JP2000200795A - Resin sealing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To offer a resin sealing method which automatically prevents application to any circuit board having any missing or greatly dislocated electronic components, and enables restart of stable continuous operation even after applying operation is immediately stopped owing to emergency stop, occurrence of a trouble, etc. SOLUTION: The corrective action in case of occurrence of an error during recognition can be selected as production requirements from among immediate stop, skip to the next electronic component, and skip to an electronic component on the next module. It is enabled to apply only to normally recognized electronic components, enhancing continuous productivity in mass production. When operation is stopped while an electronic component is being sealed owing to emergency stop or occurrence of an error, the location of the electronic component which was being sealed and the number of applications are stored in the memory in the device, and an application-disabling flag is set. The incompletely sealed electronic component can be skipped when operation is restarted so as to enhance productivity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for mounting an electronic component such as a semiconductor bare chip on a circuit board in which a predetermined amount of a sealant is applied between the electronic component and the circuit board in a plurality of times. The present invention relates to a resin sealing method.

[0002]

2. Description of the Related Art In recent years, in order to reduce the size of electronic equipment, high-density mounting of electronic circuits has been promoted. For this reason, flips in which a semiconductor bare chip obtained by dividing a wafer into individual pieces are turned over and mounted directly on a circuit board are used. Chip mounting methods are frequently used. After the semiconductor bare chip manufactured by this mounting method is electrically connected to the circuit board by bumps formed on the electrode pads, a sealing agent is poured between the electronic component and the circuit board, and the electronic component and the circuit are mounted. The space between the substrate and the substrate is sealed and fixed.

A conventional process of sealing an electronic component and a circuit board will be described with reference to FIG. FIG. 5A shows the configuration of the circuit board. The circuit board 1 has four modules, and three ICs are mounted on each of the four modules. Next, FIG.
The sealing operation will be described with reference to FIG. First, all the ICs on the circuit board 1 are recognized, and the application start and end points of the sealant are determined. The first application is performed on the IC based on the determined result. Next, after a lapse of time during which the sealant penetrates for overcoating, application is performed based on the number of overcoatings set for each IC. The sealing process is completed when the specified number of coatings for all the ICs have been completed.

In this sealing step, when the apparatus is stopped due to an error or an emergency stop, an electronic component at the time of resuming production is designated, and the sealing operation is performed intermittently from the electronic component. Become.

[0005]

As described above, if the apparatus is stopped due to an instantaneous stop, an emergency stop, an error, or the like during the application of the specified number of times as described above, the first application is performed during the production. Although it is possible to specify the production start position by checking the board, it is difficult to judge how far the board has been applied even when looking at the board during production in the case of multi-coating, so the manual Recovery operation becomes difficult.
In addition, even if the program that is currently being produced is displayed on the device to the extent that it has been executed, if the operator cannot grasp all the programs that are being produced, careless mistakes will occur due to input or misunderstanding when specifying when resuming production, There is a problem that it causes a defect and that the burden on the worker is increased and the productivity is not improved. In addition, when interruption occurs in a plurality of electronic components during application, there is a problem that the conventional specification at the start of execution cannot cope since only the electronic components at the start of production can be specified.

Further, when an IC is not mounted on a circuit board due to a defect caused by a flip chip process,
There is also a defect due to chipping. In addition, when performing continuous production for mass production, there is a problem that productivity is not improved if production is stopped every time a recognition error occurs. Accordingly, the present invention provides a resin sealing method that enables continuous operation by a simple operation in a resin sealing step that requires recoating, and that enables continuous production without interruption by automatic skipping when a recognition error occurs. It is intended to provide.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a method for controlling all electronic components based on production data such as the position of the electronic components, the number of times of applying the sealant, and the application speed. Recognize and store the application start position and application end position information if the recognition is normal, and perform the application operation of the sealant based on the application information table storing the application execution impossible information if the recognition error occurs. A resin sealing method characterized by automatically skipping a generated electronic component and performing resin sealing of the next electronic component.

According to the present invention, if an error occurs during recognition as a production condition, it is determined whether to stop immediately or not.
If it does not stop, skip to the next electronic component or
It is possible to specify whether to skip to the electronic component of the next module. Thus, during mass production, abnormal electronic components are skipped to the next from the result at the time of recognition, and only the electronic components with normal recognition can be applied, so that continuous productivity can be improved.

If an error occurs during the operation of applying the sealant, the application execution information is set in the corresponding application information table, and at the same time, the number of applications at the time of the error and the electronic component to be applied next are set. A resin sealing method is characterized in that a coating information table number is stored, and when the coating operation is restarted, coating is performed from the number of times of coating in the stored coating information table.

[0010] According to the present invention, it is possible to skip the electronic parts that were in the process of being sealed at the time of resuming the coating operation and continue the production, thereby improving the productivity and preventing the production of defective products due to incorrect designation. Can be. Moreover, even when interruption occurs in a plurality of electronic components during application, the plurality of electronic components can be skipped, so that only electronic components that can be applied can be produced.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a sealant is repeatedly formed between each electronic component and the circuit board a plurality of times while relatively moving the circuit board on which the electronic component is mounted. A resin encapsulation method in which all electronic components are recognized based on production data such as the position of the electronic component registered in advance, the number of times the sealing agent has been applied, and the application speed. Stores the dispensing start position and dispensing end position information,
In the case of a recognition error, the application operation of the sealant is performed based on the application information table storing the dispensable information, and the electronic component in which the recognition error has occurred is automatically skipped and the next electronic component is resin-sealed. It is possible to automatically prevent application of a sealant to a circuit board on which an electronic component is not mounted or a large displacement is a defective module, This has the effect that continuous production can be realized without stopping errors due to recognition errors during mass production.

According to a second aspect of the present invention, if an error occurs during the operation of applying the sealant, the application execution information is set in a corresponding application information table, and at the same time, the number of application times when the error occurs and the next The application information table number of the electronic component to be applied is saved in the application information table. When the application operation is restarted, the application is performed based on the number of applications in the saved application information table. This is a resin sealing method characterized by performing resin sealing of parts.If an emergency stop or error stop occurs while applying a sealant between the electronic component and the circuit board, By skipping the stopped electronic component and applying the next electronic component, due to a human error in data setting at the time of restarting production, it is not possible to further apply to the already sealed components or to apply the required number of applications. There is no occurrence of defects during production of child components occurs, has the effect of allowing stable and continuous production.

Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. FIG. 1 is a perspective view showing a resin sealing device applied to one embodiment for realizing claims 1 and 2 of the present invention. Next, this resin sealing device will be briefly described. A circuit board 1 to which electronic parts such as semiconductor bare chips are electrically connected by bumps is housed in a circuit board carrying magazine 2 provided on the right side of the resin sealing device. The circuit boards 1 are taken out one by one from the bottom of the magazine by the circuit board pull-out mechanism 3. The taken out circuit board is carried into the coating stage 4, and its position is defined by vacuum suction and a setting claw (not shown). After the positioning of the circuit board, the head axis (X) 5
Then, the stage axis (Y) 6 is operated, the electronic components on the circuit board are recognized by the recognition camera 7, and the application start position and the application end position are calculated. Next, the upper side of each electronic component is calculated from the application start position to the application end position, which is calculated based on a preset number of application times for each electronic component, by CP control, and the gap between the electronic component and the circuit board is sealed with a sealant. Stop. When a resin is applied to an electronic component for sealing a plurality of times, the sealing agent waits until the next application starts after the end of the first application. The permeation waiting time is registered in the apparatus before the start of production. After the application of all the electronic components is completed, the substrate on the application stage 4 is unloaded and heated for a predetermined time in the fillet forming furnace 8, and the left magazine 9
To be stored. The television monitor 10 has a recognition camera 7
Is projected. The tool cleaning unit 11 is used to remove the sealant accumulated at the tip of the dispense head 12 and to stably discharge the sealant after waiting for penetration.

Next, control during coating in the mass production mode of the present invention will be described. FIG. 2 is an explanatory diagram showing control at the time of coating. Here, solid lines in the circuit board 1 indicate mounted electronic components, and broken lines indicate non-mounted electronic components. The position of the electronic component to be applied, the number of applications,
Information such as the coating speed and the discharge pressure is registered in the apparatus as production data 13 in advance. The production data 13 is based on the assumption that all electronic components on the circuit board 1 are normally mounted. First, inside the apparatus, a coating information table 14 including a coating start position and a coating end position of all electronic components on the circuit board 1 is created from the registered data 13. Next, the electronic component is recognized, and if the recognition is normal,
The application start position and the application end position are calculated and stored in the application information table 14. A dispensing impossible flag is set in the dispensing information table 14 of the electronic component in which the recognition error has occurred,
The recognition camera 7 is moved to the next electronic component or the next module electronic component. This is executed for all the electronic components on the circuit board 1 to complete the application information table 14. In the example of FIG. 2, since only the IC 2 of the module 3 has a recognition error, the IC 2 of the module 3 in the application information table 14 is not recognized.
Is set to the application impossible mode. The subsequent application operation is performed based on the created application information table 14.

Next, a description will be given of a control in the case where the power is stopped due to an emergency stop or an instantaneous stop during application, or the stop is caused by an error during operation of the apparatus. FIG. 3 is an explanatory diagram showing a continuation process after the application operation is interrupted. The solid line on the upper side of each IC indicates the number of times of application. The operation during application is divided into small operation units as shown in FIG. During this divided operation, stop during the operation from the end of coating until the start of the next coating (including raising and lowering the dispense head)
If so, the continuous production is executed from the electronic component to be applied. However, if the application is stopped during the application, it is highly likely that voids will be generated between the already poured sealant and the newly poured sealant if the electronic component is applied again. May be defective even if re-applied. If an error occurs during application and the application is stopped, information indicating that application cannot be performed is set in the application information table 14 created from the recognition result, and at the same time, the current number of applications and the application information table number of the electronic component to be applied next. Is stored inside the device. During the continuous operation, the production is restarted from the number of times of application of the stored application information table number. Further, even in the case of a stop due to an error or the like during application of another electronic component, by performing the same processing, it is possible to skip the electronic component in the middle of application and perform application. In FIG. 3, IC 2 of module 2 and module 4
3 shows a case where the operation is stopped during application by IC1. The information in the application information table 14 is retained until all the electronic components on the circuit board 1 have been applied the specified number of times.
The dispensing cannot be performed again for the electronic component that cannot be dispensed again, and the information that dispensing cannot be performed is cleared because the recognition of the next electronic component on the circuit board is a normal result. Is obtained.

When the sealing of all the electronic components on the circuit board 1 is completed, information as to which electronic component was skipped by what number of coatings is accumulated as production management information, and the information is printed and printed. As compared with the circuit board 1 described above, it is possible to check the electronic components skipped on the way.

[0017]

As described above, according to the present invention, when an error occurs during the recognition as a production condition, it is determined whether or not to stop on the spot, or if not, skip to the next electronic component, or By specifying whether to skip to the electronic parts of the module, abnormal electronic parts can be skipped to the next from the result of recognition, and only the recognized electronic parts can be applied, so that continuous productivity can be improved. .

If the production is interrupted due to an emergency stop or an error stop during the sealing of the electronic component, the position of the electronic component being sealed and the number of times the coating has been performed are stored in a memory inside the apparatus. By memorizing, it is possible to skip the electronic parts that were in the middle of encapsulation, which is likely to be defective at the time of restart, and continue production, improving productivity and preventing defective products due to incorrect designation. Can be.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a resin sealing device according to an embodiment to which a recovery method of the present invention is applied.

FIG. 2 is an explanatory diagram showing control at the time of preparing preparation information before starting application.

FIG. 3 is an explanatory diagram showing a continuation process after the application operation is interrupted.

FIG. 4 is an explanatory diagram showing division of an operation during coating.

FIG. 5A is an explanatory diagram of a conventional sealing operation, and FIG. 5B is a flowchart showing processing of the sealing operation.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 2, 9 Conveying magazine 3 Circuit board draw-out mechanism 4 Coating stage 5 Head axis (X) 6 Stage axis (Y) 7 Recognition camera 8 Fillet forming furnace 10 Television monitor 11 Tool cleaning unit 12 Dispense head 13 Production data 14 Dispensing information table

Claims (2)

[Claims] 1. A resin sealing method for an electronic component, comprising: applying a sealant between each electronic component and the circuit board a plurality of times while relatively moving a circuit board on which the electronic component is mounted.
Based on production data such as the position of the electronic component registered in advance, the number of application of the sealant, and the application speed, all the electronic components are recognized, and if the recognition is normal, the application start position and the application end position information are stored, In the case of a recognition error, the application operation of the sealant is performed based on the application information table storing the dispensable information, and the electronic component in which the recognition error has occurred is automatically skipped and the next electronic component is resin-sealed. A resin sealing method. 2. When an error occurs during the operation of applying the sealant, the application execution information is set in a corresponding application information table, and at the same time, the number of applications at the time of the error and the electronic component to be applied next are set. The dispensing information table number is saved, and when the dispensing operation is resumed, dispensing is performed based on the number of dispensing operations in the saved dispensing information table, and the electronic component in which an error has occurred during the dispensing operation is skipped and resin sealing of the next electronic component is performed. The resin sealing method according to claim 1, wherein: