KR20070092966A - Stamper attaching apparatus and thermal transfer press machine - Google Patents

Abstract

Through holes (231 (231A, 231B)) are formed on stamper holders 23 (23A, 23B)) at positions corresponding to the entire plane of stampers (24 (24A, 24B)). The through holes (231 (231A, 231B)) are communicated by communicating grooves (232 (232A, 232B)), and are communicated with suction holes 222 (222A, 222B)) on the both sides of temperature adjusting plates (22 (22A, 22B)). Since the stampers (24 (24A, 24B) can be held by suction over the entire plane, uplift at a center part of the stampers (24 (24A, 24B)) is prevented. Further, since the stampers 24 (24A, 24B)) well adhere to the temperature adjusting plates (22 (22A, 22B)) through the stamper holders (23 (23A, 23B)), heating and cooling efficiencies are improved.

Description

STAMPER ATTACHING APPARATUS AND THERMAL TRANSFER PRESS MACHINE}

The present invention relates to a stamper attachment device and a heat transfer press machine equipped with the stamper attachment device.

In recent years, the heat transfer press machine which transfers the stamper which has a fine uneven | corrugated surface to a primary-molded resin plate by heating it is developed (for example, refer patent document 1). In this heat transfer press machine, an air passage is formed in the mold in order to attach the stamper to the mold, and the stamper is attracted to the mold by sucking the periphery of the stamper from the air passage.

However, in this heat transfer press machine, since the periphery of the stamper is attracted, the center portion cannot be sucked well, and the stamper rises, and the center portion of the stamper cannot be sufficiently heated. Therefore, good transfer performance may not be obtained. In particular, in the case of thermal transfer to a large-size material that the thermal transfer press machine is confident of, the problem becomes more serious because the size of the stamper also increases.

As a method of solving the problem of the rise of the stamper, a method of sucking the entire stamper surface is considered. For example, even in an injection molding machine in which a molten resin is injected to obtain a molded article, a stamper having fine irregularities is formed in a mold to form irregularities on the surface of the injection molded article. In such an injection molding machine, through holes are formed at equal intervals in a region where the stamper is disposed in the mold, and the stamper is sucked into the mold by sucking air from these through holes (see Patent Document 2, for example).

[Patent Document 1] Japanese Unexamined Patent Publication No. 2003-1705 (Page 3, Figs. 1 and 2)

[Patent Document 2] Japanese Unexamined Patent Publication No. 2004-130515 (Figs. 1 and 2)

However, in this injection molding machine, a fluid passage is formed inside the mold to heat or cool the mold. Therefore, the through holes for adsorbing the stampers should be formed to avoid the formation positions of these fluid passages. That is, on the contrary, since the fluid passage must be formed to avoid the formation position of the through hole, a sufficient number of fluid passages cannot be secured, resulting in a poor heating and cooling efficiency of the mold. For this reason, heating or cooling of a metal mold | die takes time, and the cycle time of shaping | molding becomes long. Therefore, even if this structure is applied to a heat transfer press machine, it is very difficult to shorten the cycle time because of poor heating and cooling efficiency.

SUMMARY OF THE INVENTION An object of the present invention is to provide a stamper attachment device capable of satisfactorily preventing bumps from rising, and to improve heating and cooling efficiency, and a heat transfer press machine including the stamper attachment device.

The stamper attachment device of the present invention is a stamper attachment device for attaching a stamper to a thermal transfer press machine that transfers the uneven pattern of the stamper to the substrate, and is attached to the thermal transfer press machine, and a temperature control plate for adjusting the stamper to a predetermined temperature; And a stamper holder disposed between the temperature control plate and the stamper, wherein the stamper holder is provided with a plurality of through holes for air suction throughout the area in which the stamper is in contact, and at least one of the temperature control plate and the stamper holder is provided. A communication path communicating with the through hole is formed.

According to the present invention, a through hole is formed in the stamper holder, and a communication path is formed in at least one of the temperature control plate and the stamper holder. Therefore, when the air in the communication path is sucked, the stamper is passed through the communication path and the through hole. It is attracted to the stamper holder side and is attracted to the stamper holder. At this time, since the through hole is formed over the entire area where the stamper is in contact, the entire surface of the stamper is adsorbed by the stamper holder to prevent the stamper from rising. In addition, the stamper holder is attracted to the temperature control plate by sucking air in the communication path. As a result, the heat from the temperature control plate is well transmitted to the center of the stamper, and when the press is performed by the heat transfer press machine, the uneven pattern of the stamper is transferred to the substrate well.

Further, since the through hole covering the entire area of the stamper is formed in the stamper holder, it is not necessary to form the through hole in a position corresponding to the center portion of the stamper, for example. Therefore, the temperature of the stamper can be adjusted by using the entire surface of the temperature control plate, so that the heating and cooling efficiency of the stamper is good. In addition, even when the temperature adjustment of the temperature regulating plate is performed with a fluid and a fluid passage through which the fluid flows is formed inside the temperature regulating plate, it is not necessary to form the through hole while avoiding the fluid passage, thus forming a plurality of fluid passages. It becomes possible to do this, and heating and cooling efficiency become favorable also by this.

In the stamper attachment device of the present invention, the communication path is preferably a communication groove formed on a surface of the stamper holder opposite to the temperature control plate.

According to the present invention, since the communication path is a communication groove, a groove may be formed on the surface of the stamper holder by an appropriate method such as etching, and the formation of the communication path is simpler than when the communication path is formed of a hole. Done. In addition, since the communication path is formed on the surface opposite to the temperature control plate of the stamper holder, the communication path is not exposed on the surface opposite to the stamper. Therefore, even when the stamper is pressed onto the substrate by a thermal transfer press machine, there is no fear that the shape of the communication groove is transferred to the substrate, and the transfer quality is good.

In the stamper attachment device of the present invention, it is preferable that the through holes are arranged at substantially equal intervals, and the communication path communicates the plurality of through holes.

According to the present invention as described above, since the through holes are arranged at substantially equal intervals, the holding performance of the stamper is stabilized, and the adsorption of the stamper is assured. In addition, since the communication path communicates with the plurality of through holes, the number of the communication paths is reduced with respect to the number of the through holes, the configuration of the stamper holder and / or the temperature control plate is simplified, and the production is simplified.

In the stamper attachment device of the present invention, it is preferable that the temperature control plate is formed with a fluid passage through which a temperature adjusting fluid flows, and a plate through hole communicating with a communication path is formed outside the region where the fluid passage is formed. .

According to the present invention as described above, since the plate through hole is formed outside the area of the fluid passage, the area and dimensions of the fluid passage required for temperature adjustment of the temperature regulating plate are secured. Also in this case, since the entire stamper surface is adsorbed by the communication path and the through hole, the stamper is reliably attached while ensuring the performance of the temperature control plate satisfactorily.

In the stamper attachment device of the present invention, it is preferable that a plate communication groove is formed on the surface of the temperature control plate facing the stamper holder to communicate with the plurality of communication paths and plate through holes.

According to the present invention as described above, since the plate communication groove is formed in the temperature control plate, the plurality of communication paths communicate with each other by the plate communication groove. Therefore, even when the stamper has a large dimension and a large number of through holes are formed in the stamper holder, for example, a plurality of communication paths are formed, and the end of the communication path is extended to the plate communication groove so that the stamper suction passage can be easily formed. It can be secured. In addition, when the plurality of plate through holes communicate with each other by the plate communication grooves, the air pressure in the plate through holes can be made uniform, and the suction force of the stamper can be made uniform.

The heat transfer press machine of the present invention is provided with the stamper attachment device of the present invention described above.

According to this invention, since the heat transfer press machine is provided with the above-mentioned stamper attachment apparatus, the same effect as the above-mentioned stamper attachment apparatus is acquired, the protuberance of the center part of a stamper is prevented, and a stamper is reliable to a heat transfer press machine. Is attached. Therefore, since heat is well transmitted to the stamper, temperature control is assured and transfer performance of the uneven pattern is good.

BRIEF DESCRIPTION OF THE DRAWINGS The front view which shows the whole of the thermal transfer press machine which concerns on one Embodiment of this invention.

It is a front view which shows the stamper attachment apparatus which concerns on the said embodiment.

3 is a plan view showing a stamper holder according to the embodiment.

4 is an enlarged cross-sectional view showing a part of a stamper holder according to the embodiment.

5 is another enlarged cross-sectional view showing a part of the stamper holder according to the embodiment.

(Explanation of symbols for the main parts of the drawing)

One … Thermal transfer press machine 22 (22A, 22B). Thermostatic plate

23 (23A, 23B). Stamper holder 24 (24A, 24B). Stamper

222 (222A, 222B). Suction Hole (Plate Through Hole)

223 (223A, 223B). Plate communication grooves 231 (231A, 231B). Through hole

232 (232A, 232B). Communication grooves.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of this invention is described based on drawing.

In FIG. 1, the front view of the heat transfer press machine 1 which concerns on one Embodiment of this invention is shown. In this embodiment, the thermal transfer press machine 1 manufactures the light guide plate used for the backlight of a liquid crystal display by thermal-transferring an uneven | corrugated pattern to a base material.

In Fig. 1, the heat transfer press machine 1 has four apolites 11 (two of which are shown in Fig. 1) mounted on the bed 10 and on the upper surface of the apolite 11. The crown 12 to be installed, the slide 13 installed below the crown 12, the bolster 14 disposed on the bed 10 opposite the slide 13, and the slide 13 below A stamper attachment device 20 (20A) installed on the side to attach the stamper 24 (24A), and a stamper attachment device 20 (20B) installed on the bolster 14 to attach the stamper 24 (24B). ) And stampers 24 (24A, 24B).

Inside the crown 12, a slide drive device for moving the slide 13 up and down is built-in. When the slide 13 is moved up and down by the slide drive device, the stamper 24 (24A, 24B) is closely spaced and stamper. The base material (not shown) arrange | positioned between 24 (24A, 24B) is pressed.

2, the stamper attachment apparatus 20 (20A, 20B) of the heat transfer press machine 1 is shown. In this FIG. 2, the stamper attachment apparatus 20 (20A, 20B) is arrange | positioned on the lower surface and the bolster 14 of the slide 13, respectively, and is provided in pair. These stamper attachment devices 20 (20A, 20B) are provided with vacuum suction members 15 and 16 provided on the lower surface of the slide 13 or the upper surface of the bolster 14, and the lower surface of the vacuum suction member 16. Alternatively, the heat insulating members 21 (21A and 21B) provided on the upper surface of the vacuum suction member 15 and the temperature control plates 22 (22A and 22B provided on the lower surface or the upper surface of the heat insulating materials 21 (21A and 21B). )), A stamper holder 23 (23A, 23B) which is installed on the lower surface or the upper surface of the temperature control plates 22 (22A, 22B), and sucks and holds the stamper 24 (24A, 24B), and a vacuum. A vacuum device (air suction device) (not shown) connected to the suction members 15 and 16 and the stamper 24 when the thermal transfer press machine 1 presses the vacuum device (air suction device), which are not shown, and are installed on the vacuum suction members 15 and 16. (24A, 24B) The press vacuum apparatus 25 which makes a periphery a vacuum is provided.

In the vacuum suction members 15 and 16, air suction passages 151 and 161 are formed, respectively. The passages 151, 161 have openings 152, 162 on the side surfaces of the vacuum suction members 15, 16, and a vacuum device is connected to these openings 152, 162. The passages 151, 161 are formed substantially parallel to the surfaces of the vacuum suction members 15, 16, and are formed in a substantially rectangular shape at a position corresponding to the outer circumferential portion of the region where the heat insulating materials 21 (21A, 21B) contact. have. A plurality of passages 153 and 163 are formed in the middle of the passages 151 and 161 along the thickness direction of the vacuum suction members 15 and 16. These passages 153, 163 communicate with the outside of the passages 151, 161 and the vacuum suction members 15, 16, and face the heat insulating material 21 (21A, 21B) in the vacuum suction members 15, 16. It is open to the surface of the side.

The heat insulating material 21 (21A, 21B) has a predetermined thickness, and is interposed between the vacuum suction members 15, 16 and the temperature control plates 22 (22A, 22B). These heat insulating materials 21 (21A, 21B) prevent the transfer of heat from the temperature control plates 22 (22A, 22B) to the vacuum suction members 15, 16. The heat insulating material 21 (21A, 21B) is formed with a plurality of through holes 211 (211A, 211B) penetrating in the thickness direction at positions corresponding to the openings of the passages 153, 163 of the vacuum suction members 15, 16. It is.

The temperature control plates 22 (22A, 22B) are flat members having a thickness of about 8 mm to 10 mm, and one surface (upper surface) is closely attached to the heat insulating material 21 (21A, 21B). Inside the temperature control plates 22 (22A, 22B), fluid passages 221 (221A, 221B) are formed in which the temperature control fluid flows in the center in the thickness direction. The fluid passages 221 (221A, 221B) are formed in a circular cross section having a diameter of about 5 mm, are formed substantially parallel to the surface of the temperature control plates 22 (22A, 22B), and are approximately parallel to each other. It is arrange | positioned at the pitch of 7 mm. By circulating fluid inside these fluid passages 221 (221A, 221B), the temperature control plates 22 (22A, 22B) are adjusted to a predetermined temperature to heat and / or the stamper 24 (24A, 24B). Cool.

Here, the fluid passages 221 (221A, 221B) have good heat transfer of the fluid to the temperature control plates 22 (22A, 22B) so that the heating and / or cooling of the stamper 24 (24A, 24B) is quick. It is preferable that the inner circumferential area of the fluid passages 221 (221A, 221B) be set so as to be large. In other words, the diameter dimension of the fluid passages 221 (221A, 22B) is preferably set as large as possible. On the other hand, since the temperature control plate is pressurized between the slide 13 and the bolster 14, it is necessary to ensure some strength. Therefore, the materials and dimensions of the temperature control plates 22 (22A, 22B), the cross-sectional dimensions of the fluid passages 221 (221A, 221B), the pitch of the arrangement, and the like are preferably set in consideration of these conditions. Do.

As the fluid to be passed through the fluid passages 221 (221A, 221B), for example, a fluorine-based inert liquid such as perfluoropolyether, or a fluid such as water or steam can be employed.

Through-holes 211 (211A, 211B) of the heat insulating material 21 (21A, 21B) outside the region where the fluid passages 221 (221A, 221B) are formed in the temperature control plates 22 (22A, 22B). Suction holes 222 (222A, 222B) as plate through holes are formed at positions corresponding to the respective positions. The suction holes 222 (222A and 222B) are formed to have a diameter of about 5.0 mm.

Plate communication grooves 223 communicating with the opening portions of the suction holes 222 (222A, 222B) on the surface of the temperature control plate 22 (22A, 22B) facing the stamper holders 23 (23A, 23B). 223A, 223B) are formed. These plate communication grooves 223 (223A, 223B) are arranged on both sides in the longitudinal direction of the outer side of the region where the stampers 24 (24A, 24B) are disposed, as shown by the dashed-dotted line in FIG. A plurality of suction holes 222 (222A, 222B) communicate with each other by these two plate communication grooves 223 (223A, 223B). In this way, since the plurality of suction holes 222 (222A, 222B) communicate with each other at a position close to the stamper holder 23 (23A, 23B), the respective suction holes when the air is sucked by the vacuum apparatus. The suction force by (222 (222A, 222B)) is averaged by these plate communication grooves 223 (223A, 223B) to obtain a uniform suction force. In addition, the width dimension of the plate communication groove 223 (223A, 223B) is set to about 1.5 mm in this embodiment. In addition, the depth dimension of the plate communication groove 223 (223A, 223B) is set to about 2 mm.

Here, the suction holes 222 (222A, 222B) are disposed outside the region where the fluid passages 221 (221A, 221B) are formed. That is, since the suction holes 222 (222A, 222B) are not formed in the region where the stampers 24 (24A, 24B) are attached, more fluid passages 221 (221A, 221B) can be arranged. . Therefore, the heat of the fluid can be transferred to the temperature control plates 22 (22A, 22B) well, and the heat transfer efficiency of the temperature control plates 22 (22A, 22B) can be improved.

3 shows a plan view of the stamper holders 23 (23A, 23B). 3, the stamper holder 23 (23A, 23B) is a thin plate-shaped member made of nickel, and the through-holes 231 (231A, 231B) over the entire region where the stampers 24 (24A, 24B) are disposed. Is formed. The through holes 231 (231A, 231B) are disposed at substantially equal intervals vertically and horizontally at predetermined intervals. In this embodiment, the hole diameter of the through holes 231 (231A, 231B) is about 0.3 mm, and the plurality of through holes 231 (231A, 231B) are formed at a pitch (predetermined interval) of about 10 mm.

Here, it is preferable that the stamper holder 23 (23A, 23B) is comprised as thin as possible in order to improve heat transfer rate. In this embodiment, the stamper holder 23 (23A, 23B) is set to the thickness of about 0.25 mm. In addition, the hole diameter of the through holes 231 (231A, 231B) is preferably set equal to or smaller than the thickness dimension of the stamper 24 (24A, 24B). When set to such a dimension, when the stamper 24 (24A, 24B) is pressed to a base material, the shape of the through hole 23 (23A, 23B) can be prevented from being transferred to a base material.

The material of the stamper holders 23 (23A, 23B) is preferably selected from materials of the same coefficient of thermal expansion as the stampers 24 (24A, 24B) in order to prevent misalignment with the stampers 24 (24A, 24B). It is preferable, and more preferably, it is good to consist of the same material. In this embodiment, the stamper holders 23 (23A, 23B) and the stampers 24 (24A, 24B) are both made of nickel which is the same material.

4 is an enlarged cross-sectional view showing a part of the stamper holder 23 (23A, 23B). 5 is another expanded sectional view which shows a part of stamper holder 23 (23A, 23B). 4 is a cross-sectional view taken along line IV-IV of FIG. 3, and FIG. 5 is a cross-sectional view taken along line V-V of FIG. 3. As shown in these FIG. 4, FIG. 5, and FIG. 3 mentioned above, the surface which opposes the temperature control plate 22 (22A, 22B) in the stamper holder 23 (23A, 23B) has several through-holes ( Communication grooves (communication paths) 232 (232A, 232B) communicating with 231 (231A, 231B) are formed. These communication grooves 232 communicate with a plurality of through holes 231 (231A, 231B) arranged in a straight line along the thickness direction of the stamper 24 (24A, 24B), and the plurality of communication grooves 232 (232A). , 232B) are arranged almost parallel to each other. Both ends of these communication grooves 232 (232A, 232B) are disposed at positions corresponding to the plate communication grooves 223 (223A, 223B) of the temperature control plates 22 (22A, 22B), respectively.

When the stamper holders 23 (23A, 23B) are superimposed on the temperature control plates 22 (22A, 22B) by the communication grooves 232 (232A, 232B) having such a shape, the communication grooves 232 (232A, 232B) are disposed. Both ends of)) communicate with the plate communication grooves 223 (223A, 223B). Therefore, the suction holes 222 (222A, 222B) and the plurality of communication grooves 232 (232A, 232B) communicate with each other by the plate communication groove 223.

In addition, since the communication grooves 232 (232A, 232B) are formed not on the surface facing the stamper 24 (24A, 24B), but on the surface facing the temperature control plate 22 (22A, 22B) on the opposite side, When transferring the uneven patterns of the stamper 24 (24A, 24B) to the substrate, the shape of the communication grooves 232 (232A, 232B) can be prevented from being transferred to the substrate. In addition, since the plurality of through holes 231 (231A, 231B) communicate with the communication grooves 232 (232A, 232B), the communication grooves 232 (for the number of formation of the through holes 231 (231A, 231B). 232A, 232B) can be reduced, so that the manufacture of the stamper holders 23 (23A, 23B) can be simplified, and the reduction in the strength of the stamper holders 23 (23A, 23B) can be reduced. The shape of the communication grooves 232 (232A, 232B) can be prevented from being transferred to the base material more effectively.

Here, the dimension of the communication groove 232 (232A, 232B) is set so that the shape of the communication groove 232 (232A, 232B) is not transferred to the substrate when the stamper 24 (24A, 24B) is pressed on the substrate. The depth dimension and the width dimension of the communication grooves 232 (232A, 232B) are preferably 1/3 or less of the plate thickness of the stamper holders 23 (23A, 23B). In this embodiment, the dimension of the communication groove 232 (232A, 232B) is set to about 0.1 mm in width dimension, and about 0.05 mm in depth dimension. Further, such communication grooves 232 (232A, 232B) are formed by a suitable method such as etching.

In the stamper 24 (24A, 24B), a fine concavo-convex pattern is formed on the surface (surface) opposite to the surface of the stamper 24 (24A, 24B) that faces the stamper holder 23 (23A, 23B). The stampers 24 (24A, 24B) are made of nickel similarly to the stamper holders 23 (23A, 23B) and the thickness dimension is set to about 0.3 mm. In this embodiment, in order to create the light-guide plate for backlight of a liquid crystal display, although the uneven | corrugated pattern becomes a prism pattern, it is not limited to this as the uneven | corrugated pattern, It can employ | adopt arbitrarily according to the pattern to transfer, For example, a dot pattern etc. are mentioned. Can be.

The press vacuum apparatus 25 includes a pair of wall portions 251A and 251B attached to the vacuum suction members 15 and 16, vacuum packings 252A and 252B provided to the wall portions 251A and 251B, and a wall portion ( An air suction device (not shown) for vacuuming the area surrounded by 251A and 251B is provided. The wall portions 251A, 251B are stampers 24 (24A, 24B), stamper holders 23 (23A, 23B), temperature control plates 22 (22A, 22B), and heat insulating materials 21 (21A, 21B). It is arrange | positioned so that the outer periphery of and may protrude in the direction which mutually approaches. The vacuum packings 252A and 252B are provided at ends where the wall portion 251A and the wall portion 251B face each other.

Next, operation | movement of the heat transfer press machine 1 of such a structure is demonstrated.

First, when attaching the stamper 24 (24A, 24B) to the heat transfer press machine 1, the stamper holder 23 (23A, 23B) is placed on the upper or lower surface of the temperature control plate 22 (22A, 22B). And position the stamper 24 (24A, 24B) on the upper surface or the lower surface thereof. At this time, the outer circumferences of the stampers 24 (24A, 24B) and the stamper holders 23 (23A, 23B) are fixed with screws or tapes so that the positions of the stampers 24 (24A, 24B) and the stamper holders 23 (23A, 23B) do not deviate before adsorbing the stampers 24 (24A, 24B). Or by a suitable holding means such as providing a holding frame to the temperature control plates 22 (22A, 22B).

If a vacuum device draws air from the passages 151 and 161 of the vacuum suction members 15 and 16, the through holes 211 (211A and 211B) of the passages 151 and 161, the passages 153 and 163 and the heat insulating material 21 (21A and 21B). )), Suction holes 222 (222A, 222B), plate communication grooves 223 (223A, 223B), communication grooves 232 (232A, 232B), and through holes 231 (231A, 231B). Since air is sucked through, the stamper 24 (24A, 24B) is attached to the stamper holder 23 (23A, 23B), and the stamper holder 23 (23A, 23B) is mounted on the temperature control plate 22 (22A, 22B). ) Is adsorbed.

Since the stamper holder 23 (23A, 23B) and the stamper 24 (24A, 24B) are attached to the temperature control plates 22 (22A, 22B) by adsorbing, they are detached compared to the case where the conventional stamper is attached with double-sided tape, for example. This is greatly facilitated. Conventionally, when removing the double-sided tape, the stamper is bent when the double-sided tape is peeled off.However, the peeled stamper cannot be used.However, once the double-sided tape is attached, the stamper must be pressed for the life of the stamper to make the work process inflexible. There was. On the other hand, in this embodiment, since the stamper 24 (24A, 24B) is affixed by adsorption, it can prevent that the stamper 24 (24A, 24B) is damaged at the time of separation. In addition, since the replacement of the stamper 24 (24A, 24B) is easy, it is possible to flexibly cope with the production of small quantities of various kinds.

Further, since the through holes 231 (231A, 231B) of the stamper holders 23 (23A, 23B) are formed in the area corresponding to the entire surface of the stamper 24 (24A, 24B), the stamper 24 (24A) , 24B) can be uniformly adsorbed over the entire surface. Therefore, since the stamper 24 (24A, 24B) reliably and satisfactorily adheres to the stamper holders 23 (23A, 23B), the stamper 24 (24A, 24B) is removed from the temperature control plate 22 (22A, 22B). The heat transfer efficiency to 24B)) can be made favorable, and the heating and cooling efficiency of the stamper 24 (24A, 24B) can be made favorable. In addition, since the rise of the central portion of the stamper 24 (24A, 24B) can be prevented, the transfer quality can be improved.

Here, in the case where a through hole is formed in a conventional temperature control plate, for example, when using a stamper having a size smaller than the area where the through hole is formed, a through hole in which the stamper does not come into contact with the outside of the stamper occurs. In this case, the procedure which closes a through hole is needed, and a work becomes complicated. On the contrary, in the case of using a stamper having a size larger than the area where the through hole is formed, since the through hole is not disposed at the outer circumferential portion of the stamper, the outer circumferential portion cannot be adsorbed and the stamper cannot be reliably maintained. In addition, in the case of processing the through-hole in the temperature control plate, the machining must be performed by drilling or discharging, which makes the machining difficult and increases the machining cost by the number of through-holes.

On the other hand, in the stamper attachment apparatus 20 (20A, 20B) of this embodiment, the suction hole 222 is outer side of the fluid passage 221 (221A, 221B) in the temperature control plates 22 (22A, 22B). (222A, 222B) and plate communication grooves 223 (223A, 223B) are formed only, so that the through holes 231 (231A, 231B) for adsorbing the stampers 24 (24A, 24B) are stamper holders. It is formed in 23 (23A, 23B). Therefore, when using stampers of different sizes, it is sufficient to prepare a stamper holder according to the stamper's dimensions and to form through holes in accordance with the stamper's dimensions. Therefore, the stamper can be easily replaced, and the entire stamper surface can be adsorbed and held well regardless of the size of the stamper. Therefore, even if the uneven pattern is transferred to a substrate having a relatively large dimension, the transfer object can be favorably enlarged, thereby facilitating the enlargement of the transfer object.

In addition, since the processing of the through holes 231 (231A, 231B) and the communication grooves 232 (232A, 232B) to the stamper holders 23 (23A, 23B) can be easily performed by etching, the through holes 231 (231A, 231B) and the number of communication grooves 232 (232A, 232B) do not depend on the machining cost.

The heating fluid flows through the fluid passages 221 (221A, 221B) of the temperature control plates 22 (22A, 22B) to heat the temperature control plates 22 (22A, 22B) to a predetermined temperature. Here, the predetermined temperature refers to the heat transfer efficiency of the substrate and the heat transfer efficiency of the temperature control plates 22 (22A, 22B), the stamper holders 23 (23A, 23), and the stampers 24 (24A, 24B). In consideration of this, for example, when the base material is an acrylic resin, since the thermal softening temperature is about 95 ° C, the predetermined temperature is set to about 120 ° C to 140 ° C.

Here, since the stamper 24 (24A, 24B) is heated while the slide 13 is in the raised position, the entire surface of the stamper 24 (24A, 24B) is adsorbed and the stamper holder 23 (23A, 23B). Close contact with the temperature control plates 22 (22A, 22B) through)) is important for improving heat transfer efficiency.

Heat from the temperature regulating plate 22 (22A, 22B) is transferred to the stamper holders 23 (23A, 23B) and the stampers 24 (24A, 24B) to heat the stamper 24 (24A, 24B) to a predetermined temperature. do. When the substrate is disposed on the stamper 24 (24B) on the side of the bolster 14, the slide 13 is lowered by the slide driving device to approach the bolster 14. Then, the wall portions 251A and 251B are also close to each other, and the vacuum packings 252A and 252B come into contact with each other to enclose an area surrounded by the wall portions 251A and 251B. In this state, when the air inside the wall portions 251A and 251B is sucked by the air suction device, the area enclosed by the wall portions 251A and 251B becomes a vacuum, and the periphery of the stamper 24 (24A, 24B) also becomes a vacuum.

Thus, by pressing the vacuum device 25 around the stamper 24 (24A, 24B), the stamper 24 (24A, 24B) and the stamper 24 (24A, 24B) are pressed against the substrate. The air can be prevented from rolling in between the base materials. Thereby, the uneven | corrugated pattern of the stamper 24 (24A, 24B) can be favorably transferred to a base material, and generation | occurrence | production of problems, such as a defective transfer can be prevented.

At this time, even when the suction force of the stamper 24 (24A, 24B) is reduced by vacuuming the inside of the wall portions 251A, 251B, the outer periphery of the stamper 24 (24A, 24B) is maintained by appropriate holding means. Therefore, there is no fear that the stamper 24 (24A, 24B) may be separated or out of position.

