TWI340423B - - Google Patents

Info

Publication number
TWI340423B
TWI340423B TW095140148A TW95140148A TWI340423B TW I340423 B TWI340423 B TW I340423B TW 095140148 A TW095140148 A TW 095140148A TW 95140148 A TW95140148 A TW 95140148A TW I340423 B TWI340423 B TW I340423B
Authority
TW
Taiwan
Application number
TW095140148A
Other versions
TW200731445A (en
Inventor
Yuji Kamikawa
Koji Egashira
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200731445A publication Critical patent/TW200731445A/zh
Application granted granted Critical
Publication of TWI340423B publication Critical patent/TWI340423B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
TW095140148A 2005-10-28 2006-10-27 Batch forming apparatus, substrate processing system, batch forming method, and batch forming program TW200731445A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005314409A JP4688637B2 (ja) 2005-10-28 2005-10-28 基板処理装置及びバッチ編成装置並びにバッチ編成方法及びバッチ編成プログラム

Publications (2)

Publication Number Publication Date
TW200731445A TW200731445A (en) 2007-08-16
TWI340423B true TWI340423B (zh) 2011-04-11

Family

ID=37565070

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140148A TW200731445A (en) 2005-10-28 2006-10-27 Batch forming apparatus, substrate processing system, batch forming method, and batch forming program

Country Status (6)

Country Link
US (1) US8002511B2 (zh)
EP (1) EP1780784A3 (zh)
JP (1) JP4688637B2 (zh)
KR (1) KR101071326B1 (zh)
CN (1) CN100543958C (zh)
TW (1) TW200731445A (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8033288B2 (en) 2007-03-09 2011-10-11 Dainippon Screen Mfg. Co., Ltd. Substrate treatment apparatus
JP4824664B2 (ja) * 2007-03-09 2011-11-30 大日本スクリーン製造株式会社 基板処理装置
US8712569B2 (en) * 2008-06-27 2014-04-29 Globalfoundries Singapore Pte. Ltd. System for determining potential lot consolidation during manufacturing
KR101181560B1 (ko) * 2008-09-12 2012-09-10 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 그것에 사용되는 기판반송장치
JP5249098B2 (ja) 2009-03-17 2013-07-31 東京エレクトロン株式会社 基板処理システム及び基板処理方法
MY161955A (en) * 2009-03-30 2017-05-15 Ats Automation Tooling Systems Inc Systems and methods for handling wafers
US20120073567A1 (en) * 2010-09-23 2012-03-29 Roland Winston Solar thermal concentrator apparatus, system, and method
JP5447431B2 (ja) * 2011-05-09 2014-03-19 株式会社安川電機 ロボットシステム
US20120305193A1 (en) 2011-06-03 2012-12-06 Arthur Keigler Parallel single substrate processing agitation module
JP6049970B2 (ja) * 2011-08-10 2016-12-21 川崎重工業株式会社 エンドエフェクタ装置及び該エンドエフェクタ装置を備える基板搬送用ロボット
JP2013051275A (ja) * 2011-08-30 2013-03-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JP5993625B2 (ja) 2012-06-15 2016-09-14 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置、および、基板処理装置
WO2014082212A1 (en) * 2012-11-28 2014-06-05 Acm Research (Shanghai) Inc. Method and apparatus for cleaning semiconductor wafer
JP5871845B2 (ja) * 2013-03-12 2016-03-01 東京エレクトロン株式会社 基板搬送装置、基板処理装置、基板取出方法および記憶媒体
TWI684229B (zh) 2013-07-08 2020-02-01 美商布魯克斯自動機械公司 具有即時基板定心的處理裝置
US9214369B2 (en) * 2013-11-01 2015-12-15 Varian Semiconductor Equipment Associates, Inc. Dynamic pitch substrate lift
JP6685213B2 (ja) * 2016-09-29 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板整列装置、基板処理装置、基板配列装置、基板整列方法、基板処理方法および基板配列方法
JP6723131B2 (ja) 2016-09-29 2020-07-15 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
JP6862163B2 (ja) * 2016-12-09 2021-04-21 東京エレクトロン株式会社 基板処理装置
CN110676199B (zh) * 2019-10-16 2022-04-22 深圳市迈诺为智能科技有限公司 一种高速装片刻印机

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
US3949891A (en) * 1974-07-22 1976-04-13 Micro Glass Inc. Semiconductor wafer transfer device
JPS6233437A (ja) * 1985-08-07 1987-02-13 Mitsubishi Electric Corp 半導体ウエハの整列装置
US5125784A (en) * 1988-03-11 1992-06-30 Tel Sagami Limited Wafers transfer device
US5153841A (en) * 1990-11-21 1992-10-06 Advanced Micro Devices Method of and apparatus for semi-conductor wafer selection
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate
US5735662A (en) * 1996-05-14 1998-04-07 Micron Technology, Inc. Adjustable wafer transfer machine
CH697146A5 (de) * 1996-10-09 2008-05-15 Tec Sem Ag Greifvorrichtung zur Handhabung von Wafern.
JP3510463B2 (ja) * 1997-11-10 2004-03-29 東京エレクトロン株式会社 基板の整列装置及び整列方法
JP3938436B2 (ja) * 1998-06-05 2007-06-27 大日本スクリーン製造株式会社 基板移載装置およびそれを用いた基板処理装置
CH693726A5 (de) * 1998-07-09 2003-12-31 Tec Sem Ag Vorrichtung und Verfahren zur Bereitstellung eines vollständigen Waferstapels.
US6457929B2 (en) * 1998-11-03 2002-10-01 Seh America, Inc. Apparatus and method for automatically transferring wafers between wafer holders in a liquid environment
US6055694A (en) * 1998-11-30 2000-05-02 Tsk America, Inc. Wafer scrubbing machine
US6612801B1 (en) * 1999-08-26 2003-09-02 Tokyo Electron Limited Method and device for arraying substrates and processing apparatus thereof
US20010048867A1 (en) * 2000-03-29 2001-12-06 Lebar Technology, Inc. Method and apparatus for processing semiconductor wafers
JP4069236B2 (ja) * 2000-06-05 2008-04-02 東京エレクトロン株式会社 液処理装置
EP1299899B1 (de) * 2000-07-09 2009-11-04 Brooks-PRI Automation (Switzerland) GmbH Speichervorrichtung, insbesondere zur zwischenlagerung von test-wafern
JP4033689B2 (ja) * 2002-03-01 2008-01-16 東京エレクトロン株式会社 液処理装置および液処理方法
JP2004055697A (ja) * 2002-07-17 2004-02-19 Ace:Kk 基板の移載、搬送装置及び移載方法
JP4413562B2 (ja) * 2003-09-05 2010-02-10 東京エレクトロン株式会社 処理システム及び処理方法

Also Published As

Publication number Publication date
EP1780784A2 (en) 2007-05-02
EP1780784A3 (en) 2011-07-06
CN100543958C (zh) 2009-09-23
US20090010748A1 (en) 2009-01-08
JP4688637B2 (ja) 2011-05-25
KR101071326B1 (ko) 2011-10-07
US8002511B2 (en) 2011-08-23
JP2007123592A (ja) 2007-05-17
CN1983548A (zh) 2007-06-20
TW200731445A (en) 2007-08-16
KR20070046016A (ko) 2007-05-02

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