TWI351323B - Method of dispensing paste using paste dispenser - Google Patents

Method of dispensing paste using paste dispenser Download PDF

Info

Publication number
TWI351323B
TWI351323B TW097126075A TW97126075A TWI351323B TW I351323 B TWI351323 B TW I351323B TW 097126075 A TW097126075 A TW 097126075A TW 97126075 A TW97126075 A TW 97126075A TW I351323 B TWI351323 B TW I351323B
Authority
TW
Taiwan
Prior art keywords
coating
height
nozzle
speed
reaches
Prior art date
Application number
TW097126075A
Other languages
Chinese (zh)
Other versions
TW200927305A (en
Inventor
Seo-Ho Son
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW200927305A publication Critical patent/TW200927305A/en
Application granted granted Critical
Publication of TWI351323B publication Critical patent/TWI351323B/en

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • G02F1/13394Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/48Flattening arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)

Description

135*1323 九、發明說明: 【相關申請案參照】 本申請案主張2007年12月20日申請之韓國專利 申請案第10-2007-0134490號之優先權,其所揭露之内 容係整體併入本文作為參考。 【發明所屬之技術領域】 本發明關於一種利用點膠機(paste dispenser)以預定 圖案而塗佈膠之方法。 【先前技術】 菖製1^平面板顯示器時,為了搞合或密封兩個基 板’利用點膠機以預定圖案而塗佈勝於基板上。 點膠機包含置放基板於其上之平台、包含用以 膠的喷嘴之塗佈頭、以及域塗佈頭之頭支撐單元 台及/或頭支撐單元藉祕動H料移缺―奸。 地’塗佈頭藉由不同的致動器水平移動於垂直於及 /或頭支撐單元移動方向之方向。因此 二 板移動。致動器由控制器所控制。 相對於基 板上之膠圖案資訊之資 輸入至點膠機,點膠機根據關於 料 膠圖案之資訊改變噴嘴 位置而塗佈膠於基杯卜' 交 I板上因而形成膠圖案於基板上 6 而形成0 , h㈣膠之終止時點連續塗饰膠 膠圖案1必須形成為厚度及寬度一致,其理由如 I。若膠於連接部份的寬度及高度小於膠_的其餘部 伤,其中膠之連接部份為開始塗佈膠之祕部份與終止 ,佈膠之終點部分相遇之處,則黏接基板彼此的黏著力 量會變弱,且基板的密封效果會變差。 同時,若膠於連接部份的寬度及高度大於膠圖案其 餘部份,則膠可能流到螢幕有效區,使得由膠圖案i所 界定之空間減少,或膠可能流到基板s外。更糟的是, 當預定量的液晶填充入膠圖案1所界定的空間,對應空 間減少量之液晶可能從空間溢流出或漏出。 因此,以膠圖案1之寬度及高度滿足膠圖案1整個 區域的預設尺寸方式來形成膠圖案1是很重要的。 【發明内容】 本發明提供以下列方式塗佈膠之膠圖案於基板上 1351323 1351323 點 2法’㈣案之寬度及高度於咖案的整個區域為 致的,包含開始塗佈膠之起始部份與終止塗_之終 郤分相遇處之連接部份。 於其2本發明之—方面,提供—種糊點膠機塗佈膠 塗=藉,於基板上升或下降喷 動時改變塗佈速噴嘴相對於基板水平移 μ 健力而釋㈣時,以塗佈起 ϋ重料佈終齡置之方錢舞 嘴=塗2:自待命高度下降至第-塗佈高度直到ί 然後維持噴嘴於第-塗佈高度直 产上升位諸心上升位置,以及料嘴達到第一高 又上升位置時,將喷嘴自第一塗 高度,然後維射嘴於第二塗佈高度:升至第一塗佈 法更包含:當噴嘴達到圖案終止位置時 置:升=嘴塗佈高度上= 又上升位置#,自第二塗佈高度增加塗佈 然後維持噴嘴於第三塗佈高度直到;嘴;: 二阿又上升位置;以及當喷嘴達到第三高戶 日寸’自第三塗佈高度增加塗佈高度 :位置 ::持喷嘴於該第四塗佈高度“=終: 8 戈明ίΓί他觀簡於後之卿巾料,且部份將由 ’而顯而易知,或可由施行本發明而習得。 應了解前述一般描述及以下詳細描述皆 及說明性,且用以提供本發明進一步的說明。 【實施方式】 參考顯示本發明示範實施例之所附圖式,於後以更 加詳細描述本發明。然而,本發明可以不同形式實施, 且不應解釋為以此所闡述的示範實施例作為限制。更確 切而言,提供示範實施例以使揭露更加徹底,且將完全 地傳達本發明範缚予熟此技藝者。於圖式中,為清楚顯 示可能誇示層及區域之尺寸及相對尺寸。圖式中類似的 參考符號代表類似的元件。 圖2顯示應用根據本發明實施例之塗佈膠的方法之 點膠機10的透視圖。 參考圖2,點膠機10包含框架11、平台12、頭支 撐單元13、至少一頭單元21、以及控制器(未顯示)。平 台12設置於框架11上,而自框架11之一側所供给之 基板S則設置於平台12上。 示)而滑動於γ軸:m:第-致動器(未顯 動器(未顯咖滑動於向。千台12可藉由第二致 延伸於I3日置於Γ台12上方。頭支撐單元13 元13可藉由第三致動兩^由去框架11所支標。頭支揮單 —致動盗而(未顯不)滑動於Y軸方向。 移動ΐΓί單元21可被支樓於頭支樓單元13上,龙可 -滑動於=向頭單:·,由第四致動器(未顯ί 構。 11碩早元21可具有如圖3所示之結 嗔嘴含ΐ有排出膠之,22的塗佈項23。 简供應單元(未顯示)。 —24具有 24,供應射狀壓紅线至注射器 作為自喷嘴。::24中之壓力。注射器24中的壓力 嘴排出注射器24中的膠之塗佈壓力,而喷 2排出之膠量可藉由調整塗佈壓力來控制。赁 動,可藉由第錢動器(未顯示)而向上移 又貝_ 22的位置。第五致動器可包含馬達 10 以及由馬達25所提升之提升部(未顯示)。於此,提升部 可固定於塗佈頭23。若提升部由馬達25提升,則可提 升固定於提升部之塗佈頭23。騎佈頭23被提升,則 改變噴頭22之高度。 β提供距離偵測器26於喷嘴22旁,而距離偵測器% 可里測基板S與噴嘴22間之距離,並且提供量測的距 離值給控㈣。控制器可基於量測的距離值,而控制第 五致動器以改變噴嘴22之高度。 _ 同,地,控制器基於關於平台12、頭支撐單元13、 以及頭單元21之位置的資訊,控制第-到第四致動器 以改憂基板S對嘴嘴22的相對位置至一預設位置。同 樣地’控制器控制第一到第四致動器,以改變喷嘴22 相^•於基S移動之塗佈速度至_預設速度 。同樣地, 控制器控制氣動供應單元,以自喷嘴22排出預定量之 膠。 現在參考圖4及5,將描述由點膠機1〇執行根據本 發明實施例塗佈膠之方法。在此說明書中,將描述以塗 佈起始位置重疊塗佈終點位置的方式而塗佈膠之方 法。再將描述以塗佈起始位置與塗佈終點位置重疊 部份的寬度及高度等於整個膠圖案其餘部份的方式而 塗佈膠之方法。 1351323 塗佈二=實例之塗佈膠的方法而開始 佈速度的改變、以及塗健力的改變。 ^ ±135*1323 IX. Description of the Invention: [Related Application Proposal] The present application claims priority to Korean Patent Application No. 10-2007-0134490, filed on Dec. 20, 2007, the disclosure of which is incorporated herein in its entirety. This article serves as a reference. BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a method of applying a glue in a predetermined pattern using a paste dispenser. [Prior Art] When the 1^ flat panel display is clamped, in order to fit or seal the two substrates, the coating is applied in a predetermined pattern over the substrate by a dispenser. The dispenser includes a platform on which the substrate is placed, a coating head including a nozzle for glue, and a head support unit and/or a head support unit of the domain coating head. The ground coating head is horizontally moved by a different actuator in a direction perpendicular to the direction of movement of the head support unit. So the second board moves. The actuator is controlled by the controller. The information about the glue pattern information on the substrate is input to the dispenser, and the dispenser changes the nozzle position according to the information about the glue pattern to apply the glue on the base cup and thus forms a glue pattern on the substrate. When the 0, h (four) glue is formed, the continuous finishing glue pattern 1 must be formed to have the same thickness and width, for the reason of I. If the width and height of the glue in the joint portion are smaller than the rest of the glue _, the joint portion of the glue is the secret part of the start of the glue, and the end of the glue meets, the bonded substrates are bonded to each other. The adhesive strength will be weak and the sealing effect of the substrate will be deteriorated. At the same time, if the width and height of the glue portion are greater than the rest of the glue pattern, the glue may flow to the effective area of the screen, so that the space defined by the glue pattern i is reduced, or the glue may flow outside the substrate s. To make matters worse, when a predetermined amount of liquid crystal is filled into the space defined by the glue pattern 1, the liquid crystal corresponding to the space reduction amount may overflow or leak out from the space. Therefore, it is important to form the glue pattern 1 in such a manner that the width and height of the glue pattern 1 satisfy the predetermined size of the entire area of the glue pattern 1. SUMMARY OF THE INVENTION The present invention provides a method for coating a glue on a substrate in the following manner: 13513323 1351323 point 2 method '(4) The width and height of the case are the entire area of the coffee case, including the beginning of the beginning of the coating of the glue The part of the connection that ends with the end of the application. In the aspect of the invention of the present invention, a paste-coating machine is provided for coating, and when the substrate is lifted or lowered, the coating speed nozzle is changed relative to the horizontal displacement of the substrate (4), Applying the ϋ heavy material cloth to the end of the square money dance mouth = Tu 2: from the standby height to the first - coating height until ί and then maintaining the nozzle at the first coating height, the rise of the rising position, and When the nozzle reaches the first high and raised position, the nozzle is raised from the first coating height, and then the nozzle is at the second coating height: the first coating method is further included: when the nozzle reaches the pattern end position: = mouth coating height = again rising position #, increasing coating from the second coating height and then maintaining the nozzle at the third coating height until; mouth;: argon again rising position; and when the nozzle reaches the third highest household day Inch ' increases the coating height from the third coating height: position:: holds the nozzle at the fourth coating height "=finish: 8 gemin ίΓί he view simple in the back of the towel, and part will be It is easy to know, or can be learned by the practice of the present invention. It should be understood that the foregoing general description and the following detailed description DETAILED DESCRIPTION OF THE INVENTION The present invention will be described in more detail with reference to the accompanying drawings which illustrate the exemplary embodiments of the invention. The implementations are not to be construed as limiting the exemplary embodiments set forth herein. More specifically, exemplary embodiments are provided to provide a more thorough disclosure and will fully convey the invention. In the drawings, the dimensions and relative sizes of the layers and regions may be exaggerated for clarity. The same reference numerals in the drawings represent similar elements. Figure 2 shows a dispensing machine 10 using a method of applying a glue according to an embodiment of the present invention. Referring to Figure 2, the dispenser 10 includes a frame 11, a platform 12, a head support unit 13, at least a head unit 21, and a controller (not shown). The platform 12 is disposed on the frame 11, and one of the frames 11 The substrate S supplied from the side is disposed on the platform 12. Slided on the γ axis: m: the first actuator (not the actuator (not shown in the direction of the coffee. The thousand 12 can be used by the second Extended to I3 It is placed above the platform 12. The head supporting unit 13 can be supported by the third actuating frame 13 by the frame 11. The head is swayed and slid (not shown) in the Y-axis direction. The mobile unit 21 can be supported on the head unit 13 and the dragon can slide to the head: • by the fourth actuator (not shown). The knotted nozzle shown has a discharge of glue, 22 of the coating item 23. A simple supply unit (not shown). - 24 has 24, supply a spray red line to the syringe as a self-nozzle.::24 Pressure. The pressure nozzle in the syringe 24 discharges the coating pressure of the glue in the syringe 24, and the amount of glue discharged from the spray 2 can be controlled by adjusting the coating pressure. The movement can be controlled by a money actuator (not shown). And move up and the position of _ 22. The fifth actuator may include a motor 10 and a lift (not shown) that is lifted by the motor 25. Here, the lifting portion can be fixed to the coating head 23. If the lifting portion is lifted by the motor 25, the coating head 23 fixed to the lifting portion can be lifted. When the riding head 23 is lifted, the height of the head 22 is changed. The distance detector 26 is provided adjacent to the nozzle 22, and the distance detector % measures the distance between the substrate S and the nozzle 22, and provides the measured distance value for control (4). The controller can control the fifth actuator to change the height of the nozzle 22 based on the measured distance value. The controller controls the first to fourth actuators to change the relative position of the substrate S to the nozzle 22 to a pre-determination based on information about the position of the platform 12, the head support unit 13, and the head unit 21. Set the location. Similarly, the controller controls the first to fourth actuators to change the coating speed of the nozzle 22 to the base S to the preset speed. Likewise, the controller controls the pneumatic supply unit to discharge a predetermined amount of glue from the nozzle 22. Referring now to Figures 4 and 5, a method of applying a glue according to an embodiment of the present invention by a dispenser 1 will be described. In this specification, a method of applying a glue in such a manner that the coating start position overlaps the coating end position will be described. A method of applying a glue in such a manner that the width and height of the overlapping portion of the coating start position and the coating end position are equal to the rest of the entire rubber pattern will be described. 1351323 The method of coating the coating gel of the second example was started to change the cloth speed and the change of the coating strength. ^ ±

歸=4所示i當喷嘴22達到塗佈起始位置Ld卜 之塗佈局度自待命高度HIT*降至第_塗佈高 又H2。然後維持喷嘴22於第一塗佈高度H2直到喷嘴 22達到第-南度上升位置Lh卜在另一範例巾,第」高 度上升位置Lhl可設為圖案起始位置Ld2或為圖案起始 位置Ld2之前的任意位置。 之後,當喷嘴22達到第一高度上升位置LM時, 塗佈高度自第一塗佈高度H2上升至第二塗佈高度H3, 然後維持喷嘴22於第二塗佈高度H3 ^第二塗佈高度 H3對應將形成基板上之膠圖案的高度。When the value of the nozzle 22 reaches the coating start position Ld, the coating degree is lowered from the standby height HIT* to the first coating height and H2. Then, the nozzle 22 is maintained at the first coating height H2 until the nozzle 22 reaches the first-degree rising position Lh. In another example towel, the first height rising position Lhl can be set to the pattern starting position Ld2 or the pattern starting position Ld2. Any previous position. Thereafter, when the nozzle 22 reaches the first height rising position LM, the coating height is raised from the first coating height H2 to the second coating height H3, and then the nozzle 22 is maintained at the second coating height H3 ^ the second coating height H3 corresponds to the height at which the glue pattern on the substrate will be formed.

於第一高度上升位置Lhl之前啟動氣動供應單 元,以施加塗佈壓力於噴嘴22中之膠。當喷嘴22達到 第二加速終止位置Lv2時,維持塗佈壓力於預設壓力。 在另一範例中’於噴嘴22達到第二加速終止位置Lv2 之前,維持塗佈壓力於預設壓力。 當喷嘴22自塗佈起始位置Ldi之前而移動至第一 12 加速終止位置Lvl時,塗佈速度自零速度增加至第一塗 钸速度VI ’然後維持在第一塗佈速度V1。塗佈速度可 自塗佈起始位置Ldl之前的任意位置而增加。又 然後,當喷嘴22自圖案起始位置Ld2移動至第二 加速終止位置Lv2時,塗佈速度自第—塗佈速度^ ^ 加至第二塗佈速度V2,然後維持在第二塗佈速度% : 第二塗佈速度V2為除了形成卵案之縣疊部份外的 剩餘部份之速度。第二加速終止位置Lv2可相同於第一 高度上升位置Lhl。 ' 在此方法巾,喷嘴22相對於基板s移動(見圖2)以 塗佈膠於基板S上,而塗佈高度、塗佈速度、以及塗佈 座力在塗佈㈣之位置處的改變,將於下參 加詳細描 田於塗佈起始位置Ldl之前逐漸地增加塗佈速 度自待命高度H1 T降至第-塗佈高度 Η2 ’此時噴嘴22沿塗佈膠之方向逐漸地傾斜下降,直 到噴嘴22達到基板s上方之第一塗佈高度Η2。因此, 可避免黏著在噴嘴22排出σ的_到基板s上。 亦即’右喷嘴22直接從待命高度出掉到第一塗佈 问又H2 ’黏著在噴嘴22排出口的膠則會滴到基板$ 135.1323 上’且因此塗佈於基板S上的膠受到噴嘴22擠壓,使 得膠變成中空。然而,若喷嘴22自待命高度H1傾斜地 下降至第一塗佈高度H2,可平順地塗佈膠於基板s上 而不滴到基板S上。因此,可避免使塗佈起始位置與塗 佈終點位置之重疊部份的寬度及咼度變得不同於整個 膠圖案之其餘部份。 然後,當喷嘴22自塗佈起始位置Ldl移動至第— • 高度上升位置Lhl時,維持喷嘴22於低於第二塗佈高 度H3之第一塗佈高度H2。於此時,在喷嘴22達到^ 一咼度上升位置Lhl之前,開始施加塗佈壓力於噴嘴 22中的膠’且當喷嘴22達到第二加速終止位置Lv2時, 塗佈壓力達到預設壓力。當噴嘴22自塗佈起始位置Ldl 之如而移動至第一加速終止位置Lvl時,塗佈速度自裳 速度增加至第一塗佈速度VI,而當喷嘴22自圖案起始 位置Ld2而到達至第二加速終止位置Lv2時,塗佈速度 • 則自第一塗佈速度VI增加至第二塗佈速度V2。 於此程序中,塗佈於基板S上之膠的寬度及高度可 自塗佈起始位置Ldl逐漸增加,直到膠達到圖案起始位 置Ld2。塗佈於基板S上塗佈起始位置Ldl及圖案起始 位置Ld2間之膠的寬度及高度,可能少於將塗佈於第二 塗佈高度H3之膠。 14 塗佈於塗佈起始位置Ldl及圖案起始位置Ld2間之 膠的形狀,可藉由調整塗佈高度、塗佈速度、以及塗佈 屋力而隨意設定。因此,當塗佈於塗佈起始位置Ldi及 圖案起始位置Ld2間之膠重疊塗佈於圖案終止位置 及塗佈終止位置Ld4間之膠(見圖5),重疊部份的寬度 及高度可相同於整個圖案的其餘部份。 若第一咼度上升位置Lhl在圖案起始位置Ld2太前 面,塗佈於第一高度上升位置Lhl及圖案起始位置Ld2 間之膠的寬度及高度,可能大於塗佈於第二塗佈高度 H3之膠。因此,第一高度上升位置LM可為圖案起始 位置Ld2及第二加速終止位置Lv2間之任意位置。 圖5顯示根據本發明實施例當根據塗佈膠方法終止 塗佈膠時,相對於喷嘴22位置之塗佈高度改變、塗佈 速度改變、以及塗佈壓力改變。 如圖5所示’維持喷嘴22於第二塗佈高度H3,直 到噴嘴22達到第二高度上升位置Lh2。第二高度上升 位置Lh2可等於圖案終止位置Ld3。然後,當噴嘴22 自第二高度上升位置Lh2移動至第三高度上升位置乙… 時,塗佈南度自第二塗佈高度H3增加至第三塗佈高度 H4 ’然後維持在第三塗佈高度H4。 1351323 然後’當喷嘴22自第三高度上升位置如移動至 塗佈終止位置Ld4時,塗佈高度自第三塗佈高度拟货 加至第四塗佈高度H5,然後維持在第四塗佈高度^ 接續地’塗佈高度自細塗佈高度Hs增加至待命高度 當塗佈高度如上述改變時,於第一減速起始位置 Lv3關掉氣動供應單元降低塗佈壓力。同時塗佈麼力 開始降低的位置可於第i迷起始位置W之前或之 後0 同樣地,自噴嘴22達到第一減速起始位置Lv3時, 塗佈速度降至第-塗佈速度V1。第—減速起始位置W 可於圖案終結位置Ld3之前。 然後,自喷嘴22達到第二減速起始位置lv4時, 塗佈速度逐漸地朝零速度下降。第二減速起始位置^ 可於通過圖案終止位置Ld3後於塗佈終止位置之 前。塗佈速度達到零速度之位置可為通過塗佈終止位置 Ld4後之任意位置,使得喷嘴22移動到待命高度H1。 一喷噍22相對於基板S移動以塗佈膠於基板s上, 當塗佈終止時塗佈高度、塗佈速度、以及塗佈壓力之改 變之方法,將於下描述。 16 當噴嘴22自第-減迷起始位置Lv3移動至第二減 速起始位置Lv4時,塗佈速庚楚 邱迷度自第一塗佈速度VI降低The pneumatic supply unit is activated prior to the first height rise position Lhl to apply a coating pressure to the glue in the nozzle 22. When the nozzle 22 reaches the second acceleration end position Lv2, the coating pressure is maintained at the preset pressure. In another example, the coating pressure is maintained at a preset pressure before the nozzle 22 reaches the second acceleration end position Lv2. When the nozzle 22 is moved to the first 12th acceleration end position Lv1 before the coating start position Ldi, the coating speed is increased from the zero speed to the first coating speed VI' and then maintained at the first coating speed V1. The coating speed can be increased from any position before the coating start position Ldl. Then, when the nozzle 22 is moved from the pattern start position Ld2 to the second acceleration end position Lv2, the coating speed is increased from the first coating speed ^^ to the second coating speed V2, and then maintained at the second coating speed. % : The second coating speed V2 is the speed of the remaining portion except for the county stack portion forming the egg case. The second acceleration end position Lv2 may be the same as the first height rising position Lhl. In this method, the nozzle 22 is moved relative to the substrate s (see Fig. 2) to apply glue to the substrate S, and the coating height, coating speed, and coating force are changed at the position of the coating (4). The coating speed will gradually increase from the standby height H1 T to the first coating height Η 2 ' before the detailed description of the coating start position Ldl. The nozzle 22 gradually tilts down in the direction of the coating glue. Until the nozzle 22 reaches the first coating height Η2 above the substrate s. Therefore, it is possible to avoid sticking the _ of the nozzle 22 to the substrate s. That is, the right nozzle 22 is directly discharged from the standby height to the first coating and H2 'the glue adhered to the discharge port of the nozzle 22 drops onto the substrate $135.1323' and thus the glue applied to the substrate S is subjected to the nozzle. 22 extrusion, making the glue hollow. However, if the nozzle 22 is inclined obliquely from the standby height H1 to the first coating height H2, the glue can be smoothly applied onto the substrate s without dropping onto the substrate S. Therefore, it is possible to prevent the width and the twist of the overlapping portion between the coating start position and the coating end position from becoming different from the rest of the entire rubber pattern. Then, when the nozzle 22 is moved from the coating start position Ld1 to the - - - height rising position Lhl, the nozzle 22 is maintained at the first coating height H2 which is lower than the second coating height H3. At this time, the application of the coating pressure to the glue in the nozzle 22 is started before the nozzle 22 reaches the rising position Lhl, and when the nozzle 22 reaches the second acceleration end position Lv2, the coating pressure reaches the preset pressure. When the nozzle 22 is moved from the coating start position Ld1 to the first acceleration end position Lv1, the coating speed is increased from the skirting speed to the first coating speed VI, and when the nozzle 22 reaches from the pattern starting position Ld2 At the second acceleration end position Lv2, the coating speed is increased from the first coating speed VI to the second coating speed V2. In this procedure, the width and height of the glue applied to the substrate S can be gradually increased from the coating start position Ldl until the glue reaches the pattern start position Ld2. The width and height of the glue applied between the coating start position Ld1 and the pattern start position Ld2 on the substrate S may be less than the glue to be applied to the second coating height H3. The shape of the glue applied between the coating start position Ld1 and the pattern start position Ld2 can be arbitrarily set by adjusting the coating height, the coating speed, and the coating force. Therefore, when the glue applied between the coating start position Ldi and the pattern start position Ld2 is overlapped and applied to the glue between the pattern end position and the coating end position Ld4 (see FIG. 5), the width and height of the overlap portion It can be the same as the rest of the entire pattern. If the first temperature rising position Lhl is too far ahead of the pattern starting position Ld2, the width and height of the glue applied between the first height rising position Lhl and the pattern starting position Ld2 may be greater than the coating height applied to the second coating height. H3 glue. Therefore, the first height rising position LM can be any position between the pattern start position Ld2 and the second acceleration end position Lv2. Fig. 5 shows a change in coating height, a change in coating speed, and a change in coating pressure with respect to the position of the nozzle 22 when the coating gel is terminated according to the coating gel method according to an embodiment of the present invention. As shown in Fig. 5, the nozzle 22 is maintained at the second coating height H3 until the nozzle 22 reaches the second height rising position Lh2. The second height rising position Lh2 may be equal to the pattern end position Ld3. Then, when the nozzle 22 is moved from the second height rising position Lh2 to the third height rising position B, the coating south degree is increased from the second coating height H3 to the third coating height H4' and then maintained at the third coating. Height H4. 1351323 Then 'when the nozzle 22 is moved from the third height to the coating end position Ld4, the coating height is increased from the third coating height to the fourth coating height H5, and then maintained at the fourth coating height ^Continuously, the coating height is increased from the fine coating height Hs to the standby height. When the coating height is changed as described above, the pneumatic supply unit is turned off at the first deceleration starting position Lv3 to lower the coating pressure. At the same time, the position at which the application force starts to decrease can be before or after the first start position W. Similarly, when the nozzle 22 reaches the first deceleration start position Lv3, the coating speed is lowered to the first coating speed V1. The first-deceleration start position W may precede the pattern end position Ld3. Then, when the nozzle 22 reaches the second deceleration start position lv4, the coating speed gradually decreases toward zero speed. The second deceleration start position ^ can be before the coating end position after passing through the pattern end position Ld3. The position at which the coating speed reaches zero speed may be any position after the end position Ld4 is applied by the coating, so that the nozzle 22 is moved to the standby height H1. A method in which a squeegee 22 is moved relative to the substrate S to coat the substrate on the substrate s, and the coating height, coating speed, and coating pressure are changed when the coating is terminated, will be described below. When the nozzle 22 is moved from the first-decrease start position Lv3 to the second deceleration start position Lv4, the coating speed is lowered from the first coating speed VI.

