TWI346672B - Conductor compositions for use in electronic circuits - Google Patents

Conductor compositions for use in electronic circuits

Info

Publication number
TWI346672B
TWI346672B TW093109112A TW93109112A TWI346672B TW I346672 B TWI346672 B TW I346672B TW 093109112 A TW093109112 A TW 093109112A TW 93109112 A TW93109112 A TW 93109112A TW I346672 B TWI346672 B TW I346672B
Authority
TW
Taiwan
Prior art keywords
electronic circuits
conductor compositions
conductor
compositions
circuits
Prior art date
Application number
TW093109112A
Other languages
English (en)
Other versions
TW200500403A (en
Inventor
Sarah Jane Mears
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200500403A publication Critical patent/TW200500403A/zh
Application granted granted Critical
Publication of TWI346672B publication Critical patent/TWI346672B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B39/00—Locking of screws, bolts or nuts
    • F16B39/02—Locking of screws, bolts or nuts in which the locking takes place after screwing down
    • F16B39/10—Locking of screws, bolts or nuts in which the locking takes place after screwing down by a plate, spring, wire or ring immovable with regard to the bolt or object and mainly perpendicular to the axis of the bolt
    • F16B39/101—Locking of screws, bolts or nuts in which the locking takes place after screwing down by a plate, spring, wire or ring immovable with regard to the bolt or object and mainly perpendicular to the axis of the bolt with a plate, spring, wire or ring holding two or more nuts or bolt heads which are mainly in the same plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y10S428/924—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • Y10T428/24909—Free metal or mineral containing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Conductive Materials (AREA)
  • Glass Compositions (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)
TW093109112A 2003-04-01 2004-04-01 Conductor compositions for use in electronic circuits TWI346672B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0307547.0A GB0307547D0 (en) 2003-04-01 2003-04-01 Conductor composition V

Publications (2)

Publication Number Publication Date
TW200500403A TW200500403A (en) 2005-01-01
TWI346672B true TWI346672B (en) 2011-08-11

Family

ID=9955991

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093109112A TWI346672B (en) 2003-04-01 2004-04-01 Conductor compositions for use in electronic circuits

Country Status (8)

Country Link
US (3) US7470380B2 (zh)
EP (1) EP1465209B1 (zh)
JP (1) JP2004311438A (zh)
KR (1) KR100603486B1 (zh)
CN (1) CN100358053C (zh)
DE (1) DE602004009237T2 (zh)
GB (1) GB0307547D0 (zh)
TW (1) TWI346672B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112005001527B4 (de) * 2004-07-06 2019-10-02 Murata Manufacturing Co., Ltd. Elektrisch leitfähige Paste und eine elektrisch leitfähige Paste aufweisendes keramisches Elektronikbauelment
US7556748B2 (en) * 2005-04-14 2009-07-07 E. I. Du Pont De Nemours And Company Method of manufacture of semiconductor device and conductive compositions used therein
US8895899B2 (en) * 2007-10-26 2014-11-25 Philippe Marquet Glazing comprising a network of conducting wires
CN102017014A (zh) * 2008-05-28 2011-04-13 E.I.内穆尔杜邦公司 包含光伏电池导体中所用的亚微米颗粒的组合物
EP2664503B1 (en) 2011-01-14 2018-03-07 Asahi Glass Company, Limited A method for producing a windowpane for vehicles
EP2771185B1 (en) 2011-10-28 2018-11-28 Corning Incorporated Glass articles with infrared reflectivity and methods for making the same
CA2813551C (en) 2012-04-20 2018-10-30 Goodrich Corporation Printed heating element
US9351398B2 (en) * 2013-04-04 2016-05-24 GM Global Technology Operations LLC Thick film conductive inks for electronic devices
CN104658633A (zh) * 2013-11-20 2015-05-27 湖南利德电子浆料有限公司 一种汽车玻璃热线用导电铜浆的配方及制备方法
WO2016176096A1 (en) 2015-04-30 2016-11-03 Corning Incorporated Electrically conductive articles with discrete metallic silver layers and methods for making same
EP3278959B1 (de) * 2016-08-01 2019-02-13 ROPEX Industrie-Elektronik GmbH Heizanordnung
JP6740995B2 (ja) * 2017-06-30 2020-08-19 株式会社デンソー 電気抵抗体、ハニカム構造体、および、電気加熱式触媒装置

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3583931A (en) 1969-11-26 1971-06-08 Du Pont Oxides of cubic crystal structure containing bismuth and at least one of ruthenium and iridium
US4366094A (en) 1981-02-02 1982-12-28 E. I. Du Pont De Nemours And Company Conductor compositions
US4381945A (en) * 1981-08-03 1983-05-03 E. I. Du Pont De Nemours And Company Thick film conductor compositions
US4510179A (en) 1981-08-18 1985-04-09 Matsushita Electric Industrial Co., Ltd. Electrode on heat-resisting and isolating substrate and the manufacturing process for it
US4459166A (en) * 1982-03-08 1984-07-10 Johnson Matthey Inc. Method of bonding an electronic device to a ceramic substrate
US4446059A (en) 1982-04-15 1984-05-01 E. I. Du Pont De Nemours & Co. Conductor compositions
JPS6166303A (ja) 1984-09-06 1986-04-05 太陽誘電株式会社 配線基板の製造方法
DE3770507D1 (de) 1986-03-31 1991-07-11 Hitachi Chemical Co Ltd Verfahren zur metallisierung von glasoberflaechen.
WO1992003030A1 (en) 1990-07-31 1992-02-20 Nfe Co., Ltd. Method of forming electrodes
US5162062A (en) 1991-06-17 1992-11-10 E. I. Du Pont De Nemours And Company Method for making multilayer electronic circuits
US5242623A (en) * 1991-08-13 1993-09-07 E. I. Du Pont De Nemours And Company Screen-printable thick film paste composition
US5302557A (en) 1991-12-03 1994-04-12 E. I. Du Pont De Nemours And Company Automotive glass thick film conductor paste
US5296413A (en) 1991-12-03 1994-03-22 E. I. Du Pont De Nemours And Company Automotive glass thick film conductor paste
JPH05235497A (ja) * 1992-02-20 1993-09-10 Murata Mfg Co Ltd 銅導電性ペースト
JPH0640821A (ja) 1992-07-24 1994-02-15 Toshiba Silicone Co Ltd 防カビ性ポリオルガノシロキサン組成物
US5376596A (en) * 1992-08-06 1994-12-27 Murata Manufacturing Co., Ltd. Conductive paste
US5378408A (en) 1993-07-29 1995-01-03 E. I. Du Pont De Nemours And Company Lead-free thick film paste composition
JPH07302510A (ja) 1994-05-10 1995-11-14 Sumitomo Metal Mining Co Ltd 導電ペースト組成物
JP3541070B2 (ja) * 1994-11-15 2004-07-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 自動車ガラスの厚膜導電体ペースト
JPH08148787A (ja) 1994-11-21 1996-06-07 Sumitomo Kinzoku Ceramics:Kk 厚膜ペースト
US5518663A (en) 1994-12-06 1996-05-21 E. I. Du Pont De Nemours And Company Thick film conductor compositions with improved adhesion
JPH08186049A (ja) * 1994-12-28 1996-07-16 Du Pont Kk 多層コンデンサー用端子電極組成物
GB9518033D0 (en) 1995-09-05 1995-11-08 Cookson Matthey Ceramics Plc Composition
JPH09139112A (ja) 1995-11-16 1997-05-27 Sumitomo Metal Mining Co Ltd 厚膜導体組成物
US5670089A (en) 1995-12-07 1997-09-23 E. I. Du Pont De Nemours And Company Conductive paste for MLC termination
JP3209089B2 (ja) * 1996-05-09 2001-09-17 昭栄化学工業株式会社 導電性ペースト
DE19647044A1 (de) 1996-11-14 1998-05-20 Degussa Paste für Einbrennschichten
EP0895252A1 (en) * 1997-07-29 1999-02-03 E.I. Du Pont De Nemours And Company Thick film silver termination composition
JP2000048642A (ja) 1998-07-24 2000-02-18 Murata Mfg Co Ltd 導電性ペースト及びガラス回路基板
JP3484983B2 (ja) 1998-07-28 2004-01-06 株式会社村田製作所 導電性ペースト及びガラス回路基板
JP3571957B2 (ja) * 1999-03-30 2004-09-29 松下電器産業株式会社 導体ペーストおよびセラミック多層基板の製造方法
US6787068B1 (en) * 1999-10-08 2004-09-07 E. I. Du Pont De Nemours And Company Conductor composition
GB9923882D0 (en) 1999-10-08 1999-12-08 Du Pont Chemical composition
US6228288B1 (en) * 2000-04-27 2001-05-08 Cts Corporation Electrically conductive compositions and films for position sensors
JP3534684B2 (ja) * 2000-07-10 2004-06-07 Ｔｄｋ株式会社 導電ペーストおよび外部電極とその製造方法
GB0108888D0 (en) 2001-04-09 2001-05-30 Du Pont Conductor composition IV
GB0108886D0 (en) 2001-04-09 2001-05-30 Du Pont Conductor composition II
GB0108887D0 (en) 2001-04-09 2001-05-30 Du Pont Conductor composition III
US20030178057A1 (en) * 2001-10-24 2003-09-25 Shuichi Fujii Solar cell, manufacturing method thereof and electrode material
US7074349B2 (en) * 2003-01-24 2006-07-11 E. I. Du Pont De Nemours And Company Terminal electrode compositions for multilayer ceramic capacitors
US7138347B2 (en) * 2003-08-14 2006-11-21 E. I. Du Pont De Nemours And Company Thick-film conductor paste for automotive glass
US7731868B2 (en) * 2007-04-12 2010-06-08 E.I. Du Pont De Nemours And Company Thick film conductive composition and process for use in the manufacture of semiconductor device

Also Published As

Publication number Publication date
EP1465209B1 (en) 2007-10-03
GB0307547D0 (en) 2003-05-07
DE602004009237T2 (de) 2008-07-10
US20090098350A1 (en) 2009-04-16
EP1465209A1 (en) 2004-10-06
US7470380B2 (en) 2008-12-30
US8257618B2 (en) 2012-09-04
KR20040088391A (ko) 2004-10-16
CN100358053C (zh) 2007-12-26
US20040222407A1 (en) 2004-11-11
TW200500403A (en) 2005-01-01
CN1536587A (zh) 2004-10-13
US20110220852A1 (en) 2011-09-15
DE602004009237D1 (de) 2007-11-15
JP2004311438A (ja) 2004-11-04
KR100603486B1 (ko) 2006-07-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees