TWI348976B - - Google Patents

Info

Publication number
TWI348976B
TWI348976B TW094144646A TW94144646A TWI348976B TW I348976 B TWI348976 B TW I348976B TW 094144646 A TW094144646 A TW 094144646A TW 94144646 A TW94144646 A TW 94144646A TW I348976 B TWI348976 B TW I348976B
Authority
TW
Taiwan
Application number
TW094144646A
Other languages
Chinese (zh)
Other versions
TW200621526A (en
Inventor
Koji Miyoshi
Toshiya Shintani
Mikio Minonishi
Original Assignee
Komatsu Ind Corp
Komatsu Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ind Corp, Komatsu Mfg Co Ltd filed Critical Komatsu Ind Corp
Publication of TW200621526A publication Critical patent/TW200621526A/en
Application granted granted Critical
Publication of TWI348976B publication Critical patent/TWI348976B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B29C33/306—Exchangeable mould parts, e.g. cassette moulds, mould inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
TW094144646A 2004-12-20 2005-12-16 Stamper attaching device and thermal transfer press machine TW200621526A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004368552A JP4469713B2 (en) 2004-12-20 2004-12-20 Stamper mounting device and thermal transfer press machine

Publications (2)

Publication Number Publication Date
TW200621526A TW200621526A (en) 2006-07-01
TWI348976B true TWI348976B (en) 2011-09-21

Family

ID=36601617

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094144646A TW200621526A (en) 2004-12-20 2005-12-16 Stamper attaching device and thermal transfer press machine

Country Status (5)

Country Link
JP (1) JP4469713B2 (en)
KR (1) KR100861972B1 (en)
CN (1) CN101084102B (en)
TW (1) TW200621526A (en)
WO (1) WO2006068016A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI760093B (en) * 2021-01-27 2022-04-01 大陸商業成科技（成都）有限公司 Thermoforming device

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101342802B (en) * 2008-08-20 2010-12-22 友达光电股份有限公司 Device for temperature control
TWI395655B (en) * 2009-01-16 2013-05-11 Chenming Mold Ind Corp Microstructure forming device and method thereof
JPWO2010089867A1 (en) * 2009-02-05 2012-08-09 パイオニア株式会社 Transfer apparatus and transfer method
TW201038385A (en) * 2009-02-17 2010-11-01 Idemitsu Unitech Co Ltd Method and apparatus for manufacturing optical member having surface shape
JP5431878B2 (en) * 2009-11-09 2014-03-05 株式会社浅野研究所 Mold fixing apparatus, thermoforming apparatus, mold fixing method, and thermoforming method
KR100974822B1 (en) * 2009-12-15 2010-08-09 주식회사 광성테크 Method and apparatus for pressing nickel base thin film for forming melamine sheet
CN102275445A (en) * 2010-06-13 2011-12-14 中芯国际集成电路制造(上海)有限公司 Imprinting device for pattern formation
CN103373052A (en) * 2012-05-08 2013-10-30 襄阳金飞环彩色包装有限公司 Combined gold-stamping embossing pressure compensation plate-adjusting-free technology
KR101472042B1 (en) * 2013-10-25 2014-12-24 (주)에스더블유몰드텍 Mold for light guide plate injection-molding
JP6421980B2 (en) * 2015-03-02 2018-11-14 パナソニックＩｐマネジメント株式会社 Imprint device
CN107877886A (en) * 2017-10-08 2018-04-06 刘道灵 A kind of gas phase differential prepares the device of embossment wallpaper
JP2019126923A (en) * 2018-01-22 2019-08-01 トヨタ自動車株式会社 Molding die, molding apparatus, molding method, and manufacturing method of resin product

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3686186B2 (en) * 1996-10-22 2005-08-24 旭化成ケミカルズ株式会社 Mold for resin molding and molding method using the same
JPH11156891A (en) * 1997-11-26 1999-06-15 Chatani Sangyo Kk Production of light guide plate, mold member, and plate-shaped member
JP4209602B2 (en) * 2001-06-22 2009-01-14 株式会社名機製作所 Optical product press molding apparatus and press molding method
JP4266328B2 (en) * 2002-06-17 2009-05-20 株式会社ナガセインテグレックス Transfer device
JP3920188B2 (en) * 2002-10-08 2007-05-30 株式会社名機製作所 Molding method using optical product mold
JP2004322358A (en) * 2003-04-22 2004-11-18 Sons Engineering Co Ltd Mold and mold protecting sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI760093B (en) * 2021-01-27 2022-04-01 大陸商業成科技（成都）有限公司 Thermoforming device

Also Published As

Publication number Publication date
KR20070092966A (en) 2007-09-14
JP2006175617A (en) 2006-07-06
TW200621526A (en) 2006-07-01
CN101084102A (en) 2007-12-05
JP4469713B2 (en) 2010-05-26
WO2006068016A1 (en) 2006-06-29
CN101084102B (en) 2011-01-26
KR100861972B1 (en) 2008-10-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees