JP4298582B2 - Electronic component mounting system - Google Patents

Description

  The present invention relates to a coating method and a coating apparatus for a viscous material.

  In manufacturing a circuit board, it is necessary to mount various electronic components on the circuit board. At the time of mounting, a viscous material such as an adhesive for fixing a component to a substrate and a conductive paste such as a silver paste is applied to a predetermined position of the substrate using a viscous material application device.

  In the coating device, for example, an adhesive as a viscous material is supplied and applied on the substrate from the coating head unit. The coating head unit has a discharge nozzle, and the adhesive is supplied onto the substrate from above the substrate via the discharge nozzle.

  In this coating process, if the jumping of the adhesive or stringing occurs, the quality of the substrate may be adversely affected. For example, jumping and stringing may be placed on the land portion on which the semiconductor chip of the substrate is mounted. If the adhesive is placed on the land portion, the quality of the circuit board may be deteriorated. Further, as a result of the flying sticks to the substrate and hardens into a spherical shape, there is a risk of causing cracks.

  Therefore, after raising the coating head unit to a predetermined height, either the adhesive coating head unit or the substrate is moved in the XY direction (horizontal direction).

JP-A-11-276963

  In order to prevent the stringing and jumping of the adhesive as much as possible, it is conceivable to increase the rising amount of the coating head unit. It is possible to remove stringing by increasing the amount of increase. Further, it is possible to prevent the adhesive from jumping by utilizing the property of returning to the original shape according to the thixo ratio of the adhesive after a predetermined time has elapsed.

  However, as the amount of increase increases, the time (tact) required for one supply of the adhesive increases, and the productivity of the circuit board may be deteriorated. Also, stringing and jumping of the adhesive are contradictory properties, and it is difficult to prevent both and reduce the tact. Furthermore, it is necessary to consider the physical properties of the adhesive. Generally, stringing tends to occur when the viscosity of the adhesive is high, and jumping easily occurs when the viscosity is low.

  Even when a viscous material other than an adhesive is applied, the above-described problem may occur.

  An object of the present invention is to provide a viscous material coating method and a coating apparatus capable of improving the productivity while maintaining the quality of an object to be coated.

  In the viscous material application method of the present invention, the object to be coated is held so that the surface to be coated faces downward, the viscous material is supplied to the surface to be coated from a position below the surface to be coated, and the object is coated. Apply on the surface. It is preferable to supply the viscous material substantially perpendicularly to the surface to be coated.

  Examples of the viscous material include an adhesive. The kind of adhesive agent is not specifically limited.

  The viscous material coating apparatus of the present invention includes a holding mechanism that holds an object to be coated so that the surface to be coated faces downward, and a supply unit that supplies the viscous material onto the surface to be coated from a position below the surface to be coated. And have. An elevating mechanism that holds the supply unit and moves it vertically relative to the object to be coated on the lower side of the surface to be coated, and supplies the viscous material at a timing when the viscous material can be coated on the surface to be coated. A control device for controlling the supply unit and the lifting mechanism may be provided.

  Further, the supply unit may have a nozzle for discharging the viscous material at its upper end.

  The mounting system of the present invention includes the above-described coating device, a reversing device that is connected to the coating device and reverses the object to be coated, and a coating target that is connected to the reversing device and is coated with the inverted viscous material of the coating object. And a component mounting apparatus for mounting components on the surface.

  From another point of view, the present invention also provides a viscous material on a circuit board having a supply unit having a nozzle for discharging the viscous material at the upper end, and an elevating mechanism that holds the supply unit and moves it vertically. A coating apparatus is provided.

  The “viscous material” in the present application is not limited to an adhesive. For example, a sealing agent for sealing an electronic component, or a nozzle for applying a conductive paste such as cream solder or silver paste. This corresponds to a viscous body having a viscosity that does not flow out of its own weight. Further, the “object to be coated” is not limited to the circuit board.

  In the present invention, the viscous material is supplied from the lower side of the coating object to the coating surface of the coating object in a state against gravity. Therefore, stringing of the viscous material is less likely to occur. Moreover, even if jumping occurs, almost all of the flying falls downward due to the action of gravity, making it difficult to adhere to the surface of the object to be coated.

  Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 shows an apparatus 1 for applying an adhesive as a viscous material according to an embodiment of the present invention. The coating apparatus 1 includes a suction block 3 as a holding mechanism that holds a substrate 2 as an object to be coated and a supply unit 4 that supplies a viscous material onto the substrate 2. Further, the coating apparatus 1 holds the supply unit 4 and moves the supply unit 4 in the vertical direction below the substrate 2 and the timing at which application can be performed on the adhesive application surface 2a of the substrate 2. And a supply control device 6 for controlling the supply unit 4 and the lifting mechanism 5 so as to supply the adhesive.

  The supply unit 4 includes a nozzle 7 that discharges an adhesive supplied from a tank (not shown) by the action of the discharge motor 8 onto the substrate 2. As a method of discharging the adhesive, various methods such as a method of sending out the adhesive by compressed air and a method of pushing out the adhesive by rotating the screw shaft can be applied, and the type is not limited. In the embodiment, the nozzle 7 is provided at the uppermost end of the supply unit 4.

  The elevating mechanism 5 is connected to an elevating motor 9, an output shaft of the elevating motor 9, supported in a state of being rotatable around the axis, and a ball screw nut that engages with the ball screw 10. 11 and an arm 12 that is supported at one end by the ball screw nut 11 and moves between the standby position of the nozzle and the application position along the axial direction of the ball screw 10. A nozzle 7 is attached to the arm 12. With this configuration, the supply unit 4 and thus the nozzle 7 can be moved in the vertical direction (Z direction in FIG. 1). However, the configuration of the elevating mechanism is not limited to that of the embodiment, and various types can be used as long as the nozzle 7 can be driven up and down, and the type thereof is not limited.

  The control device 6 controls the supply unit 4 and the lifting mechanism 5 so that the adhesive is supplied at an appropriate position and an appropriate amount on the adhesive application surface 2a of the substrate 2. Various hardware, software, and programs can be used for the control apparatus 6, and the kind is not limited. The discharge conditions can be changed as appropriate according to the viscosity of the viscous material, the thixo ratio, and other conditions.

  As shown in FIG. 2, the suction block 3 as a holding mechanism sucks and holds the surface 2b of the substrate 2 opposite to the coated surface 2a by air suction. In this case, there are no parts on the surface 2b. By adsorbing the substrate 2 to the adsorption block 3, it is possible to prevent the substrate 2 from being bent.

  On the other hand, when a component is already mounted on the surface 2b, that is, the surface opposite to the coated surface 2a, the suction device 13 shown in FIG. 3 is used. The suction device 13 includes a support portion 14 and a suction portion 15. While supporting the periphery of the board | substrate 2 with the support part 14, the part in which the electronic component 16 is not mounted in the part other than the periphery of the board | substrate 2 is adsorbed and supported in the adsorption part 15. FIG. The suction part 15 also sucks and holds the substrate 2 by the air suction action. By using the suction portion 15, it is possible to prevent the substrate 2 from being bent and to maintain a flat state.

  Of course, the configuration of the holding mechanism is not limited to the suction block 3 and the suction device 13, and various types can be used.

  Next, the operation and action of the coating apparatus of the present invention will be described.

  FIG. 2 shows how the adhesive is applied to the substrate 2 by the coating apparatus of the present invention, focusing on only the nozzle 7 and the peripheral portion of the substrate 2. For convenience of description, the nozzle 7a, 7b, 7c, 7d and the adhesives 17a, 17b are shown in FIG. 17c and 17d (arrow t in FIG. 2). It should be noted that there are not actually different nozzles 7a, 7b, 7c, 7d.

  In the present invention, after the adhesive 17d is applied to the substrate 2 by the nozzle 7d, even if stringing occurs, the stringing is pulled to the lower side by the action of gravity. There is little possibility of stringing on top. Further, even if the jumping of the adhesive occurs, most of the jumping falls downward due to the action of gravity, as in the case of stringing, so that there is little possibility of the jumping on the substrate 2. Therefore, it becomes easy to improve the productivity while maintaining the quality of the substrate.

  In the above-described embodiment, the adhesive is supplied in a state where the substrate 2 is held horizontally and the nozzle 7 is held perpendicular to the substrate 2. That is, the adhesive is supplied perpendicular to the coated surface 2a. However, the vertical here does not have to be exact, and may be substantially vertical.

  FIG. 4 shows an example in which the coating apparatus 1 of the present invention is incorporated in a system for mounting electronic components on a substrate. In the mounting system 18 of FIG. 4A, the substrate 2 is transported from the substrate supply device 19 to the coating device 1 with the coated surface 2a facing down. After applying the adhesive, the substrate 2 is conveyed to the substrate reversing device 20, and the substrate is reversed by the substrate reversing device 20, and then the substrate 2 is conveyed to the component mounting device 21. Various components are mounted on the substrate 2. Therefore, component mounting is performed from the upper side of the board 2.

  In the mounting system 18 of FIG. 4B, the substrate 2 is transferred from the substrate supply device 19 to the substrate reversing device 20 with the coated surface 2a facing up. The substrate 2 is reversed by the substrate reversing device 20 and conveyed to the coating device 1. After the adhesive is applied, the substrate 2 is transported to another substrate reversing device 20, the substrate is reversed, and then the substrate 2 is transported to the component mounting device 21. Various components are mounted on the substrate 2. Therefore, component mounting is performed from the upper side of the substrate 2.

  5 to 13 show a method for reversing the substrate 2 using the substrate reversing device 20. By driving the motor 24, the both ends of the board which has been conveyed and arrived by the belt 23 provided on the rail 22 are sandwiched between the holding portions 25 connected to the motor 24 (FIG. 5). In order to avoid the rail 22, the reversing unit composed of the substrate 2, the motor 24 and the holding portion 25 is raised (FIG. 6), and the substrate is reversed (FIG. 7). Then, the sandwiching between both ends of the substrate is released (FIG. 8).

  Next, the substrate 2 and the reversing unit are lowered (FIG. 9), and the reversing unit is further lowered to a position where the substrate 2 can be conveyed (FIG. 10). Then, the substrate 2 is conveyed by the belt 23 (FIG. 11). Thereafter, the rotation and return of the reversing unit are returned (FIGS. 12 and 13).

  In the above-described embodiment, the adhesive is discharged in the direction opposite to the direction of gravity, but the discharge direction does not need to be completely 180 degrees opposite to the direction of gravity. That is, the present invention is included in the present invention as long as the effect of the present invention can be obtained even if the discharge direction of the adhesive deviates from the direction opposite to the gravity. Also, it is not absolutely necessary to hold the substrate completely in the horizontal direction (gravitational and vertical). Further, the discharge direction of the adhesive and the lower surface of the substrate (surface to be coated) do not have to be completely perpendicular.

  In addition, although the above-mentioned Example is an application | coating apparatus of an adhesive agent, the application object of this invention is not restricted to an adhesive agent, It can apply also to the application apparatus and method of another viscous material. Examples of other viscous materials include sealing agents for sealing electronic components, general conductive pastes including cream solder and silver paste, but are not particularly limited.

  In the above-described embodiments, the object to be coated with the viscous material is a substrate, but the type of the substrate is not limited. Moreover, the coating apparatus and method of this invention are applicable with respect to objects other than a board | substrate. In other words, the present invention can be applied not only to the field of electronic component mounting but also to other industries where it is necessary to apply a viscous material to an object to be coated.

  Moreover, in the above-mentioned Example, the structure which drives a supply unit up and down relatively with respect to a to-be-coated object using the raising / lowering mechanism was employ | adopted. However, it is theoretically possible to fix the supply unit and drive the coating object up and down on the upper side of the supply unit, and it is included in the scope of the present invention. It is theoretically possible to drive both the workpiece and the supply unit.

  Although various embodiments of the present invention have been described above, the present invention is not limited to the matters shown in the above-described embodiments, and those skilled in the art will be able to understand based on the claims and the description of the specification and well-known techniques. Such changes and applications are also within the scope of the present invention, and are included in the scope for which protection is sought.

  ADVANTAGE OF THE INVENTION According to this invention, the coating method and coating apparatus of the viscous material which can improve the productivity, maintaining the quality of a to-be-coated object are provided.

It is a whole side view in the coating device of the present invention. It is the schematic diagram which showed the process in which the adhesive agent is apply | coated to a board | substrate in the coating device of this invention. It is a figure which shows the state by which the board | substrate was adsorbed and supported by the adsorption | suction apparatus in the coating device of this invention. It is a schematic diagram of the mounting system in which the coating device of the present invention is incorporated. It is a figure which shows the inversion process of the board | substrate using a substrate inversion apparatus. It is a figure which shows the inversion process of the board | substrate using a substrate inversion apparatus. It is a figure which shows the inversion process of the board | substrate using a substrate inversion apparatus. It is a figure which shows the inversion process of the board | substrate using a substrate inversion apparatus. It is a figure which shows the inversion process of the board | substrate using a substrate inversion apparatus. It is a figure which shows the inversion process of the board | substrate using a substrate inversion apparatus. It is a figure which shows the inversion process of the board | substrate using a substrate inversion apparatus. It is a figure which shows the inversion process of the board | substrate using a substrate inversion apparatus. It is a figure which shows the inversion process of the board | substrate using a substrate inversion apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Coating device 2 Substrate 3 Suction block 4 Supply unit 5 Lifting mechanism 6 Control device 7 Nozzle 13 Suction device 18 Mounting system 19 Substrate supply device 20 Substrate reversing device 21 Component mounting device

Claims (3)

A holding mechanism for holding the circuit board so that the coated surface faces downward;
A supply unit for supplying a viscous material to the coated surface on the position below the said surface to be coated,
An inverting device for inverting the circuit board;
A component mounting apparatus for mounting a component on a surface to which the viscous material of the inverted circuit board is applied;
Electronic component mounting system having An elevating mechanism for holding the supply unit and moving the supply unit relative to the circuit board in the vertical direction below the coated surface;
2. The electronic component mounting according to claim 1 , further comprising a control device that controls the supply unit and the elevating mechanism so as to supply the viscous material at a timing at which the viscous material can be applied onto the surface to be coated. System . Said supply unit has a nozzle for discharging the viscous material at its upper end, the electronic component mounting system according to claim 1 or claim 2.

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