Next, the slide 13 is further lowered to press (press) the stamper 24 (24A, 24B) against the substrate. A predetermined time is maintained at a predetermined pressure to soften only the surface of the substrate, thereby transferring the uneven pattern of the stamper 24 (24A, 24B) onto both sides of the substrate. In addition, when the stamper 24 (24A, 24B) comes into close contact with the substrate, the suction by the press vacuum device 25 may be stopped, and the interior of the wall portions 251A, 251B may be opened to the atmosphere.

When the surface of the substrate is softened and the uneven pattern is transferred, the fluid inside the fluid passages 221 (221A, 221B) of the temperature control plates 22 (22A, 22B) is replaced with a cooling fluid to convert the temperature control plate 22 ( 22A, 22B) are cooled to a predetermined temperature. Here, the predetermined temperature is considered in consideration of the heat transfer efficiency of the substrate material, the temperature control plates 22 (22A, 22B), the stamper holders 23 (23A, 23B), the stamper 24 (24A, 24B), and the like. It is suitably set, and when it is an acrylic resin, for example, it cools to about 70 degreeC-50 degreeC.

After the surface of the substrate is cooled and the resin is solidified, the slide 13 is lifted to release pressure, and the substrate on which the uneven pattern is transferred is taken out from the thermal transfer press machine 1.

In addition, this invention is not limited to embodiment mentioned above, The deformation | transformation, improvement, etc. in the range which can achieve the objective of this invention are included in this invention.

Although the stamper was provided in both the bolster upper part and the slide lower part, it is not limited to this, You may be provided only in either one of the bolster upper part or the slide lower part. In this case, the thermal transfer press machine transfers the uneven pattern only on one side of the substrate.

The communication groove communicating with the through hole formed in the stamper holder was formed on the surface opposite to the temperature control plate in the stamper holder, but the present invention is not limited thereto, and the communication groove is formed on the surface opposite to the stamper holder in the temperature control plate. You may be. Alternatively, the communication groove may be formed in both the temperature control plate and the stamper holder. In short, the communication groove should just be formed in at least one of a temperature control plate and a stamper holder.

The communication path for communicating the through hole is not limited to the communication groove formed in at least one of the stamper holder and the temperature control plate, and may be, for example, a communication hole for communicating the through hole.

The plate communication groove may be formed in the stamper holder.

Although the best structure, method, etc. for implementing this invention are disclosed by the above description, this invention is not limited to this. In other words, the present invention is mainly shown and described specifically with respect to specific embodiments, but the embodiments, embodiments, shapes, materials, quantities, and the like of the embodiments described above without departing from the technical spirit and the desired range of the present invention. Various modifications can be added by those skilled in the art in other detailed configurations.

Accordingly, the descriptions limiting the shapes, materials, and the like described above are provided by way of example in order to facilitate understanding of the present invention, and are not intended to limit the present invention. The description by the name of a member beyond the limit of is included in the present invention.

The present invention can be used as a heat transfer press machine for producing a light guide plate for a backlight of a liquid crystal panel, and can also be used for a heat transfer press machine for manufacturing a separator of a fuel cell and a design plate, for example.

Claims (6)

A stamper attachment device for attaching the stamper to a thermal transfer press machine that transfers the uneven pattern of the stamper to the substrate: A temperature regulating plate installed in the thermal transfer press machine and adjusting the stamper to a predetermined temperature; and A stamper holder disposed between the temperature control plate and the stamper; The stamper holder is provided with a plurality of through holes for air suction over the entire area where the stamper is in contact; And at least one of said temperature control plate and said stamper holder is formed with a communication path communicating with said through hole. The stamper attachment device according to claim 1, wherein the communication path is a communication groove formed on a surface of the stamper holder opposite to the temperature control plate. The stamper attachment device according to claim 1 or 2, wherein the through holes are arranged at substantially equal intervals, and the communication path communicates with the plurality of through holes. According to any one of claims 1 to 3, wherein the temperature control plate is formed with a fluid passage through which the temperature control fluid flows, And a plate through hole communicating with the communication path outside the region where the fluid passage is formed. The stamper attachment apparatus according to claim 4, wherein a plate communication groove is formed on a surface of the temperature control plate facing the stamper holder to communicate with the plurality of communication paths and the plate through hole. The heat transfer press machine provided with the stamper attachment apparatus as described in any one of Claims 1-5.

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