DE3770507D1 - Verfahren zur metallisierung von glasoberflaechen. - Google Patents
Verfahren zur metallisierung von glasoberflaechen.Info
- Publication number
- DE3770507D1 DE3770507D1 DE8787302681T DE3770507T DE3770507D1 DE 3770507 D1 DE3770507 D1 DE 3770507D1 DE 8787302681 T DE8787302681 T DE 8787302681T DE 3770507 T DE3770507 T DE 3770507T DE 3770507 D1 DE3770507 D1 DE 3770507D1
- Authority
- DE
- Germany
- Prior art keywords
- glass surfaces
- metallizing
- metallizing glass
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011521 glass Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
- C03C17/10—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geochemistry & Mineralogy (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7383586A JPH06104579B2 (ja) | 1986-03-31 | 1986-03-31 | 結晶化ガラス表面の金属化法 |
JP19837986A JPH07493B2 (ja) | 1986-08-25 | 1986-08-25 | 結晶化ガラス表面の金属化法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3770507D1 true DE3770507D1 (de) | 1991-07-11 |
Family
ID=26414983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787302681T Expired - Lifetime DE3770507D1 (de) | 1986-03-31 | 1987-03-27 | Verfahren zur metallisierung von glasoberflaechen. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4859505A (de) |
EP (1) | EP0240268B1 (de) |
DE (1) | DE3770507D1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3641202A1 (de) * | 1986-12-03 | 1988-06-16 | Standard Elektrik Lorenz Ag | Metallkernleiterplatte als traeger fuer hf- und mikrowellenschaltkreise |
US5494721A (en) * | 1989-01-13 | 1996-02-27 | Hitachi, Ltd. | Magnetic disc substrate |
JP2886872B2 (ja) * | 1989-01-13 | 1999-04-26 | 株式会社日立製作所 | 磁気ディスク用基板および磁気ディスク |
JPH0692263B2 (ja) * | 1989-02-16 | 1994-11-16 | 伊藤忠商事株式会社 | 記録ディスク基板及びその製造方法 |
US5268071A (en) * | 1989-04-27 | 1993-12-07 | Nippon Sheet Glass | Process of producing a magnetic disk substrate |
EP0489601B1 (de) * | 1990-12-06 | 1997-11-05 | Fujitsu Limited | Kleine Glaselektrode und Verfahren für deren Herstellung |
US5626935A (en) * | 1993-05-19 | 1997-05-06 | Kabushiki Kaisya Ohara | Magnetic disk substrate and method for manufacturing the same |
US5744208A (en) * | 1994-06-24 | 1998-04-28 | Corning Incorporated | Glass-ceramics containing lithium disilicate and tridymite |
US5851366A (en) * | 1994-07-19 | 1998-12-22 | Corning Incorporated | Adhering metal to glass |
US6544583B2 (en) * | 2000-02-01 | 2003-04-08 | Trebor International, Inc. | Method for adjusting resistivity of a film heater |
US7081602B1 (en) | 2000-02-01 | 2006-07-25 | Trebor International, Inc. | Fail-safe, resistive-film, immersion heater |
US6663914B2 (en) * | 2000-02-01 | 2003-12-16 | Trebor International | Method for adhering a resistive coating to a substrate |
US6479094B2 (en) * | 2000-02-01 | 2002-11-12 | Trebor International, Inc. | Method for forming a resistor |
US6580061B2 (en) | 2000-02-01 | 2003-06-17 | Trebor International Inc | Durable, non-reactive, resistive-film heater |
US6674053B2 (en) | 2001-06-14 | 2004-01-06 | Trebor International | Electrical, thin film termination |
FI20000515A0 (fi) * | 2000-03-07 | 2000-03-07 | Heimo Ylaenen | Menetelmä bioaktiivisen lasin pinnan karhentamiseksi |
GB0307547D0 (en) * | 2003-04-01 | 2003-05-07 | Du Pont | Conductor composition V |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3093503A (en) * | 1959-12-29 | 1963-06-11 | Avco Corp | Coated materials having an undercut substrate surface and method of preparing same |
FR1361882A (fr) * | 1962-12-28 | 1964-05-29 | Ibm | Procédé de revêtement magnétique par voie non électrolytique |
GB1276550A (en) * | 1969-10-13 | 1972-06-01 | Croda Bowmans Chemicals Ltd | Etching compositions and uses thereof |
DE3332029C2 (de) * | 1982-09-16 | 1994-04-28 | Licentia Gmbh | Verfahren zur Beschichtung eines festen Körpers |
DE3345353A1 (de) * | 1983-12-15 | 1985-08-29 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren und metallisierung einer keramikoberflaeche |
US4666744A (en) * | 1984-05-10 | 1987-05-19 | Kollmorgen Technologies Corporation | Process for avoiding blister formation in electroless metallization of ceramic substrates |
-
1987
- 1987-03-27 DE DE8787302681T patent/DE3770507D1/de not_active Expired - Lifetime
- 1987-03-27 EP EP19870302681 patent/EP0240268B1/de not_active Expired - Lifetime
- 1987-03-31 US US07/032,248 patent/US4859505A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0240268B1 (de) | 1991-06-05 |
US4859505A (en) | 1989-08-22 |
EP0240268A1 (de) | 1987-10-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |