DE3770507D1 - Verfahren zur metallisierung von glasoberflaechen. - Google Patents

Verfahren zur metallisierung von glasoberflaechen.

Info

Publication number
DE3770507D1
DE3770507D1 DE8787302681T DE3770507T DE3770507D1 DE 3770507 D1 DE3770507 D1 DE 3770507D1 DE 8787302681 T DE8787302681 T DE 8787302681T DE 3770507 T DE3770507 T DE 3770507T DE 3770507 D1 DE3770507 D1 DE 3770507D1
Authority
DE
Germany
Prior art keywords
glass surfaces
metallizing
metallizing glass
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787302681T
Other languages
English (en)
Inventor
Hajime Nakayama
Kouichi Tsuyama
Toshiro Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7383586A external-priority patent/JPH06104579B2/ja
Priority claimed from JP19837986A external-priority patent/JPH07493B2/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE3770507D1 publication Critical patent/DE3770507D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886Multistep pretreatment
    • C23C18/1893Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C03C17/10Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemically Coating (AREA)
DE8787302681T 1986-03-31 1987-03-27 Verfahren zur metallisierung von glasoberflaechen. Expired - Lifetime DE3770507D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7383586A JPH06104579B2 (ja) 1986-03-31 1986-03-31 結晶化ガラス表面の金属化法
JP19837986A JPH07493B2 (ja) 1986-08-25 1986-08-25 結晶化ガラス表面の金属化法

Publications (1)

Publication Number Publication Date
DE3770507D1 true DE3770507D1 (de) 1991-07-11

Family

ID=26414983

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787302681T Expired - Lifetime DE3770507D1 (de) 1986-03-31 1987-03-27 Verfahren zur metallisierung von glasoberflaechen.

Country Status (3)

Country Link
US (1) US4859505A (de)
EP (1) EP0240268B1 (de)
DE (1) DE3770507D1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3641202A1 (de) * 1986-12-03 1988-06-16 Standard Elektrik Lorenz Ag Metallkernleiterplatte als traeger fuer hf- und mikrowellenschaltkreise
US5494721A (en) * 1989-01-13 1996-02-27 Hitachi, Ltd. Magnetic disc substrate
JP2886872B2 (ja) * 1989-01-13 1999-04-26 株式会社日立製作所 磁気ディスク用基板および磁気ディスク
JPH0692263B2 (ja) * 1989-02-16 1994-11-16 伊藤忠商事株式会社 記録ディスク基板及びその製造方法
US5268071A (en) * 1989-04-27 1993-12-07 Nippon Sheet Glass Process of producing a magnetic disk substrate
EP0489601B1 (de) * 1990-12-06 1997-11-05 Fujitsu Limited Kleine Glaselektrode und Verfahren für deren Herstellung
US5626935A (en) * 1993-05-19 1997-05-06 Kabushiki Kaisya Ohara Magnetic disk substrate and method for manufacturing the same
US5744208A (en) * 1994-06-24 1998-04-28 Corning Incorporated Glass-ceramics containing lithium disilicate and tridymite
US5851366A (en) * 1994-07-19 1998-12-22 Corning Incorporated Adhering metal to glass
US6544583B2 (en) * 2000-02-01 2003-04-08 Trebor International, Inc. Method for adjusting resistivity of a film heater
US7081602B1 (en) 2000-02-01 2006-07-25 Trebor International, Inc. Fail-safe, resistive-film, immersion heater
US6663914B2 (en) * 2000-02-01 2003-12-16 Trebor International Method for adhering a resistive coating to a substrate
US6479094B2 (en) * 2000-02-01 2002-11-12 Trebor International, Inc. Method for forming a resistor
US6580061B2 (en) 2000-02-01 2003-06-17 Trebor International Inc Durable, non-reactive, resistive-film heater
US6674053B2 (en) 2001-06-14 2004-01-06 Trebor International Electrical, thin film termination
FI20000515A0 (fi) * 2000-03-07 2000-03-07 Heimo Ylaenen Menetelmä bioaktiivisen lasin pinnan karhentamiseksi
GB0307547D0 (en) * 2003-04-01 2003-05-07 Du Pont Conductor composition V

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3093503A (en) * 1959-12-29 1963-06-11 Avco Corp Coated materials having an undercut substrate surface and method of preparing same
FR1361882A (fr) * 1962-12-28 1964-05-29 Ibm Procédé de revêtement magnétique par voie non électrolytique
GB1276550A (en) * 1969-10-13 1972-06-01 Croda Bowmans Chemicals Ltd Etching compositions and uses thereof
DE3332029C2 (de) * 1982-09-16 1994-04-28 Licentia Gmbh Verfahren zur Beschichtung eines festen Körpers
DE3345353A1 (de) * 1983-12-15 1985-08-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren und metallisierung einer keramikoberflaeche
US4666744A (en) * 1984-05-10 1987-05-19 Kollmorgen Technologies Corporation Process for avoiding blister formation in electroless metallization of ceramic substrates

Also Published As

Publication number Publication date
EP0240268B1 (de) 1991-06-05
US4859505A (en) 1989-08-22
EP0240268A1 (de) 1987-10-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee