TWI350213B - - Google Patents

Info

Publication number
TWI350213B
TWI350213B TW096104999A TW96104999A TWI350213B TW I350213 B TWI350213 B TW I350213B TW 096104999 A TW096104999 A TW 096104999A TW 96104999 A TW96104999 A TW 96104999A TW I350213 B TWI350213 B TW I350213B
Authority
TW
Taiwan
Application number
TW096104999A
Other languages
Chinese (zh)
Other versions
TW200740530A (en
Inventor
Yoshida Junichi
Masuichi Mikio
Takamura Yukihiro
Ueno Hiroyuki
Kawagoe Masafumi
Matsuka Tsuyoshi
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006050726A external-priority patent/JP4789652B2/ja
Priority claimed from JP2006050727A external-priority patent/JP5116978B2/ja
Priority claimed from JP2006091060A external-priority patent/JP4780656B2/ja
Priority claimed from JP2006091061A external-priority patent/JP4656578B2/ja
Priority claimed from JP2006094263A external-priority patent/JP4656580B2/ja
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200740530A publication Critical patent/TW200740530A/zh
Application granted granted Critical
Publication of TWI350213B publication Critical patent/TWI350213B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electroluminescent Light Sources (AREA)
TW096104999A 2006-02-27 2007-02-12 Coating device and coating method TW200740530A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006050726A JP4789652B2 (ja) 2006-02-27 2006-02-27 塗布装置
JP2006050727A JP5116978B2 (ja) 2006-02-27 2006-02-27 塗布方法および塗布装置
JP2006091060A JP4780656B2 (ja) 2006-03-29 2006-03-29 塗布装置
JP2006091061A JP4656578B2 (ja) 2006-03-29 2006-03-29 塗布装置および塗布方法
JP2006094263A JP4656580B2 (ja) 2006-03-30 2006-03-30 塗布装置

Publications (2)

Publication Number Publication Date
TW200740530A TW200740530A (en) 2007-11-01
TWI350213B true TWI350213B (ko) 2011-10-11

Family

ID=38614252

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096104999A TW200740530A (en) 2006-02-27 2007-02-12 Coating device and coating method

Country Status (3)

Country Link
KR (1) KR100840482B1 (ko)
CN (1) CN101912833B (ko)
TW (1) TW200740530A (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009130008A (ja) * 2007-11-21 2009-06-11 Toray Eng Co Ltd 塗布装置及びその基板保持方法
JP5276338B2 (ja) * 2008-02-27 2013-08-28 東レエンジニアリング株式会社 塗布装置
JP5750385B2 (ja) * 2012-02-27 2015-07-22 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置
CN105964488B (zh) * 2016-05-30 2019-12-03 中国科学院半导体研究所 带基片加热和气氛处理的匀胶机
JP6739786B2 (ja) * 2016-05-30 2020-08-12 武蔵エンジニアリング株式会社 液体材料吐出装置、その塗布装置および塗布方法
CN110523558A (zh) * 2019-08-28 2019-12-03 昆山工研院新型平板显示技术中心有限公司 一种涂布机构

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6514344B2 (en) * 1999-12-16 2003-02-04 Tokyo Electron Limited Film forming unit
JP3849921B2 (ja) * 2001-09-26 2006-11-22 大日本スクリーン製造株式会社 基板処理装置
MY133543A (en) * 2002-01-24 2007-11-30 Three Bond Co Ltd Material application apparatus
JP4313026B2 (ja) * 2002-11-08 2009-08-12 株式会社ヒラノテクシード 毛管現象による塗工ノズルを用いた有機ｅｌパネルの製造装置及び製造方法
JP2005013787A (ja) * 2003-06-23 2005-01-20 Tokyo Electron Ltd 塗布成膜装置及び塗布成膜方法
JP4805555B2 (ja) * 2004-07-12 2011-11-02 株式会社東芝 塗布装置及び塗布方法

Also Published As

Publication number Publication date
CN101912833A (zh) 2010-12-15
KR20070089039A (ko) 2007-08-30
TW200740530A (en) 2007-11-01
KR100840482B1 (ko) 2008-06-20
CN101912833B (zh) 2012-10-10

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees