TWI339730B - Prober for electronic device testing on large area substrates - Google Patents

Prober for electronic device testing on large area substrates

Info

Publication number
TWI339730B
TWI339730B TW096117479A TW96117479A TWI339730B TW I339730 B TWI339730 B TW I339730B TW 096117479 A TW096117479 A TW 096117479A TW 96117479 A TW96117479 A TW 96117479A TW I339730 B TWI339730 B TW I339730B
Authority
TW
Taiwan
Prior art keywords
prober
electronic device
large area
device testing
area substrates
Prior art date
Application number
TW096117479A
Other languages
English (en)
Chinese (zh)
Other versions
TW200801531A (en
Inventor
Benjamin M Johnston
Sriram Krishnaswami
Hung T Nguyen
Matthias Brunner
Yong Liu
William Beaton
Ludwig F Ledl
Ralf Schmid
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/746,530 external-priority patent/US7786742B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200801531A publication Critical patent/TW200801531A/zh
Application granted granted Critical
Publication of TWI339730B publication Critical patent/TWI339730B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611—Control of matrices with row and column drivers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Liquid Crystal (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW096117479A 2006-05-31 2007-05-16 Prober for electronic device testing on large area substrates TWI339730B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US80359506P 2006-05-31 2006-05-31
US82190406P 2006-08-09 2006-08-09
US11/746,530 US7786742B2 (en) 2006-05-31 2007-05-09 Prober for electronic device testing on large area substrates

Publications (2)

Publication Number Publication Date
TW200801531A TW200801531A (en) 2008-01-01
TWI339730B true TWI339730B (en) 2011-04-01

Family

ID=39142022

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096117479A TWI339730B (en) 2006-05-31 2007-05-16 Prober for electronic device testing on large area substrates

Country Status (4)

Country Link
JP (1) JP2007322428A (enrdf_load_stackoverflow)
KR (2) KR101088566B1 (enrdf_load_stackoverflow)
CN (1) CN101082637B (enrdf_load_stackoverflow)
TW (1) TWI339730B (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8907277B2 (en) 2008-03-07 2014-12-09 Carl Zeiss Microscopy, Llc Reducing particle implantation
EP2180327A1 (en) * 2008-10-21 2010-04-28 Applied Materials, Inc. Apparatus and method for active voltage compensation
CN101943744A (zh) * 2009-07-06 2011-01-12 应用材料股份有限公司 干型高电位测试器以及太阳模拟工具
KR101162912B1 (ko) * 2009-10-27 2012-07-06 주식회사 탑 엔지니어링 어레이기판 검사장치 및 어레이기판 검사방법
WO2011085227A2 (en) * 2010-01-08 2011-07-14 Photon Dynamics, Inc. Automatic probe configuration station and method therefor
KR101129195B1 (ko) * 2010-12-20 2012-03-27 주식회사 탑 엔지니어링 어레이 테스트 장치
KR101234088B1 (ko) * 2010-12-30 2013-02-19 주식회사 탑 엔지니어링 어레이 테스트 장치
KR101191343B1 (ko) * 2010-12-30 2012-10-16 주식회사 탑 엔지니어링 어레이 테스트 장치
CN102621731B (zh) * 2012-04-17 2014-11-19 深圳市华星光电技术有限公司 液晶基板的电压施加装置
WO2015010714A1 (en) * 2013-07-22 2015-01-29 Applied Materials, Inc. Apparatus and method for processing a large area substrate
US9472410B2 (en) * 2014-03-05 2016-10-18 Applied Materials, Inc. Pixelated capacitance controlled ESC
JP2017003484A (ja) * 2015-06-12 2017-01-05 株式会社ジャパンディスプレイ 表示装置の検査装置、表示装置用マザー基板の検査方法、及び、表示装置
JP2017096949A (ja) * 2015-11-24 2017-06-01 フォトン・ダイナミクス・インコーポレーテッド セル接触プロービングパッドを使用して平面パネル型表示装置を電気的に検査するためのシステムおよび方法
KR102612272B1 (ko) * 2016-12-15 2023-12-11 세메스 주식회사 프로브 모듈 및 이를 포함하는 어레이 테스트 장치
TWI718610B (zh) * 2018-08-09 2021-02-11 日商歐姆龍股份有限公司 探針單元
CN108982931A (zh) * 2018-09-21 2018-12-11 京东方科技集团股份有限公司 探针单元、探针治具
CN112285446B (zh) * 2019-07-12 2024-05-31 瑞昱半导体股份有限公司 执行多种测试的测试系统、传送装置与接收装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3592831B2 (ja) * 1996-02-26 2004-11-24 株式会社日本マイクロニクス プローブユニット及びその調節方法
JPH11174108A (ja) * 1997-12-12 1999-07-02 Dainippon Printing Co Ltd 電極配線の検査装置
US6744268B2 (en) * 1998-08-27 2004-06-01 The Micromanipulator Company, Inc. High resolution analytical probe station
US7355418B2 (en) * 2004-02-12 2008-04-08 Applied Materials, Inc. Configurable prober for TFT LCD array test
JP4790997B2 (ja) * 2004-03-26 2011-10-12 株式会社日本マイクロニクス プローブ装置
JP2006085235A (ja) 2004-09-14 2006-03-30 Agilent Technol Inc 移動型操作装置および移動型操作装置を制御するための方法

Also Published As

Publication number Publication date
KR20070115639A (ko) 2007-12-06
KR101088566B1 (ko) 2011-12-05
KR20090120444A (ko) 2009-11-24
JP2007322428A (ja) 2007-12-13
TW200801531A (en) 2008-01-01
CN101082637B (zh) 2012-01-18
CN101082637A (zh) 2007-12-05

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