. In addition to the effects of the first invention, the second invention, or the third invention, the fourth invention is fixed by applying only a voltage applied to the first electrode portion of the temple surface that is close to the workpiece. The surface of the workpiece adsorption surface is farther from the second electrode portion, and the surface potential of the workpiece adsorption surface is variable, so that only the surface potential of the fourth electrode portion of the fourth electrode portion can be alternately positively and negatively continuous. Change time 'can be used to remove the workpiece in contact with the workpiece adsorption surface. 132572.doc 1352401 Therefore 'only control the voltage of the single-sided electrode, you can enter 1 J -X-1 kilowatts of the result, and for the pair of two electrodes The voltage control structure can be simplified and the cost can be reduced as compared with the conventional lightning protection method in which the power supply of the unit is separately adjusted and the reverse potential is applied to remove the workpiece.
如圖1所示，本發明之靜電吸盤之表面電位控制方法， 係以夹持絕緣層3而被疊層的方式埋設第i電極部i之層1,和 第2電極部2之層2·之雙極型靜電吸盤，在其驅動時，0藉= 對這些第1電極部1和第2電極部2從分別連通之電源U以 施加不同極性之電壓，從而，設定使靜電吸附工件w之工 件吸附面4之表面電位之絕對值成為〇〜數百伏特。 工As shown in Fig. 1, the surface potential control method of the electrostatic chuck of the present invention embeds the layer 1 of the i-th electrode portion i and the layer 2 of the second electrode portion 2 so as to sandwich the insulating layer 3. When the bipolar electrostatic chuck is driven, the first electrode portion 1 and the second electrode portion 2 are applied with voltages of different polarities from the respective power sources U that are connected to each other, thereby setting the electrostatic adsorption workpiece w. The absolute value of the surface potential of the workpiece adsorption surface 4 becomes 〇 to several hundred volts. work
上述絕緣層3以由耐熱性優越之聚亞醯胺或陶瓷、塑膠 等絕緣材料而成之薄膜（膜）狀或薄板狀形成，藉由在其表 裏兩面接著金屬fg等導電材料等進行疊層，在該絕緣層3 之一面設置第i電極層卜而在另一面設置第2電極滑2，。曰 藉由餘刻等在這些第i電極層i，及帛2電極層2，分別 成爲第i電極部i、第2電極部2之導電性部分，並較佳為將 其任-方之電極部形成為圖案狀之同肖，另—方之電極， 將除絕緣層3之邊部料之大致全面形成爲覆蓋面狀。° 一例《_部k㈣形狀之具體例’雖為如圖吻所 不’櫛齒狀之圖案或格子狀之圖帛’但除此以外也可以B 蜂巢形狀之圖案或有條紋之圖㈣，或其他形狀之疋 另外’例舉第2電極部2之具體例， 如 物示之涉及第2電極層2，之大致整個區域之面^為如圖 •32572.doc 1352401 在如此形成之第〗電極層Γ之表面， _ 』如*藉由接著以 聚亞醯胺、聚苯醚醚酮（PEEK)、聚- 性;機_成為叫 =4等進灯覆盍’將其層表面作為工件 之工件吸附面4。 ’在上述第2電極層2,之裏面’例如，藉由接著以 =胺、聚笨_(職)、聚蔡二甲酸乙二醇醋 絕緣緣性有機材料形成為平滑之薄膜狀或薄板狀之 、緣層5等進打覆蓋；藉由將該絕緣層5由 ό與例如由铭等金屬而成之 、等接著層 電吸盤。 基板7體化，製作本發明之靜 在如此製作之本發明之靜電吸盤中，作爲將工件吸附面 4之表面電位以絕對值成為〇〜數百伏特之設定之方法之— 例，如圖1 (a)所示，為μ & 上述第1電極部1及第2電極部2之面 積不對稱時’以這些兩電極部卜2之電壓施加狀態藉由 例如通過靜電電位傳感器等靜電監測器13測定工件吸附面 4之表面電位，從而’限制在其測定值接近0伏特之施加狀 ，，決定各電極部卜2之電壓施加量之任一方或兩方或經 *監視工件吸附面4之表面電位，於適當之時刻自動調整 各電極部卜2之電I施加量，使該工件吸附面4之表面電 位接近0伏待，從而，消除由兩電極部卜2之面積不對稱 而導致之表面電位之不平衡。 作爲其他例’藉由變更第j電極部！及第2電極部2之任一 方或兩方之形成圖案，使工件吸附面4之表面電位之測定 I32572.doc • 11 · 值接近0伏特，將其導電部份la之圖案寬度PW或節距P等 為在這些圖案設汁規則上之比率，也能夠消除由這些 兩電極部1、2之電壓施加導致之表面電位之不平衡。 即，工件吸附面4之表面電位，因配置在與其接近之上 層之第1電極部1之影響大，且其之施加電壓成為支配性， 所以例如，於上層之第1電極部1中，其導電部份13之圖 案寬度PW為一定時，擴大該導電部分u之節距p，或導電 邛刀la之節距p為一定時，縮小該導電部分ia之圖案寬度 由此下層之第2電極部2之影響變大，其施加電壓 成爲支配性。 與此相反，在上層之第丨電極部丨中，其導電部分u之圖 案寬度pw為一定時，縮小該導電部分丨a之節距p，或導電 部分la之節距P為一定時，擴大該導電部分u之圖案寬度 PW，由此，該上層之第丨電極部丨之施加電壓之影響變 大’成爲支配性。 利用這樣之特性，也可以與向第丨電極部丨及第2電極部2 之電壓施加量無關地進行調整以使工件吸附面4之表面電 位之測定值接近〇伏特。 另外，本發明之靜電吸盤較佳為具備除電功能，在工件 處理後從其工件吸附面4剝離工件|時，以及在脫離之工 件W側殘留靜電，防止在該工件w上形成之裝置之破壞 等。 以下’基於附圖説明本發明之各實施例。 實施例1 132572_doc -12· 1352401 如圖l(a)〜(c)所示，此實施例丨將第丨電極部丨之圖案形狀 形成為櫛齒狀之圖t，並將第2電極部2形《為涉及第2電 極層2之大致整個區域之面狀之同時作爲向對於工件吸 附面4之面積不對稱之第丨電極部丨及第2電極部2之施加方 法決疋各電極部1、2之電屋施加4，使藉由靜電監測器 13測定之工件吸附面4之表面電位接近〇伏特。 若詳細説明，表1示出邊分別按規定值變更電源11對第1 電極部1之施加電壓和電源12對第2電極部2之施加電壓， 邊藉由靜電監測器丨3測定工件吸附面4之表面電位之結 果。 [表1] 第1電極部之施加電慰kV) -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 -1.5 -1.50 -1.14 -0.69 -0.36 0.03 0 33 0 68 第2電極 部之施 -1.0 -1.32 -0.98 -0.51 -0.28 0 19 〇 51 0 88 -0.5 -1.11 -0.82 -0.34 -0.14 〇 36 0 63 1 00 加電壓 0.0 -0.95 -0.65 -0.18 0.04 0.56 0 85 1 22 i kV、 0·5 -0.78 -0.49 -0.02 0.22 0 69 1 03 1 37 V Λ v / 1,0 -0,62 -0.32 0.09 0.41 0.88 1 18 1 63 1.5 -0.54 -0.16 0.21 0.60 1.01 1.43 1.74 在此表1中，用斜體表示對兩電極部丨、2分別施加不同 極性的、且絕對值相同之電壓之對稱施加部分之測定值。 由此，容易了解到工件吸附面4之表面電位，在配置于 與其接近之上層之第丨電極部丨之影響大，其之施加電壓成 132572.doc •13· 1352401 爲支配性地事實β ^ =表1之數據，將對向這些兩電極部卜2之施加電 化_及附面4之表面電位之測定值之分佈狀態圖表 化，不于圖2。 藉由：表面電位分佈圖，了解到工件吸附面4之表面電 之測疋值為〇.〇〇之邊界線（通過之區域中心之 虛線4刀）在第2電極部2之施加電愿為^ 5 時第上電極 部1之施加電磨接折ς α· **The insulating layer 3 is formed of a film (film) or a thin plate made of an insulating material such as polyimide or ceramic or plastic, which is excellent in heat resistance, and is laminated on a surface thereof with a conductive material such as a metal fg. The i-th electrode layer is provided on one surface of the insulating layer 3, and the second electrode is provided on the other surface. The first i-electrode layer i and the second electrode layer 2 are electrically conductive portions of the i-th electrode portion i and the second electrode portion 2, respectively, and are preferably any of the electrodes. The portion is formed in the same shape as the pattern, and the other electrode is formed into a covering surface substantially in the entire surface of the insulating layer 3. ° An example of "the specific example of the shape of the _ part k (four)" is a pattern of a tooth-like pattern or a grid-like pattern as shown in the figure, but in addition to the pattern of the honeycomb shape or the pattern of the stripes (four), or In other shapes, a specific example of the second electrode portion 2 is exemplified, and the surface of the second electrode layer 2 is substantially the entire surface of the second electrode layer 2 as shown in Fig. 32572.doc 1352401. The surface of the layer, _ _ such as * by using polyamine, poly(phenylene ether ether ketone) (PEEK), poly- ing; machine _ become called = 4, etc. Workpiece adsorption surface 4. 'In the second electrode layer 2, the inside thereof' is formed into a smooth film shape or a thin plate shape by, for example, an amine, a polystyrene, a polycaene glycol vinegar insulating edge organic material. The edge layer 5 or the like is covered; the insulating layer 5 is formed of a crucible and a layer such as a metal such as a metal. The substrate 7 is formed, and the electrostatic chuck of the present invention produced in the present invention is produced as a method of setting the surface potential of the workpiece adsorption surface 4 to an absolute value of 〇 to several hundreds of volts. (a) is a μ & when the areas of the first electrode portion 1 and the second electrode portion 2 are asymmetrical, 'the voltage application state of the two electrode portions 2 is by an electrostatic monitor such as an electrostatic potential sensor. 13 measuring the surface potential of the workpiece adsorption surface 4, thereby limiting the application value of the measured value to approximately 0 volts, determining one or both of the voltage application amounts of the respective electrode portions, or monitoring the workpiece adsorption surface 4 by * The surface potential automatically adjusts the amount of electric I applied to each electrode portion at an appropriate timing so that the surface potential of the workpiece adsorption surface 4 approaches 0 volts, thereby eliminating the area asymmetry caused by the two electrode portions. The surface potential is not balanced. As another example, by changing the jth electrode portion! And forming one or both of the second electrode portions 2 to measure the surface potential of the workpiece adsorption surface 4 I32572.doc • 11 · The value is close to 0 volt, and the pattern width PW or pitch of the conductive portion la P or the like is a ratio of the juice setting rules in these patterns, and it is also possible to eliminate the imbalance of the surface potential caused by the voltage application of the two electrode portions 1, 2. In other words, the surface potential of the workpiece adsorption surface 4 is largely influenced by the first electrode portion 1 disposed adjacent to the upper layer, and the applied voltage is dominant. Therefore, for example, in the first electrode portion 1 of the upper layer, When the pattern width PW of the conductive portion 13 is constant, the pitch p of the conductive portion u is enlarged, or when the pitch p of the conductive trowel la is constant, the pattern width of the conductive portion ia is reduced, and the second electrode of the lower layer is thereby The influence of the portion 2 becomes large, and the applied voltage becomes dominant. On the other hand, in the second electrode portion 上 of the upper layer, when the pattern width pw of the conductive portion u is constant, the pitch p of the conductive portion 丨a is reduced, or the pitch P of the conductive portion la is constant, and is enlarged. The pattern width PW of the conductive portion u, whereby the influence of the applied voltage of the second electrode portion 丨 of the upper layer becomes large, becomes dominant. With such characteristics, it is possible to adjust the measurement value of the surface potential of the workpiece adsorption surface 4 to be close to 〇V, regardless of the amount of voltage applied to the second electrode portion 丨 and the second electrode portion 2. Further, the electrostatic chuck of the present invention preferably has a static eliminating function, and when the workpiece is peeled off from the workpiece suction surface 4 after the workpiece is processed, and static electricity remains on the workpiece W side to prevent the destruction of the device formed on the workpiece w. Wait. The embodiments of the present invention are described below based on the drawings. Embodiment 1 132572_doc -12· 1352401 As shown in FIGS. 1(a) to 1(c), in this embodiment, the pattern shape of the second electrode portion 丨 is formed into a denture-like pattern t, and the second electrode portion 2 is formed. The method of applying the second electrode portion 2 and the second electrode portion 2, which are asymmetric with respect to the area of the workpiece adsorption surface 4, is the same as the surface of the second electrode layer 2, and the electrode portion 1 is determined. The electric house of 2 is applied 4 so that the surface potential of the workpiece adsorption surface 4 measured by the electrostatic monitor 13 is close to 〇V. As will be described in detail, Table 1 shows that the applied voltage of the power source 11 to the first electrode portion 1 and the voltage applied to the second electrode portion 2 by the power source 12 are changed by a predetermined value, and the workpiece adsorption surface is measured by the electrostatic monitor 丨3. The result of the surface potential of 4. [Table 1] Application of the first electrode portion to the electric comfort kV) -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 -1.5 -1.50 -1.14 -0.69 -0.36 0.03 0 33 0 68 The second electrode portion -1.0 -1.32 - 0.98 -0.51 -0.28 0 19 〇51 0 88 -0.5 -1.11 -0.82 -0.34 -0.14 〇36 0 63 1 00 Applying voltage 0.0 -0.95 -0.65 -0.18 0.04 0.56 0 85 1 22 i kV, 0·5 -0.78 -0.49 -0.02 0.22 0 69 1 03 1 37 V Λ v / 1,0 -0,62 -0.32 0.09 0.41 0.88 1 18 1 63 1.5 -0.54 -0.16 0.21 0.60 1.01 1.43 1.74 In this table, italics are used. The measured values of the symmetric applied portions of the voltages having the same polarity and having the same absolute value are applied to the two electrode portions 丨 and 2, respectively. Therefore, it is easy to know that the surface potential of the workpiece adsorption surface 4 is large and has a large influence on the second electrode portion 与其 disposed adjacent to the upper layer, and the applied voltage is 132572.doc • 13· 1352401 is the dominant fact β ^ = The data in Table 1 is a graph showing the distribution state of the measured values of the surface potentials applied to the two electrode portions 2 and the surface potential of the surface 4, which is not shown in Fig. 2. By the surface potential distribution map, it is understood that the surface electrical conductivity of the workpiece adsorption surface 4 is 边界. The boundary line of the (. ( (the dotted line of the center of the region is 4 knives) is applied to the second electrode portion 2 ^ 5 when the upper electrode portion 1 is applied to the electric grinder ς α· **
接近〇·5 kV，在第2電極部2之施加電壓為 + 1.5 kv時，第！電極部以施加電壓接近。 預先保存/^該刀佈圖上之Q QQ之邊界線之電塵值，基於 該保存值，分別從電源u、12施加至第丄電極部】和第巧 極部2時’即使為面積不對稱之電極構造，也可設定工件 吸附面4之表面電位，使其絕對值成爲〇〜數百伏特。 即，至於作爲靜電吸盤性能重要之靜電吸附力因可以 由施加於各電極部丨、2之電壓之電位差決定，所以，至於 所需之吸附力，以電位差規定，並作爲其中之施加平衡之 詳細内容，決定施加狀態，使工件吸附面4之表面電位接 近0伏特即可。 由此，可以將工件吸附面4之表面電位設定為約5〇〇伏特 以下’較佳為3 0 0伏特以下’以使不發生工件上形成之裝 置或佈線之破壞、裝置特性之變化。 而且，基於如此被保存之分佈數據，這些兩電極部1 ' 2 之施加電壓中之任一方被變更時，也可以自動變動另一方 電極部之施加電壓’以使工件吸附面4之表面電位接近〇伏 132572.doc • 14- 1352401 特。 另一方面，如此製作之本發明之靜電吸盤，作爲工件 w，配備在裝卸自如地保持用於板狀之液晶顯示器（lcd) 或電漿顯示器（PDP)或軟性顯示器之面板之玻璃基板或塑 膠膜基板而進行貼合之基板貼合機或搬送這種基板等之絕 緣體、導電體或半導體晶片等工件之基板搬送裝置等而被 使用。 在用於基板貼合機時，在由固定盤而成之上下一對保持 板之任一方或兩方配備本發明之靜電吸盤，在這些上下保 持板分別靜電吸附2張工件W並裝卸自如地保持，在其周 圍形成之封閉空間達到規定之真空度之後，依次進行工件 w彼此之位置對準和重合，並且，將兩基板a、b之間壓碎 至規定之隙縫，完成貼合工序，繼而，從該靜電吸盤剝離 並搬出元成該貼合之已貼合之工件W。 事實上，配備在這種基板貼合機進行實驗之結果，藉由 以往之施加方法，對第丨電極部丨及第2電極部2分別從電源 11、12施加正極側和負極側具有相同之絕對值而極性不同 之電H在工件W上形成之裝置特性上發現#電所導致 之變化。 對此，將上述本發明之吸附面4之表面電位以絕對值成 爲〇〜數百伏特之不對稱之施加方法對兩電極部i、2電壓施 加時，沒有發現工件w上形成之裝置特性之變化或放電所 導致之破壞，而且，也能夠證實獲得可確實地吸附握持工 件W之吸附力的事實，發現了明顯之效果。 132572.doc •15· 1352401 實施例2 此實施例2作爲將藉由上述靜電監測器13測定之工件吸 附面4之表面電位接近〇伏特地設定的方法調整圖所 示之第i電極部i及第2電極部2之任一方或兩方之形成圖案 並設定為規定之形狀，並將對應於這些各設定圖案之電壓 施加在第1電極部丨及第2電極部2之構成與上述實施例1不 同’除此以外之構成與上述實施例1相同。When it is close to 〇·5 kV, when the applied voltage of the second electrode unit 2 is + 1.5 kv, the first! The electrode portion is approached by an applied voltage. Pre-storing /^ The dust value of the Q QQ boundary line on the knife layout is based on the saved value, respectively, when the power supply u, 12 is applied to the second electrode portion and the second electrode portion 2, even if the area is not The symmetrical electrode structure can also set the surface potential of the workpiece adsorption surface 4 so that the absolute value becomes 〇~hundreds of volts. In other words, the electrostatic adsorption force which is important as the performance of the electrostatic chuck can be determined by the potential difference between the voltages applied to the respective electrode portions 丨, 2, so that the required adsorption force is defined by the potential difference, and the balance is applied as a detail. The content is determined by the application state so that the surface potential of the workpiece adsorption surface 4 is close to 0 volt. Thereby, the surface potential of the workpiece adsorption surface 4 can be set to about 5 volts or less, preferably 300 volts or less, so that the destruction of the device or the wiring formed on the workpiece and the change in the device characteristics do not occur. Further, when any one of the applied voltages of the two electrode portions 1' 2 is changed based on the distributed data thus stored, the applied voltage ' of the other electrode portion can be automatically changed to bring the surface potential of the workpiece adsorption surface 4 closer. Crouching 132572.doc • 14- 1352401 special. On the other hand, the electrostatic chuck of the present invention thus produced is provided as a workpiece w, and is provided with a glass substrate or plastic which is detachably held by a panel for a liquid crystal display (LCD) or a plasma display (PDP) or a flexible display. A substrate bonding machine that bonds the film substrate, or a substrate transfer device that transports a workpiece such as an insulator, a conductor, or a semiconductor wafer. When used in a substrate bonding machine, the electrostatic chuck of the present invention is provided on either or both of the pair of holding plates formed by the fixed disk, and the upper and lower holding plates electrostatically adsorb two workpieces W and detachably After the closed space formed around the vacuum space reaches a predetermined degree of vacuum, the workpieces w are sequentially aligned and overlapped with each other, and the two substrates a and b are crushed to a predetermined gap to complete the bonding process. Then, the workpiece W that has been bonded to the bonded surface is peeled off from the electrostatic chuck. In fact, as a result of the experiment conducted on the substrate bonding machine, the positive electrode side and the negative electrode side are applied to the second electrode portion 丨 and the second electrode portion 2 from the power sources 11 and 12, respectively, by the conventional application method. The electrical characteristics of the absolute value and the different polarity are found on the device characteristics of the workpiece W. On the other hand, when the surface potential of the adsorption surface 4 of the present invention is applied to the voltages of the two electrode portions i and 2 with an absolute value of 〇 to several hundreds of volts, the device characteristics formed on the workpiece w are not found. The damage caused by the change or discharge, and also the fact that the adsorption force for holding the workpiece W can be surely adsorbed can be confirmed, and a remarkable effect is found. 132572.doc •15· 1352401 Embodiment 2 In the second embodiment, the ith electrode portion i and the ith electrode portion i shown in the figure are adjusted as a method of setting the surface potential of the workpiece adsorption surface 4 measured by the electrostatic monitor 13 to approximately 〇V. One or both of the second electrode portions 2 are patterned and set to a predetermined shape, and the voltages corresponding to the respective setting patterns are applied to the first electrode portion 丨 and the second electrode portion 2, and the above embodiment 1 different 'The configuration other than this is the same as that of the above-described first embodiment.
因 電 部 若詳細地説明，如上所述，工件吸附面4之表面電位， 配置在與其接近之上層之第丨電極部丨之影響大，其施加 壓成為支配性，所以，例如，在第i電極部〗中，其導電 部分la之圖案寬度！>臂為一定時，擴大該導電部分13之 節距P’或導電部分U之節距P為一定時，縮小該導電部分 la之圖案寬度PW地進行變更，則下層之第2電極部2之影 響變大，其施加電壓成爲支配性。As described in detail in the electric unit, as described above, the surface potential of the workpiece adsorption surface 4 is disposed to be larger than the influence of the second electrode portion 之上 of the upper layer, and the applied pressure becomes dominant. Therefore, for example, in the i-th In the electrode section, the pattern width of the conductive portion la is! > When the arm is constant, when the pitch P' of the conductive portion 13 is increased or the pitch P of the conductive portion U is constant, the pattern width PW of the conductive portion 1a is reduced, and the second electrode portion 2 of the lower layer is changed. The influence becomes larger, and the applied voltage becomes dominant.
與此相反，在上層之第i電極部丨中，其導電部分u之圖 案寬度pw為一定時，縮小該導電部分la之節距p，或導電 部分la之節距P為一定時，擴大該導電部分u之圖案寬度 PW地進行變更，則該上層之第丨電極部〗之施加電壓之影 響變大’成爲支配性。 利用這種特性，基於吸附面4之表面電位之測定值調 整第1電極部丨之圖案寬度PW及節距p之任一方或兩方並設 定該測定值’使其接近〇伏特’則即使從各電源u、12分 別對第1電極部！及第2電極部2施加極性不同而絕對值相同 之電壓也可預先設疋工件吸附面4之表面電位，使其接 132572.doc 1352401 近〇伏特β 因此，該實施例2也可以獲得與上述實施例丨相同之作用 效果。 實施例3 ”亥實施例3，藉由只改變靠近上述工件吸附面4之向第】 電極部1之施加電壓，而固定從工件吸附面4遠之第2電極 部2之施加電壓，可改變工件吸附面4之表面電位，進行與 工件吸附面4接觸之工件W之除電之構成與上述圖丨〜圖2所 示之實施例1不同，除此以外之構成與圖丨〜圖2所示之實施 例1相同。 該除電係，在工件處理後，從工件吸附面4剝離工件曹 時及剝離之後，在該工件w側殘留靜電，防止該工件W上 形成之裝置之破壞等。 例舉具體例，在基板貼合機配備使用本發明之靜電吸盤 時，除電為從其工件吸附面4搬出貼合完畢之工件w而剝 離之瞬間發生之剝離帶電，容易從工件吸附面4剝離工件 W。 這種除電，藉由電壓調整第1電極部1和第2電極部2之電 源Π、12 ’並將電壓之極性反復反轉等施加逆電位，將工 件吸附面4之表面電位（帶電電位）交替連續可變爲+〜_。 因此’在本發明之靜電吸盤之表面電位控制方法中，工 件吸附面4之表面電位因與其接近之上層之第1電極部1之 影響大，其施加電壓成為支配性’所以’即使固定電源12 對下層之第2電極部2之施加電壓，也可只在其操作範圍内 132572.doc •17· 調整電源11對上層之第丨電極部 附面4之表面電位。 ”之把加電歷，改變工件吸 之：：細説明，因向第丨電極部〗及第2電極部2施加不對稱 η ’所以，例如’以第1電極部1之施加電壓為+05 、第2電極部2之施加電愿為」5 kv之差社〇…進行驅 動時’為將工件吸附面4之表面電位成為」〇 W，只需將 上層之第1電極部i之電位稍微下降即可，而且，為將工件 吸附面4之表面電位成為+1〇 kv，只需將上層之第}電極 部1之電位上升至+ 1.〇 kV+a即可。，下層之第2電極部2 之電壓固定為佳。 由此，具有以下優點：即，僅控制第丨電極部i之電源U 之電壓即可改變工件吸附面4之表面電位，能夠將第丨電極 部1和第2電極部2之電源11、12之+和·之極性固定同時， 可在操作範圍内之電壓可變區域實施工件吸附面4之表面 電位之控制。 需要説明之是，雖只説明了本發明之靜電吸盤，作爲工 件W ’配備在裝卸自如地保持用於板狀之液晶顯示器 (LCD)或電漿顯示器（PDP)或軟性顯示器之面板之玻璃基板 或塑膠膜基板並進行貼合之基板貼合機配備之情況，但不 限於此’也可配備在除該基板貼合機以外之基板組裝裝置 或搬送基板之基板搬送裝置，或接著保持LCD面板用玻璃 基板以外之基板。 而且，説明了在真空中貼合2張工件W之基板貼合機， 但不限於此’也可以在大氣中貼合2張工件W之基板貼合 132572.doc -18 * 機’在此情沉，也可 用效果 【圖式簡單說明】 圖1表示本發明之靜電吸 施例’（a)為橫切正視圖 以獲得與上述之真空貼合機相同之作 盤之表面電位控制方法之一實 圖，（c)為/势 （b)為在第1電極部橫切之剖面 2電極部橫切之剖面圖。 圖2疋測定分佈圖。 【主要 1 元件符號說明】 X 第1電極部 1' 第1電極層 1 a 導電部分 2 第2電極 2， 第2電極層 3 絕緣層 3a 泵 4 工件吸附面 4' 介電層 5 絕緣層 6 接著層 7 基板 11 第1電極部之電源 12 第2電極部之電源 13 靜電監測器 132572.docOn the other hand, when the pattern width pw of the conductive portion u is constant in the i-th electrode portion 上 of the upper layer, when the pitch p of the conductive portion 1a is reduced, or the pitch P of the conductive portion 1a is constant, the expansion is performed. When the pattern width PW of the conductive portion u is changed, the influence of the applied voltage of the second electrode portion of the upper layer becomes large, and becomes dominant. By using such a characteristic, one or both of the pattern width PW and the pitch p of the first electrode portion 调整 are adjusted based on the measured value of the surface potential of the adsorption surface 4, and the measured value 'close to 〇 volt' is set even if Each of the power sources u and 12 is opposite to the first electrode portion! The voltage applied to the second electrode portion 2 having the same polarity and the same absolute value may be set in advance to the surface potential of the workpiece adsorption surface 4 so as to be connected to 132572.doc 1352401 near volts. Therefore, the second embodiment can also be obtained as described above. The same effect is achieved in the embodiment. In the third embodiment, the application voltage of the second electrode portion 2 far from the workpiece adsorption surface 4 is fixed by changing the voltage applied to the electrode portion 1 close to the workpiece adsorption surface 4, and the voltage can be changed. The surface potential of the workpiece adsorption surface 4 is different from that of the first embodiment shown in FIG. 2 to FIG. 2 except that the workpiece W is in contact with the workpiece adsorption surface 4, and the other configuration is as shown in FIG. In the same manner as in the first embodiment, in the static elimination system, after the workpiece is processed, the workpiece is peeled off from the workpiece adsorption surface 4 and peeled off, and static electricity is left on the workpiece w side to prevent breakage of the device formed on the workpiece W. In a specific example, when the electrostatic chuck of the present invention is used in the substrate bonding machine, the static electricity is stripped and charged at the moment when the workpiece w is removed from the workpiece suction surface 4 and peeled off, and the workpiece W is easily peeled off from the workpiece suction surface 4. In this type of static elimination, the surface potential of the workpiece adsorption surface 4 (charged potential) is applied by adjusting the power supply Π, 12' of the first electrode portion 1 and the second electrode portion 2 by voltage and repeatedly inverting the polarity of the voltage. )alternately Therefore, in the surface potential control method of the electrostatic chuck of the present invention, the surface potential of the workpiece adsorption surface 4 is greatly affected by the influence of the first electrode portion 1 adjacent to the upper layer, and the applied voltage becomes dominant. Even if the fixed power source 12 applies a voltage to the second electrode portion 2 of the lower layer, it can be only within the operating range of 132572.doc • 17· Adjust the surface potential of the power source 11 to the upper electrode portion 4 of the upper electrode portion "The electric power is applied to the workpiece, and the workpiece is sucked.": The asymmetry η ' is applied to the second electrode portion and the second electrode portion 2. Therefore, for example, the applied voltage of the first electrode portion 1 is + 05. When the electric power of the second electrode unit 2 is "5 kv", when the driving is performed, the surface potential of the workpiece adsorption surface 4 is "〇W", and the potential of the first electrode portion i of the upper layer is required. In order to increase the surface potential of the workpiece adsorption surface 4 to +1 〇 kv, it is only necessary to increase the potential of the first electrode portion 1 of the upper layer to + 1. 〇 kV + a. The voltage of the second electrode portion 2 of the lower layer is preferably fixed. Therefore, it is possible to change the surface potential of the workpiece adsorption surface 4 by controlling only the voltage of the power source U of the second electrode portion i, and the power supply 11 and 12 of the second electrode portion 1 and the second electrode portion 2 can be changed. While the polarity of + and · is fixed, the surface potential of the workpiece adsorption surface 4 can be controlled in a voltage variable region within the operating range. It should be noted that although only the electrostatic chuck of the present invention has been described, the workpiece W' is provided as a glass substrate that is detachably held by a panel for a liquid crystal display (LCD) or a plasma display (PDP) or a flexible display. In the case where the plastic film substrate is attached to the substrate bonding machine, it is not limited thereto. It may be provided in a substrate assembly device other than the substrate bonding machine or a substrate transfer device that transports the substrate, or subsequently the LCD panel is held. A substrate other than a glass substrate is used. Further, a substrate laminator in which two workpieces W are bonded in a vacuum is described, but the invention is not limited thereto. It is also possible to laminate two workpieces W in the atmosphere to a substrate bonding 132572.doc -18 * machine 'in this case Sink, can also be used [Simplified description of the drawings] Fig. 1 shows an electrostatic absorption example of the present invention (a) is a cross-sectional front view to obtain the same surface potential control method as the vacuum laminator described above. In the actual diagram, (c) is a cross-sectional view in which the potential (b) is a cross section of the electrode portion of the cross section 2 which is transverse to the first electrode portion. Figure 2 疋 Determination of the distribution map. [Main 1 component symbol description] X First electrode portion 1' First electrode layer 1 a Conductive portion 2 Second electrode 2, Second electrode layer 3 Insulating layer 3a Pump 4 Workpiece adsorption surface 4' Dielectric layer 5 Insulation layer 6 Next layer 7 substrate 11 power supply of the first electrode portion 12 power supply of the second electrode portion 13 electrostatic monitor 132572.doc