TWI350213B - - Google Patents
Info
- Publication number
- TWI350213B TWI350213B TW096104999A TW96104999A TWI350213B TW I350213 B TWI350213 B TW I350213B TW 096104999 A TW096104999 A TW 096104999A TW 96104999 A TW96104999 A TW 96104999A TW I350213 B TWI350213 B TW I350213B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006050726A JP4789652B2 (ja) | 2006-02-27 | 2006-02-27 | 塗布装置 |
JP2006050727A JP5116978B2 (ja) | 2006-02-27 | 2006-02-27 | 塗布方法および塗布装置 |
JP2006091060A JP4780656B2 (ja) | 2006-03-29 | 2006-03-29 | 塗布装置 |
JP2006091061A JP4656578B2 (ja) | 2006-03-29 | 2006-03-29 | 塗布装置および塗布方法 |
JP2006094263A JP4656580B2 (ja) | 2006-03-30 | 2006-03-30 | 塗布装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200740530A TW200740530A (en) | 2007-11-01 |
TWI350213B true TWI350213B (ko) | 2011-10-11 |
Family
ID=38614252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096104999A TW200740530A (en) | 2006-02-27 | 2007-02-12 | Coating device and coating method |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100840482B1 (ko) |
CN (1) | CN101912833B (ko) |
TW (1) | TW200740530A (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009130008A (ja) * | 2007-11-21 | 2009-06-11 | Toray Eng Co Ltd | 塗布装置及びその基板保持方法 |
JP5276338B2 (ja) * | 2008-02-27 | 2013-08-28 | 東レエンジニアリング株式会社 | 塗布装置 |
JP5750385B2 (ja) * | 2012-02-27 | 2015-07-22 | 株式会社Screenホールディングス | 塗布装置 |
CN105964488B (zh) * | 2016-05-30 | 2019-12-03 | 中国科学院半导体研究所 | 带基片加热和气氛处理的匀胶机 |
JP6739786B2 (ja) * | 2016-05-30 | 2020-08-12 | 武蔵エンジニアリング株式会社 | 液体材料吐出装置、その塗布装置および塗布方法 |
CN110523558A (zh) * | 2019-08-28 | 2019-12-03 | 昆山工研院新型平板显示技术中心有限公司 | 一种涂布机构 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6514344B2 (en) * | 1999-12-16 | 2003-02-04 | Tokyo Electron Limited | Film forming unit |
JP3849921B2 (ja) * | 2001-09-26 | 2006-11-22 | 大日本スクリーン製造株式会社 | 基板処理装置 |
MY133543A (en) * | 2002-01-24 | 2007-11-30 | Three Bond Co Ltd | Material application apparatus |
JP4313026B2 (ja) * | 2002-11-08 | 2009-08-12 | 株式会社ヒラノテクシード | 毛管現象による塗工ノズルを用いた有機elパネルの製造装置及び製造方法 |
JP2005013787A (ja) * | 2003-06-23 | 2005-01-20 | Tokyo Electron Ltd | 塗布成膜装置及び塗布成膜方法 |
JP4805555B2 (ja) * | 2004-07-12 | 2011-11-02 | 株式会社東芝 | 塗布装置及び塗布方法 |
-
2006
- 2006-12-08 KR KR1020060124240A patent/KR100840482B1/ko not_active IP Right Cessation
-
2007
- 2007-02-12 TW TW096104999A patent/TW200740530A/zh not_active IP Right Cessation
- 2007-02-27 CN CN2010102668071A patent/CN101912833B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101912833A (zh) | 2010-12-15 |
KR20070089039A (ko) | 2007-08-30 |
TW200740530A (en) | 2007-11-01 |
KR100840482B1 (ko) | 2008-06-20 |
CN101912833B (zh) | 2012-10-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BRPI0720064A2 (ko) | ||
BRMU8603216U8 (ko) | ||
BRPI0715824A8 (ko) | ||
BRPI0713487A2 (ko) | ||
BR122016023444A2 (ko) | ||
BRPI0708307B8 (ko) | ||
CH2121272H1 (ko) | ||
TWI350213B (ko) | ||
AT504380A8 (ko) | ||
BY9789C1 (ko) | ||
CN300725925S (zh) | 童装(3791) | |
CN300725920S (zh) | 童装(3754) | |
CN300725932S (zh) | 童装(3829) | |
CN300729933S (zh) | 交流接触器(hc1-16s/22s) | |
CN300729633S (zh) | 时钟(cd674) | |
CN300725931S (zh) | 童装(3815) | |
CN300725944S (zh) | 童装(3890) | |
CN300725927S (zh) | 童装(3795) | |
CN300727557S (zh) | 移动硬盘 | |
CN300729415S (zh) | 包装盒(合桃酥) | |
CN300725912S (zh) | 童装(3706) | |
CN300725913S (zh) | 童装(3712) | |
CN300725914S (zh) | 童装(3714) | |
CN300725915S (zh) | 童装(3728) | |
CN300725916S (zh) | 童装(3732) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |