KR20230148761A - Coating apparatus and coating method - Google Patents

Abstract

[Problem] To provide a coating device and a coating method that can realize a thinner coating film formed on a substrate and achieve uniformity in the film thickness of the coating film.
[Solution means] A table for mounting a substrate, a rotation driver for rotating the table, a nozzle for supplying a coating liquid from above the substrate that rotates with the table, and a control section for controlling the rotation speed of the table, the control section comprising: , From the first rotation speed of the table at the start of supply of the coating liquid to the substrate, the rotational acceleration is set to 30 to 230 rpm/sec during or after supply of the coating liquid, and the rotation drive unit is controlled so that the table reaches the second rotation speed. do.

Description

Applicator and application method {COATING APPARATUS AND COATING METHOD}

The present invention relates to an application device and an application method.

When forming a coating film on a substrate, a coating device that rotates the substrate while supplying the coating liquid to the substrate and spreads the coating liquid on the substrate is known. The coating liquid may have a high viscosity depending on the type, such as an adhesive, and it may be difficult to spread the coating liquid uniformly over the entire substrate surface on a rotating substrate. As a result, the thickness of the coating film does not become uniform on the substrate, and concentric irregularities (irregularities) occur in the thickness of the coating film. When a thinning treatment is performed by polishing the substrate in the subsequent process, concentric circular irregularities may be transferred to the substrate, leaving concentric circular marks, so-called dispense marks, on the substrate. These dispensing marks become a factor that deteriorates the flatness (Total Thickness Variation: TTV) of the substrate. Conventionally, when supplying a coating liquid to a substrate, a coating device that aims to equalize the thickness of the coating film by adjusting the rotational acceleration of the substrate has been proposed (for example, patent document 1).

Japanese Patent Laid-Open No. 2000-150357

In Patent Document 1, in order to increase the film thickness of the color resist and achieve uniformity, when supplying the coating liquid, the rotational acceleration of the substrate is set to low at the start of rotation and set to high acceleration after a predetermined period of time. On the other hand, due to recent demands for lower profile of electronic devices, thinning is required even when forming a coating film using a coating liquid with high viscosity such as the above-described adhesive. Even if a film is formed by a method as shown in Patent Document 1 using such a highly viscous coating liquid, it is difficult to realize thinning. That is, even when a coating liquid with high viscosity is used, it is required to realize a thinner coating film and to achieve uniform film thickness.

The purpose of the present invention is to provide a coating device and a coating method that can realize thinning of the coating film formed on a substrate and uniformity of the film thickness of the coating film.

A coating device related to an aspect of the present invention includes a table for mounting a substrate, a rotation drive unit for rotating the table, a nozzle for supplying a coating liquid from above the substrate that rotates together with the table, and a control unit for controlling the rotation speed of the table. Provided, the control unit sets the rotational acceleration to 30 to 230 rpm/sec during or after supply of the coating liquid from the first rotation speed of the table at the start of supply of the coating liquid to the substrate, so that the table rotates the second time. Control the rotation drive unit so that the number of

The coating method related to an aspect of the present invention includes supplying a coating liquid to a rotating substrate while rotating a table on which a substrate is mounted at a first rotation speed, and supplying the coating liquid to the table at a first rotation speed after or during supply. It includes setting the second rotation speed to a rotational acceleration of 30 to 230 rpm/sec.

According to the coating device and coating method of the above-mentioned aspect, the rotation speed of the substrate changes from the first rotation speed to the second rotation speed with a rotation acceleration of 30 to 230 rpm/sec during or after supply of the coating liquid, so that the substrate is supplied. Even when the viscosity of the applied coating liquid is high, the coating liquid spreads appropriately on the substrate, thereby realizing thinning of the coating film and uniformity of the film thickness of the coating film.

1 is a perspective view showing an example of an application device according to an embodiment.
Figure 2 is a flow chart showing an example of an application method according to the embodiment.
Figure 3 is a flow chart explaining in detail a part of the application method according to the embodiment.
Figure 4 is a table showing the rotation speed and rotational acceleration of the table when the application method according to Example 1 is applied.
Figure 5 is a table showing the rotation speed and rotational acceleration of the table when the application method according to Comparative Example 1 is applied.
Figure 6 is a table showing the rotation speed and rotational acceleration of the table when the application method according to Example 2 is applied.
Figure 7 is a graph showing an example of the thickness distribution of the substrate according to Example 2.
Figure 8 is a table showing the rotation speed and rotational acceleration of the table when the coating method related to Comparative Example 2 is applied.
Figure 9 is a graph showing an example of the thickness distribution of the substrate related to Comparative Example 2.
Figure 10 is a graph comparing the change in rotation speed over time between the Example and the Comparative Example.

Hereinafter, embodiments will be described with reference to the drawings, but the present invention is not limited to the content described below. In the drawings, in order to make each configuration easier to understand, some parts are emphasized or some parts are simplified, and the actual structure, shape, scale, etc. may be different. In the drawing, the direction in the drawing is explained using the XYZ coordinate system. The horizontal plane is the XY plane. One direction in the horizontal plane is indicated as the X direction. The direction perpendicular to the X direction in the horizontal plane is indicated as the Y direction. The direction perpendicular to the X and Y directions is indicated as the Z direction. In addition, in each of the X, Y, and Z directions, the direction indicated by the arrow in the drawing is the + direction, and the direction opposite to the direction indicated by the arrow is the - direction.

[Applicator]

The application device 100 according to the embodiment will be described. 1 is a perspective view showing an example of the coating device 100 according to the embodiment. The coating device 100 applies, for example, a coating liquid for forming a separation layer that deteriorates by absorption of light or heating on a substrate W, such as glass or a semiconductor wafer, which serves as a support, or, It is used when applying a coating liquid for forming an adhesive layer on a separation layer, when applying a coating liquid for molding an electronic component placed on an adhesive layer or on a separation layer, etc. In the present embodiment, the substrate W is a circular substrate in plan view, but may be a rectangular square substrate.

The coating device 100 is provided with a table 10, a nozzle drive unit 20, a nozzle 30, a coating liquid supply unit 40, and a control unit 50. The table 10 is provided with a shaft portion 11. The shaft portion 11 is provided to extend downward (-Z direction) from the center of the lower surface of the table 10. The shaft portion 11 is rotatably supported around the axis of the central axis AX1 by a box (base portion), not shown. The table 10 can rotate around the central axis AX1 together with the shaft portion 11. The shaft portion 11 is connected to the rotation drive portion 12. The rotation drive unit 12 rotates the table 10 via the shaft unit 11. The rotation drive unit 12 rotates the table 10 toward the rotation direction P at a predetermined number of rotations around the axis of the central axis AX1. As the rotation drive unit 12, for example, an electric motor or the like is used.

The table 10 has a substrate W mounted on its upper surface. The table 10 is, for example, circular in plan view, and the diameter of the upper surface is set to be slightly larger than the diameter of the substrate W. That is, when the substrate W is mounted on the upper surface of the table 10 with the center of the substrate W aligned with the central axis AX1 of the table 10, the outer edge E of the substrate W is , It is set to be inside the outer periphery of the upper surface of the table 10.

The table 10 is provided with a suction portion (not shown) in the range where the substrate W is mounted, for example. The suction portion is formed on the upper surface of the table 10 by, for example, a combination of a plurality of radial grooves and a plurality of annular grooves, and some of these grooves are connected to a suction pump. After the substrate W is mounted on the table 10, the vacuum pump of the adsorption unit is driven to hold the substrate W on the upper surface of the table 10 by the adsorption unit. Additionally, the shape of the adsorption portion is arbitrary, and any shape capable of holding the substrate W on the upper surface of the table 10 can be applied.

The table 10 is accommodated in, for example, a receiving portion (not shown). The receiving portion is, for example, shaped like a cup surrounding the table 10. Materials of the receiving portion include metal and resin. However, since the coating liquid L may adhere when applying the coating liquid L to the substrate W, it has resistance to the components of the coating liquid L. Materials that are available are preferred. The receiving portion cup is provided with an insertion hole at the bottom through which the shaft portion 11 is inserted.

The nozzle driver 20 can rock the nozzle 30 along the XY plane parallel to the upper surface of the substrate W in the rocking direction S, which is around the axis of the rocking axis AX2. Additionally, the nozzle driving unit 20 can raise and lower the nozzle 30 in the vertical direction (H). The nozzle drive unit 20 includes a rotating shaft 21, an arm 22, and a oscillating/elevating drive unit 23. The rotation shaft 21 is supported on a support member (not shown). The rotation shaft 21 is rotatable around the axis of the oscillating shaft AX2 and is supported so as to be raised and lowered along the vertical direction H. The rotation shaft 21 rotates and goes up and down by the swing/elevation drive unit 23.

The arm 22 connects the nozzle 30 and the rotation shaft 21. The arm 22 is a rod-shaped body extending in the horizontal direction from the side surface of the rotation axis 21, and rotates (oscillates) around the axis of the rotation axis AX2 integrally with the rotation axis 21. One end of the arm 22 is fixed to the side of the rotating shaft 21, and the other end supports the nozzle 30. Accordingly, the arm 22 is rocked by the rotation of the rotation shaft 21, so that the nozzle 30 fixed at the other end can be rocked in the swing direction S. For example, when loading and unloading the substrate W into and out of the table 10, the nozzle 30 can be retracted to a position away from the upper side of the table 10. On the other hand, when applying the coating liquid L to the surface of the substrate W, the nozzle 30 can be placed again above the table 10.

The length of the arm 22 is set so that the point directly below the nozzle 30 coincides with the central axis AX1 of the table 10, for example. The arm 22 may be provided with a structure capable of adjusting the length from the rotation axis 21 to the nozzle 30 or the position of the nozzle 30 in the longitudinal direction. Additionally, the arm 22 can adjust the height of the nozzle 30 by moving up and down in the vertical direction (H) integrally with the rotation shaft 21. That is, the distance between the nozzle 30 and the upper surface of the substrate W can be adjusted by the rotation shaft 21 and the arm 22 moving up and down.

The oscillating/elevating drive unit 23 rotates the rotating shaft 21 and also raises and lowers the rotating shaft 21. The rocking/elevating drive unit 23 may be separately provided with a drive source for rotating the rotary shaft 21 and a drive source for raising and lowering the rotary shaft 21, and one drive source may be used to rotate the rotary shaft 21 and the rotary shaft ( 21) may be lifted up and down. As a drive source for rotating the rotation shaft 21, an electric motor or the like is used, for example. As a drive source for raising and lowering the rotating shaft 21, an electric motor, a cylinder device, etc. are used, for example.

Additionally, the nozzle drive unit 20 described above is an example and is not limited to this form. The nozzle driving unit 20 can use any driving system that moves the nozzle 30 in the X direction, Y direction, Z direction, and a combination of these directions. For example, the nozzle drive unit 20 may be a robot arm (multi-joint arm) holding the nozzle 30 at the tip, and may be formed by combining an may be used.

The nozzle 30 is mounted on the end of the arm 22 and is arranged above the substrate W so that its immediate bottom coincides with the central axis AX1 of the table 10 . As a result, the nozzle 30 can supply the coating liquid L to the center O of the substrate W. The nozzle 30 has a discharge port 31 and a supply pipe 32. The discharge port 31 is provided at the lower end of the nozzle 30 facing downward so as to face the surface of the substrate W, and supplies the coating liquid L. As the nozzle 30, known nozzles can be used, for example, hydraulic nozzles, dual fluid nozzles, spray nozzles, etc.

One end of the supply pipe 32 is connected to the nozzle 30 and sends the coating liquid L to the nozzle 30. The other end of the supply pipe 32 is connected to the coating liquid supply unit 40. As the supply pipe 32, for example, a flexible tube or the like is used. The material of the supply pipe 32 is a known material as long as it is resistant to the components of the coating liquid L. For example, materials for the supply pipe 32 include metal, resin such as vinyl chloride, etc.

The coating liquid supply unit 40 has, for example, a tank storing the coating liquid L, a liquid feeding pump for sending the coating liquid L, and a flow rate adjustment unit. By adjusting the flow rate per unit time of the coating liquid L sent to the nozzle 30 by this flow rate adjustment unit, it becomes possible to supply an appropriate amount of the coating liquid L to the substrate W from the discharge port 31. In addition, in this embodiment, the form having one nozzle 30 is explained as an example, but it is not limited to this form. For example, a plurality of nozzles 30 may be mounted on the arm 22 and the coating liquid L may be supplied from each.

The coating liquid (L) is, for example, a material for forming a separation layer, such as fluorocarbon, a polymer whose repeating units contain a structure capable of absorbing light (e.g., laser light), an inorganic material, and an infrared ray. Compounds having an absorbent structure, etc. can be mentioned. In addition, the coating liquid (L) is, for example, a material for forming an adhesive layer, and may be any of hydrocarbon resin, acrylic-styrene resin, maleimide resin, elastomer resin, polysallic resin, or a combination thereof, etc. Compounds of: In addition, the coating liquid (L) is, for example, a material for molding electronic components, and examples thereof include inorganic substances and non-conductive compounds. The viscosity of the coating liquid (L) is preferably 1500 to 12000 cP.

The control unit 50 collectively controls the application device 100, and for example, a computer is used. The control unit 50 controls the rotation drive unit 12, the rocking/elevating drive unit 23, and the coating liquid supply unit 40. The control unit 50 controls the rotation drive unit 12 to rotate and stop the table 10 and rotate the table 10 at a predetermined number of rotations when the table 10 is rotated. Additionally, the control unit 50 controls the rotational acceleration to reach a predetermined number of rotations in a predetermined time. The rotation speed and rotational acceleration of the table 10 may be values previously stored in a storage unit (not shown) provided in the control unit 50, or may be set appropriately by the operator.

The control unit 50 adjusts the height of the nozzle 30 in the vertical direction (H) by the rocking/elevating drive unit 23 and further swings the nozzle 30 in the rocking direction (S). The control unit 50 controls the oscillation/elevation drive unit 23 to adjust the oscillation width of the nozzle 30, that is, the oscillation amount retracted from above the substrate W, or from the retracted position to the upper side of the substrate W. Set the amount of shaking when entering, the speed of shaking when retreating or entering, etc. The oscillation width and oscillation speed of the nozzle 30 may be values previously stored in a storage unit (not shown) provided in the control unit 50, or may be set appropriately by the operator.

The control unit 50 controls the flow rate adjustment unit of the coating liquid supply unit 40 to adjust the flow rate of the coating liquid L per unit time and causes the coating liquid L to be supplied from the nozzle 30. Under the control of the control unit 50, the coating liquid L is supplied from the nozzle 30 to the substrate W while the distance between the nozzle 30 and the substrate W is adjusted. ) can be adjusted by a predetermined rotational acceleration.

[Application method]

The application method according to the embodiment will be described. FIG. 2 is a flow chart showing an example of the application method according to the embodiment, and FIG. 3 is a flow chart explaining in detail a part of the application method according to the embodiment. As shown in FIG. 2, first, the substrate W is loaded onto the table 10 (step S01). In step S01, the substrate W is mounted on the table 10 by, for example, a transfer device. This transport device is provided with, for example, a suction pad that adsorbs the upper surface of the substrate W, and transports the substrate W in a state where it is adsorbed by the suction pad, and mounts the substrate W on the table 10. . Afterwards, the suction by the suction pad is released and the substrate W is retracted from the coating device 100, thereby being placed on the table 10.

Additionally, when loading the substrate W, the control unit 50 retracts the nozzle 30 to a position away from the upper side of the table 10. Additionally, after the substrate W is mounted on the table 10, the control unit 50 drives an adsorption unit (not shown) to adsorb and hold the substrate W on the table 10. In addition, after the substrate W is mounted on the table 10, prior to adsorption of the substrate W, the center O of the substrate W is aligned with the central axis AX1. Alignment may be performed. When performing such alignment of the substrate W, the substrate W is adsorbed by the suction unit after the substrate W is aligned. Next, the control unit 50 causes the nozzle 30 to enter the upper part of the table 10 and arranges the nozzle 30 to coincide with the center O (central axis AX1) of the substrate W. I order it.

Next, the control unit 50 supplies the coating liquid L onto the substrate W while rotating the table 10 (step S02). In step S02, as shown in FIG. 3, steps S11 to S14 are executed. After the substrate W is loaded onto the table 10 in step S01 described above, the control unit 50 applies the coating liquid L on the substrate W while rotating the table 10 at a first rotation speed. Supply (step S11). In step S11, the control unit 50 drives the rotation drive unit 12 to increase the rotation speed of the table 10 from a stationary state to a predetermined rotation acceleration (hereinafter referred to as the first rotation acceleration), When the number of revolutions reaches 1, this first number of revolutions is maintained. The values of the first rotation speed and the first rotational acceleration may be set in advance in a storage unit (not shown) included in the control unit 50, or may be set appropriately by the operator.

The control unit 50 controls the rotation drive unit 12 to increase the rotation speed of the table 10 at the first rotation acceleration until the table 10 reaches the first rotation speed. For example, the control unit 50 controls the rotation drive unit 12 so that the first rotation acceleration is 5000 rpm/sec and the first rotation speed is 200 rpm from the start of rotation of the table 10 (0 rpm). In this case, the time from the start of rotation (that is, the rotation speed is 0 rpm) until the first rotation speed of 200 rpm is reached is 200 rpm/5000 rpm/sec = 0.04 sec. Additionally, the time to reach the first rotation speed can be adjusted by changing the first rotation acceleration. Additionally, for example, the first rotation speed is set to 10 to 250 rpm.

When the rotation speed of the table 10 reaches the first rotation speed, the control unit 50 drives the coating liquid supply unit 40 to supply the coating liquid L from the nozzle 30 onto the substrate W. Start it. The coating liquid L sent from the coating liquid supply unit 40 is sent to the nozzle 30 via the supply pipe 32. As described above, since the nozzle 30 is disposed above the center O of the substrate W, the coating liquid L discharged from the nozzle 30 is located at the center O of the substrate W. supply towards. After the coating liquid L is supplied to the center O of the substrate W, it spreads toward the outer edge E due to the centrifugal force caused by the rotation of the substrate W.

Next, the control unit 50 maintains the first rotation speed of the table 10 for a first predetermined time (step S12). In step S12, the first predetermined time is the time for maintaining the first rotation speed of the table 10 for a certain period of time. When the table 10 reaches the first rotation speed, the control unit 50 controls the rotation drive unit 12 to maintain the first rotation speed for a first predetermined time. The first predetermined time is measured, for example, by a timer (not shown) provided in the control unit 50. The value of the first predetermined time may be set in advance in a storage unit (not shown) included in the control unit 50, or may be set appropriately by the operator. The first predetermined time is, for example, 15 to 25 sec. For example, the control unit 50 controls the rotation drive unit 12 to maintain the first rotation speed of 200 rpm for 20 seconds as the first predetermined time.

In step S12, while the control unit 50 is holding the table 10 at the first rotation speed for a first predetermined time, the nozzle ( The coating liquid L is supplied onto the substrate W from 30). When supplying the coating liquid L in part of the first predetermined time, the control unit 50 supplies the first predetermined time for part of the time from the start of the first predetermined time, or part of the time while the first predetermined time has elapsed. In some part of the time until the time expires, the coating liquid supply unit 40 may be driven to supply the coating liquid L from the nozzle 30 onto the substrate W.

Next, the control unit 50 rotates the table 10 at a rotational acceleration of 30 to 230 rpm/sec from the first rotation speed to the second rotation speed (step S13). In step S13, the second rotation speed refers to rotation over a predetermined period of time, with the first rotation speed set to a predetermined rotation acceleration selected from 30 to 230 rpm/sec (hereinafter referred to as the second rotation acceleration). This is the number of rotations after increasing the number. The values of the second rotation speed and the second rotational acceleration may be set in advance in a storage unit (not shown) provided in the control unit 50, or may be set appropriately by the operator.

The control unit 50 rotates the table 10 at a first rotation speed of 200 rpm for a first predetermined time of 20 sec, for example, with a second rotation acceleration of 40 rpm/sec and a second rotation speed of 600 rpm. Controls the driving unit 12. In this case, since the second rotational acceleration is 40rpm/sec, 10sec is required from the first rotational speed of 200rpm to the second rotational speed of 600rpm. The time from the first rotation speed to reaching the second rotation speed (10 sec) is longer than the time from the start of rotation of the table 10 to reaching the first rotation speed (0.04 sec). In this way, a form of applying a second rotational acceleration that gradually increases the rotational speed of the table 10 over a predetermined period of time, for example, an acceleration time of 5 to 15 seconds, is sometimes called slope acceleration. Step S13 is performing slope acceleration. The second rotation speed is, for example, 450 to 2500 rpm.

In step S13, the control unit 50 removes the substrate W from the nozzle 30 by the coating liquid supply unit 40 during all or part of the time during which the rotation speed of the table 10 is increased at the second rotational acceleration. The coating liquid (L) may be supplied to the bed. When supplying the coating liquid L during a part of the time during which the second rotational acceleration is applied, the control unit 50 controls a part of the time from the start of the acceleration, or a part of the time during the acceleration, when the acceleration ends. For some of the time up to this point, the coating liquid supply unit 40 may be driven to supply the coating liquid L from the nozzle 30 onto the substrate W.

Next, the control unit 50 maintains the second rotation speed for a second predetermined time (step S14). In step S14, the second predetermined time is the time for maintaining the second rotation speed for a certain period of time. When the table 10 reaches the second rotation speed, the control unit 50 controls the rotation drive unit 12 to maintain the second rotation speed for a preset second predetermined time. For example, the control unit 50 controls the rotation drive unit 12 to maintain the second rotation speed of 600 rpm for 10 seconds as the second predetermined time. The second predetermined time is, for example, 15 to 25 sec.

In addition, in step S02 (step S11 to step S14) described above, the supply of the coating liquid L may be in the form of continuously discharging the coating liquid L from the nozzle 30 by the coating liquid supply unit 40. Alternatively, the coating liquid L may be discharged intermittently from the nozzle 30. The control unit 50 controls the form of the coating liquid L discharged from the nozzle 30.

Next, as shown in FIG. 2, the control unit 50 ends supply of the coating liquid L (step S03). In step S03, the control unit 50 stops the supply of the coating liquid L from the nozzle 30 onto the substrate W after a predetermined time has elapsed. The control unit 50 acquires the elapse of a predetermined time using a timer (not shown), stops the operation of the coating liquid supply unit 40, and stops the supply of the coating liquid L to the nozzle 30. In addition, the control unit 50 acquires information about the flow rate at which the coating liquid L is sent from the flow rate adjustment unit provided in the coating liquid supply unit 40, and drives the coating liquid supply unit 40 at the timing of sending the predetermined flow rate. You may stop it.

Next, the control unit 50 stops the rotation of the table 10 (step S04). In step S04, the control unit 50 controls the rotation drive unit 12 to stop the rotation of the table 10. In this way, the control unit 50 stops the supply of the coating liquid L in step S03 and then stops the rotation of the table 10 in step S04. However, the control unit 50 may perform steps S04 and S03 simultaneously. That is, the control unit 50 may stop the rotation of the table 10 at the timing when the supply of the coating liquid L from the nozzle 30 is stopped.

Next, in step S05, the control unit 50 unloads the substrate W from the table 10 (step S05), and the control unit 50 retracts the nozzle 30 from above the substrate W. . Subsequently, the control unit 50 releases the adsorption of the substrate W by the adsorption unit of the table 10. As a result, the substrate W is in a state in which it can be taken out from the table 10. The substrate W on the table 10 is carried out from the table 10 by, for example, the above-described transport device.

By performing the series of steps described above, it is possible to realize a thinner coating film on the surface of the substrate W and to achieve uniformity in the thickness of the coating film. In addition, as a subsequent process, even if a thinning process is performed on the substrate W after forming the coating film to thin the thickness of the substrate W by polishing the surface opposite to the coating film, the appearance of dispensing marks can be avoided. You can.

In this way, according to this embodiment, the rotation speed of the substrate W changes from the first rotation speed to the second rotation speed with the rotation acceleration set to 30 to 230 rpm/sec during or after supply of the coating liquid L, so that the substrate Even in the case where the viscosity of the coating liquid L supplied to It can be promoted.

[Example]

Hereinafter, examples and comparative examples will be described with reference to FIGS. 4 to 10.

[Example 1]

A substrate W with a diameter of 300 mm was mounted on the table 10. The rotation of the table 10 was started, the first rotational acceleration was 5000 rpm/sec, and the rotation speed of the table 10 was set to 200 rpm, which was the first rotation speed. After the first rotation speed reached 200 rpm, the adhesive having a viscosity of 2000 cP as the coating liquid L was started to be supplied from the nozzle 30 to the substrate W. Next, the first rotation speed of 200 rpm was maintained for 20 seconds, which is the first predetermined time. Next, the second rotation acceleration was 40 rpm/sec, the acceleration time was 10 sec, and the second rotation speed was 600 rpm. In Example 1, slope acceleration shown in steps S13 to S14 described above was performed.

After maintaining the second rotation speed of 600 rpm for a second predetermined time of 20 seconds, the supply of adhesive was stopped. The adhesive supply time was 20 seconds. The above results are shown in Figure 4. In Figure 4, Time represents time, Speed represents rotation speed, and Acc represents rotational acceleration. After that, a glass substrate serving as a support was attached to the adhesive-coated side of the substrate W to form a laminate. In Example 1, the thickness distribution of the substrate W was measured, and it was confirmed that there were no dispensing marks.

[Comparative Example 1]

A substrate W similar to Example 1 was mounted on the table 10. The rotation of the table 10 was started, the rotational acceleration was 5000 rpm/sec, and the rotation speed of the table 10 was 200 rpm. After the first rotation speed reached 200 rpm, the same adhesive as in Example 1 started to be supplied to the substrate W from the nozzle 30 similar to Example 1. Next, the rotation speed of 200 rpm was maintained for 20 seconds, and the rotation speed of 200 rpm was further maintained for 2 seconds, for a total of 22 seconds. Next, the rotational acceleration was 5000 rpm/sec, the rotation speed was set to 400 rpm, and the rotation speed of 400 rpm was maintained for 2 sec. Next, the rotational acceleration was 5000 rpm/sec, the rotation speed was set to 600 rpm, and the rotation speed of 600 rpm was maintained for 25 sec. Comparative Example 1, unlike Example 1, applies a method called step acceleration in which the rotation speed of the table 10 is gradually increased to 200 rpm, 400 rpm, and 600 rpm at a large rotational acceleration.

After that, the supply of adhesive was stopped. The adhesive supply time was 20 seconds. The above results are shown in Figure 5. In Figure 5, Time represents time, Speed represents rotation speed, and Acc represents rotational acceleration. After that, a glass substrate serving as a support was attached to the adhesive-coated side of the substrate W to form a laminate. In Comparative Example 1, the distribution of the thickness of the substrate W was measured, and it was found that there were irregularities in the thickness of the adhesive film on the substrate W, so that the radius from the center O of the substrate W was It was confirmed that concentric circle-shaped dispensing marks were occurring approximately 125 mm in direction.

[Example 2]

A substrate W similar to Example 1 was mounted on the table 10. The rotation of the table 10 was started, the first rotational acceleration was 5000 rpm/sec, and the rotation speed of the table 10 was set to 200 rpm, which was the first rotation speed. After the first rotation speed reached 200 rpm, the adhesive having a viscosity of 5000 cP as the coating liquid L was started to be supplied from the nozzle 30 to the substrate W. Next, the first rotation speed of 200 rpm was maintained for 20 seconds, which is the first predetermined time. Next, the second rotation acceleration was 80 rpm/sec, the acceleration time was 10 sec, and the second rotation speed was 1000 rpm. In Example 2, as in Example 1, slope acceleration shown in steps S13 to S14 described above was performed.

After maintaining the second rotation speed of 1000 rpm for a second predetermined time of 20 seconds, the supply of adhesive was stopped. The adhesive supply time was 20 seconds. The above results are shown in Figure 6. In Figure 6, Time represents time, Speed represents rotation speed, and Acc represents rotational acceleration.

Next, a glass substrate serving as a support was attached to the adhesive-coated side of the substrate W to form a laminate. Figure 7 shows the distribution of the thickness of the substrate W. In Fig. 7, the vertical axis represents the height (μm) of the upper surface of the substrate W. The horizontal axis represents the distance (mm) from the center O of the substrate W to the outer edge E. The + direction is the distance (mm) from the center O of the substrate W to the outer edge E toward the + The distance (mm) to the outer edge (E) facing the -X side and -Y side is shown. In addition, the dotted line represents the film thickness (μm) in the X direction of the substrate W (see FIG. 1), and the solid line represents the distribution of the film thickness (μm) in the Y direction of the substrate W. As shown in FIG. 7, in Example 2, it was confirmed that there were no dispensing marks on the substrate W.

[Comparative Example 2]

A substrate W similar to Example 1 was mounted on the table 10. The rotation of the table 10 was started, the rotational acceleration was 5000 rpm/sec, and the rotation speed of the table 10 was 200 rpm. After the first rotation speed reached 200 rpm, the same adhesive as Example 2 was started to be supplied to the substrate W from the same nozzle 30 as Example 2. Next, the rotation speed of 200 rpm was maintained for 20 seconds, and the rotation speed of 200 rpm was further maintained for 2 seconds, for a total of 22 seconds.

Next, the rotational acceleration was 5000 rpm/sec, the rotation speed was set to 400 rpm, and the rotation speed of 400 rpm was maintained for 2 sec. Next, the rotational acceleration was 5000 rpm/sec, the rotation speed was set to 600 rpm, and the rotation speed of 600 rpm was maintained for 2 sec. Next, the rotational acceleration was 5000 rpm/sec, the rotation speed was 1500 rpm, and the rotation speed of 1500 rpm was maintained for 10 sec. In Comparative Example 2, unlike Example 2, a method called step acceleration is applied, in which the rotational speed of the table 10 is gradually increased to 200 rpm, 400 rpm, 600 rpm, and 1500 rpm with a large rotational acceleration.

After that, the supply of adhesive was stopped. The adhesive supply time was 20 seconds. The above results are shown in Figure 8. In Figure 8, Time represents time, Speed represents rotation speed, and Acc represents rotational acceleration.

Next, a glass substrate serving as a support was attached to the adhesive-coated side of the substrate W to form a laminate. Figure 9 shows the distribution of the thickness of the substrate W. In Fig. 9, the vertical axis represents the height (μm) of the upper surface of the substrate W. In addition, in FIG. 9, the contents of the vertical axis, horizontal axis, dotted line, and solid line are the same as those in the graph of FIG. 7 of Example 2, so their description is omitted. As shown in FIG. 9, in Comparative Example 2, unevenness was formed in the film thickness of the adhesive coating film on the substrate W, so that the thickness was approximately 120 mm in the radial direction from the center O of the substrate W. It was confirmed that concentric circle-shaped dispensing marks were occurring.

Figure 10 is a graph showing changes in rotation speed over time for slope acceleration in Example 1 and step acceleration in Comparative Example 1. In Fig. 10, the horizontal axis represents the passage of time, and the vertical axis represents the number of rotations of the table 10. In Example 1, slope acceleration is performed with an acceleration time of 10 seconds between 20 and 30 seconds. On the other hand, in Comparative Example 1, step acceleration is performed for 10 seconds of 20 to 30 seconds. As shown in Figure 10, in Example 1, the increase in rotation speed from 200 rpm to 600 rpm is relatively gradual, whereas in Comparative Example 1, the rotation speed increases from 200 rpm to 400 rpm. It is confirmed that the rotation speed increases rapidly, and the rotation speed increases from 400 rpm to 600 rpm.

As described above, an adhesive having a viscosity of 2000 cP or 5000 cP is applied to the substrate W by controlling the rotation speed of the table 10, that is, the rotation speed of the substrate W, by step acceleration and slope acceleration. As a result of applying ), the generation of dispensing marks was suppressed in the application method using slope acceleration. On the other hand, in the application method using step acceleration, dispensing marks were generated on the substrate W. In addition, it was confirmed that the adhesive with a large viscosity value produced dispensing marks closer to the center O of the substrate W than the adhesive with a low viscosity value.

Although the embodiments and examples have been described above, the technical scope of the present invention is not limited to the above-described embodiments and examples. It is clear to those skilled in the art that various changes or improvements can be made to the above-described embodiments and examples. In addition, forms with such changes or improvements are also included in the technical scope of the present invention. One or more of the requirements described in the above embodiments and examples may be omitted. Additionally, the requirements described in the above-described embodiments and examples can be appropriately combined. Additionally, the execution order of each operation shown in the embodiments and examples can be realized in any order as long as the result of the previous operation is not used in the subsequent operation. In addition, although the operations in the above-described embodiments and examples are described using “first,” “next,” “continuing,” etc. for convenience, it is not essential to perform them in this order.

10: table
11: shaft
12: Rotation driving unit
20: nozzle driving unit
21: rotation axis
22: arm
23: Oscillating/elevating drive unit
30: nozzle
40: Coating liquid supply unit
50: control unit
100: Applicator
L: coating liquid
W: substrate
O: center
E: outer edge

Claims (12)

A table on which a substrate is mounted,
a rotation drive unit that rotates the table,
a nozzle that supplies a coating liquid from above the substrate rotating with the table;
Equipped with a control unit that controls the number of rotations of the table,
The control unit, from the first rotation speed of the table at the start of supply of the coating liquid to the substrate, sets the rotational acceleration to 30 to 230 rpm/sec during or after supply of the coating liquid, so that the table rotates to the second rotation speed. An application device that controls the rotation drive unit to adjust the number of rotations. According to claim 1,
The applicator wherein the control unit controls the rotation drive unit to maintain the first rotation speed for a first predetermined time. According to claim 2,
The coating device wherein the first predetermined time is 15 to 25 sec. The method according to any one of claims 1 to 3,
The coating device wherein the first rotation speed is 10 to 250 rpm. The method according to any one of claims 1 to 3,
The applicator wherein the control unit controls the rotation drive unit to maintain the second rotation speed for a second predetermined time. According to claim 5,
The coating device wherein the second predetermined time is 15 to 25 sec. The method according to any one of claims 1 to 3,
The coating device wherein the second rotation speed is 450 to 2500 rpm. The method according to any one of claims 1 to 3,
An application device in which the control unit controls the rotation drive unit so that the rotation acceleration is 40 to 200 rpm/sec. The method according to any one of claims 1 to 3,
The applicator wherein the control unit controls the rotation drive unit to provide rotational acceleration to the table in an acceleration time of 5 to 15 seconds. The method according to any one of claims 1 to 3,
The coating liquid is an adhesive for forming an adhesive layer on a substrate. The method according to any one of claims 1 to 3,
The coating liquid has a viscosity of 1500 to 12000 cP. Supplying a coating liquid to the rotating substrate while rotating the table on which the substrate is mounted at a first rotation speed;
An application method comprising adjusting the table to a second rotation speed at a rotational acceleration of 30 to 230 rpm/sec from the first rotation speed after or during supply of the coating liquid.