TWI351136B - - Google Patents
Info
- Publication number
- TWI351136B TWI351136B TW094137911A TW94137911A TWI351136B TW I351136 B TWI351136 B TW I351136B TW 094137911 A TW094137911 A TW 094137911A TW 94137911 A TW94137911 A TW 94137911A TW I351136 B TWI351136 B TW I351136B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004315522 | 2004-10-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200633313A TW200633313A (en) | 2006-09-16 |
TWI351136B true TWI351136B (zh) | 2011-10-21 |
Family
ID=36227892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094137911A TW200633313A (en) | 2004-10-29 | 2005-10-28 | Probe member for wafer inspection, probe card for wafer inspection and wafer inspection equipment |
Country Status (5)
Country | Link |
---|---|
US (1) | US7656176B2 (zh) |
EP (1) | EP1806589A4 (zh) |
KR (1) | KR101167750B1 (zh) |
TW (1) | TW200633313A (zh) |
WO (1) | WO2006046650A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000258495A (ja) * | 1999-03-12 | 2000-09-22 | Oki Electric Ind Co Ltd | 半導体デバイス試験装置 |
KR100929244B1 (ko) * | 2007-05-28 | 2009-12-01 | 주식회사 코리아 인스트루먼트 | 프로브 시트, 이를 포함하는 프로브 카드 및 이의 제조방법 |
JP5424675B2 (ja) * | 2008-03-18 | 2014-02-26 | キヤノン株式会社 | 半導体装置の製造方法及び半導体装置 |
JP5314683B2 (ja) * | 2008-06-02 | 2013-10-16 | 株式会社アドバンテスト | プローブウエハ、プローブ装置および試験システム |
KR101204941B1 (ko) * | 2012-04-27 | 2012-11-27 | 주식회사 아이에스시 | 전극지지부를 가지는 테스트용 소켓 및 그 테스트용 소켓의 제조방법 |
TWI491897B (zh) * | 2013-01-03 | 2015-07-11 | 矽品精密工業股份有限公司 | 半導體元件之測試裝置及測試方法 |
US10361105B2 (en) | 2014-12-03 | 2019-07-23 | Kla-Tencor Corporation | Determining critical parameters using a high-dimensional variable selection model |
JP6537905B2 (ja) * | 2015-06-30 | 2019-07-03 | 日本航空電子工業株式会社 | コネクタ |
KR20180049427A (ko) * | 2016-11-01 | 2018-05-11 | 솔브레인멤시스(주) | 다공성 도전부를 구비하는 이방 도전성 시트 및 그 제조 방법 |
JP7018368B2 (ja) * | 2018-07-12 | 2022-02-10 | 東京エレクトロン株式会社 | 検査装置及び検査装置の清浄化方法 |
KR102427089B1 (ko) * | 2020-05-27 | 2022-07-29 | 주식회사 아이에스시 | 전기접속용 커넥터 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5828226A (en) * | 1996-11-06 | 1998-10-27 | Cerprobe Corporation | Probe card assembly for high density integrated circuits |
JPH11160356A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Ind Co Ltd | ウェハ一括型測定検査用プローブカードおよびセラミック多層配線基板ならびにそれらの製造方法 |
JP3898363B2 (ja) * | 1998-11-29 | 2007-03-28 | Hoya株式会社 | ウエハ一括コンタクトボード用多層配線基板、該多層配線基板に接続するコネクタ、及びそれらの接続構造、並びに検査装置 |
JP2000258495A (ja) | 1999-03-12 | 2000-09-22 | Oki Electric Ind Co Ltd | 半導体デバイス試験装置 |
JP4083350B2 (ja) | 1999-06-30 | 2008-04-30 | Hoya株式会社 | バンプ付きメンブレンリングの製造方法 |
JP2001056347A (ja) * | 1999-08-20 | 2001-02-27 | Hoya Corp | コンタクト部品及びその製造方法 |
JP2002184821A (ja) | 2000-12-12 | 2002-06-28 | Jsr Corp | シート状コネクターおよびその製造方法並びにプローブ装置 |
DE60238824D1 (de) | 2001-02-09 | 2011-02-17 | Jsr Corp | "anisotroper leitfähiger verbinder, herstellungsverfahren dafür und sondenglied" |
KR100441578B1 (ko) | 2001-07-24 | 2004-07-23 | 제이에스알 가부시끼가이샤 | 이방도전성 쉬이트 및 커넥터 |
JP2003092317A (ja) | 2001-09-19 | 2003-03-28 | Jsr Corp | シート状コネクターおよびプローブ装置 |
JP2004053409A (ja) * | 2002-07-19 | 2004-02-19 | Matsushita Electric Ind Co Ltd | プローブカード |
US7131851B2 (en) | 2002-08-09 | 2006-11-07 | Jsr Corporation | Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method |
DE60315059T2 (de) | 2002-08-09 | 2008-04-17 | Jsr Corp. | Prüfverbinder mit anisotroper leitfähigkeit |
JP3685192B2 (ja) | 2002-08-09 | 2005-08-17 | Jsr株式会社 | 異方導電性コネクターおよび導電性ペースト組成物、プローブ部材並びにウエハ検査装置およびウエハ検査方法 |
JP4140423B2 (ja) | 2003-04-09 | 2008-08-27 | 株式会社井上製作所 | 湿式媒体分散装置及びそれに用いる攪拌ディスク |
TWI239685B (en) | 2003-05-13 | 2005-09-11 | Jsr Corp | Flaky probe, its manufacturing method and its application |
JP3649245B2 (ja) * | 2003-05-13 | 2005-05-18 | Jsr株式会社 | シート状プローブの製造方法 |
JP2006118942A (ja) | 2004-10-20 | 2006-05-11 | Jsr Corp | シート状プローブおよびその製造方法並びにその応用 |
-
2005
- 2005-10-27 EP EP05799029A patent/EP1806589A4/en not_active Withdrawn
- 2005-10-27 KR KR1020077009615A patent/KR101167750B1/ko active IP Right Grant
- 2005-10-27 US US11/718,065 patent/US7656176B2/en active Active
- 2005-10-27 WO PCT/JP2005/019799 patent/WO2006046650A1/ja not_active Application Discontinuation
- 2005-10-28 TW TW094137911A patent/TW200633313A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20070072551A (ko) | 2007-07-04 |
WO2006046650A1 (ja) | 2006-05-04 |
US7656176B2 (en) | 2010-02-02 |
EP1806589A4 (en) | 2012-02-29 |
TW200633313A (en) | 2006-09-16 |
EP1806589A1 (en) | 2007-07-11 |
KR101167750B1 (ko) | 2012-07-23 |
US20090140756A1 (en) | 2009-06-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |