TWI735539B - Coating device and coating method - Google Patents

Abstract

In the present invention, the thickness of the coating film applied to the member to be coated is set to the desired thickness. The coater 10 of the coating device 5 has a reservoir 13 for accumulating the coating liquid, an ejection port 11 for ejecting the coating liquid, and a slit-like flow path 12 connecting the reservoir 13 and the ejection port 11, and is opposed to The substrate 7 ejects the coating liquid from the ejection port 11. The coating device 5 includes: a moving mechanism 20 that moves the coater 10 relative to the substrate 7 in a direction parallel to the coated surface 8; a pump 30 that supplies the coating liquid to the coater 10; and a control device 50. When the control device 50 moves the coater 10 on one side and sprays the coating liquid from the ejection port 11 on the substrate 7, it performs the self-pumping while making the coating liquid in the coater 10 negative pressure. 30 supplies the coating liquid to the control of the coater 10.

Description

Coating device and coating method

The present invention relates to a coating device and coating method for forming a coating film on a coated member.

As a coating device used to form a coating film with a uniform thickness on a coated member (such as a round substrate like a silicon wafer), slit coaters or spin coaters have been widely known, but their characteristics are different. Expand the use according to its characteristics. The slit coater is used, for example, to form a coating film on a color filter of a liquid crystal display or a TFT (thin-film transistor) substrate. The slit coater can also handle large glass substrates, and fully utilize the characteristics of higher utilization efficiency of the coating liquid (that is, less waste of the coating liquid). The spin coater is inferior to the slit coater in terms of the utilization efficiency of large substrates or coating liquids, but it can relatively easily form a uniform thickness of the coating film on a round substrate like a silicon wafer , Which is widely used in the field of semiconductor manufacturing. However, in recent years, in the field of semiconductor manufacturing, in order to improve the utilization efficiency of the coating liquid, a slit coater has gradually been used (for example, refer to Patent Document 1 and Patent Document 2). The slit coater has a coater (also referred to as a nozzle or a slit die nozzle), a slit-shaped flow path is formed inside the coater, and the front end of the coater becomes a spray outlet for the coating liquid. The ejection port has a slender shape and a width dimension larger than the diameter of a circular substrate (silicon wafer). In addition, the relative movement of the substrate and the coater (ejection port) is caused by the surface tension of the coating liquid (droplets of the coating liquid) generated between the substrate and the coater. , The coating liquid can be ejected (extracted) from the ejection port. Therefore, the coating liquid is ejected (extracted) from the portion where the substrate is opposite to the elongated ejection port, while the coating liquid is not ejected (not drawn) on the portion without the substrate. As a result, for circular substrates such as silicon wafers, the coating liquid can be consumed without wasting, and a coating film can be formed on the required part, thereby improving the utilization efficiency of the coating liquid. In addition, this type of slit coater (also referred to as a capillary coater) has previously been configured with the nozzle of the coater upward, but as disclosed in Patent Document 1 and Patent Document 2, it has been proposed to make the nozzle Downward. In the slit coater, the spray outlet of the coater is placed downward, and the pressure (internal pressure) of the coating liquid in the coater is controlled to be a negative pressure. Then, the coating liquid is drawn out from the applicator by the surface tension of the coating liquid (droplets of the coating liquid) generated between the substrate and the applicator, so that the coating liquid can be efficiently applied to such as A round substrate like a silicon wafer. Furthermore, the advantage of making the ejection orifice downward lies in the following aspects: the coating surface of the substrate can be made upward, thereby simplifying the processing of the substrate and suppressing the flow of liquid after coating. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2013-98371 [Patent Document 2] Japanese Patent Laid-Open No. 2015-192984

[Problem to be solved by the invention] When the coating liquid is applied to the substrate using a capillary coater with the nozzle of the applicator set downward, the main influence on the film thickness of the coating liquid is The control parameter is the pressure in the coater or the coating speed. Even if the coating is controlled by using these control parameters, it must be controlled with high precision to make the film thickness reproduce stably. The capillary coating mechanism described in Patent Document 1 has a narrow storage chamber in which the coating liquid is stored in the coater, and the pressure (air pressure) of the storage chamber is controlled. If the coating liquid in the storage chamber is ejected from the ejection port, that is, if the coating liquid is consumed for coating, the liquid level of the coating liquid in the storage chamber is lowered. Although it is possible to re-supply the coating liquid to the coater (storage chamber) from the outside, since the storage chamber is narrow, the liquid level with the consumption (and supply) of the coating liquid fluctuates greatly. As a result, the It is substantially difficult to control the pressure of the storage chamber to be fixed. In addition, the capillary coater described in Patent Document 2 includes a tank for storing the coating liquid connected to the coater via a pipe, and feedbacks the pressure of the tank based on the measured value of the pressure sensor provided in the coater Control so that the pressure in the applicator becomes constant. However, there are cases in which the action of the coating liquid becomes slow due to the pressure loss that occurs when the coating liquid flows in the flow path (piping) from the tank to the applicator, and the responsiveness of control decreases. That is, there is a problem that even if the pressure of the tank is controlled, there will be a time deviation before the pressure change caused by the control is reflected in the pressure in the applicator. As a result, the pressure in the applicator will not become The required pressure, or the pressure change in the applicator. As described above, if the control of the pressure in the applicator is unstable, the amount of the coating liquid sprayed from the applicator fluctuates. As a result, the thickness of the coating film formed on the member to be coated may be Will not become uniform. Therefore, the present invention was completed in order to solve the problem of the capillary coater (capillary coating) as described above, and its object is to provide a coating film that can be formed on a member to be coated to a desired thickness. Coating device and coating method. [Technical Means for Solving the Problem] The coating device of the present invention includes an applicator having a storage portion for storing the coating liquid, an ejection port for ejecting the coating liquid, and a slit connecting the storage portion and the ejection port A flow path, and spray the coating liquid from the nozzle to the member to be coated; a moving mechanism that causes the applicator and the member to be coated to face each other in a direction parallel to the coated surface of the member to be coated Pump, which supplies the coating liquid to the applicator; and the control device, which performs the relative movement on one side and the coating action of spraying the coating liquid from the ejection port on the surface of the coated member. Control of supplying the coating liquid from the pump to the applicator while keeping the coating liquid in the applicator at a negative pressure. According to this coating device, capillary coating can be performed in which the coating liquid can be ejected from the ejection port to form a coating film of a desired thickness on the member (coated surface) to be coated. In addition, the control device may perform control for supplying the coating liquid corresponding to the amount of the coating liquid ejected from the ejection port from the pump to the applicator during the coating operation. According to this structure, during the coating operation, since the coating liquid corresponding to the amount of the coating liquid consumed by ejecting from the ejection port is supplied to the coater from the pump, it is easy to form a coating film with a desired thickness Control of capillary coating on the coated member (coated surface). In addition, the coating device further includes: a pressure applying device that applies pressure to the coating liquid in the applicator; and a pressure sensor that measures the pressure of the coating liquid in the applicator; and The control device can control the pressure of the coating liquid in the applicator by the pressure applying device, so that the coating liquid in the applicator is at a negative pressure, and use it based on the measurement result of the pressure sensor Adjustment and control of the coating liquid of the above pump. According to this structure, pressure control is performed to keep the pressure (negative pressure) in the coater constant, and the capillary coating is performed to form a coating film of a desired thickness on the coated member (coated surface). Control becomes easy. In addition, when the coating liquid is attached to the coating start portion of the member to be coated, it is preferable to appropriately control the ejection amount of the coating liquid to obtain a desired film thickness from the coating start portion. Therefore, it is preferable for the control device to supply the coating liquid to the applicator by the pump so as to start the liquid adhering action of adhering the coating liquid to the member to be coated, and to cause the coating liquid to be applied by the supply. After the pressure of the coating liquid in the container is increased, if the pressure drop is detected, the supply of the coating liquid by the above-mentioned pump is stopped. If the coating liquid is supplied to the applicator from the pump, the pressure of the coating liquid in the applicator temporarily increases, whereby the coating liquid is ejected from the ejection port. Then, if the coating liquid contacts the member to be coated, the coating liquid in the applicator will be drawn out further due to the surface tension of the coating liquid, thereby reducing the pressure in the applicator. Therefore, if the pressure drop is detected, the supply of the coating liquid by the pump is stopped, thereby preventing the excess coating liquid from adhering to the member to be coated during the liquid adhering operation. Furthermore, in order to perform the above-mentioned liquid adhesion operation, the coating device preferably further includes: a tank which is connected to the applicator via a pipe to store the coating liquid; and a pressure regulator which adjusts the coating liquid stored in the tank The pressure is used to maintain the pressure of the coating liquid in the applicator at a specific value; and a valve that can connect and block the applicator and the tank; and the control device is connected to and blocked by the valve In the state that the communication between the applicator and the tank is blocked, the coating liquid is supplied to the applicator by the pump, and if a decrease in the pressure is detected later, the supply of the coating liquid by the pump is stopped, and The valve is operated to connect the tank and the applicator. According to this configuration, during the liquid adhesion operation, after the coating liquid ejected from the ejection port adheres to the member to be coated, the pressure of the coating liquid in the applicator can be maintained at a fixed value (negative pressure). In addition, the coating method of the present invention is a method for capillary coating by spraying the coating liquid from the nozzle of the coater to the member to be coated. The spray outlet of the cloth liquid, and the slit-like flow path connecting the reservoir and the spray outlet; the coating method is performed while the applicator and the member to be coated are aligned with the member to be coated The cloth surface is relatively moved in a parallel direction, while facing the coated member, spraying the coating liquid from the above-mentioned nozzle, and during the above-mentioned coating operation, while making the coating liquid in the above-mentioned applicator negative The pressure side supplies the coating liquid to the applicator from a pump connected to the applicator. According to this coating method, capillary coating can be performed in which the coating liquid can be ejected from the ejection port to form a coating film of a desired thickness on the member (coated surface) to be coated. In addition, during the coating operation, the coating liquid corresponding to the amount of the coating liquid ejected from the ejection port is supplied to the applicator from the pump. According to this structure, during the coating operation, since the coating liquid corresponding to the amount of the coating liquid consumed by ejecting from the ejection port is supplied to the coater from the pump, it is easy to form a coating film with a desired thickness Control of capillary coating on the coated member (coated surface). In addition, the pressure of the coating liquid in the applicator is measured by a pressure sensor, and the pressure of the coating liquid in the applicator is controlled in order to make the coating liquid in the applicator a negative pressure. And based on the measurement result of the pressure sensor, the adjustment control of the coating liquid using the pump is performed. According to this structure, pressure control is performed to keep the pressure (negative pressure) in the coater constant, and the capillary coating is performed to form a coating film of a desired thickness on the coated member (coated surface). Control becomes easy. In addition, when the coating liquid is attached to the coating start portion of the member to be coated, it is preferable to appropriately control the ejection amount of the coating liquid to obtain a desired film thickness from the coating start portion. Therefore, it is preferable to supply the coating liquid to the applicator by the pump in order to perform the liquid adhering action of starting to adhere the coating liquid to the member to be coated, and the supply of the coating liquid in the applicator After the pressure of the coating liquid is increased, if the pressure drop is detected, the supply of the coating liquid by the above-mentioned pump is stopped. If the coating liquid is supplied to the applicator from the pump, the pressure of the coating liquid in the applicator temporarily increases, whereby the coating liquid is ejected from the ejection port. Then, if the coating liquid contacts the member to be coated, the coating liquid in the applicator will be drawn out further due to the surface tension of the coating liquid, thereby reducing the pressure in the applicator. Therefore, if the pressure drop is detected, the supply of the coating liquid by the pump is stopped, thereby preventing the excess coating liquid from adhering to the member to be coated during the liquid adhering operation. In addition, in order to perform the above-mentioned liquid adhesion operation, it is preferable that a valve is provided in the above-mentioned applicator, and the valve is connected to a tank storing the coating liquid through a pipe and can communicate and block the applicator and the tank. The pressure of the coating liquid stored in the tank can be adjusted by a pressure regulator to keep the pressure of the coating liquid in the applicator at a specific value, and the valve can block the applicator and the When the tank is in communication, the pump is used to supply the coating liquid to the applicator. If the pressure drop is detected later, the pump is stopped to supply the coating liquid, and the valve is operated to make the tank Connect with the above-mentioned applicator. According to this configuration, during the liquid adhesion operation, after the coating liquid ejected from the ejection port adheres to the member to be coated, the pressure of the coating liquid in the applicator can be maintained at a fixed value (negative pressure). [Effects of the Invention] According to the present invention, the amount of the coating liquid supplied to the applicator can be controlled to a specific amount by using a pump, thereby suppressing the amount of coating liquid ejected from the applicator to the member to be coated. The surface tension is the amount of the coating liquid to be ejected from the ejection port to the outside of the applicator. As a result, during the coating operation, the coating liquid in the coater can be maintained at a negative pressure, so that the thickness of the coating film applied to the member to be coated can be a desired thickness.

Hereinafter, the embodiments of the present invention will be described with reference to the drawings. [Regarding the configuration of the coating device] Fig. 1 is a schematic configuration diagram illustrating the overall configuration of the coating device. The coating device 5 is a device for spraying a coating liquid on, for example, a single sheet-shaped member to be coated to form a coating film of uniform thickness. Furthermore, the coated member described in this embodiment is a circular substrate 7 (refer to FIG. 2(A)), specifically, a circular silicon wafer. The coating device 5 is provided with an applicator 10 (also referred to as a nozzle or a slit die nozzle) located on the upper side of the substrate 7, and the coating liquid is sprayed from the applicator 10 to apply the coating liquid to the substrate 7 Above the surface. The upper surface of the substrate 7 becomes the coated surface 8 for coating with the coating liquid. The substrate 7 is supported on the platform 9 with the coated surface 8 facing upward, and the coating is performed in this state. In addition to the above-mentioned coater 10 for spraying the coating liquid, the coating device 5 also includes: a moving mechanism 20 for relatively moving the substrate 7 and the coater 10; and a pump 30 for supplying the coating liquid to the coating The cloth device 10; the pressure imparting device 40, which causes pressure to act on the coating liquid in the applicator 10; the control device 50, which is composed of a computer that performs various controls; and the pressure sensor 60, which is used for coating The pressure of the coating liquid in the cloth device 10 is measured. The coater 10 will be described. As shown in FIG. 2(A), the applicator 10 is composed of a straight nozzle that is long in one direction, and at its lower end is provided with a nozzle 11 that is long in one direction for spraying the coating liquid. As described above, the substrate 7 (coated surface 8) is circular, and the ejection port 11 has a larger width dimension W (W>D) than the diameter D of the substrate 7 (the maximum dimension of the substrate 7 in the above-mentioned one direction). Therefore, in the applicator 10 (the ejection port 11), the part where the substrate 7 exists directly below and the part where the substrate 7 does not exist directly below are generated. In addition, the respective ranges (lengths) of these parts are based on the substrate 7 and The relative position of the applicator 10 (jet port 11) changes. Fig. 2(A) is a perspective view showing the coater 10 and the substrate 7, Fig. 2(B) is a cross-sectional view of the part of the coater 10 where the substrate 7 is located directly below, and Fig. 2(C) is the coater 10 is a cross-sectional view of the portion where the substrate 7 is not located directly below. As shown in Fig. 2(B)(C), the applicator 10 has a reservoir 13 for accumulating the coating liquid, an ejection port 11 for ejecting the coating liquid, and a slit shape connecting the reservoir 13 and the ejection port 11 Flow path 12. The reservoir 13, the slit-shaped flow path 12, and the ejection port 11 are formed to be long in one direction (the direction orthogonal to the paper surface of Fig. 2(B)(C)). The storage part 13 is an area expanded in order to temporarily store the coating liquid ejected from the ejection port 11. The lower end of the slit-shaped flow path 12 is a discharge port 11. In addition, in the coater 10, the coating liquid is ejected from the ejection port 11 toward the substrate 7 downward. During the coating operation described below, the reservoir 13 and the slit-like flow path 12 are in a state filled with the coating liquid (that is, a full state). In the present embodiment, the direction in which the coating liquid is sprayed from the spray outlet 11 is downward, but it is not limited to this, and it may be inclined downward, and it may also be horizontal (toward the horizontal direction), upward, and inclined upward. The situation. In FIG. 1, a pressure sensor 60 is provided in the applicator 10, and is a sensor for measuring the pressure of the coating liquid in the applicator 10. In the present embodiment, the detection part (sensor part) of the pressure sensor 60 is exposed in the reservoir 13, and the pressure (internal pressure) of the coating liquid in the reservoir 13 is measured. The measurement result of the pressure sensor 60 is input to the control device 50. In addition, in the following, the “pressure in the applicator 10” means the pressure of the coating liquid in the reservoir 13. The coating device 5 includes a device base 6 and a platform 9 mounted on the device base 6 and on which a substrate 7 is placed. The coated surface 8 of the substrate 7 on the platform 9 is horizontal. Furthermore, in this embodiment, the applicator 10 can be moved relative to the platform 9 by the moving mechanism 20. The moving mechanism 20 includes a rail 21 provided on the device base 6, a movable block 22 that moves in the horizontal direction along the rail 21, and a linear actuator 23 that moves the movable block 22. Furthermore, the applicator 10 is mounted on the movable block 22. With the moving mechanism 20, the applicator 10 can be moved in a horizontal direction relative to the substrate 7 on the platform 9 in a fixed state. Furthermore, the moving mechanism 20 only needs to be configured to relatively move the applicator 10 and the substrate 7 in a direction parallel to the coated surface 8 of the substrate 7. Although not shown, it may be configured to move the platform 9 (substrate 7) A structure that moves relative to the applicator 10 in a fixed state. In addition, the moving mechanism 20 includes a lift actuator 24 that moves the applicator 10 in the vertical direction. Thereby, the height of the coater 10 (discharge port 11) relative to the substrate 7 can be adjusted. The moving mechanism 20 is controlled by the control device 50 and can move the applicator 10 in the horizontal direction at a specific speed (specifically, a fixed speed). In this coating device 5, in a state where the substrate 7 and the applicator 10 (discharge port 11) are opposed to each other in the vertical direction, the moving mechanism 20 moves the substrate 7 relative to each other. The surface tension of the coating liquid (droplet 3 of the coating liquid) generated between the coating liquid and the coater 10 causes the coating liquid to be ejected from the coater 10. Therefore, for the elongated ejection port 11, the coating liquid is ejected in the portion where the substrate 7 is present as shown in FIG. 2(B), while the coating liquid is not ejected in the portion where there is no substrate 7 as shown in FIG. 2(C).涂液。 Coating solution. Therefore, when the circular substrate 7 is used as the coating target, the coating liquid can be formed without wasting the coating liquid, and the coating film can be formed on the necessary part, thereby improving the utilization efficiency of the coating liquid. In FIG. 1, the pump 30 has the function of supplying a required amount of coating liquid to the applicator 10. The pump 30 can accurately deliver the coating liquid at any flow rate, and is, for example, a syringe pump (quantitative pump). The applicator 10 and the pump 30 are connected by a pipe 81, and the pipe 81 is provided with an on-off switching valve 71. The pump 30 is controlled by the control device 50 to control the feeding amount of the coating liquid per unit time, and supply the coating liquid to the coater 10. By supplying the coating liquid to the coater 10 by the pump 30, the coating liquid is ejected from the ejection port 11 of the coater 10. In addition, the pump 30 can also suck the coating liquid on the side of the applicator 10 by performing an operation opposite to the operation for supplying the coating liquid. This suction operation will be described below, but it can be performed when the pump 30 is refilled with the coating liquid and in the control mode (Part 2). In addition, the coating device 5 further includes a tank (first tank) 35 that stores the coating liquid. The tank 35 is connected to the pump 30 through a pipe 83 extended from the pipe 81 described above. The piping 83 is provided with an on-off switching valve 73. The volume of the coating liquid that can be stored in the tank 35 is larger than that of the pump 30, and the coating liquid stored in the tank 35 becomes the coating liquid for replenishing the pump 30. The pressure applying device 40 includes a tank (second tank) 41 and a pressure regulator 42. The tank 41 stores the coating liquid, and is connected to the applicator 10 through a pipe 82. The piping 82 is provided with an on-off switching valve 72, and when the valve 72 is in an open state, the coating liquid can flow between the tank 41 and the applicator 10 (reservoir 13). The valve 72 can communicate and block the applicator 10 and the second tank 41. The volume of the coating liquid that can be stored in the tank 41 is larger than the volume (volume) of the storage portion 13 of the applicator 10. The pressure regulator 42 is composed of a regulator, and changes the pressure of the coating liquid acting on the tank 41. The pressure regulator 42 is controlled by the control device 50 to adjust the pressure (internal pressure) of the coating liquid in the tank 41. Since the tank 41 and the applicator 10 are connected by the pipe 82, the pressure of the coating liquid in the applicator 10 (reservoir 13) can be controlled to a specific value by adjusting the pressure of the coating liquid in the tank 41 pressure. For example, by adjusting the pressure (gauge pressure) of the coating liquid in the tank 41 to a negative pressure, the pressure (gauge pressure) of the coating liquid in the applicator 10 (reservoir 13) can be a negative pressure. Thus, in this embodiment, the pressure regulator 42 is used to adjust the pressure of the coating liquid stored in the tank 41 to maintain the pressure of the coating liquid in the applicator 10 at a specific value (negative pressure). The pressure regulator 42 and the tank 41 constitute a pressure applying device 40 for applying pressure (negative pressure) to the coating liquid in the applicator 10. The coating device 5 having the above configuration includes a pump control line L1 and a pressure control line L2 respectively connected to the coater 10. The pump control line L1 includes pipes 81, 83, valves 71, 73, a pump 30, and a first tank 35. The pressure control line L2 includes a pipe 82, a valve 72, a second tank 41, and a pressure regulator 42. In each of the following coating operation and liquid adhesion operation, one or both of the pump control circuit L1 and the pressure control circuit L2 can be selectively used. The coating device 5 of this embodiment has two control modes for coating operations, and one of them can be used alternatively. Therefore, among the computer programs stored in the memory mechanism of the control device 50, programs including two control modes can be selectively executed. Furthermore, the above-mentioned coating action refers to the following action, namely, while the substrate 7 and the coater 10 are relatively moved by the moving mechanism 20 (linear actuator 23), while the substrate 7 is ejected from the ejection port 11涂液。 Coating solution. Hereinafter, the coating method performed by the coating apparatus 5 provided with the above-mentioned structure is demonstrated. In this coating method, a liquid adhesion operation of starting to adhere the coating liquid to the substrate 7 is included, and the application operation is performed after the liquid adhesion operation. [Control Mode (Part 1)] Figs. 3 to 5 are explanatory diagrams explaining the coating method. Furthermore, in the following description, the valve 71 between the pump 30 and the applicator 10 is referred to as the first valve 71, and the valve 72 between the second tank 41 and the applicator 10 is referred to as the second valve 72 , The valve 73 between the first tank 35 and the pump 30 is called the third valve 73. As shown in FIG. 3(A), the initial delivery of the coating liquid from the coater 10 (initial delivery step) is performed. For this reason, the first valve 71 is opened, and a small amount of coating liquid is discharged from the discharge port 11 by operating the pump 30. In this initial delivery step, the applicator 10 is not present on the substrate 7. Next, wipe the ejection port 11 of the applicator 10 (wiping step: refer to FIG. 3(B)). At this time, the pump 30 is in a stopped state. Next, the height position of the applicator 10 is set to a specific position relative to the substrate 7 on the platform 9. The height adjustment of the applicator 10 is performed by the lift actuator 24 (refer to FIG. 1). For example, the distance between the ejection port 11 and the coated surface 8 is set to several tens of μm. In addition, the linear actuator 23 (refer to FIG. 1) moves the coater 10 so that the ejection port 11 is located directly above the coating start position of the substrate 7 (the edge of the substrate 7) (preparatory movement step) ). During the period before the completion of the preparatory movement step, a process of setting the pressure of the coating liquid in the second tank 41 to be lower than the atmospheric pressure (hereinafter referred to as pre-processing) is performed. In the pre-processing, in the pressure control circuit L2, the pressure of the coating liquid in the second tank 41 is set to a specific reduced pressure value (a specific negative pressure value). The pressure reduction value (negative pressure value) is set at the value of the control device 50, and is used to make the pressure of the coating liquid of the applicator 10 a specific negative pressure value. Specifically, it is set to the same value as the negative pressure value generated by the coating liquid of the applicator 10 during the coating operation. The negative pressure (decompression) of the coating liquid in the second tank 41 is performed by the pressure regulator 42. The above processing is pre-processing. Through this pre-processing, the second valve 72 is in the closed state before the above-mentioned pre-movement step. In this state, the pressure of the coating liquid in the second tank 41 will not affect the pressure of the coating liquid in the applicator 10 Although described below, the second valve 72 can be opened to cause the negative pressure of the coating liquid in the second tank 41 to act on the pressure of the coating liquid in the applicator 10 to make the applicator 10 The pressure of the coating liquid becomes negative pressure instantaneously. Next, the pump 30 is operated to supply the coating liquid to the applicator 10 (see FIG. 4(A)). At this time, the supply amount of the coating liquid by the pump 30 is an extremely small amount, which is less than the supply amount during the coating operation. As a result, a small amount of coating liquid is ejected from the ejection port 11. Furthermore, by supplying the coating liquid by the pump 30, the pressure of the coating liquid in the applicator 10 rises and approaches the atmospheric pressure. Then, if a small amount of the coating liquid ejected from the ejection port 11 contacts the substrate 7 (see FIG. 4(B)), the pressure in the applicator 10 drops sharply (returns to a negative pressure lower than atmospheric pressure). The reason is that the surface tension of the coating liquid in contact with the substrate 7 and the capillary (capillary) are reduced, and the coating liquid in the applicator 10 is drawn to the side of the substrate 7. Since the pressure sensor 60 measures the pressure in the applicator 10 at all times, if the control device 50 detects the decrease in the pressure in the applicator 10 caused by the contact of the coating liquid on the substrate 7, the second valve 72 Open (refer to Figure 4(C)). Furthermore, the supply of the coating liquid by the pump 30 is stopped. Thus, in coordination with the above-mentioned pre-processing, the coating liquid of the applicator 10 is affected by the pressure of the coating liquid in the second tank 41, and the pressure of the coating liquid of the applicator 10 becomes a negative pressure. As a result, it is possible to prevent the coating liquid from continuing to flow out from the coater 10 and to form droplets 3 of the coating liquid between the substrate 7 and the ejection port 11 (see FIG. 4(C)). The steps shown in FIGS. 4(A) to (C) above are the above-mentioned liquid adhesion operation (liquid adhesion step). In this liquid adhesion operation, the following control is performed by the control device 50 as described above. That is, the coating liquid is supplied to the coater 10 by the pump 30 so that the liquid adhesion action of starting to adhere the coating liquid to the substrate 7 is performed, and the pressure of the coating liquid in the coater 10 is increased by this supply After the increase, if the pressure drop is detected by the pressure sensor 60, the supply of the coating liquid by the pump 30 is stopped. Furthermore, in this embodiment, in a state where the communication between the applicator 10 and the second tank 41 is blocked by the second valve 72 (that is, the second valve 72 is in the closed state), the coating is removed by the pump 30 The distributing liquid is supplied to the applicator 10, and if the pressure sensor 60 detects the pressure drop later, the pump 30 is stopped to supply the coating liquid, and the second valve 72 is activated (that is, the second valve 72 Open) so that the second tank 41 communicates with the applicator 10. According to this liquid adhesion operation, when the coating liquid is supplied to the applicator 10 from the pump 30, the pressure of the coating liquid in the applicator 10 temporarily increases, and the coating liquid is ejected from the ejection port 11 as a result. Then, if the coating liquid contacts the substrate 7, the coating liquid in the applicator 10 will be drawn out further due to the surface tension of the coating liquid, so that the pressure in the applicator 10 is reduced. Therefore, if the pressure sensor 60 detects the pressure drop, the supply of the coating liquid by the pump 30 is stopped, thereby preventing the excess coating liquid from adhering to the substrate 7 during the liquid adhering operation. Furthermore, by opening the second valve 72, the second tank 41 communicates with the applicator 10, and after the coating liquid sprayed from the ejection port 11 adheres to the substrate 7, the coating liquid in the applicator 10 can be The pressure is maintained at a fixed value (negative pressure). Perform the liquid adhesion action as described above. If the pressure of the coating liquid in the applicator 10 becomes negative due to the influence of the pressure of the coating liquid in the second tank 41 (if the pressures of the two become equal), Then the second valve 72 is closed. Then, as shown in FIG. 5(A), a coating operation (coating step) is performed. In this step, the applicator 10 starts to move in the horizontal direction by the moving mechanism 20 (linear actuator 23), and the pump 30 starts to supply the coating liquid. Then, while the applicator 10 is moved in the horizontal direction, the supply of the coating liquid by the pump 30 is performed. In this embodiment, the moving speed of the applicator 10 is fixed. Here, since the substrate 7 is circular, as described above (refer to FIG. 2), in the applicator 10 (ejection port 11), a portion where the substrate 7 exists directly below and a portion where the substrate 7 does not exist directly below are generated. In addition, the respective ranges of these portions vary according to the relative positions of the substrate 7 and the applicator 10. In addition, for the elongated ejection port 11, the coating liquid is ejected at the portion where the substrate 7 is present as shown in FIG. 2(B), while the coating liquid is not ejected at the portion where the substrate 7 is not present as shown in FIG. 2(C). The spray of coating liquid. Therefore, in order to move the applicator 10 at a fixed speed to apply the coating liquid on the circular substrate 7 and to form a fixed film thickness of the coating film on the substrate 7, the amount of the coating liquid that should be ejected from the ejection port 11 needs to be based on The position of the applicator 10 relative to the substrate 7 is different. Therefore, the following control (quantitative discharge control) is performed, that is, instead of sending a fixed amount of the coating liquid from the pump 30, the amount necessary to form a coating film of a fixed thickness on the substrate 7 is sent. That is, the amount of the coating liquid sent from the pump 30 is set to an amount equivalent to the amount of the coating liquid (the aforementioned necessary amount) that changes in accordance with the change (shape change) of the substrate 7 in the width direction. In addition, the above-mentioned width direction of the substrate 7 is a direction that coincides with the longitudinal direction of the applicator 10 (discharge port 11). The amount of the coating liquid sent from the pump 30 as described above is set in the computer program stored in the memory mechanism of the control device 50. That is, the computer program includes data that establishes a correspondence between the relative position of the coater 10 and the substrate 7 and the ejection amount (supply amount) of the coating liquid at that position. Based on this data, the control device 50 The pump 30 and the moving mechanism 20 are operated. Thereby, even if the measured value of the pressure sensor 60 is not used, a set amount of coating liquid can be ejected from the applicator 10 to form a fixed film thickness on the substrate 7. In addition, the above-mentioned ejection amount based on the position is a value obtained in advance according to the coating film to be formed, and changes according to the coating film. In addition, when the coating operation starts, the above-mentioned pre-processing is performed, the pressure of the coating liquid in the coater 10 is set to negative pressure, and the amount of coating liquid ejected from the ejection port 11 is replenished from the pump 30 to the coating Therefore, the pressure in the applicator 10 maintains a negative pressure during the coating operation and maintains a fixed value. As described above, in the control mode (Part 1), during the coating operation, the control device 50 performs the following control. That is, during the coating operation, control is performed to supply the coating liquid corresponding to the amount of the coating liquid consumed by ejecting from the ejection port 11 from the pump 30 to the applicator 10. With this control, the coating liquid in the coater 10 is maintained at a negative pressure, while the capillary coating with the required uniform thickness is formed on the substrate 7 (coated surface 8). Easy. Then, as shown in FIG. 5(B), when the coater 10 (discharge port 11) reaches the coating end position of the substrate 7 (the edge of the substrate), the supply of the coating liquid by the pump 30 is stopped. If the supply is stopped, although not shown, the applicator 10 is raised by the raising and lowering actuator 24, the first valve 71 is closed, and the third valve 73 is opened. Then, the pump 30 sucks the coating liquid in the first tank 35 for replenishment, and prepares for the next coating. In addition, the substrate 7 coated with the coating liquid is removed from the platform 9 and transported to the dryer. Through the above operations, in the control mode (Part 1), the pump 30 is used to control the supply of the coating liquid consumed by the coating. During this control, the second valve 72 of the pressure control line L2 is in a closed state, and only the pump 30 of the pump control line L1 is used for liquid supply. The pump 30 supplies the coating liquid to the applicator 10 only in an amount corresponding to the discharge amount of the coating liquid from the applicator 10 set in advance. At this time, the amount of coating liquid supplied to the applicator 10 is set to be higher than the shear force generated by the droplet 3 of the coating liquid between the substrate 7 and the applicator 10 due to the capillary phenomenon and the coating action On the other hand, the amount of the coating liquid to be drawn out of the applicator 10 is slightly smaller, and therefore, it becomes a supply accompanied by suppression of ejection. As a result, although the coating liquid is supplied by the pump 30, in the coater 10, a force to draw the coating liquid out from the ejection port 11 acts, and the coating liquid in the coater 10 is maintained at a negative pressure The state. [Control Mode (Part 2)] Perform the initial discharging step of initial discharging of the coating liquid from the applicator 10, the wiping step of wiping the spray outlet 11 of the applicator 10, and the discharging outlet 11 is located on the substrate 7 The preparatory movement step of moving the coater 10 by the method directly above the coating start position (the edge of the substrate 7) is the same as the initial sending step (Figure 3(A)) and the wiping step in the above-mentioned control mode (Part 1) (FIG. 3(B)) and the pre-movement step (FIG. 3(C)) are performed in the same manner. In addition, the above-mentioned pre-processing is also the same as the control mode (Part 1) during the period before the preparation for movement step is completed. Then, the liquid attaching operation (liquid attaching step) that starts attaching the coating liquid to the substrate 7 is started. This liquid adhesion operation is the same as the liquid adhesion operation (liquid adhesion step) of the control mode (Part 1) shown in Figs. 4(A) to (C). The description of the same aspects as the control mode (Part 1) is omitted here. When the liquid adhering action is completed, a droplet 3 of the coating liquid is formed between the substrate 7 and the ejection port 11 (refer to FIG. 4(C)). Perform the liquid adhesion action. By opening the second valve 72 to communicate the second tank 41 with the applicator 10, the coating liquid sprayed from the nozzle 11 can be applied to the substrate 7 and then the coating in the applicator 10 can be applied. The pressure of the liquid is maintained at a fixed value (negative pressure). When the pressure of the coating liquid in the applicator 10 becomes negative due to the pressure of the coating liquid in the second tank 41, in the above control mode (Part 1), close the second valve 72 (refer to the figure) 5(A)), but in the control mode (Part 2), the second valve 72 is maintained in an open state (refer to FIG. 6(A)). Then, the coating operation (coating step) is performed. In this step, start to use the moving mechanism 20 (linear actuator 23) to move the applicator 10 in the horizontal direction, and connect the second tank 41 to the second tank 41 by controlling the pressure of the coating liquid in the second tank 41 The pressure of the coating liquid of the applicator 10 is maintained at a fixed value (a fixed negative pressure value), and further, the pump 30 can be used to supply the coating liquid to the applicator 10. That is, while the applicator 10 is moved in the horizontal direction by the moving mechanism 20, the pressure control by the second tank 41 and the pressure regulator 42 is performed by the control device 50, and the coating liquid is supplied by the pump 30 The supply control. The above-mentioned pressure control performed in the coating operation is to keep the pressure of the coating liquid in the second tank 41 at a set value, so that the pressure of the coating liquid in the applicator 10 becomes a specific (fixed) negative pressure value的控制。 The control. In addition, the above-mentioned supply control performed during the coating operation is feedback control based on the measured value of the pressure sensor 60. That is, the control device 50 constantly detects changes in the measured value of the pressure sensor 60, and when the change exceeds a threshold value (allowable value), the pump 30 supplies or sucks the coating liquid. Specifically, when the measured value obtained by the pressure sensor 60 decreases and the amount of change exceeds the threshold, the operation of supplying the coating liquid is performed, and when the measured value rises and the amount of change exceeds the threshold , Carry out the action of sucking the coating liquid. In this way, the control device 50 further stabilizes the pressure of the coating liquid of the applicator 10 by performing the adjustment operation of the supply or suction of the coating liquid by the pump 30. Moreover, in the control mode (Part 2), the moving speed of the applicator 10 is also fixed. Here, since the substrate 7 is circular, as described above (refer to FIG. 2), in the applicator 10 (ejection port 11), a portion where the substrate 7 exists directly below and a portion where the substrate 7 does not exist directly below are generated. In addition, the respective ranges of these portions vary according to the relative positions of the substrate 7 and the applicator 10. In addition, for the elongated ejection port 11, the coating liquid is ejected at the portion where the substrate 7 is present as shown in FIG. 2(B), while the coating liquid is not ejected at the portion where the substrate 7 is not present as shown in FIG. 2(C). The spray of coating liquid. Therefore, in order to move the applicator 10 at a fixed speed to apply the coating liquid on the circular substrate 7 and form a fixed film thickness on the substrate 7, the amount of the coating liquid that should be ejected from the ejection port 11 needs to be based on the coating The position of the device 10 relative to the substrate 7 is different. Therefore, control is performed such that, instead of sending a fixed amount of the coating liquid from the pump 30, the amount necessary to form a coating film with a fixed film thickness on the substrate 7 is sent out. Furthermore, in this control mode (Part 2), as described above, the supply or suction of the coating liquid by the pump 30 is controlled based on the measured value of the pressure sensor 60, and the pressure in the applicator 10 is adjusted. (Set as fixed). That is, the amount of the coating liquid sent from the pump 30 becomes an amount equivalent to the amount of the coating liquid (the above-mentioned necessary amount) that changes in accordance with the change (shape change) of the substrate 7 in the width direction, and by performing pressure-based The control of the measurement value of the sensor 60 is the sum of the amount of coating liquid supplied or sucked by the coating liquid. In the above control mode (Part 1), the amount of coating liquid sent from the pump 30 is set in the computer program stored in the control device 50 in advance, but in the control mode (Part 2), the coating liquid sent from the pump 30 The amount will vary from time to time according to the measured value of the pressure sensor 60. As described above, during the coating operation, the control device 50 performs the following control. That is, during the coating operation, in order to maintain the coating liquid in the coater 10 at a negative pressure, the pressure applying device 40 (the second tank 41 and the pressure regulator 42) performs the coating in the coater 10 The pressure of the liquid distribution is controlled, and based on the measurement result of the pressure sensor 60, the adjustment control including the supply and suction of the coating liquid by the pump 30 is performed. Furthermore, when the coating operation starts, the above-mentioned pre-processing is performed, and the pressure of the coating liquid of the applicator 10 is set to a negative pressure, and even if the coating operation starts, the pressure applying device 40 maintains the coating. The negative pressure of the applicator 10 is also controlled by the pump 30 based on the measurement result of the pressure sensor 60. Therefore, the pressure of the coating liquid of the applicator 10 maintains a negative pressure and maintains a fixed value. With this control, pressure control is performed to keep the pressure (negative pressure) in the coater 10 constant, and a uniform thickness of the coating film is formed on the substrate 7 (coated surface 8) of the capillary coating Control becomes easy. Moreover, in this embodiment, as shown in FIG. 6(B), in addition to the substrate 7 provided on the platform 9, there is also provided an edge portion of the substrate 7 (edge portion on the side where the coating is completed) adjacent to For the dummy plate 65, the applicator 10 moves along the substrate 7 and passes the coating end position of the substrate 7 (the edge of the substrate 7) until it reaches the dummy plate 65, and continues to spray the coating liquid. Then, when the coater 10 (discharge port 11) reaches a specific position of the dummy plate 65, the adjustment (discharge) of the coating liquid by the pump 30 is stopped, and the second valve 72 is closed. Then, although not shown, the applicator 10 is raised by the raising and lowering actuator 24, the first valve 71 is closed, and the third valve 73 is opened. Then, the pump 30 sucks the coating liquid in the first tank 35 for replenishment, and prepares for the next coating. In addition, the substrate 7 coated with the coating liquid is removed from the platform 9 and transported to the dryer. Furthermore, the dummy board 65 may be omitted and the coating operation may be ended as in the control mode (No. 1), and the dummy board 65 may be used in the control mode (No. 1). In this control mode (Part 2), both the first valve 71 of the pump control line L1 and the second valve 72 of the pressure control line L2 are set to an open state for control. If the pressure sensor 60 provided in the applicator 10 detects the pressure drop while the coating operation is being performed, the pump 30 can be used to supply a small amount of liquid to the applicator 10, so that the applicator The pressure within 10 returns to the original set value. By performing feedback control on this operation in a short time, the pressure in the applicator 10 can be kept constant. Furthermore, regarding the liquid supply amount by the pump 30, it can also be set to the amount corresponding to the predicted consumption of the coating liquid, but it is more preferable to set it when there is a difference between the set liquid supply amount and the actual liquid consumption amount. The adjusted value after feedback control. [Control Mode (Part 1) and (Part 2)] In the coating device 5 with the above-mentioned configuration, the control device 50 can selectively adopt one of the pump control circuit L1 and the pressure control circuit L2 according to the coating conditions Or both. That is, according to the coating conditions, the control mode (No. 1) or the control mode (No. 2) is selected alternatively. The coating conditions include, for example, the thickness of the film formed on the substrate 7, the coating speed (the moving speed of the coater 10), and the like. Furthermore, the liquid adhesion operation (liquid deposit method at the start of coating) performed in each of the control modes (Part 1) and (Part 2) will be described. As shown in Figure 4(A), in the state where the second valve 72 of the pressure control line L2 is set to off and the first valve 71 of the pump control line L1 is set to open, the coating is supplied from the pump 30 The coating liquid is slowly ejected from the applicator 10 with a small amount of coating liquid. At this time, the pressure in the applicator 10 changes from a negative pressure state to a positive pressure direction. Then, if the coating liquid ejected from the coater 10 adheres to the substrate 7 (refer to FIG. 4(B)), the coating liquid (droplet 3) connected between the coater 10 and the substrate 7 is caused by surface tension. In order to extend the adhesion, the force to draw the coating liquid from the applicator 10 is generated. With this force, the pressure in the applicator 10 changes to a negative pressure direction. If the pressure change in the applicator 10 is detected by the pressure sensor 60, the pressure control circuit L2 and the pump control circuit L1 are switched in the following manner. That is, based on the pressure change in the applicator 10, the pump 30 is stopped, and the second valve 72 of the pressure control line L2 is opened (refer to FIG. 4(C)). Thereby, the pressure in the applicator 10 becomes the pressure set in advance by the pressure control line L2 (the second tank 41). At this time, the time from the pressure change to the stop of the supply of the coating liquid by the pump 30 and the time from the pressure change to the opening of the second valve 72 can be used as a timer. The control of the set specific time is to control the amount of coating liquid sprayed from the coater 10 at the beginning of coating. After the second valve 72 is set to open, when the pump 30 is used for coating film thickness control (control mode (Part 1)), the second valve 72 is set to be closed again, and the pump 30 is used for coating liquid The supply. When the coating film thickness is controlled by pressure control (control mode (Part 2)), the second valve 72 is directly set to the open state, and the pressure fixed control corresponding to the set pressure is performed. Furthermore, when the coating liquid is adhered to the coating start portion of the substrate 7, the amount of the coating liquid to be ejected out of the coater 10 due to the capillary phenomenon is reduced by supplying the coating liquid by the pump 30 Suppression is the minimum necessary. In addition, by detecting the timing of the coating liquid deposition based on the pressure change of the applicator 10, even a small amount of the coating liquid can be ejected reliably, and a stable coating start portion can be obtained. Film thickness. As described above, in each of the above two control modes, the control device 50 is used to maintain the coating liquid in the applicator 10 at a negative pressure from the pump 30 during the coating operation. The coating liquid is supplied to the control of the coater 10. According to this configuration, during the coating operation, the pump 30 can be used to control the amount of the coating liquid supplied to the coater 10 to a specific amount, and it is possible to prevent the coating from being ejected from the coater 10 to the substrate 7 The amount of the coating liquid to be ejected from the ejection port 11 to the outside of the applicator 10 due to the surface tension of the liquid and the capillary phenomenon. Therefore, capillary coating can be performed in which the coating liquid can be ejected downward from the ejection port 11 to form a coating film of a desired thickness (uniform thickness) on the substrate 7 (coated surface 8). Moreover, by applying the coating method (capillary coating) performed by the coating device 5 to the manufacturing method of the product, it is possible to stably manufacture high-quality products with a coating film having a uniform thickness over the entire surface. . [Application conditions] As a coating liquid that can be applied to the coating device 5 described above, in terms of coating properties, a viscosity of 1 to 100,000 mPa·S and a Newtonian (Newtonian) is preferable, but it can also be used Applied to coating liquid with thixotropy. As an example of a coating liquid that can be specifically applied, in addition to a black matrix for color filters and a coating liquid for forming RGB color pixels, there are also the following: resist liquid, protective layer material, pillar forming material, etc. , Or coating liquid for adhesive layer for semiconductor, coating liquid for planarization, coating liquid for protective film, resist liquid, coating liquid for colored layer, coating liquid for fluorescent light-emitting layer, positive type for TFT Resist etc. As the substrate (member to be coated) 7, in addition to silicon wafers and glass, metal plates such as aluminum, ceramic plates, films, and the like can also be used. The shape of the substrate (coated member) 7 may be a rectangular shape, or may be a non-rectangular shape such as a circle. Furthermore, by arranging a plurality of non-rectangular substrates along the length direction of the coater 10, the substrates 7 can be coated simultaneously. Furthermore, as the coating conditions used, the coating speed is 0.1-100 mm/sec, more preferably 0.5-20 mm/sec, between the ejection port 11 of the coater 10 and the coated surface 8 of the substrate 7 The gap (slit gap) is 50 to 1000 μm, more preferably 100 to 500 μm, and the coating thickness in the wet state is 0.5 to 100 μm, more preferably 1 to 50 μm. [Embodiment 1] An embodiment when the control mode (Part 1) is adopted will be described. The coating device 5 shown in FIG. 1 is used to coat polyimide on a round silicon wafer with a diameter of f100 and a thickness of 0.53 mm. Polyimide has a viscosity of 4400 mPa·s and a solid content of 19%. As the coater 10, the length in the coating width direction (length direction, Y direction) of the ejection port 11 is 150 mm, and the gap (length in the X direction) of the ejection port 11 is 0.4 mm. In order to measure the pressure of the coating liquid in the reservoir 13 of the applicator 10, a pressure sensor 60 is provided. Furthermore, under the control of the ejection amount by the pump 30, the ejection amount corresponding to the change in the coating width is specified so that the wet film thickness becomes 40 μm, and the pressure in the coater 10 at the start of coating is -20 Coating is carried out under the conditions of Pa (gauge pressure) and coating speed of 0.5 mm/sec. The coated substrate 7 was dried for 10 minutes on a hot plate at 150°C. After drying, the coating conditions were observed. As a result, a coating film with a thickness of 8 μm was formed on the entire surface area of f100. The film thickness was not uniform within the range of 96 mm in diameter except the 2 mm range of the outer periphery of the coating. Good ±3% or less. [Embodiment 2] Another embodiment when the control mode (Part 2) is adopted will be described. With the coating device 5 shown in FIG. 1, a color photoresist is coated on a round silicon wafer with a diameter of f100 × a thickness of 0.53 mm. Color photoresist has a viscosity of 4 mPa·s and a solid content of 15%. As the coater 10, the length of the coating width direction (length direction, Y direction) of the ejection port 11 is 150 mm, and the gap (length in the X direction) of the ejection port 11 is 0.2 mm. In order to measure the pressure of the coating liquid in the reservoir 13 of the applicator 10, a pressure sensor 60 is provided. In addition, as the discharge amount control by constant pressure control, the correction of the pressure fluctuation in the applicator 10 is performed by the pump 30. Set the pressure in the coater 10 at the start of coating to -180 Pa (gauge pressure), and the coating speed is 2 mm/sec, with the variation of the ejection pressure as the threshold value, within 5 Pa In this way, the pump 30 is feedback controlled, and the coating action is performed at the same time. The coated substrate 7 was vacuum-dried to 65 Pa in 25 seconds for 60 seconds, and then dried on a hot plate at 120° C. for 10 minutes. The coating condition was observed after drying. As a result, a coating film with a thickness of 800 nm was formed on the entire surface area of f100. The film thickness was not uniform in the range of 96 mm in diameter except the 2 mm range of the outer periphery of the coating. Good ±3% or less. When the direction of spraying the coating liquid from the coater 10 (discharge port 11) is set downward as in the present embodiment (in the case of downward capillary coating), the coating in the coater 10 The meaning of setting the liquid to negative pressure lies in the following (1) and (2). (1) To prevent the coating liquid in the applicator 10 from flowing freely from the ejection port 11 (due to its own weight). (2) To adjust the thickness of the film formed on the substrate 7. Furthermore, the coating device 5 may be constructed in such a way that the ejection direction of the coating liquid becomes upward (including oblique upward). In this case (when the capillary is coated upward), although not shown, (if described with reference to FIG. 1), in the same state as when the ejection port 11 is downward, the ejection port 11 and its The coating liquid droplets are formed between the upper substrate 7 and the coating liquid in the vicinity of the ejection port 11 (the slit-shaped flow path 12) becomes a negative pressure. During this operation, the pressure value applied to the tank 41 by the pressure regulator 42 is a pressure value calculated based on the coating liquid near the ejection port 11 becoming a specific negative pressure, and may not be a negative pressure. Then, the coating operation is performed in this state. That is, during the coating operation, the control device 50 is used to supply the coating liquid from the pump 30 to the coater 10 while making the coating liquid near the ejection port 11 in the coater 10 a negative pressure.的控制。 The control. Specifically, control is performed to supply the coating liquid corresponding to the amount of the coating liquid ejected from the ejection port 11 from the pump 30 to the applicator 10. That is, the coating operation based on the above-mentioned control mode (Part 1) is performed. Moreover, the control device 50 also has the following function, that is, the pressure applying device 40 controls the pressure of the coating liquid in the coater 10 to maintain the coating liquid near the ejection port 11 in the coater 10 It is a negative pressure, and the adjustment control of the coating liquid by the pump 30 is performed based on the measurement result of the pressure sensor 60. That is, the coating operation based on the above-mentioned control mode (Part 2) can also be performed. Furthermore, in the case of the upward capillary coating, the significance of making the coating liquid near the ejection port 11 in the applicator 10 a negative pressure lies in the above (2). [Supplementary Note] The implementation form disclosed this time is illustrative in all respects and not restrictive. The scope of the patent application of the present invention is not limited to the above-mentioned embodiments, and includes all changes within the scope equivalent to the composition described in the scope of the patent application. In the above-mentioned embodiment, the coated member is a single-piece substrate 7, but it may not be a single-piece but a continuous member.

3‧‧‧Droplets of coating liquid ‧‧Applicator 11‧‧‧Ejection port 12‧‧‧Slit flow path 13‧‧‧Reservoir 20‧‧‧Moving mechanism 21‧‧‧Track 22‧‧‧Moving block 23‧‧‧Linear actuation Actuator 24‧‧‧Lift actuator 30‧‧‧Pump 35‧‧‧First tank 40‧‧‧Pressure applying device 41‧‧‧Second tank 42‧‧‧Pressure regulator 50‧‧‧Control device 60 ‧‧‧Pressure sensor 65‧‧‧Dummy plate 71‧‧‧First valve 72‧‧‧Second valve 73‧‧‧Third valve 81‧‧‧Piping 82‧‧‧Piping 83‧‧‧Piping D ‧‧‧Diameter L1‧‧‧Pump control circuit L2‧‧‧Pressure control circuit W‧‧‧Width dimension

Fig. 1 is a schematic configuration diagram illustrating the overall configuration of the coating device. Figure 2 (A) ~ (C) are explanatory diagrams of the coater and the substrate. 3(A) to (C) are explanatory diagrams explaining the coating method. 4(A) to (C) are explanatory diagrams explaining the coating method. Fig. 5 (A) and (B) are explanatory diagrams explaining the coating method. Fig. 6 (A) and (B) are explanatory diagrams explaining the coating method.

3‧‧‧Drops of coating liquid

5‧‧‧Coating device

6‧‧‧Installation abutment

7‧‧‧Substrate (component to be coated)

8‧‧‧Coated surface

9‧‧‧Platform

10‧‧‧Applicator

11‧‧‧Ejection outlet

12‧‧‧Slit flow path

13‧‧‧Accumulation Department

20‧‧‧Mobile mechanism

21‧‧‧Orbit

22‧‧‧movable block

23‧‧‧Linear actuator

24‧‧‧Lift actuator

30‧‧‧Pump

35‧‧‧The first pot

40‧‧‧Pressure giving device

41‧‧‧The second pot

42‧‧‧Pressure Regulator

50‧‧‧Control device

60‧‧‧Pressure Sensor

71‧‧‧First valve

72‧‧‧Second valve

73‧‧‧Third valve

81‧‧‧Piping

82‧‧‧Piping

83‧‧‧Piping

L1‧‧‧Pump control circuit

L2‧‧‧Pressure control circuit

Claims (12)

A coating device comprising: an applicator having a storage portion for storing a coating liquid, an ejection port for ejecting the coating liquid, and a slit-like flow path connecting the storage portion and the ejection port, and The ejection port ejects the coating liquid to the member to be coated; a moving mechanism that makes the applicator and the member to be coated relatively move in a direction parallel to the coated surface of the member to be coated; a pump, which passes and The pipe to which the applicator is connected is connected to the applicator and supplies the coating liquid to the reservoir; and a control device that performs the relative movement on one side and ejects the coating from the ejection port toward the member to be coated During the coating operation of the cloth liquid, control is performed during the entire process of the coating operation to maintain the coating liquid in the reservoir at a negative pressure while supplying the coating liquid from the pump to the applicator; And equipped with: a tank which stores the coating liquid and is connected to the above-mentioned applicator; and a pressure regulator which adjusts the pressure of the coating liquid in the above-mentioned tank to a negative pressure so that the coating liquid in the storage part The pressure becomes negative pressure; and in order to form droplets formed by the coating liquid between the coated member and the ejection port, the pressure regulator adjusts the pressure of the coating liquid in the tank, and the pressure of the coating liquid in the tank is adjusted by the above The influence of pressure sets the pressure of the coating liquid in the reservoir to a negative pressure; the control device, in the state where the liquid droplets are formed, performs the relative movement from the ejection port to the coated member During the coating action of spraying the coating liquid, proceed It is used to maintain the negative pressure of the coating liquid in the reservoir caused by the influence of the pressure, while controlling the supply of the coating liquid from the pump to the applicator. The coating device of claim 1, wherein the control device performs control for supplying the coating liquid corresponding to the amount of coating liquid ejected from the ejection port from the pump to the coating device during the coating operation . The coating device of claim 1, wherein the tank and the pressure regulator constitute a pressure applying device for applying pressure to the coating liquid in the applicator; The pressure of the coating liquid in the coating device is measured; and the control device controls the pressure of the coating liquid in the coating device by the pressure applying device to maintain the coating liquid in the coating device at a negative pressure, And based on the measurement result of the pressure sensor, the adjustment control of the coating liquid using the pump is performed. The coating device of claim 2, wherein the tank and the pressure regulator constitute a pressure applying device for applying pressure to the coating liquid in the coating device; The pressure of the coating liquid in the coating device is measured; and the control device controls the pressure of the coating liquid in the coating device by the pressure applying device to maintain the coating liquid in the coating device at a negative pressure, And based on the measurement result of the pressure sensor, the adjustment control of the coating liquid using the pump is performed. The coating device according to any one of claims 1 to 4, wherein the control device supplies the coating liquid to the applicator by the pump so as to start attaching the coating liquid to the coated member In the adhesion operation, after the pressure of the coating liquid in the applicator is increased by the supply, if the pressure drop is detected, the supply of the coating liquid by the pump is stopped. The coating device of claim 5, further comprising: a valve capable of connecting and blocking the coating device and the tank; and the control device is configured to block the coating device and the tank by the valve In the connected state, the coating liquid is supplied to the applicator by the pump, and if the pressure drop is detected later, the supply of the coating liquid by the pump is stopped, and the valve is operated to make the tank and the The spreader is connected. A coating method, which is a method for capillary coating by spraying a coating liquid from the nozzle of a coating device to a member to be coated, the coating device having a reservoir for storing the coating liquid, and spraying the coating liquid The ejection port, and the slit-shaped flow path connecting the reservoir and the ejection outlet; and the coating liquid can be supplied to the reservoir from a pump connected to the applicator through a pipe connected to the applicator ; And the coating method performs the following coating action: while the applicator and the coated member are relatively moved in a direction parallel to the coated surface of the coated member, and on the same side from the ejection port The member to be coated sprays the coating liquid, and during the coating operation, the coating liquid in the reservoir is maintained at a negative pressure during the entire process of the coating operation, and the coating liquid is supplied from the pump to the The coater; and the tank that stores the coating liquid is connected to the coater, and the pressure regulator can be used to The pressure of the coating liquid in the tank is adjusted to a negative pressure, so that the pressure of the coating liquid in the reservoir becomes a negative pressure; wherein, in order to form the coating liquid between the coated member and the ejection port The pressure regulator adjusts the pressure of the coating liquid in the tank, and the pressure of the coating liquid in the reservoir is set to a negative pressure by the influence of the pressure; In the state, during the coating operation, while maintaining the negative pressure of the coating liquid in the reservoir due to the influence of the pressure, the coating liquid is supplied from the pump to the applicator. The coating method according to claim 7, wherein during the coating operation, the coating liquid corresponding to the amount of the coating liquid ejected from the ejection port is supplied from the pump to the applicator. Such as the coating method of claim 7, which measures the pressure of the coating liquid in the applicator by a pressure sensor, and controls the pressure of the coating liquid in the applicator to control the pressure in the applicator. The coating liquid is maintained at a negative pressure, and the adjustment control of the coating liquid by the pump is performed based on the measurement result of the pressure sensor. Such as the coating method of claim 8, which measures the pressure of the coating liquid in the applicator by a pressure sensor, and controls the pressure of the coating liquid in the applicator to control the pressure in the applicator. The coating liquid is maintained at a negative pressure, and the adjustment control of the coating liquid by the pump is performed based on the measurement result of the pressure sensor. The coating method according to any one of claims 7 to 10, wherein the coating liquid is supplied to the applicator by the pump so as to perform the liquid adhering action to start adhering the coating liquid to the member to be coated, and After the pressure of the coating liquid in the applicator is increased by this supply, if the pressure drop is detected, the supply of the coating liquid by the pump is stopped. The coating method of claim 11, wherein a valve is provided in the applicator, the valve is connected to the tank storing the coating liquid through a pipe, and the applicator can be connected to and blocked from the tank, In the state where the communication between the applicator and the tank is blocked by the valve, the coating liquid is supplied to the applicator by the pump, and if the pressure drop is detected later, the supply by the pump is stopped The coating liquid is applied, and the valve is operated to connect the tank and the applicator.

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