TWI337510B - Laser induced thermal imaging apparatus with contact frame - Google Patents

Description

P37510 IX. Description of the invention: 1. Field of the Invention The present invention relates to the production of electronic devices, and more particularly to the use of laser induced thermal imaging (LITI) techniques to form organic material layers in electronic devices. . [Prior Art] A specific electronic device includes an organic layer. For example, an organic light emitting device (OLED) contains various organic layers. Various methods have been used to form these organic layers. For example, such methods include deposition methods, ink jet methods, and laser induced thermal imaging (LITI) methods. In the UTI law, a supply device is used to provide a transfer layer. • the film supply device is placed on a partially fabricated electronic device (intermediate device) such that the transferable layer contacts the surface of the intermediate device on which the transferable layer is to be transferred (receiving The surface p then illuminates a laser beam onto a selected area of the furnace film supply device which generates heat in selected areas of the film supply unit. This heat causes the desired portion of the transfer layer to Peeling. After the removal of the 4 film supply device, the peeled portions of the transferable layer will remain on the surface of the intermediate device. Typical LITI devices use suction to allow the transfer layer to be The treatment shoulder is kept in contact with the surface of the intermediate device. Figure 1 is a cross-sectional view of the device 100. The LITI device 1 includes: a reaction chamber 11A, a substrate support 120, and a laser a source or an oscillator 13. The substrate support 120 includes: an intermediate device receiving a trench ΐ2ι for receiving an intermediate 1 sub-assembly f 140 therein; and a film supply device receiving the trench 123, 6 1337510 for Wherein a film supply device 150 is received. The portion of the organic material is transferred to the intermediate device in a less defective manner, and the transfer layer must be in intimate contact with the receiving surface. The UTI device 100 includes a suction mechanism for achieving this close contact. The suction mechanism comprises a plurality of conduits 61 and 63 and a vacuum cylinder p. The suction generated by the conduit 61 will attract the intermediate device 14 placed in the groove 121 downward and keep it downward. The suction generated by the conduit 163 will draw the film supply device 150 placed in the groove 123 downward and keep it downwardly attracted and contact the intermediate device. In order to generate the aforementioned suction force, the reaction chamber must have air or Other gaseous media. ' However, because the process performed before and after the LITI process is usually performed in a vacuum environment, the LITI process using the above suction must destroy the vacuum between the previous process and the subsequent process. The discussion in this section is provided for the present invention. Background information on related art, rather than prior art.

SUMMARY OF THE INVENTION One aspect of the present invention provides a laser-induced thermal imaging (LITI) device, (4) comprising: a substrate support configured to support an intermediate electronic device and a supply film a laser source; and a contact frame disposed between the substrate support and the laser source, the contact frame being opposite to the substrate support between the -first position and the second position To move 'the first position of 1 and the substrate support are separated by a first distance'. The second position is separated from the substrate support by a second distance, 1337510 - the second distance is greater than the first distance. The contact frame is configured to squeeze the film supply device against the intermediate device based on the first position. The contact frame includes at least one magnetic material selected from the group consisting of: a permanent magnet and an electromagnet. - The electromagnet can be electrically connected to an external power source and can be configured to be selectively excited. The at least one magnetic material may comprise - or a plurality of forms selected from the group consisting of: a flat plate, a sheet, a wafer-like rod, and a pellet. The contact frame may include a magnetic portion and a non-magnetic portion, and the magnetic portion may include the at least one magnetic material. The magnetic portion can generally be arranged closer to the substrate support j than the non-magnetic portion. The substrate support can include at least - a magnetic material selected from the group consisting of: a permanent magnet, an electromagnet, and a magnetically attractable material. The method includes: - an intermediate electronic device including a receiving surface and placed on the substrate support; and a film supply device including a transferable film layer and being placed Above the intermediate device. The intermediate device and the film supply device may be arranged to allow the receiving surface to be rotatable. The p film layers are in contact with each other. There may be substantially no air bubbles between the receiving surface and the transferable film layer. The film supply device may further include a layer change. The film supply device may not include a magnetic layer containing a permanent magnet or an electromagnet. The intermediate electronic device may include at least one of a magnetic material selected from the group consisting of: a permanent magnet 'electromagnet, and another method of magnetically absorbing the other electronic device of the present invention, providing a method of manufacturing using the above apparatus . The method includes: placing an intermediate device on the 1337510 substrate support, the intervening device including a first surface and a second surface, the first surface facing the contact frame, the second surface contacting the a soil support, the 臈-supply device is disposed on the first surface of the intermediate device, the film supply device includes a third surface and a fourth surface, the third surface facing the contact frame, and the The four surfaces are self-supporting the substrate; the contact frame is moved to contact the third surface of the film supply device such that the fourth surface of the film supply device contacts the first surface of the intermediate device, and The film supply device is squeezed to abut the intermediate device. The contact frame can include an opening, and the method can further include irradiating a laser beam through the opening of the contact frame to the film supply device. The method can be carried out in a vacuum soil. The contact frame can include an electromagnet' and initiating the magnetic force can include activating the electromagnet. Squeezing the film supply device may include applying a weight of the contact frame to the film supply device. Squeezing the film supply device may further comprise magnetically interacting a magnet or a magnetically attractable material of the at least one magnetic material under the first surface of the intermediate device. The intermediate skirt may comprise the magnet or A material that can be magnetically attracted. The substrate support can include the magnet or a magnetically attractable material. [Embodiment] From the following description, the various aspects of the present invention can be clearly and more easily understood. Advantages. Various embodiments of the present invention will be described with reference to the drawings, in which the same reference numerals indicate the same or functionally identical components or components. 1337510 In an embodiment of the invention, a LITI device uses a magnetic force to create a close contact between a film supply device and an intermediate device. Unlike the suction force in the LITI device of Figure 1, the magnetic force acts on the reaction. There is no need for air or fluid in the room. In the embodiment of the invention, the magnetic force is used to contact the film supply device and the intermediate device can be vacuum or non-vacuum. Implemented in Figure 2. Figure 2 shows an LITI device 200 in accordance with an embodiment.

The illustrated LITI device includes a reaction chamber 21A, a substrate support 26A, a contact frame 230, and a laser source or oscillator 220. The reaction chamber 210 provides a space for processing the intermediate (or partially fabricated) electronic device 250 with a film supply unit 24 1 . The substrate support 260 is configured to support the intermediate device 250 and the film supply device 241. The contact frame 23 is movably coupled to the reaction chamber 21A to provide a downward weight on the film supply unit 241. In a particular embodiment, the contact frame 230 can be omitted. The film supply device 241 includes a transferable layer (not shown). The transferable layer is transferred to the intermediate device via a laser. A laser oscillator 220 is disposed above the contact frame 23A. The laser oscillator 220 is configured to illuminate a laser over the film supply device 241 via the contact frame. In one embodiment, the LITI device 200 operates as follows. First, the intermediate device 250 is introduced into the reaction chamber 21A and placed over the substrate support 260. Next, the supply device 24A is placed above the intermediate device 250. The film supply device 241 will at least & 10 1337510

The intermediate device 250 is contacted. With a magnetic force, wm 丄 W presses the film supply unit 241 with a magnetic force to abut the intermediate unit 25, and the transfer layer closely contacts the intermediate unit. The laser oscillation H 220 is activated to shoot the - Ray (4) over the county 241. The transfer layer is transferred from the film supply unit 241 to the inter-unit device 25A.

A schematic exploded view of the LITI device shown in Fig. 3. The reaction t 21G is indicated by a dotted line in the figure. In the embodiment shown in the figures, the laser vibrator (4), the contact frame 230, and the substrate support 26 are vertically aligned with one another. During the Lm process, an intermediate device 25 is placed over the substrate support 260, and the film supply i 241 is placed over the intermediate device 250. In another embodiment, the front components may have a different arrangement. For example, it may have an opposite configuration. The substrate support can be configured from above. To fix the intermediate device. Such a substrate support can be referred to as a substrate holder. Reaction chamber 2 I 0 will provide a reaction space 'for the Lm process. The reaction chamber may be any suitable confined space in which the LITI process can be applied. The reaction chamber 210 houses the contact frame 23 and the substrate support 260. The reaction chamber also includes an inlet and outlet for introducing or removing the intermediate device 250 and the film supply device 241. In one embodiment, the reaction chamber 20 can be configured to provide a vacuum environment. In the embodiment shown in the figures, the laser oscillator 220 is disposed above the contact frame 230 at a central portion of the top end of the reaction chamber 210. However, the present invention is not limited thereto. The laser oscillator 22 is placed with 1337510 丨· % to illuminate a laser beam onto the film supply unit 24 1 . An embodiment of the sinusoidal laser oscillating device 220 shown in Fig. 11. The laser oscillator 220 shown in Tuschen can be a CW Nd:YAG laser (1064 nm). The laser oscillator 220 has two galvanometer scanners 221,222. The laser oscillator 220 also has a scanning lens 223 and a cylindrical lens 224. Those skilled in the art will appreciate that various types of laser oscillators can be adapted to provide a laser for the film supply device. In the embodiment shown in the drawings, the contact frame 23 is disposed above the substrate supporting base 260, but the present invention is not limited thereto. The contact frame 230 is movably connected to the central portion of the top end of the reaction chamber 210 through a transport unit 231. The contact frame 23A has a contact plate 232 that is configured to provide a weight above the film supply device 241. The contact plate 232 is patterned to expose a plurality of portions of the lower film supply device 241 while blocking other portions. To expose the portions of the film supply device 241, the contact plate 232 will include a plurality of openings 233. The openings 233 allow the laser beam to be directed to the portions of the film supply unit 241. This configuration can transfer a plurality of portions of the transferable layer to the intermediate device 250, as will be described in detail later. In a particular embodiment, the LITI device may not have any contact frames. In the embodiment shown in the drawings, the substrate supporting base 26 is disposed at the bottom of the reaction chamber 210, but the present invention is not limited thereto. The substrate support 260 shown in the drawing has a recess 263 for receiving the intermediate device 250. The substrate holder 26 will also support the film supply unit 241. In addition, the substrate support 260 is provided with a substrate lifter and a 121337510%, membrane device lifter 266 below. The substrate support seat 26q has a penetration hole 26i", and the substrate lifter 265 and the film supply device are moved in the vertical direction to pass through the penetration holes. The intervening device 250 will be in the LITI plastic: Bb pq, »· n 1 is placed on the substrate holder 260 during the Li 11 path. The "intermediate device" - the word refers to the surface to use the 忒UTI process to form an organic material. Devices... Generally, these devices are partially manufactured electronic devices. In the middle of the real one: in the example 'the intermediate installation i 25G series - has been partially manufactured to complete the timing of the light 'set. The inter-installation device 250 includes a surface onto which the transferable layer can be transferred. The film supply unit 24i is placed over the intermediate portion 250 during the LITI process. In one embodiment, the supply device comprises: a base substrate; a light to heat conversion layer; and a __ transferable layer. A step-by-step description will be given later. The film supply unit 4 24 ι shown in the drawing further includes a film supply tray 24 that surrounds the film supply unit 241. The film feeder tray 240 acts as a maintenance frame for maintaining the shape of the film supply device (4). The transferable layer will be arranged to face the surface of the intermediate device during LITI processing. The gripping device of Fig. 3 uses a kinetic force to bring the film feeding device 241 into close contact with the intermediate device 25A. This magnetic force causes the devices 241 to be in close contact with each other such that there is substantially no air gap or air bubble between the devices 241 and 250. In one embodiment, the magnetic force can be generated by two or more magnetic materials that are separated. In an embodiment, the magnetic material forms 13 1337510 among the two components that are separated in the s-thin LITI system, between which the transferable layer and the transferable layer are to be transferred. The surface, that is, one of the components is disposed above the transferable layer, and the other component is disposed below the surface. Here, the term "component" refers to the components and devices used in the LITI process, including the intermediate device 250, the film supply device 241, the contact frame 23A, and the substrate support 260. In an embodiment, a magnet or a magnetic material is formed between the lower two components of the Lm system, although the invention is not limited thereto: between the intermediate device 250 and the film supply device 241; 2) the intermediate device 25 Between the contact frame 230; 3) between the substrate support 260 and the film supply device 241; or 4) between the substrate support 260 and the contact frame 23A. Optionally, a magnetic material such as shai can be disposed in one of the following component combinations of the UTI system: 5) a substrate support 26, an intermediate device 250, and a contact frame 230; 6) a substrate support 260, The intermediate device 250, and the film supply device 241; 7) the substrate support 260, the film supply device 241, and the contact frame 230; or 8) the intermediate device 250, the film supply device 241, and the contact frame 230. In still another embodiment, the magnetic material can be disposed in the following: 9) the substrate support 260, the intermediate device 25, the film supply device 24, and the contact frame 23A. The skilled artisan will appreciate that the magnetic material can also be placed in a particular other component, depending on the design of a UTI device. The magnetic materials among the four pairs of components are configured to attract each other such that the film supply device 241 and the intermediate device 25 are formed between the transferable layer and the surface on which the layer is to be transferred. Close contact. As used herein, the term "magnetic material of 1337510" refers to either a magnet or a magnetically attractable material. Unless specifically mentioned, a "magnet" can generally refer to a permanent magnet or an electromagnet. As used herein, the term "magnetically attractable material" refers to a material that is not a magnet but is attracted to a magnet. In some embodiments, one of the two Lm assemblies can comprise a magnet and the other can comprise a non-magnet magnetically attractable material. In other embodiments, both of the two Lm assemblies may comprise magnets. In a particular embodiment, the assembly containing a magnet may also contain a magnetically attractable material. In all of these embodiments, the amount of magnetic material contained in the material assembly is sufficient to produce a sufficient magnetic force for intimate contact between the film supply device 241 and the intermediate device 250. This force is different from the suction force, which can be generated in a vacuum environment. Thus, in the embodiment of the material, magnetically induced contact between the film supply device 241 and the intermediate device 1 250 can be utilized to perform the Lm process in a vacuum without destroying the vacuum. In other embodiments, the magnetic force system can also be used in conjunction with the suction system to improve the Lm process. The position and configuration of the magnets or magnetically permeable materials of each of the component wipes are described in detail below. In one embodiment, the magnetic material beneath the transferable layer is disposed in the intermediate package S 250. A schematic cross-sectional view of an embodiment of the intermediate device shown in the circle 4...B. The intermediate device 400A shown in the drawing is an organic light-emitting device (OLED) which has been partially manufactured. Each of the intermediate devices 40 includes a substrate 401, a buffer layer 402, a thin film transistor 440, a passivation layer 15 337510, an electrode 420, and a pixel dividing wall 43. Hey. The thin film transistor 匕3, the insulating layer 403, 4〇4, the semiconductor 35405, the source electrode, the - (four) electrode, and the gate electrode. The pixel knives dJ 43 0 are formed over the passivation layer and over the partial electrodes, which expose most of the top surface of the electrode 42. The electrode 42 will fill the cathode or anode of the organic t-light body. The transferable layer will be formed over the exposed top surface of the electrode 420. In Figure 4A, the magnetic layer will adhere to the bottom surface of the substrate. In another embodiment shown in Fig. 4B, the magnetic layer 4 〇 ib is disposed between the substrate 401 and the buffer layer 4 〇 2 . This side contains - a magnetic material, which will be described in detail below. In the embodiment, the thickness of the magnetic layer 4〇la or 401b is between about 5, 〇〇〇a and about ιο, οοοΑ. In a particular embodiment, the intermediate device can include any component that is embedded under the electrode 420 (eg, substrate 4, buffer layer (10) 2, insulating layer 403 '404, and/or passivation layer 4〇9). The magnetic material in the middle depends on the design of the device. In any case, the amount of magnetic material contained in the intermediate device is sufficient to bring the film feeder layer into intimate contact with the intermediate device. In an embodiment, the intermediate device can include a plurality of strips of magnetic material in a particular region of the intermediate skirt. A top view of an embodiment of an intermediate bud 400C shown in FIG. 4C is shown. The device is a partially manufactured organic light-emitting device 400C. The device 4c is inserted into a display area 460, a data driver 431, a scan driver 44A, and

^ Connect 410 and 421. Display area 46A includes a composite matrix 470 in the form of a presentation matrix. The device shown in the drawing includes a core of magnetic material "45" b. In the embodiment shown in the drawing, the magnetic material strips 450a are disposed in a peripheral area outside the display area. Further, the The magnetic material strip side is formed in the display region 460. The magnetic materials V 450b shown in the drawing are substantially parallel to each other. In other embodiments, the magnetic material strips are formed in the pixel region. Medium, rather than being formed in such surrounding areas, the skilled artisan will appreciate that a variety of other magnetic material strip configurations can be used to provide a magnetic force.

In one embodiment, the magnetic material can be a magnet comprising a permanent magnet or an electromagnet. The permanent magnet may be an alnico magnet, a ferrite magnet, a rare earth magnet, a rubber magnet, or a plastic magnet. The permanent magnet may have at least one selected from the group consisting of a flat plate, a sheet, a wafer, a rod, and a pellet. In one embodiment, the permanent magnet may be a nano-sized magnetic particle, a magnetic plate, a magnetic sheet, a magnetic wafer, or a magnetic rod. These nano-sized particles may be deposited on a surface of a component of the intermediate device by spin coating, electron beam deposition, or inkjet deposition. In other embodiments, the magnetic plates, magnetic sheets, magnetic wafers, magnetic rods, and magnetic particles may also be larger than the nanometer size. The permanent magnet can be substantially uniformly dispersed in the magnetic layer 401a or 401b. In another embodiment, the magnetic layer 401a or 401b may have a permanent magnet portion only in a region on which the transferable layer is to be transferred. In yet another embodiment, the magnetic layer may be a single plate made of a permanent magnet. In another embodiment, the magnetic material can be an electromagnet. The electromagnetic fiber may have at least one of the following forms: s & π green cymbal: a solenoid and a ring to which the spiral s is referred to form a coil in the shape of a straight tube. The system of the heart of the toroidal ring - forming a coil of donut shape. In general, the loop Hf is curved so that the two ends meet the solenoid. In some implementations: '- A solenoid or toroidal coil may contain a core made of paramagnetic or 2 material (for example, iron) within the coil. Because the electromagnet needs a current to magnetize, the electromagnet is connected to a power supply via a wire. In the embodiment, a non-display area of the intermediate device is used to electrically connect one or more electrodes of the electromagnet. The (etc.) electrode is configured to receive power from an external power source. In addition, ^ etc.) the electrode is connected to the electromagnet via the (etc.) wire. In the first embodiment, the (equal) electrode may be formed on the surface of the device or body to be incorporated into the electromagnet to be electrically connected to the external power source. In other embodiments, the (equal) electrode may protrude from the outside of the device or body to be incorporated into the electromagnet into a final completed electronic device formed by the intermediate device, and the (etc.) electrode may not function. And will be buried in a dielectric material. The same system as the long-lasting magnet, the electromagnet can be substantially uniformly or unevenly spread, depending on the design of the intermediate device. For example, the magnetic material can be a magnetically attractable material 'but not a magnet. Examples of the magnetically attractable material include, but are not limited to, Fe, Ni, Cr, Fe2〇3, C〇Fe2〇4, MnFe〇4, alloys thereof, and mixtures of two or more of the foregoing materials. Other examples of magnetically attractable materials may include plastically displaced magnetic materials and (iv) magnetic materials 18 1337510. The same structure as the permanent magnet, the magnetically attractable material may have at least one of the following forms selected from the group consisting of a flat plate, a sheet, a wafer, a rod, and a pellet. They can be granules of even larger size. The magnetically attractable material can be evenly dispersed in the magnetic layer 4〇1& or b. In another embodiment, the magnetic layer 401a or b may have a magnetically attractable portion of the material only in the region over which the transferable layer is to be transferred. In yet another embodiment, the magnetic layer can be a single plate made of the magnetically attractable material. In another embodiment, a magnetic material underlying the transferable layer can be disposed on the substrate support. An embodiment of the substrate support 260 including the magnetic material shown in Figs. 5A and 5?. The substrate support 260 shown in the drawing will include a plurality of electromagnets 264 in a region 263 (shown in phantom in the figure) below a recess. The electromagnets 264 shown in the figures are aligned in the vertical direction. However, the electromagnets can also be arranged in a variety of configurations depending on the design of the substrate holder. The electromagnets can also have various shapes and configurations as described above for the intermediate device. In a particular embodiment, the magnetic material can be a permanent magnet or a magnetically attractable material as described above for the intermediate device. In one of the tenth embodiments, a magnetic material located above the transferable layer may be disposed in the film supply device. Figures 6A to 6C are partial cross-sectional views of the film supply devices 600A to 600C according to the embodiment. Each of the film supply devices 600A to 600C includes: a base substrate 6〇1; a light-to-heat conversion layer 602 over the base substrate 601; an intermediate layer above the light-to-heat conversion layer 602 603; and one located in the middle layer 19 1337510

The transferable layer 6〇4 above 603. Optionally, the film supply means may further comprise - a buffer layer (not shown) interposed between the intermediate layer 603 and the transferable layer 604. The base substrate 601 is for providing the film supply device to have a film structure. The base substrate 001 can be made of a transparent polymer. Examples of such transparent polymers include, but are not limited to, polyethylene, polyester, polyethylene terephthalate, polyacrylate, polyepoxy, and polystyrene. The base substrate 6〇1 has a thickness of between about 1 〇/zm and about 500//m, and optionally between about 100 " m and about 4 〇〇 β m.

The light to heat conversion layer 602 is configured to absorb the laser and convert it to heat. The conversion layer 602 comprises a light absorbing material. The light absorbing material may have an optical intensity of from about 0.1 to about ^ 4 ^. The light absorbing material may comprise: a metal, a metal oxide, and/or an organic material. Examples of the metal/metal oxide include, but are not limited to, aluminum, silver, chromium, tungsten, tin, nickel, titanium, cobalt, zinc, gold,

Copper, box, wrong, and oxides of the foregoing metals. The organic material may comprise a photosynthetic material. Examples of the organic material include a polymer made of a methacrylic acid monomer or oligomer such as an acrylic (mercapto) acrylate polymer, an ester (mercapto) acrylate oligomer, and an epoxy. A resin type (meth) acrylate oligomer, a urethane type (meth) acrylate oligomer, etc., or a mixture of two or more of the conjugates. In addition, the conversion layer 602 may also contain other additives such as carbon black, stone see, or infrared dyes. The thickness of the light to heat conversion layer 6〇2 can be varied depending on the light absorbing materials and the manufacturing method. For example, when using a vacuum deposition method, a laser beam/child method, or a recording method, the thickness of the conversion layer can be between about 15,000 A to about another embodiment, when used. Can the extrusion coating method, the 20 gravure coating method, the spin coating method, and the coating method be between about 0 1 and about? The thickness of the 5th metamorphic layer is J. The main is about 2 #m. The function of the intermediate layer 603 is to maintain its tone A, the tines x, and the heat transfer layer 602. In the solid yoke example, the intermediate layer 6 has an identical heat resistance to the intermediate layer 601讦尨a. The amine is made of an organic material or an inorganic material such as polyamidamine. The intermediate layer 603 has a high yield between the & bristles of a particular ^; 1 between about 1 (four) and about 1.5 hearts. In the embodiment, the intermediate layer may be omitted. It can be transferred to 2 layers of 60 6 4 4 4 to be transferred to the layer on the intermediate device. The Li two organic material is composed of. In the case of the electronic _ - organic hair, the material can be used, but the material can also be used for machine hair. u ·) is used to form the organic hair ::: it is an organic material. These other components include, but are not::: and hole transport layer _), electron injection layer _, and electron transport layer (ETL). In the 苴 &; 黾 装置 device, any material suitable for constituting a target component can be # A #iu < leaf 1 is a material for the 5 meta-transferable layer. The transferable layer 604 has a thickness of between about 2 〇〇 α and about 1,000 Å. The transferable layer 604 can be formed by any suitable method, for example, extrusion coating, gravure coating, spin coating, forgetting coating, vacuum deposition, or chemistry. Vapor deposition (CVD). This buffer layer (not shown) is used to improve the transfer characteristics of the transferable layer 604. The buffer layer may be combined with one or more of: one or more of the following: metal oxides, metal sulfides, non-metal servants, organic compounds, and organic materials. Examples of such inorganic compounds An example of an organic material comprising ruthenium, Aue, or the like comprises a poly-branched amine. 21 1337510 Referring now to Figure 6A, the light to heat conversion layer 6 〇 2 comprises a material. For example, the light to heat conversion layer 6 〇 2 弋赍 赍 从 from " 匕 3 - water long magnets and / or electromagnets. In other embodiments, the conversion layer 6〇2 may comprise a magnetically attractable material. The magnetic material may have various configurations as described above for the intermediate device. In other embodiments, the deuterium material can be buried in the base substrate 6G1 or the intermediate layer (5). In an alternate embodiment, the ~magnetic material can be embedded in at least two of: a base substrate, a thermal conversion layer 602, and an intermediate layer 6 () 3. In other embodiments, the magnetic material may only be embedded in a particular portion of one or more of the layers 6〇1 through 6, rather than in the entire layer. For example, in the layer (4) to 603 - or more, the magnetic material may be contained only under the portion of the transferable layer to be transferred to the intermediate device, and now referring to FIGS. 6B and 6C' film supply device 6〇〇B and 6〇〇c include a magnetic layer 605. The magnetic layer 6〇5 comprises a magnetic material: a permanent magnet, an electromagnet, and/or a magnetically attractable material. The magnetic material may have various configurations as described above for the intervening device. In Fig. 6B, the supply device 6A includes the magnetic layer 605 between the base substrate 6A and the light-to-heat conversion layer 602. In Fig. 6C, the film supply device 600C includes the magnetic layer 605 between the light-to-heat conversion layer 602 and the intermediate layer 6〇3. In another embodiment, the supply device can interpose the magnetic layer between the intermediate layer 6〇3 and the transmissible layer 604. In still another embodiment, the film supply device can include the magnetic layer on a bottom surface of the base substrate 601 facing away from the light-to-heat conversion layer 602. In a particular embodiment, the film supply device can be inserted into two or more magnetic layers between successive layers of the layers 601 through 604. 22 1337510 m • In these embodiments, a magnetic material may be further embedded in at least one of: a base substrate 601, a light to heat conversion layer 602, and an intermediate layer 603. Those skilled in the art will appreciate that the configuration and combination of the magnetic layers can vary depending on the design of the film supply device. In another embodiment, a magnetic material positioned above the transferable layer can be disposed within the contact frame. An embodiment of the contact frame 23A shown in Fig. 7 is shown. The contact frame 230 shown in the drawing includes a magnetic material embedded in the frame. The magnetic material may be a permanent magnet or an electromagnet as described above for the intermediate device. In another embodiment, the magnetic material may be a magnetically attractable material as described above. In a particular embodiment, the contact frame 230 can include a separate magnetic layer "the magnetic layer comprising a magnetic material as described above for the intermediate device. The magnetic layer may be attached to one of the top and bottom surfaces of the contact frame 230, in another embodiment, the magnetic layer may be embedded in the contact frame 230. In such embodiments, the layer will be patterned to have openings corresponding to the openings in the contact frame. The contact frame and the opening in the layer allow the laser beam to be directed to a plurality of portions of the film supply unit 24i. This configuration allows the transferable film to be selectively transferred onto the intermediate device 25G. In another embodiment, the contact frame itself may be constructed of the magnetic material. In all of the foregoing embodiments, the contact frame contains a sufficient amount of magnetic material to provide a magnetic force for squeezing the film supply device against the intermediate device. F-induced thermal-induced tan arm aluminum laser-induced thermal imaging (LITI) process in accordance with various embodiments of the present invention 23

/ J1U Magnetic force to allow the chamber between the media supply and the intermediate device to be contacted. The flow of an embodiment of the UTI process shown in Figure 8 is first 'in step 81"'- the intermediate device is said to be placed over a support 260. During this step, the intermediate device will move in accordance with the appropriate movement mechanism (for example, the "robot mechanism"). In step 820, a film supply i 241 is placed above the middle = 250. First, the film supply will be vertically aligned with the #7 set 250 so that the transferable layer faces down. Then, the film supply device 241: will move down to the intermediate device 25A. At least one of the transferable layers contacts the intermediate package f. a soil removing device 250 is the same as step 810, and the film feeding device 241 can be moved by the moving mechanism. A magnetic force is applied in step 830 to squeeze the film supply unit 41' against the intermediate unit 25'. The magnetic force can be generated by a magnetic material disposed in two of the above-described LITI components, the component is located above the transferable layer, and the other component is placed thereon for transfer Below the surface of the layer. In some embodiments, such

Two LITI components are neutral A ', 匕 3 one magnet; the other can include S a non-magnet but magnetically attractable material. In other embodiments, both of the two UTI components can include a magnet. The magnet may comprise a permanent magnet and/or an electromagnet. In the embodiment of the magnet-electromagnet-containing magnet, the magnetic force can be generated in a selective manner in accordance with the requirements of the LITI process in a special embodiment, containing (4) (4) magnetic attraction of the magnet. material. 24 1337510 In this step, the magnetic force pushes it against the intermediate device 250, which causes the "mount" 241 to touch the surface on which the layer is to be transferred. This process more closely connects or at least: between: the air supply gap or the air bubble between the filming device 241 and the intermediate device 25A. This step facilitates the two-part empty device 25. Above. The 褥P layer is transferred to the middle in step 840. The laser is irradiated onto the film supply 241. The laser provides the necessary thermal energy for transferring the transferable layer to the intermediate device. In this step, - the laser oscillator 22 is used. It will be activated to irradiate - the laser on the top surface of the film supply device 241. - In the embodiment of the contact frame $23Q having a plurality of openings, this will pass through the opening π and reach the surface of the film supply device 241. During this process, the laser will be directed to selected areas of the film supply unit 241. The laser will reach the light-to-heat conversion layer of the film 41 through the base substrate. The light to heat conversion layer converts the light energy into thermal energy for generating heat. Money is transferred to selected portions of the transferable layer. By this process, the specific portion of the transferable layer φ is released from the film supply device and transferred to the intermediate device m. In another implementation where no contact frame is used, the laser will be selectively irradiated onto a particular portion of the top surface of the film supply device 241. Then, in step 850, the film supply i (4) is removed from above the intermediate device 250, leaving a plurality of portions of the convertible P layer on the top surface of the intermediate device 250. The film supply device 241 can be removed using the same movement mechanism as used in step 35. 25 1337510 Referring now to Figures 9A through 9F, an intermediate device 250 will be introduced into a transfer chamber 900. The intermediate device 250 is placed over an end effector 91A of a robotic arm 920 in the transfer chamber 900. Then, a meta-intermediate device 250 is transported into a LITI reaction chamber 21, as shown in Fig. 9B. The intermediate device 250 is then placed over a substrate support 260, as shown in Figure 9c. Next, a film supply device 241 is placed over the end effector 91A as shown in Fig. 9C. Then, the film supply device 241 is introduced. Among the mysterious LITI reaction chambers 210, as shown in Fig. 9D. The film supply unit 241 is vertically aligned with the intermediate unit 25A. Next, the film supply unit 24 will be moved down onto the intermediate unit 250 as shown in Fig. 9E. Then, the end effector 91〇 is taken out from the LJT reaction chamber 2〇. Then, it closes - asks 930 to provide a closed reaction chamber. In one embodiment, during these steps, a vacuum environment is maintained throughout the transfer chamber and the uTi reaction chamber. Optionally, a contact frame can be provided over the film supply device. In Fig. 9F, the contact frame 230 is moved downward to the film supply device μ. The contact «230 will be provided over the film supply f 241 and the intermediate device 250'. The contact frame can be contacted with the frame 23 to assist in making intimate contact between the film supply device 241. In other embodiments

Next, '俨&&&<> the film supply device 4 in the LITI '26 1337510 - one component is located below the transferable layer, and the other component is located above the transferable layer, as above Said. The skilled artisan will appreciate that the magnetic material # can also be provided in a particular other component, depending on the design of a liti sigh. In all of the foregoing embodiments, the magnetic force is applied between the intermediate device and the film supply device to be strong enough to create contact without any air gaps or bubbles therebetween. The details of the location and configuration of the magnetic materials are the same as those described above for the lit device. Fig. 1 is a cross-sectional view showing how a transferable layer is transferred onto an intermediate device as shown in Figs. The intermediate device shown in the drawing is a partially fabricated organic light-emitting device. In the embodiment shown in the figures, a magnetic material is placed in the intermediate device and the film supply device. In other embodiments, the magnetic materials may also be disposed in other components of the apparatus described above.

Referring now to the drawings, the intermediate device includes a thin film transistor (TFT) structure 411, a magnetic layer 4?3, an electrode (4), and a pixel dividing layer 430. The portion 412 of the sister 42G is exposed through the pixel dividing layer 430. As will be understood from the following description, an organic layer will be formed over the exposed portion 41 2 . Next, as shown in Fig. 10B, a film supply (10) is placed above the intermediate package i 400. The film supply device 600 includes a base substrate 〇1, a magnetic layer 〇5, a light-to-heat conversion layer 602, an intermediate layer 603, and a transferable layer, as described above with respect to FIG. 6b. 6〇4. The transferable;|6G4 will at least partially contact the top surface 27 1337510 of the pixel dividing layer 43() as shown in FIG. 10B. During this step, a force is applied between the supply device 6A and the intermediate device 400. The laser will then be illuminated to a selected portion of the film supply unit 600. The selected portion is disposed over the exposed portion 412 of the electrode 420. The laser passes through the base substrate and the magnetic layer 6〇5 and reaches the light to heat conversion layer 602. The light to heat conversion layer 6〇2 converts the light energy into heat energy for generating heat. This heat is transferred to the transferable layer 604 through the intermediate layer 6〇3. Then, after receiving the heat, a portion of the transferable layer 6〇4 is detached from the film supply device 600 and contacts the exposed portion 412 of the electrode 42〇, as in 0 10C. Show. In the embodiment shown in the figures, a portion of the conversion layer 602, the intermediate layer 603, and the transferable layer 6〇4 are separated from the magnetic layer 605. In other embodiments, only the transferable layer can be separated from the film supply device 600.

Then, as shown in FIG. 10D, the film supply unit f 61 is completely removed from the intermediate device. After this step, only a portion 604a of the transferable layer remains in the intermediate device 4〇. Above.丨土朴 uses a knife to make a close connection between the sputum cavity device and the intermediate device. A system different from suction, this configuration: no air pressure is required in the Lm reaction chamber. Therefore, the Yanhai LITI process can be implemented in a vacuum environment. Because the process implemented before and after the Lm process is stored in the real environment, the heart will not destroy the vacuum when the process is two. Injecting this hole from the deposit: Call)! The process of depositing the first: electrode layer can maintain the vacuum environment. 28 1337510 In addition, the LITI process can also reduce the chance of impurities or gaps between the film and the intermediate device. This improves the life, yield, and reliability of the final electronic device. Although various embodiments of the invention have been shown and described herein, it will be understood by those skilled in the art The scope of this issue is defined by the scope of the accompanying patent application and the equivalent scope of its door. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view of a laser-induced thermal imaging apparatus. 2 is a schematic cross-sectional view of a laser-initiated thermal imaging apparatus in accordance with an embodiment of the present invention. Fig. 3 is a schematic exploded perspective view of a laser-induced thermal imaging apparatus according to an embodiment of the present invention. 4A and 4B are schematic cross-sectional views of an electronic device partially fabricated in accordance with an embodiment of the present invention. Figure 4C is a schematic plan view of an electronic device that has been partially fabricated and fabricated in accordance with one embodiment of the present invention. ΒΠ - 3A is a schematic perspective view of a substrate support according to an embodiment of the present invention. Fig. 5A is a schematic cross-sectional view of the substrate support of Fig. 5A taken along a straight line.

Jgi A to 6C are schematic sectional views showing a film supply apparatus according to an embodiment of the present invention. Figure 7 is a perspective view of a contact frame in accordance with an embodiment of the present invention. Figure 8 is a flow diagram of a laser induced thermal imaging method in accordance with an embodiment of the present invention. 9A to 9F are a laser-induced thermal imaging method according to an embodiment of the present invention. 10A to 1D show a laser-induced thermal imaging method according to an embodiment of the present invention. Fig. 11 is a schematic perspective view of a laser oscillator according to the present invention. [Main component symbol description] 100 Laser-induced thermal imaging device 110 Reaction chamber 120 Substrate support 121 Intermediate device receiving groove 123 Film supply device receiving groove 130 Laser source or oscillator 140 Intermediate electronic device 150 Film supply device 161 Catheter 163 Conduit P Vacuum Cylinder 200 Laser-induced thermal imaging device 210 Reaction chamber 220 Laser source or oscillator 30 1337510

221 galvanometer scanner 222 galvanometer scan Is 223 scan lens 224 cylindrical lens 230 contact frame 231 transport unit 232 contact plate 233 opening 234 (undefined) 240 film supply device tray 241 film supply device 250 intermediate device 260 substrate support 261 Penetration hole 262 Penetration hole 263 Dimple 264 Electromagnet 265 Substrate lifter 266 Film supply device lifter 400A Intermediate device 400B Intermediate device 400C Intermediate device 401 Substrate 401a Magnetic layer 31 1337510 . 401b 402 403 404 405 406 407 408 # 409 410 411 412 413 420 421 430

440

441 450a 450b 460 470 600A magnetic layer buffer layer insulating layer insulating layer semiconductor layer source electrode drain electrode gate electrode passivation layer power connector thin film transistor structure electrode 420 exposed portion magnetic layer electrode power connector pixel segmentation wall data Driver thin film transistor scanning driver magnetic material with magnetic material with display area pixel supply device 32 1337510

. 600B

600C 601 602 603 604 604a 605 # 900 910 920 930 Film supply device Film supply device Base substrate Light to heat conversion layer Intermediate layer Transferable layer Transferable layer 604 Part of the magnetic layer Transfer chamber End effector Robot arm gate valve 33

Claims (1)

1337510 Qing X. Patent Application: -J 1. A laser-induced thermal imaging (LITI) device comprising: a substrate support configured to support an intermediate electronic device and a film supply device; a laser source; and a contact frame disposed between the substrate support and the laser source. The contact frame is movable between a first position and a second position relative to the substrate support Wherein the first position and the substrate support are separated by a first distance, the second position being spaced apart from the substrate support by a second distance greater than the first distance, the contact frame being configured to And operative to press the film supply device against the intermediate electronic device based on the first position, the contact frame comprising at least one magnetic material selected from the group consisting of a permanent magnet and an electromagnet; The contact frame includes a magnetic portion and a non-magnetic portion, the magnetic portion including the at least one magnetic material, and the magnetic portion is generally arranged to be closer to the non-magnetic portion Substrate support. 2. The device of claim 1, wherein the electromagnet is electrically connected to an external power source and configured to be selectively excited. The apparatus of claim 3, wherein the at least one magnetic material comprises one or more forms selected from the group consisting of: a flat plate, a sheet, a wafer, a rod, and a pellet. 4. The apparatus of claim 1, wherein the substrate support comprises at least one magnetic material selected from the group consisting of: a permanent magnet, an electromagnet, and a magnetically attractable material. 34 1337510 5. The apparatus of claim 1, wherein: the intermediate electronic device includes a receiving surface and is placed over the substrate holder; and the film feeding device includes a transferable film layer. And is placed on top of the intermediate electronic device. 6. The apparatus of claim 5, wherein the intermediate electronic device and the film supply device are arranged such that the receiving surface and the transferable film layer are in contact with each other. 7. The apparatus of claim 6 wherein there is substantially no air bubble between the receiving surface and the transferable film layer. 8. The apparatus of claim 5, wherein the film supply device further comprises a light to heat conversion layer. 9. The apparatus of claim 5, wherein the film supply device does not include a magnetic layer having a permanent magnet or an electromagnet. The apparatus of claim 5, wherein the intermediate electronic device comprises at least one magnetic material selected from the group consisting of permanent magnets, electromagnets, and magnetically attractable materials. 11 . A method of manufacturing an electronic device using the apparatus of claim 1 , comprising: placing an intermediate electronic device on the substrate support, the intermediate electronic device including a first surface and a second surface The first surface faces the contact frame, the second surface contacts the substrate support; the film supply device is placed on the first surface of the sinister electronic device, and the supply device includes a third surface and a first surface a fourth surface, the surface of the third table 35 1337510 facing the contact frame, moving the 亥海 contact frame to the surface of the supply device; and the fourth surface facing the substrate support: to contact the film supply device The third surface, the fourth surface contacts the first film feeding device of the intermediate electronic device to abut the intermediate electronic device. 12. If the square frame of the scope of the patent application includes -^f, the mouth, and the method of ',, i contact frame doorway will... via the contact frame The opening illuminates the laser beam on the film supply device. 13. If the method of patent application section " is applied, the method is carried out in a vacuum environment. The method of claim n, wherein the contact frame is an electromagnet, and initiating the magnetic force comprises activating the electromagnet. 15. The method of claim n, wherein squeezing the film supply device comprises applying a weight of the contact frame to the film supply device. 16. The invention of claim n, wherein the step of extruding the film feeding device comprises: allowing the at least-magnetic material and a magnet located below the first surface of the intermediate electronic device to be magnetic The attracted material creates a magnetic interaction. 17. The method of claim 16, wherein the intermediate electronic device comprises the magnet or a magnetically attractable material. The method of claim 16, wherein the substrate support comprises the magnet or a magnetically attractable material. 36