:速又、邊’自噴嘴22達到第一減速起始位置W ,降低塗佈壓力,使得自嘴嘴22排出之膠量逐漸地減 少0 於此時,當喷嘴22翻第二高度上升位4 Lh2時, -噴嘴22之塗佈高度自第二塗佈高度㈤增加至第三塗佈 高度H4 ’然後當噴嘴22達到第三高度上升位置Lh3 時,塗佈同度自第二塗佈高度H4增加至第四塗佈高度 H5。因此,喷嘴22自第二塗佈高度H3上升至第三塗 佈咼度H4,使得膠的寬度及高度逐漸地降低。之後, 喷嘴22自第三塗佈高度H4上升至第四塗佈高度H5, 因此膠的寬度及高度進一步降低,且最後停止自喷嘴22 供應膠。 藉由於圖案終止位置Ld3及塗佈終止位置Ld4間增 加喷嘴22的高度兩次’相較於增加喷嘴22高度一次的 案例’可輕易地且平順地停止自噴嘴22供應膠。若在 增加喷嘴22高度一次後就在剛通過塗佈終止位置Ld4 停止自噴嘴22的膠流動,自塗佈終止位置Ld4到膠流 動停止的位置所塗佈的膠可能加到整個膠圖案。 因此’可能發生使塗佈起始位置與塗佈終點位置之 重疊部份的寬度及尚度變得不同於整個膠圖案其餘部 份之失誤。然而,根據本發明當前之實施例,由於喷嘴 22的尚度增加兩次,因此在噴嘴22達到塗佈終止位置The speed and the side 'from the nozzle 22 reach the first deceleration starting position W, and the coating pressure is lowered, so that the amount of glue discharged from the nozzle 22 is gradually reduced by 0. At this time, when the nozzle 22 is turned to the second height, the position is raised. At Lh2, the coating height of the nozzle 22 is increased from the second coating height (five) to the third coating height H4' and then when the nozzle 22 reaches the third height rising position Lh3, the coating is equal to the second coating height H4. Increase to the fourth coating height H5. Therefore, the nozzle 22 is raised from the second coating height H3 to the third coating width H4, so that the width and height of the glue are gradually lowered. Thereafter, the nozzle 22 is raised from the third coating height H4 to the fourth coating height H5, so that the width and height of the glue are further lowered, and finally the supply of the glue from the nozzle 22 is stopped. The supply of glue from the nozzle 22 can be easily and smoothly stopped by increasing the height of the nozzle 22 between the pattern end position Ld3 and the coating end position Ld4 twice as compared with the case where the height of the nozzle 22 is increased once. If the glue flow from the nozzle 22 is stopped just after the height of the nozzle 22 is increased by the coating end position Ld4, the glue applied from the coating end position Ld4 to the position where the glue flow stops may be added to the entire glue pattern. Therefore, it may occur that the width and the degree of the overlap of the coating start position and the coating end position become different from the rest of the entire rubber pattern. However, according to the current embodiment of the present invention, since the degree of the nozzle 22 is increased twice, the nozzle 22 reaches the coating end position.

Ld4如,就停止自喷嘴22的膠流動,因而可避免此類 的失誤。 塗佈於圖案終止位置Ld3及塗佈終止位置Ld4間之 膠的形狀,可藉由調整塗佈高度、塗佈速度、以及塗佈 壓力而Jk思没定。因此,當塗佈於圖案終止位置[的及 塗佈終止位置Ld4間之膠重疊塗佈於塗佈起始位置Ldl 及圖案起始位置Ld2間之膠,重疊部份的寬度及高度可 相同於整__其餘雜。結果可使整轉圖案之寬 度及高度為一致的,包括開始塗佈膠之起始點重疊终止 塗佈膠之終點的重疊部份。 如上所述,根據本發明實施例,可藉由改變塗佈高 度、塗佈速度、以及塗健力,設定塗佈起始部份及塗 佈、,止部分之形狀為所需形狀。因此,當塗佈起始位置 重f塗佈終止位置時,重疊部份的寬度及高度等於整個 圖案的其餘部份。結果可使整娜圖案之寬度及高度為 致的’包括開始塗佈膠之起始點重疊終止塗佈膠之線 點的重疊部份。 '、 丄乃1323 一雖然本發明以參照特定示範性實施例說明與顯 不,然而熟此技術領域者應明瞭在不悖離本發明申請專 利範圍界定之精神與範訂可有各種修改及變化°。因 此,本發明意欲涵蓋所附申請專利範圍之範疇及其均等 物所提供之修改及變化。 〃 【圖式簡單說明】For example, Ld4 stops the flow of glue from the nozzle 22, thereby avoiding such errors. The shape of the glue applied between the pattern end position Ld3 and the application end position Ld4 can be determined by adjusting the coating height, the coating speed, and the coating pressure. Therefore, when the glue applied between the pattern end position and the coating end position Ld4 is overlapped and applied to the glue between the coating start position Ld1 and the pattern start position Ld2, the width and height of the overlapping portion may be the same as The whole __ remaining miscellaneous. As a result, the width and height of the entire pattern can be made uniform, including the overlap of the starting point of the beginning of the application of the glue to terminate the end of the coating glue. As described above, according to the embodiment of the present invention, the coating start portion, the coating portion, and the shape of the stopper portion can be set to a desired shape by changing the coating height, the coating speed, and the coating strength. Therefore, when the coating start position is the weight of the coating end position, the width and height of the overlapping portion are equal to the rest of the entire pattern. As a result, the width and height of the neat pattern can be made to include the overlap of the starting point of the beginning of the coating of the glue to terminate the overlap of the line of the coating glue. The present invention has been described with reference to the specific exemplary embodiments, and it should be understood that various modifications and changes can be made without departing from the spirit and scope of the invention. °. Accordingly, the invention is intended to cover the modifications and alternatives 〃 [Simple description]

包含所附圖式以提供本發明進一步的了解,並結合 且構成說明書之—部份’朗本㈣之示範實施例,並 與說明一起解釋本發明觀點。 圖1顯示塗佈於基板上之膠圖案範例; 圖2為應祕據本發明實關塗佈膠方法之點膠機 之透視圖; 圖3為圖2所示之頭單元之透視圖; 圖4顯不根據本發明實闕#根缝佈膠方法開始The accompanying drawings are included to provide a further understanding of the invention, 1 is a perspective view of a glue pattern applied to a substrate; FIG. 2 is a perspective view of a dispenser in accordance with the present invention; FIG. 3 is a perspective view of the head unit shown in FIG. 4 shows that according to the present invention, the root coating method starts.

塗佈膠時’崎於喷嘴位置之塗佈高度改變、塗佈速度 改變、以及塗佈壓力改變;以及 圖5顯tf根據本發明實施例當根據塗佈膠方法終止 塗佈膠時’相對於噴嘴位置之塗佈高度改變、塗佈速度 改變、以及塗佈壓力改變。 【主要元件符號說明】 1 膠圖案 10點膠機 19 1351323 11框架 12平台 13頭支撐單元 21頭單元 22喷嘴 23塗佈頭 24注射器 25馬達 26距離偵測器 - S 基板 ON 開 OFF關 HI、H2、H3 、H4、H5 高度 VI、V2 速度When the glue is applied, the coating height of the nozzle position is changed, the coating speed is changed, and the coating pressure is changed; and FIG. 5 shows that when the coating glue is terminated according to the coating method according to the embodiment of the present invention, The coating height of the nozzle position is changed, the coating speed is changed, and the coating pressure is changed. [Main component symbol description] 1 glue pattern 10 dispenser 19 1351323 11 frame 12 platform 13 head support unit 21 head unit 22 nozzle 23 coating head 24 syringe 25 motor 26 distance detector - S substrate ON open OFF HI, H2, H3, H4, H5 height VI, V2 speed

Ldl、Lvl、Ld2、Lhl、Lv2、Lv3、Ld3、Lh2、Lh3、 Lv4、Ld4 位置Ldl, Lvl, Ld2, Lhl, Lv2, Lv3, Ld3, Lh2, Lh3, Lv4, Ld4 positions

2020

Claims (1)

1351323 十、申請專利範圍: h :種_-點膠機塗佈膠於—基板 ,由相對於該基板上升或下降一喷嘴來改變= 22?高度且藉塗佈壓力而釋出膠時,以塗佈起始 =料佈終齡置之方式,塗佈膠 该方法包含: 双工 將該喷嘴自-待命高度下降至—第— ίΠΓ到一塗佈起始位置,然後維持該喷嘴: 署'、塗佈南度直到該喷嘴達到―第—高度上升位 置,以及 =嘴嘴翻該第—高度上雜置時,將該喷嘴 高度上升至—第二塗佈高度,然:後維持 該噴鳴於該第二塗佈高度。 2.如請求項1所述之方法,更包含: 當該噴嘴自該塗佈起始位置移動至一圖案起始位 速=:Γ=位置時,自一零速度增加塗佈 疋反主弟一塗佈速度;以及 速線達到通過該圖案起始位置後之一第二加 一'置”雜佈速度自該第-塗佈速度增加至 ώ塗佈速度,然後將該塗佈速度維持在該第二塗 佈迷度。 3.如請求項2所述之方法’其中該第—高度上升位置介 21 1351323 於該圖案起始位置及該第二加速終止位置之間。 4. 如請求項2所述之方法,其中自該零速度増加該塗佈 速度包含以下列方式增加該塗佈速度:該噴嘴沿塗佈 膠之方向逐漸地自該待命高度傾斜地下降至該塗佈起 始位置。 5. 如請求項2所述之方法,更包含在該噴嘴達到該第一 π度上升位置前,施加該塗佈壓力以於該噴嘴達到該 第二加速終止位置之時或之前達到預定壓力然 持該預定壓力。 6.如請求項1至5之任一項所述之方法,更包含: 當該喷嘴物-㈣終止位置時或當該 到通過該圖案終止位置後之一第二高度上升 時,維持該喷嘴於該第二塗佈高度; 當該噴嘴達到該第二高度上升位置時,自一 塗佈南度增加該塗佈高度至一第三塗佈高度 持該喷嘴於該第三塗佈高度直到該喷嘴達到 高度上升位置;以及 逆』弟二 當該喷嘴達到該第三高度上升位置時,自一 塗佈高度增加該塗佈高度至一第四塗佈高度, 終止位置 ?該喷?於該第四塗佈高度直到該喷嘴達到-塗佈 22 丄 7·如請求項6所述之方法,更包含: 始位喷嘴達到該圖案終止位置前之一第一減逮起 务時降低該塗佈速度,直職塗佈速度達到該 乐一塗佈速度;以及 田該喷嘴達到通過該圖案終止位置後之一第 吉位置時’自該第一塗佈速度降低該塗佈速度, 該塗嘴達到該塗佈終止位置時或當該噴嘴通過 位置後,該塗佈速度達到一零速度 8 之:法’更包含當該喷嘴達到該第- 趄始位置時,降低該塗佈壓力。 9· 一種利用 科从卜娜之方法’該_機藉由相對 該噴嘴相對於該基板水平移動時改變塗 :终=:壓力而釋出膠時,以塗佈起始位置ί= 之方式塗佈膠於基板上,該方法包含: 位置圖案終止位置或自通過該圖案終止 二第二高度上升位置時,維持該 嘴自該第二高度上升位置移動至—第三高 =升位置時,將該噴嘴自該第二塗佈高度上升至一 弟三塗佈高度’然後維持該喷嘴於該第三塗佈高度y 23 以及 該対達_第三高度上升位置時,自 噴;=加塗佈高度至-第四塗佈高度,並維持該 罢该弟四塗佈高度直_喷嘴達到-塗佈终止位1351323 X. Patent application scope: h: kind of glue dispenser coating glue on the substrate, by changing or lowering the nozzle with respect to the substrate to change the height of the nozzle and releasing the glue by the coating pressure, Coating start = the way the cloth is placed at the end of the process, the method of applying the glue comprises: duplexing the nozzle from the standby-to-stand height to - the first to the beginning of the coating, and then maintaining the nozzle: Applying the south degree until the nozzle reaches the "first-height height rising position", and when the nozzle mouth is turned over at the first-height level, the nozzle height is raised to - the second coating height, and then: the nozzle is maintained At the second coating height. 2. The method of claim 1, further comprising: when the nozzle moves from the coating start position to a pattern start bit speed =: Γ = position, increasing the coating speed from a zero speed a coating speed; and a speed of the second plus one 'set' of the cloth after the speed line reaches the starting position of the pattern is increased from the first coating speed to the coating speed, and then the coating speed is maintained at The method of claim 2, wherein the first height-increasing position is 21 1351323 between the pattern start position and the second acceleration end position. The method of 2, wherein the applying the coating speed from the zero speed comprises increasing the coating speed in such a manner that the nozzle gradually slopes from the standby height to the coating start position in the direction of the coating glue. 5. The method of claim 2, further comprising applying the coating pressure to reach a predetermined pressure at or before the nozzle reaches the second acceleration end position before the nozzle reaches the first π degree rising position. Hold the predetermined pressure. 6. If please The method of any one of clauses 1 to 5, further comprising: maintaining the nozzle in the second when the nozzle object - (4) terminates the position or when the second height rises after the end of the pattern end position a coating height; when the nozzle reaches the second height rising position, increasing the coating height from a coating south degree to a third coating height, holding the nozzle at the third coating height until the nozzle reaches a height rise Positioning; and inversely, when the nozzle reaches the third height rising position, increasing the coating height from a coating height to a fourth coating height, the ending position, the spraying at the fourth coating height Until the nozzle reaches-coating 22 丄7. The method of claim 6, further comprising: reducing the coating speed by one of the first stop before the start position of the pattern reaches the end position of the pattern, The cloth speed reaches the Le-coating speed; and when the nozzle reaches a one-thick position after passing the pattern end position, the coating speed is decreased from the first coating speed, and the coating nozzle reaches the coating end position. Time or After the nozzle passes the position, the coating speed reaches a zero speed of 8: the method further includes reducing the coating pressure when the nozzle reaches the first-initial position. 9. A method of utilizing the branch from Bu Na When the glue is released by changing the coating: final =: pressure when the nozzle is horizontally moved relative to the substrate, the glue is applied to the substrate in a coating starting position ί=, the method comprising: When the pattern is terminated or when the second height-increasing position is terminated by the pattern, the nozzle is raised from the second height-increasing position to the third height-up position, and the nozzle is raised from the second coating height to a third coating height 'and then maintaining the nozzle at the third coating height y 23 and the 対 _ third height rising position, self-spraying; = applying a coating height to - a fourth coating height, and maintaining the Stop the brother four coating height straight _ nozzle reach - coating stop bit ΐα如請^ 9所述之方法,更包含: 止位嘴達到該圖案終止位置前之一第一減速起 、,降低該塗佈速度直到該塗佈位置達到一箆 一塗佈速度;以及 J弟 1該噴嘴達到通過該随終止位置後之—第二加 〜:位置時’自該第—塗佈速度降低該塗佈速度, ::了,達到該塗佈終止位置時或當該噴嘴通過該塗 〜止位置後,該塗佈速度降低達一零速度。Ϊ́α, as described in the above, further comprising: the first deceleration of the stop nozzle before reaching the end position of the pattern, lowering the coating speed until the coating position reaches a coating speed; and J When the nozzle reaches the second plus-: position after the end position, the coating speed is decreased from the first coating speed, :: when the coating end position is reached or when the nozzle passes After the coating is stopped, the coating speed is reduced to a zero speed. 項10所述之方法’更包含當該噴嘴達到該第一 減速起始位置時,降低該塗佈壓力。 24The method of item 10 further includes reducing the coating pressure when the nozzle reaches the first deceleration start position. twenty four
TW097126075A 2007-12-20 2008-07-10 Method of dispensing paste using paste dispenser TWI351323B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070134490A KR100960969B1 (en) 2007-12-20 2007-12-20 Method of dispensing paste in paste dispenser

Publications (2)

Publication Number Publication Date
TW200927305A TW200927305A (en) 2009-07-01
TWI351323B true TWI351323B (en) 2011-11-01

Family

ID=40178587

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097126075A TWI351323B (en) 2007-12-20 2008-07-10 Method of dispensing paste using paste dispenser

Country Status (4)

Country Link
JP (1) JP2009148744A (en)
KR (1) KR100960969B1 (en)
CN (1) CN101318173B (en)
TW (1) TWI351323B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5166468B2 (en) * 2010-03-23 2013-03-21 株式会社東芝 Paste coating apparatus and paste coating method
DE102010013909A1 (en) * 2010-04-01 2011-10-06 Lp Vermarktungs Gmbh & Co. Kg Apparatus and method for spraying a surface of a substrate
JP5628123B2 (en) 2011-09-21 2014-11-19 株式会社日立製作所 Paste coating apparatus and paste coating method
CN104252067A (en) * 2014-09-16 2014-12-31 京东方科技集团股份有限公司 Coating device and coating method of seal agent
JP6472261B2 (en) * 2015-02-13 2019-02-20 株式会社ミマキエンジニアリング Printing apparatus and printing method
JP6566516B2 (en) * 2015-07-28 2019-08-28 ダイハツ工業株式会社 Sealer application method
CN106564315B (en) * 2016-10-21 2018-11-09 纳晶科技股份有限公司 Coating method, coating apparatus and luminescent device
CN112962912B (en) * 2021-02-01 2022-02-18 安徽同心林塑胶科技有限公司 Co-extrusion WPC foamed floor and preparation process thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000200795A (en) * 1999-01-05 2000-07-18 Matsushita Electric Ind Co Ltd Resin sealing method
JP2001129469A (en) * 1999-10-29 2001-05-15 Shibaura Mechatronics Corp Paste coating method
JP3815171B2 (en) * 2000-02-29 2006-08-30 松下電器産業株式会社 Paste application method
JP3607260B2 (en) * 2002-05-20 2005-01-05 貞雄 中田 Dripping coating equipment
JP4218376B2 (en) * 2003-03-12 2009-02-04 東レ株式会社 Coating method and manufacturing method of display member
JP2005218971A (en) * 2004-02-06 2005-08-18 Hitachi Industries Co Ltd Paste applicator and application method
JP2005329305A (en) * 2004-05-19 2005-12-02 Mitsubishi Chemicals Corp Sheet type coating method, sheet type coating apparatus, coated substrate and method of manufacturing sheet type coated member

Also Published As

Publication number Publication date
KR20090066792A (en) 2009-06-24
CN101318173B (en) 2012-10-10
CN101318173A (en) 2008-12-10
JP2009148744A (en) 2009-07-09
TW200927305A (en) 2009-07-01
KR100960969B1 (en) 2010-06-03

Similar Documents

Publication Publication Date Title
TWI351323B (en) Method of dispensing paste using paste dispenser
JP2798503B2 (en) Liquid coating method and coating device
JP5784903B2 (en) Method for manufacturing plate-like bonded body and apparatus for bonding plate-shaped body
TWI735539B (en) Coating device and coating method
TW200932378A (en) Method of dispensing paste using paste dispenser and pneumatic supply apparatus used therefor
TWI617361B (en) Method for dispensing paste and substrate having paste pattern formed thereon by the method
CN104368506B (en) Utilize the coating layer forming method and apparatus for coating of gap nozzle
JP2015091569A (en) Coating apparatus
JP6318317B2 (en) Curved substrate holding tray
CN107921461B (en) To the applying device and coating method of curved surface substrate coating liquid coating
JP2006122891A (en) Coating device
WO2015037121A1 (en) Attaching device
JP4409969B2 (en) Coating equipment
JP2003001171A (en) Coating device
KR101089748B1 (en) Method for controlling despenser appratus
JP4450483B2 (en) Adhesive dispenser
WO2013121814A1 (en) Coating device
JP6960111B2 (en) Coating equipment
JP2005034706A (en) Coating apparatus and method for filling coating liquid
KR20230148761A (en) Coating apparatus and coating method
JP2015112519A (en) Coating apparatus
JP2008018361A (en) Viscous fluid coater, viscous fluid coating method, and lamination substrates
TW200817762A (en) Liquid crystal dispensing apparatus and method for dispensing liquid crystal on substrate thereof
TW200938307A (en) Method of coating a substrate