TWI348342B - Method of setting reference value for examining substrate, and device and program using the same - Google Patents

Method of setting reference value for examining substrate, and device and program using the same

Info

Publication number
TWI348342B
TWI348342B TW096122979A TW96122979A TWI348342B TW I348342 B TWI348342 B TW I348342B TW 096122979 A TW096122979 A TW 096122979A TW 96122979 A TW96122979 A TW 96122979A TW I348342 B TWI348342 B TW I348342B
Authority
TW
Taiwan
Prior art keywords
program
same
reference value
setting reference
examining substrate
Prior art date
Application number
TW096122979A
Other languages
English (en)
Other versions
TW200814887A (en
Inventor
Kiyoshi Murakami
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of TW200814887A publication Critical patent/TW200814887A/zh
Application granted granted Critical
Publication of TWI348342B publication Critical patent/TWI348342B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
TW096122979A 2006-06-29 2007-06-26 Method of setting reference value for examining substrate, and device and program using the same TWI348342B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006180225A JP4697069B2 (ja) 2006-06-29 2006-06-29 基板検査のための基準値の設定方法、およびその方法を用いた装置ならびにプログラム

Publications (2)

Publication Number Publication Date
TW200814887A TW200814887A (en) 2008-03-16
TWI348342B true TWI348342B (en) 2011-09-01

Family

ID=38542115

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096122979A TWI348342B (en) 2006-06-29 2007-06-26 Method of setting reference value for examining substrate, and device and program using the same

Country Status (5)

Country Link
US (1) US7822566B2 (zh)
EP (1) EP1874107B1 (zh)
JP (1) JP4697069B2 (zh)
CN (1) CN100596267C (zh)
TW (1) TWI348342B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090306811A1 (en) * 2008-06-06 2009-12-10 Raytheon Company Ball grid array cleaning system
JP5625935B2 (ja) * 2011-01-18 2014-11-19 オムロン株式会社 判定基準値の適否判定方法およびその適正値の特定方法ならびに適正値への変更方法、部品実装基板の検査システム、生産現場におけるシミュレーション方法およびシミュレーションシステム
JP5721469B2 (ja) * 2011-02-28 2015-05-20 富士機械製造株式会社 部品実装方法および部品実装装置
JP5816532B2 (ja) * 2011-11-14 2015-11-18 富士機械製造株式会社 対基板作業支援装置
WO2012165277A1 (ja) * 2011-05-31 2012-12-06 富士機械製造株式会社 対基板作業支援装置
KR101241036B1 (ko) * 2011-11-04 2013-03-11 한국기술교육대학교 산학협력단 인쇄회로기판의 외관검사시스템
JP6524418B2 (ja) * 2016-02-04 2019-06-05 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法
JP6348137B2 (ja) 2016-03-24 2018-06-27 ファナック株式会社 工作物の良否を判定する加工機械システム
JP6661500B2 (ja) * 2016-09-16 2020-03-11 株式会社東芝 情報生成システム、装置、方法、及びプログラム
KR101893823B1 (ko) * 2016-10-04 2018-08-31 주식회사 고영테크놀러지 기판 검사장치 및 이를 이용한 기판의 왜곡 보상 방법
JP6840226B2 (ja) * 2017-03-30 2021-03-10 株式会社Ｆｕｊｉ 保守管理装置
EP3681259B1 (en) * 2017-09-08 2022-08-10 Fuji Corporation Substrate work machine
JP6988499B2 (ja) * 2018-01-16 2022-01-05 オムロン株式会社 検査管理システム、検査管理装置、検査管理方法
JP6988500B2 (ja) * 2018-01-16 2022-01-05 オムロン株式会社 検査管理システム、検査管理装置、検査管理方法
JP7035856B2 (ja) * 2018-07-03 2022-03-15 オムロン株式会社 検査方法、検査システム及びプログラム
JP7074865B2 (ja) * 2018-08-28 2022-05-24 株式会社Fuji 制御プログラムのチェック装置
CN112867906B (zh) * 2018-10-23 2022-11-22 株式会社富士 元件数据生成方法以及元件安装机
JP7358639B2 (ja) 2020-05-20 2023-10-10 ヤマハ発動機株式会社 部品実装システム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05108798A (ja) * 1991-10-17 1993-04-30 Shinko Electric Ind Co Ltd 画像処理方法と画像処理装置
US5564183A (en) * 1992-09-30 1996-10-15 Matsushita Electric Industrial Co., Ltd. Producing system of printed circuit board and method therefor
EP1909318A3 (en) * 1996-03-19 2009-12-09 Hitachi, Ltd. Process management system
JPH11298200A (ja) * 1998-04-10 1999-10-29 Nagoya Denki Kogyo Kk プリント基板の部品実装プロセスにおける自動品質管理方法およびその装置
JP3622749B2 (ja) * 2001-11-26 2005-02-23 オムロン株式会社 曲面性状検査方法およびこの方法を用いた基板検査装置
JP3882840B2 (ja) * 2004-03-01 2007-02-21 オムロン株式会社 はんだ印刷検査方法、およびこの方法を用いたはんだ印刷検査機ならびにはんだ印刷検査システム
JP4481192B2 (ja) * 2005-02-24 2010-06-16 ヤマハ発動機株式会社 検査条件管理システムおよび部品実装システム

Also Published As

Publication number Publication date
EP1874107B1 (en) 2012-02-08
JP4697069B2 (ja) 2011-06-08
TW200814887A (en) 2008-03-16
US7822566B2 (en) 2010-10-26
EP1874107A2 (en) 2008-01-02
CN100596267C (zh) 2010-03-24
CN101098619A (zh) 2008-01-02
EP1874107A3 (en) 2009-04-29
JP2008010666A (ja) 2008-01-17
US20080046210A1 (en) 2008-02-21

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees