KR20070024820A - Laser induced thermal imaging apparatus and preparing method of organic light emitting device using the same - Google Patents

Abstract

A laser induced thermal imaging apparatus and a method of manufacturing an organic light emitting diode using the same are provided to facilitate thermal imaging of a light emitting layer of the OLED by preventing pores from being formed between an acceptor substrate and a donor film. A LITI(Laser Induced Thermal Imaging) apparatus forms a light emitting layer of an OLED(Organic Light Emitting Diode). The LITI apparatus includes a substrate stage(110), a laser resonator(120), an attachment frame(130), and an attachment frame conveyor unit(140). An acceptor substrate and a donor film are sequentially moved to the substrate stage which includes a magnet. A pixel defining region is formed on the acceptor substrate. The laser resonator irradiates a laser on the donor film. The attachment frame is arranged between the substrate stage and the laser resonator and includes an aperture and a magnet. The laser passes through the aperture. The magnet generates a magnetic force with respect to the substrate stage. The attachment frame conveyor unit reciprocally moves the attachment frame toward the substrate stage. A first attachment frame unit having a first aperture and a second attachment frame unit having a second aperture are alternatively mounted on the substrate stage. The first aperture forms first and second sub-pixels. The second aperture forms two third sub-pixels.

Description

Laser induced thermal imaging apparatus and preparing method of organic light emitting device using the same

1 is a cross-sectional view showing a laser thermal transfer apparatus according to the prior art.

Figure 2 is a perspective view showing one embodiment of a laser thermal transfer apparatus according to the present invention.

3A and 3B are perspective plan views showing an embodiment of a substrate stage of the laser thermal transfer apparatus according to the present invention.

Figure 4 is a structural diagram showing an embodiment of a laser oscillator of the laser thermal transfer apparatus used in the present invention.

Figure 5a and Figure 5b is a plan view showing an embodiment of the first contact frame and the second contact frame of the laser thermal transfer apparatus according to the present invention, respectively.

5C is a plan view illustrating a pixel array of the organic light emitting diode formed by FIGS. 5A and 5B.

Figure 5d and Figure 5e is a plan view showing another embodiment of the first contact frame and the second contact frame according to the present invention, respectively.

5F is a plan view illustrating a pixel array of the organic light emitting diode formed by FIGS. 5D and 5E.

Figure 6 is a perspective view showing the contact plate conveying means of the laser thermal transfer apparatus according to the present invention.

7 is a process chart illustrating a method of manufacturing an organic light emitting device according to the present invention.

<Description of the symbols for the main parts of the drawings>

100: laser thermal transfer device 110: substrate stage

120: laser oscillator 130: contact frame

133, 133a, 133b, 133c, 133d: opening groove

140: close contact frame moving means 150: chamber

200: donor film 300: acceptor substrate

The present invention relates to a laser thermal transfer apparatus and a method of manufacturing an organic light emitting device using the same, and more particularly, a laser thermal transfer apparatus and a method including laminating a donor film and an acceptor substrate using a magnetic force. It relates to a method of manufacturing an organic light emitting device.

The field of application of the present invention is not limited to a specific industrial field and may be applied in various ways, but it is expected to be useful for forming an organic light emitting layer and the like in manufacturing an organic light emitting device. The organic light emitting device is a device that emits self by forming a light emitting layer between the first electrode and the second electrode and applying a voltage between the electrodes, whereby holes and electrons are combined in the light emitting layer. Hereinafter, the prior art of the present invention and the configuration of the present invention will be described with reference to the laser thermal transfer apparatus used in the organic light emitting device, but is not limited thereto.

In the laser thermal transfer method, a donor substrate including a base substrate, a photothermal conversion layer, and a transfer layer is irradiated with a laser to transform a laser that has passed through the substrate substrate from a photothermal conversion layer to heat to deform and expand the photothermal conversion layer, thereby forming an adjacent transfer layer. It deforms and expands, and the transfer layer adheres to the acceptor substrate so as to be transferred.

In the case of performing the laser thermal transfer method, it is preferable that a vacuum state is formed in the chamber in which the transfer is performed so as to be synchronized with the deposition process at the time of forming the light emitting element. However, in the case of conventional laser thermal transfer in a vacuum state, a donor substrate and an acceptor are used. Foreign substances or spaces are generated between the substrates, so that the transfer layer is not easily transferred. Therefore, in the laser thermal transfer method, a method of laminating a donor substrate and an acceptor substrate has an important meaning, and various methods for solving the problem have been studied.

1 is a partial cross-sectional view of a laser thermal transfer apparatus according to the prior art for solving the above problems. According to this, the laser thermal transfer apparatus 10 includes a substrate stage 12 positioned inside the chamber 11 and a laser irradiation apparatus 13 positioned above the chamber 11.

The substrate stage 12 is a stage for sequentially positioning the acceptor substrate 14 and the donor film 15 introduced into the chamber 11, respectively.

At this time, in order to allow the acceptor substrate 14 and the donor film 15 to be laminated without foreign matter or space therebetween, in this case, the substrate stage 12 is not maintained in a vacuum in the chamber 11 where laser thermal transfer is performed. The hose 16 is connected to the lower part and sucked by the vacuum pump P to bond the acceptor substrate 14 and the donor film 15 to each other.

However, even in such a prior art, the foreign matter 1 and the space between the acceptor substrate 14 and the donor film 15 cannot be completely prevented from being generated, and furthermore, the vacuum state inside the chamber 11 can not be maintained. It is known to adversely affect the reliability and longevity of the product.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art and to more completely complete the technical idea proposed by the present applicant, and an object of the present invention is to use an acceptor substrate and a donor substrate in a vacuum state by using a magnetic force. An object of the present invention is to provide a laser thermal transfer apparatus and a method for manufacturing an organic light emitting device using the same, which is laminated and advantageously used for a specific pixel array on an acceptor substrate.

In a laser thermal transfer apparatus for forming an emission layer of an organic light emitting device according to an aspect of the present invention, an acceptor in which a pixel definition region in which a first subpixel, a second subpixel, and two third subpixels constitute one pixel is formed. A substrate stage including a donor film having a substrate and an organic light emitting layer to be transferred to the pixel definition region, sequentially transferred and stacked, and including a magnet; A laser oscillator for irradiating a laser onto the donor film; An adhesion frame installed between the substrate stage and the laser irradiation apparatus, the adhesion frame including an opening groove through which a laser passes and a magnet forming a magnetic force with the substrate stage; And a close frame moving means for reciprocating the close contact frame in the substrate stage direction, wherein the close contact frame has a first close contact with an opening groove forming the first sub pixel and the second sub pixel. The frame and the second contact frame having the opening grooves forming the two third sub-pixels are alternately mounted to form a light emitting layer of the organic light emitting device.

In addition, the laser thermal transfer apparatus for forming an emission layer of an organic light emitting diode according to an embodiment of the present invention includes a pixel definition region in which a first subpixel, a second subpixel, and two third subpixels form one pixel. A substrate stage comprising a donor film having an acceptor substrate and an organic light emitting layer to be transferred to the pixel definition region, sequentially transferred and stacked, and including magnets; A laser oscillator for irradiating a laser onto the donor film; An adhesion frame installed between the substrate stage and the laser irradiation apparatus and including an opening groove through which a laser passes and a magnetic material forming a magnetic force with the substrate stage; And a close frame moving means for reciprocating the close contact frame in the substrate stage direction, wherein the close contact frame has a first close contact with an opening groove forming the first sub pixel and the second sub pixel. The frame and the second contact frame having the opening grooves forming the two third sub-pixels are alternately mounted to form a light emitting layer of the organic light emitting device.

According to another aspect of the present invention, a method of manufacturing an organic light emitting diode by a laser thermal transfer method includes a pixel in which a first subpixel, a second subpixel, and two third subpixels form one pixel on a substrate stage including a magnet. An acceptor substrate transfer step of positioning an acceptor substrate on which a definition region is formed; A first donor film transfer step of placing a donor film having a first color organic light emitting layer to be transferred to the first subpixel on the acceptor substrate; A first contact frame contact step of forming an opening groove through which a laser for transferring the first color and the second color organic light emitting layer passes, and a first contact frame including a magnet to the first donor film by magnetic attraction. ; A first transfer step of transferring a first color organic light emitting layer to a first subpixel region by irradiating a laser onto the first donor film through the opening groove of the first contact frame; A first adhesion frame separation step of separating the first adhesion frame from the first donor film; A second donor film transfer step of placing a second donor film having a second color organic light emitting layer on the acceptor substrate in exchange with the first donor film; A first adhesion frame re-adhesion step of re-adhering the first adhesion frame to the second donor film with magnetic attraction; A second transfer step of transferring a second color organic light emitting layer to a second subpixel region by irradiating a laser onto the second donor film through the opening groove of the first contact frame; The first contact frame is separated from the second donor film, and an opening groove through which a laser passes for transferring the third color organic light emitting layer of the third donor film is formed, and is replaced with a second contact frame including a magnet. A second contact frame replacement step; A second donor film transfer step of placing a third donor film having a third color organic light emitting layer on the acceptor substrate in exchange with the second donor film; A second contact frame contacting step of contacting the second contact frame to the third donor film with magnetic attraction; And a third transfer step of transferring a third color organic light emitting layer into two third subpixel regions by irradiating a laser onto the third donor film through the opening groove of the second close frame. It is done.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in more detail. Figure 2 is an exploded perspective view of a laser thermal transfer apparatus according to an embodiment of the present invention. Accordingly, the laser thermal transfer apparatus 100 includes a substrate stage 110, a laser oscillator 120, a close contact frame 130, a close contact frame moving unit 140, and a chamber 150.

First, the chamber 150 may use the chamber 150 used in the conventional laser thermal transfer apparatus 100, and at least the substrate stage 110 and the adhesion frame 130 may be mounted in the chamber 150. . The donor film 200 and the acceptor substrate 300 are transferred in the chamber 150, and the donor film 200 and the acceptor substrate 300 are transferred to the inside of the chamber 150 outside the chamber 150. Transfer means (not shown) are provided.

The substrate stage 110 is located at the bottom of the chamber 150. In the present embodiment, the substrate stage 110 includes at least one electromagnet (not shown). However, those skilled in the art will readily be able to contemplate other embodiments that are implemented as permanent magnets or magnetic materials instead of electromagnets, and are included in the scope of the present invention.

3A and 3B, the electromagnet included in the substrate stage will be described in more detail. 3A and 3B are perspective plan views showing that the electromagnet 113 is formed in a concentric circle and a plurality of rows in the substrate stage 110, respectively. When the electromagnet 113 of the substrate stage 110 is arranged concentrically as shown in FIG. 3A, power is first applied to an electromagnet constituting the innermost concentric circle, and in that state, power is applied to an electromagnet constituting the next concentric circle. By applying power to the concentric electromagnets in the state again in that state to generate a magnet and magnetic attraction of the close contact frame to be described later to create a foreign matter or space between the donor substrate and the acceptor substrate It can be laminated while minimizing.

In addition, when the electromagnet of the substrate stage is arranged while forming a plurality of rows horizontally and vertically, as shown in FIG. It is possible to produce lamination, and to perform local lamination only on the part where the laser is irradiated. On the other hand, although not shown, each electromagnet is formed with an electrical wiring for applying power.

On the other hand, the substrate stage 110 may further include a driving means (not shown) for moving. When the substrate stage 110 is moved, the laser oscillator 120 may be configured to irradiate the laser only in one direction. For example, when the laser is irradiated in the longitudinal direction and further provided with a driving means for moving the substrate stage 110 in the horizontal direction, the laser may be irradiated with respect to the entire area of the donor film 200.

In addition, the substrate stage 110 may include mounting means for receiving and mounting the acceptor substrate 300 and the donor film 200. The mounting means allows the acceptor substrate 300 and the donor film 200, which have been transferred into the chamber 150 by the transfer means, to be accurately mounted at a predetermined position of the substrate stage.

In the present embodiment, the mounting means includes through holes 410 and 510, guide bars 420 and 520, moving plates 430 and 530, supporters 440 and 540, and mounting grooves 450 and 550. Can be configured. At this time, the guide bar 420 moves up or down in conjunction with the movable plate 430 and the support 440, while the guide bar 420 rises through the through hole 410 and the acceptor substrate 300 is moved. It is a structure that seats the acceptor substrate 300 to the mounting groove 450 formed on the substrate stage 110 while lowering. Since the mounting means may be variously modified by those skilled in the art, a detailed description thereof will be omitted on the page.

The laser oscillator 120 may be installed outside or inside the chamber 150, and the laser oscillator 120 may be installed to allow the laser to shine from above. According to FIG. 4, which is a schematic configuration diagram of the laser oscillator 120, the laser oscillator 120 in this embodiment uses a CW ND: YAG laser (1604 nm) and uses two galvanometer scanners 121 and 123. And a scan lens 125 and a cylinder lens 127, but is not limited thereto.

The close contact frame 130 includes an electromagnet, a permanent magnet, or a magnetic material. The close contact frame 130 forms a magnetic force with a magnet of the substrate stage, and the donor film 200 positioned between the substrate stage 110 and the close contact frame 130. Strongly laminating the acceptor substrate 300. In addition, the close contact frame 130 is provided with an opening groove 133 through which the laser can pass, so that the close contact frame 130 may simultaneously serve as a mask in which the laser can be irradiated only at a predetermined position. In the present embodiment, the magnetic material is a concept including a ferromagnetic material and a weak magnetic material, and Fe, Ni, Cr, Fe ₂ O ₃ , Fe ₃ O ₄ , CoFe ₂ O ₄ , magnetic nanoparticles, and mixtures thereof are preferably used. Can be.

In this case, the close contact frame 130 may include a first close contact frame having at least one opening groove 133 formed to form the first subpixel and the second subpixel of the organic light emitting device according to the organic light emitting layer to be transferred, and A second contact frame having at least one opening groove 133 to form a third sub-pixel is provided, and the two first contact frames and the second contact frame are operated while being interchanged with each other.

As in this embodiment, three sub-pixels are used as two close frames instead of three close frames, so that the replacement of the close frames can be reduced once, which is advantageous in the process. In addition, the process of forming the opening groove on the front surface and manufacturing using one contact frame is not impossible, but in this case, the magnet is included only in the edge portion of the contact frame so that lamination by the magnetic force between the donor substrate and the acceptor substrate is practical. Does not happen. Therefore, the area in which the magnet is included is preferably at least 50% or more of the close contact frame.

5A and 5B illustrate an embodiment of a first contact frame 130a and a second contact frame 130b mounted while being interchanged with each other.

The first contact frame 130a of FIG. 5A has a plurality of opening grooves 133a to form the first subpixel and the second subpixel, and the second contact frame 130b of FIG. 6B has a first contact When overlapped with the frame 130a, a plurality of opening grooves 133b are formed to form two third subpixels positioned below the opening grooves 133a of the first close contact frame 130a. At this time, each close contact frame includes a magnet or a magnetic body 137. On the other hand, the pixel arrangement of the acceptor substrate formed thereby is shown in Fig. 5C.

5D and 5E illustrate another embodiment of the first and second close contact frames mounted while being interchanged with each other, and FIG. 5F illustrates the first close contact frame 130a and the second close contact frame 130b. The pixel array formed is shown. Accordingly, the first close contact frame 130c of FIG. 5C has a plurality of opening grooves 133c to form the first subpixel and the second subpixel, and the second close contact frame 130d of FIG. A plurality of opening grooves 133d are formed to form two third sub-pixels positioned on the right side of the opening groove of the first contact frame 130a when overlapping with the first contact frame 130c. At this time, each close contact frame includes a magnet or a magnetic body 137. On the other hand, the pixel arrangement of the acceptor substrate formed thereby is shown in Fig. 5F.

The close contact frame moving unit 140 is a means for reciprocating the close contact frame 130 in the substrate stage direction, but may be manufactured in various ways, according to the embodiment shown in FIG. It includes a connecting bar 143 and a connecting bar 143 connected to the cradle 141 on the upper surface of the cradle 141 and the chamber 150 and a driving means (not shown) for driving the cradle 141 connected to the cradle 141 up and down. . At this time, when the close contact frame 130 is moved by the moving means as shown is mounted on the tray 135 having a mounting protrusion 134 is moved.

On the other hand, the exchange of the first contact frame and the second contact frame can be used for replacement means such as robot arm. For example, after forming the first subpixel and the second subpixel with the first contact frame placed on the holder, the robot arm transfers the first contact frame from the holder to the outside and replaces the second contact frame with the holder. This can be done.

Next, referring to FIGS. 2 and 7, a method of forming an organic light emitting device by the above-described laser thermal transfer apparatus will be described. In forming the light emitting layer of the organic light emitting device, the method using the above-described laser thermal transfer device, the acceptor substrate transfer step (ST100), the first donor film transfer step (ST200), the first contact frame contact step (ST300), First sub-pixel transfer step (ST400), the first contact frame separation step (ST500), the second donor film transfer step (ST600), the first contact frame re-adhesion step (ST700), the second sub-pixel transfer step (ST800) A second contact frame exchange step (ST900) and a third donor film transfer step (ST1000); A second contact frame contact step (ST1100), the third sub-pixel transfer step (ST1200).

The acceptor substrate transfer step ST100 is a step of placing the acceptor substrate 300 on which the organic light emitting layer is to be formed on the substrate stage 110 including a magnet or a magnetic material. The acceptor substrate 300 defines a pixel region in which an emission layer to be transferred from the donor film is to be formed. The pixel region of the acceptor substrate 300 is arranged such that four subpixels form one pixel.

The first donor film transfer step ST200 is a step of transferring the first donor film having a light emitting layer to be transferred onto the acceptor substrate 300. At this time, the light emitting layer may be of any one color, for example, may be R.

In the first close contact frame (ST300), an opening groove through which a laser passes to transfer the first color organic light emitting layer of the first donor film is formed, and the first close contact frame including a magnet or a magnetic material is magnetized to the first donor film. It is the stage of close contact with enemy personnel. At this time, it is preferable that the first close contact frame is primarily adhered by moving the close contact frame onto the substrate stage by the close contact frame moving means, and the second close contact frame is strongly adhered by magnetic attraction.

In the first transfer step (ST400), the laser is irradiated onto the first donor film through the opening groove of the first contact frame to expand the first color organic light emitting layer provided on the first donor film so as to expand the first sub of the acceptor substrate. Transferring to the pixel area is performed. At this time, the laser irradiation range is adjusted so that the laser is irradiated only to the first pixel region of the opening groove.

In the first contact frame separating step (ST500), the first contact frame is first separated by magnetic repulsive force, and the second contact frame is moved upwardly to the upper part of the chamber by the contact frame moving means. Separating from the substrate.

The second donor film transfer step (ST600) is a step of transferring the first donor film on the acceptor substrate to the outside of the chamber, and transferring the second donor film including the second color organic light emitting layer on the acceptor substrate. That is, the first donor film is replaced with the second donor film by the donor film conveying means.

The first contact frame re-adhesion step ST700 is a step of contacting the first contact frame separated from the donor substrate with magnetic attraction to the second donor film again in the first contact frame separation step ST500. At this time, it is preferable that the first close contact frame is primarily adhered by moving the close contact frame onto the substrate stage by the close contact frame movement, and the second close contact frame is more strongly magnetically attracted.

In the second transfer step ST800, the laser is irradiated onto the second donor film through the opening groove of the first contact frame to expand the second color organic light emitting layer provided on the second donor film to form the second sub of the acceptor substrate. Transferring to the pixel area is performed. At this time, the laser irradiation range is adjusted so that the laser can be irradiated only to the second pixel area of the opening groove.

In the second contact frame replacement step (ST900), a magnetic force between the first contact frame and the substrate stage is removed or a magnetic repulsive force is generated to separate the first contact frame from the second donor film and then remove the first contact frame. An opening groove through which a laser passes for transferring the third color organic light emitting layer of the 3 donor film is formed, and is replaced with a second close contact frame including a magnet or a magnetic material.

The third donor film transfer step (ST1000) is a step of transferring the second donor film on the acceptor substrate to the outside of the chamber, and transferring the third donor film including the third color organic light emitting layer on the acceptor substrate. That is, the first donor film is replaced with the second donor film by the donor film conveying means.

In the second close contact frame adhesion step (ST1100), an opening groove through which a laser passes for transferring the third color organic light emitting layer of the third donor film is formed, and the second close contact frame including a magnet or a magnetic material is magnetized to the third donor film. It is the stage of close contact with enemy personnel. At this time, it is preferable that the first close contact frame adheres primarily by moving the close contact frame onto the substrate stage by the close contact frame moving means, and the second close contact frame adheres with magnetic force more strongly.

In the third transfer step ST1200, the laser is irradiated onto the third donor film through the opening groove of the second contact frame to expand the third color organic light emitting layer provided on the third donor film to form the third sub of the acceptor substrate. Transferring to the pixel area is performed. At this time, the laser irradiation range is adjusted so that the laser can be irradiated to the entire area of the second close contact frame.

Meanwhile, in each transfer step, the organic light emitting layer may be variously transferred to the pixel definition region. Depending on the arrangement of the transfer of the organic light emitting layer, the laser irradiation method may vary. For example, when four subpixels form 2x2 pixels, in the first transfer step, the first subpixel is formed in the upper left pixel area, and in the second transfer step, the second subpixel is positioned to the right of the first subpixel. The third subpixel may be transferred to be formed one by one under the first subpixel and the second subpixel in the third transfer step. Alternatively, the first subpixel is formed in the upper left pixel area in the first transfer step, the second subpixel is transferred under the first subpixel in the second transfer step, and the third subpixel is formed in the third transfer step. The pixels may be transferred to be formed one by one on the right side of the first subpixel and the second subpixel.

In this case, B is preferably a color forming two sub-pixels. For example, in each transfer step, the color of the first color light emitting layer transferred in the first transfer step is R, the color of the second color light emitting layer transferred in the second transfer step is G, and transferred in the third transfer step. The color of the third color light emitting layer may be manufactured to be B. Alternatively, the color of the first color light emitting layer transferred in the first transfer step is G, the color of the second color light emitting layer transferred in the second transfer step is R, and the third color light emitting layer transferred in the third transfer step. The color of can be prepared to be B.

Although the present invention has been described primarily with reference to the above embodiments, many other possible modifications and variations can be made without departing from the spirit and scope of the invention. For example, a close frame that transfers the same color diagonally with four sub-pixels, a change in the type of laser oscillator, a change in various moving means, exchange means, etc. may be easily changed by those skilled in the art.

According to the laser thermal transfer apparatus according to the present invention, the donor substrate and the acceptor substrate can be laminated using a magnetic force under vacuum, so that not only the donor substrate and the donor substrate can be maintained as in the previous process of the organic light emitting device. There is an effect that the light emitting layer transfer of the organic light emitting device is made more efficient by laminating without creating foreign matter or empty space between the acceptor substrates.

In addition, according to the manufacturing method of the organic light emitting device according to the present invention, by using two close contact frame to form a three-color sub-pixel, it is possible to improve the process efficiency than using three close contact frame or one close contact frame It can be effective.

The scope of the above-described invention is defined in the following claims, and is not bound by the description in the text of the specification, all modifications and variations belonging to the equivalent scope of the claims will fall within the scope of the present invention.

Claims (13)

In the laser thermal transfer apparatus for forming the light emitting layer of the organic light emitting element, Each donor film including an acceptor substrate having a pixel definition region in which a first subpixel, a second subpixel, and two third subpixels form one pixel, and an organic light emitting layer to be transferred to the pixel definition region is sequentially A substrate stage which is transported and stacked and comprises a magnet; A laser oscillator for irradiating a laser onto the donor film; An adhesion frame disposed between the substrate stage and the laser irradiation apparatus, the adhesion frame including an opening groove through which a laser passes and a magnet forming a magnetic force with the substrate stage; And And a close frame moving means for reciprocating the close contact frame in the substrate stage direction. The close contact frame is alternately mounted with a first close contact frame having an opening groove forming the first subpixel and the second subpixel, and a second close contact frame having an opening groove forming the two third subpixels. A laser thermal transfer apparatus forming a light emitting layer of an organic light emitting device. The method of claim 1, And a chamber including at least the substrate stage and the contact frame therein. The method of claim 1, Laser thermal transfer apparatus further comprises a driving means for moving the substrate stage. The method of claim 1, The size of the opening groove of each of the contact frame is a laser thermal transfer apparatus, characterized in that 1% to 50% of the area of the contact frame. The method of claim 1, And at least one of the magnet of the close contact frame and the magnet of the substrate stage is an electromagnet. The method of claim 1, At least one of the magnet of the substrate stage or the magnet of the contact frame is a permanent magnet. In the laser thermal transfer apparatus for forming the light emitting layer of the organic light emitting element, Each donor film including an acceptor substrate having a pixel definition region in which a first subpixel, a second subpixel, and two third subpixels form one pixel, and an organic light emitting layer to be transferred to the pixel definition region is provided. A substrate stage including sequentially transferred and stacked magnets; A laser oscillator for irradiating a laser onto the donor film; An adhesion frame installed between the substrate stage and the laser irradiation apparatus and including an opening groove through which a laser passes and a magnetic material forming a magnetic force with the substrate stage; And And a close frame moving means for reciprocating the close contact frame in the substrate stage direction. The close contact frame is alternately mounted with a first close contact frame having an opening groove forming the first subpixel and the second subpixel, and a second close contact frame having an opening groove forming the two third subpixels. A laser thermal transfer apparatus forming a light emitting layer of an organic light emitting device. The method of claim 7, wherein The magnetic material is a laser thermal transfer device is one selected from the group consisting of Fe, Ni, Cr, Fe2O3, Fe3O4, CoFe2O4, magnetic nanoparticles and mixtures thereof. In the method of manufacturing an organic light emitting device in which the light emitting layer between the electrodes is formed by the laser thermal transfer apparatus of claim 1, An acceptor substrate transfer step of positioning an acceptor substrate on which a pixel definition region in which a first subpixel, a second subpixel, and two third subpixels constitute one pixel is formed on a substrate stage including a magnet; A first donor film transfer step of placing a donor film having a first color organic light emitting layer to be transferred to the first subpixel on the acceptor substrate; A first contact frame contact step of forming an opening groove through which a laser for transferring the first color and the second color organic light emitting layer passes, and a first contact frame including a magnet to the first donor film by magnetic attraction. ; A first transfer step of transferring a first color organic light emitting layer to a first subpixel region by irradiating a laser onto the first donor film through the opening groove of the first contact frame; A first adhesion frame separation step of separating the first adhesion frame from the first donor film; A second donor film transfer step of placing a second donor film having a second color organic light emitting layer on the acceptor substrate in exchange with the first donor film; A first adhesion frame re-adhesion step of re-adhering the first adhesion frame to the second donor film with magnetic attraction; A second transfer step of transferring a second color organic light emitting layer to a second subpixel region by irradiating a laser onto the second donor film through the opening groove of the first contact frame; The first contact frame is separated from the second donor film, and an opening groove through which a laser passes for transferring the third color organic light emitting layer of the third donor film is formed, and replaced with a second contact frame including a magnet. A second close frame replacement step; A second donor film transfer step of placing a third donor film having a third color organic light emitting layer on the acceptor substrate in exchange with the second donor film; A second contact frame contacting step of contacting the second contact frame to the third donor film with magnetic attraction; And And a third transfer step of transferring a third color organic light emitting layer to two third sub-pixel regions by irradiating a laser onto the third donor film through the opening groove of the second close contact frame. Manufacturing method. The method of claim 9, The four subpixels form a pixel in a 2 × 2 matrix, and in the first transfer step, the first color organic light emitting layer is transferred to be formed at the upper left of the pixel, and the second color in the second transfer step. The organic light emitting layer is transferred so as to be formed on the right side of the first subpixel, and in the third transfer step, the third color organic light emitting layer is transferred so as to be formed under each of the first subpixel and the second subpixel. A method of manufacturing an organic light emitting device. The method of claim 10, The four subpixels form a pixel in a 2 × 2 matrix, and in the first transfer step, the first color organic light emitting layer is transferred to be formed at the upper left of the pixel, and the second color in the second transfer step. The organic light emitting layer is transferred to be formed below the first subpixel, and in the third transfer step, the third color organic light emitting layer is transferred to be formed on each right side of the first subpixel and the second subpixel. A method of manufacturing an organic light emitting device. The method of claim 10, The color of the first color light emitting layer transferred in the first transfer step is R, the color of the second color light emitting layer transferred in the second transfer step is G, and the color of the third color light emitting layer transferred in the third transfer step The manufacturing method of the organic light emitting element which is B. The method of claim 10, The color of the first color light emitting layer transferred in the first transfer step is G, the color of the second color light emitting layer transferred in the second transfer step is R, and the color of the third color light emitting layer transferred in the third transfer step The manufacturing method of the organic light emitting element which is B.

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