TWI340616B - Manufacturing method of multi-layer print wiring and multi-layer print wiring board - Google Patents

Manufacturing method of multi-layer print wiring and multi-layer print wiring board

Info

Publication number
TWI340616B
TWI340616B TW094118689A TW94118689A TWI340616B TW I340616 B TWI340616 B TW I340616B TW 094118689 A TW094118689 A TW 094118689A TW 94118689 A TW94118689 A TW 94118689A TW I340616 B TWI340616 B TW I340616B
Authority
TW
Taiwan
Prior art keywords
print wiring
layer print
manufacturing
wiring board
layer
Prior art date
Application number
TW094118689A
Other languages
English (en)
Other versions
TW200614898A (en
Inventor
Hitoshi Takii
Noriki Hayashi
Yoshio Oka
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200614898A publication Critical patent/TW200614898A/zh
Application granted granted Critical
Publication of TWI340616B publication Critical patent/TWI340616B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW094118689A 2004-06-10 2005-06-07 Manufacturing method of multi-layer print wiring and multi-layer print wiring board TWI340616B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004172095 2004-06-10
JP2004368632 2004-12-21
JP2005052321A JP4305399B2 (ja) 2004-06-10 2005-02-28 多層プリント配線板の製造方法及び多層プリント配線板

Publications (2)

Publication Number Publication Date
TW200614898A TW200614898A (en) 2006-05-01
TWI340616B true TWI340616B (en) 2011-04-11

Family

ID=36960830

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118689A TWI340616B (en) 2004-06-10 2005-06-07 Manufacturing method of multi-layer print wiring and multi-layer print wiring board

Country Status (4)

Country Link
JP (1) JP4305399B2 (zh)
KR (1) KR101116079B1 (zh)
CN (1) CN1722940B (zh)
TW (1) TWI340616B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI559825B (zh) * 2015-02-18 2016-11-21 Panasonic Ip Man Co Ltd Printed wiring board and manufacturing method thereof

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4992310B2 (ja) * 2006-06-16 2012-08-08 富士通株式会社 積層基板の製造方法
KR20090058511A (ko) * 2006-09-22 2009-06-09 히다치 가세고교 가부시끼가이샤 광도파로의 제조방법
JP5217640B2 (ja) * 2008-05-30 2013-06-19 富士通株式会社 プリント配線板の製造方法およびプリント基板ユニットの製造方法
US8453322B2 (en) * 2008-08-14 2013-06-04 Ddi Global Corp. Manufacturing methods of multilayer printed circuit board having stacked via
CN101772267A (zh) * 2008-12-30 2010-07-07 深圳玛斯兰电路科技实业发展有限公司 一种高层板压制过程改善铜箔起皱的方法
JP5593863B2 (ja) 2010-06-09 2014-09-24 富士通株式会社 積層回路基板および基板製造方法
JP5581828B2 (ja) * 2010-06-09 2014-09-03 富士通株式会社 積層回路基板および基板製造方法
US9949360B2 (en) * 2011-03-10 2018-04-17 Mediatek Inc. Printed circuit board design for high speed application
JP5464760B2 (ja) * 2011-10-21 2014-04-09 株式会社フジクラ 多層回路基板の製造方法
US20140290997A1 (en) 2012-04-26 2014-10-02 Ngk Spark Plug Co., Ltd. Multilayer wiring substrate and manufacturing method thereof
CN103458629B (zh) * 2012-05-30 2016-12-21 碁鼎科技秦皇岛有限公司 多层电路板及其制作方法
CN103458630B (zh) * 2013-08-09 2016-12-28 高德（无锡）电子有限公司 一种克服印刷电路板覆铜基板薄板作业限制的方法
CN105518824A (zh) * 2013-09-06 2016-04-20 张于纯 液态玻璃的应用
CN107509316B (zh) * 2017-08-23 2023-07-07 苏州市吴通电子有限公司 一种pcb板孔除渣头
CN110366329A (zh) * 2018-04-10 2019-10-22 电连技术股份有限公司 一种多层基板的制造方法及多层基板
WO2023272650A1 (zh) * 2021-06-30 2023-01-05 华为技术有限公司 一种封装基板及其制作方法、芯片封装结构、电子设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4444435B2 (ja) * 2000-03-06 2010-03-31 ソニーケミカル＆インフォメーションデバイス株式会社 プリント配線基板及びプリント配線基板の製造方法
JP3826731B2 (ja) * 2001-05-07 2006-09-27 ソニー株式会社 多層プリント配線基板及び多層プリント配線基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI559825B (zh) * 2015-02-18 2016-11-21 Panasonic Ip Man Co Ltd Printed wiring board and manufacturing method thereof

Also Published As

Publication number Publication date
TW200614898A (en) 2006-05-01
CN1722940B (zh) 2010-08-11
CN1722940A (zh) 2006-01-18
KR101116079B1 (ko) 2012-02-13
JP2006203148A (ja) 2006-08-03
JP4305399B2 (ja) 2009-07-29
KR20060046303A (ko) 2006-05-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees