1337052 九、發明說明： 【、明所屬之技術領域】 本设明係有關於—種损詈玲知姑班卜 方法，尤护、凌置興植板檢知裝置及其 為㈣奴位裝置，叫崎子板及母板是否 而後將斜板正確的設置於該母板之容置空間中。 【先前技術】1337052 IX. Description of invention: 【Technical field to which Ming and Ming belonged】 This design is related to the method of cultivating 詈 知 知 姑 , , , 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤 尤Whether the Qizi board and the motherboard are correctly placed in the accommodating space of the motherboard. [Prior Art]
品之= 電子產品製造者’多半將複數個產 電子元件二並合為—母板，以方便後續設置 中==:::=r而言，於同-母板 成p, ㈣無狀子板’而電子產品製造者 2即域本’多半不願接受母板巾具有财t之子板，或是 ，印刷電路板製造者降價，而造成印刷電路板製造者 上的增加。 然而一般習知之作法係為將母板中具有瑕疵之子板挖 除’而該具有瑕疵之子板挖除後會留下一容置空間，而後針 對該母板製作一模具，該模具設有一凹槽能容納及卡合該母 板’另設有一配合該容置空間之卡槽，以供一子板值入，已 取代原板被挖除之該具有瑕疵之子板，而後點膠將該植入之 子板與該母板黏合。然而，該母板及該子板之置入係以人工 之方式貼合，其費時費力又增加成本，但最重要的是，由於 該母板及子板係以該模具對位，該子板無法精準的於被挖除 之子板的位置相同，其位置的誤差，會造成後續製作時，電 子元件無法正確的設置其預定位置，尤其對於日益精密之電 路設計而言，會造成電子產品之電路短路等無法運作之情況。 1337052 是以，由上可知，上述習知之植板方式，顯然具有不便 • 與缺失存在，而可待加以改善者。 【發明.内容】 , 本發明之主要目的係提供一視覺檢知裝置與植板檢知裝 置及其方法，其用以將一母板，經由自動化植入一植入子板 ' 後，使該母板，修補為完整之母板，且該植入子板能精確的 Φ 植入該母板之容置空間。另於該植入子板植入該母板前，能 預先檢測該植入子板及母板是否為一良品。 為了達成上述之目的，本發明係提供一種視覺檢知裝 置，其用以檢知一待檢知物之上下表面之複數個定位標誌、， 該視覺檢知裝置係包括：一搬移定位裝置，其用以搬移該待 檢知物及調整該待檢知物之位置；一第一視覺定位裝置，其 用以尋找及定位該待檢知物之下表面之定位標誌之位置；以 及一第二視覺定位裝置，其用以尋找及定位該待檢知物之上 I 表面之定位標誌之位置；藉此，比對該等定位標誌之位置座 標是否超過一預定數值。 為了達成上述之目的，本發明另提供一種視覺檢知方 ’ 法，其步驟包括：一第一視覺定位裝置，其用以尋找及定位 ^ 一待檢知物之下表面之定位標誌；一第二視覺定位裝置，其 用以尋找及定位該待檢知物之上表面之定位標誌；個別判斷 該待檢知物之上表面之定位標誌與相對應之下表面之定位標 誌位置是否合乎標準，若超過該預定數值則捨棄該待檢知物。 為了達成上述之目的，本發明另提供一種植板檢知裝 置，其用以將一植入子板放置於一母板之容置空間，該母板 係包括複數個定位標諸'，该植入子板係包括複數個植入子板 疋位標tt'，該植板檢知裝置係包括：一搬移定位裝置，其用 以搬移該植入子板及調整該植入子板之位置；一視覺定位裝 置其用以哥找及疋位3玄植入子板之上下表面之植入子板定 立才不°志之位置，藉此比對忒等植入子板定位標tt之位置座標 疋否超過—預定數值；以及—定位檢視裝置，其用以尋找及 ，位該母板之定位標誌之位置；藉此，該搬移定位裝置依據 α亥母板之定位標誌之位置，以將該植入子板放置於該母板之 容置空間内。 為了達成上述之目的，本發明另提供一種植板‘檢知方 法，其步驟包括：儲存一植入子板於一儲存裝置；一視覺定 位裝置尋找及定位該植入子板上下表面之定位標誌；分別比 幸父判斷該植入子板之上表面之定位標誌與相對應之下表面之 又位標諸、位置是否超過一預定數值，若超過則捨棄該植入子 板’一定位檢視裝置尋找及，定位該母板之定位標誌；搬移該 植入子板至於該母板之容置空間。 於本發明有益的是植入子板能精準的植入母板，而能增 加後續製成的良率’植入子板植入母板係採自動化之方式， 能增加產能。並且能於該植入子板植入該母板前，能預先檢 測该植入子板及母板是否為一良品，而能事先將不良品移 除’而能節省後續之製作費用。 為了能更進一步瞭解本發明為達成預定目的所採取之技 術、手段及功效’請參閱以下有關本發明之詳細說明與附圖， 相信本發明之目的、特徵與特點，當玎由此得一深入且具體 之瞭解，然而所附圖式僅提供參考與說明用，並非用來對本 發明加以限制者 【實施方式） 請參考坌一 其設置於一 圖，本發明之視覺檢知裝置及植板檢知裝置 包括，—、之自動植板生產設備中，該自動植板生產設備其 i與柃板供給裴置100、—載板塗膠裝置2〇〇、一 R 、板裴置3 0 〇、一黏合裝置4 〇 0、一固化裝置 bU。、-卸裁裝置6〇〇。 本發g月# + A 杳王要目的為使一待檢知物於進行後續處理前， 待檢知物上之複數個定位標娃、之座標位置，特別是 =待檢2物之上下表面相對應之定位標談、，是否合乎標 1以，不符合標準之待檢知物進入後續處理時，形成不良 二二而^待檢知物係可為具有任何定位標諸之物品，該定位 二'、了為印刷於該待檢知物表面之任何圖樣，或是凸出或 凹，於為待檢知物表面之任—結構，舉例而言，該待檢知物 係可為/印刷電路板，或是，請參考第二圖及第三圖，該待 檢知係可為—具有子板8 2之母板8、單-^之植入子板8 5或是黏合有植入子板85之母板8 ’而假定該待鑑定物之 上下表面均·需設置電子$件之情說，需於該鑑定物之上下表 面又置定位標誌，且位於上表面之定位標誌與位於下表面 之疋位標誌相互對應，然而該定位標誌係先後設置於該待鈀 定物之上下表面，因此於印刷電路板上下表面相對應之定^ 標諸’其位置可能會具有誤差’若誤差過大，則需判定該印 刷電路板為壞板，而捨棄。 請參考第一圖至第三圖’本發明之另一目的係為將該母 板8，經由本發明之自動植板生產設備，而植入至少—植入 1337052 子板8 5，而能修補成為一完整之母板8，，其步騍為，首 先將該母板8黏貼於一載板9 ’而於該母板8的一個以上之 • 容置空間84分別填補上一植入子板85，而該植入子板8 5亦黏貼於該載板9上’之後以黏膠黏接該植入子板8 5之 黏接部8 6與該母板8之連接凹槽8 8，而使該母板8形成 、 完整之母板8 。而於該植入子板8 5植入該母板8前’需 / 先分別檢測該植入子板8 5與該母板8是否符合標準，若不 符合則予以捨棄’若符合才進行後續之植板處理。 i 該母板8其可為一印刷電路板或設置有複數個電子元件 之載板’其中該印刷電路板可為軟板或硬板，於本實施例中 該母板8設有三個子板8 2 ’其分別為一第一子板8 2 1、 一第二子板8 2 2及一第三子板8 2 3，而該等子板8 2係 可與該母板8 —體成形’該等子板8 2可為一應用於手機、 滑鼠等電子產品内部之印刷電路板，亦或為一電子元件。該 等子板8 2與該母板8之外框8 1以一連接部8 3連接，而 該容置空間8 4原本設置有外觀上與該等子板8 2相同之— _ 具有瑕疫之子板（圖未示）’但已於事前經由一測試裂置（圖 未示）測試為不良品’而經由切除連接部而於以挖除，特別 注意的是’該等子板8 2之數量不定，其可僅具有—個，該 等子板8 2之位置也未予限定，而該容置空間8 4之位置及 數量亦未予限定。 由於一般而言’母板上之子板數目及擺設位置會因產品 之需求而具有不同之設計，該測試裝置會於事前分別測試: 一母板上之每個子板是否具有缺陷’若該母板上之任何子板 具有缺陷’則予以挖除’而形成一個以上之容置空間， _ ^ j 问而 容置空間之位置及數目亦不定。 9 1337052 另外，嫌人子板85係設有複數 1，以作為識別、定位之用，而 攸疋位U 5 可同時設置於該植入子板85之:;===係 ，入子板8 5之側邊係可設有複數個黏 =板 =容係設有配合於該等黏接部8二 有複數個定位標誌87，而該第—子板 第 Μ 2及該第三子板8 2 3亦分別具有一第—定 諸8 7 2,以作為識別、定位之用⑽ Γ二 等第一定位標誌8 7 1及該等第二定位 U 7 2係可分別設置於該母板8之上下表面，且可相互 2。該載板9係複數個載板定位標誌、9 :，以作為該載板 =定位之用，該載板9另設有複數個點膠洞92，其該等點 膠洞9 2係配合該母板8之連接凹槽8 8，然而，由於每片 母板被挖去之子板位置不盡相同，因而該等連接凹槽係可針 對不同母板之連接凹槽之位置而預先設置。 請參考第一圖及第四圖，該載板供給裝置丄〇 〇係用以 提供一載板9至該載板塗膠裝置2 〇 〇以作後續處理，該載 板供給裝置1 〇 〇係可具有一運輸裝置（圖未示）與該載板 塗膠裝置2 0 0連接，其用以將該載板9運送至該載板塗膠 裝置2 0 0。該載板供給裝置丄〇◦之結構於本發明中並不 予限制’且由於該載板供給裝置1 〇 〇係為一習知技術，非 本發明之目的，因而並不多作描述。 請參考第四圖，其為本發明之該載板塗膠裝置2 〇◦之 第一實施例’該載板塗膠裝置2 0 0其包括一架體2 2、一 運輸裝置1 2，一黏膠塗布裝置1 3。 10 1337052 該運輸裝置1 2係架設於該架體1 1上，其可為—輸送 ' 帶、機械手臂或是其他具有運輸能力之裝置，其用以傳送該 ·- 栽板9。 • 該黏膠塗布裝置1 3係設置於該架體1 1上，其可架設 於该架體1 1平行該運輸裝置1 2之一側邊上，該黏膠塗布 . 裝置1 3係可延著平行該運輸裝置i 2之該側邊作水平移 :動，而該黏膠塗布裝置1 3係包括一懸臂1 3 1 ,該懸臂工 3 1、係具有伸縮之功能，該黏膠塗布裝置]3之一端係設有 二載板塗膠it件；1. 3 2 ’該載板塗勝元件1 3 2係可控制黏 膠之塗布量’以將塗膠塗布於該載板9上。 ^當塗膠於該載板9時，該運輸裝置1 2係控制該載板9 矛夕動至預疋位置，该黏膠塗布裝置1 3，係沿著該架體】 ^之側邊移動，並調整該懸臂1 3 1之長度，以將該載^塗 私元件1 3 2移動至一預定位置，而後該載板塗膠元件1 3 2塗布黏膠至該載板9上，該載板塗膠元件丄3 2之塗膠方 式係可為點#之方式塗布，或塗布該載板9之—特定區域。 • 而於塗布時，該載板塗膠元件1 3 2係可相對於該懸臂丄3 1往下移動，接近該載板9以方便塗膠’而塗布完成時，該 載板塗膠70件1 3 2係可相對於該懸们3 1往上移動，以 方便該載板塗膠元件1 3 2移往下一塗膠位置。 • 本貫施例可更進一步包括一黏膠抹平裝置14，其可跨 設於該架體1 1之兩相對側，該黏膠抹平裝置i 4可於該^ 1之兩相對側移動，而該黏膠抹平裝置i 4係設有一黏 膠抹平元件1 4 1，該黏膠抹平元件i 4丄係可於該黏膠抹 平裝置14上移動’而該黏膠抹平元件i 4 i係可為—塗膠 刷’當該黏勝塗布裝置丄3完成塗布黏膠時，_多動該黏膠抹 丄337052 T裝置14由該載板9之一側移動至另—相對側，而使該黏 取抹平元件141抹平該黏膠呈現薄膜狀鋪設於該載板g 。月茶考第五®及第六圖，其為本發明之視覺檢知植板裝 置3 0 〇之第一貫施例，該視覺檢知植板裝置豆 一視覺檢知裝置2及一植板檢知裝置3。 /、 抱 請參考第五圖及第五A®，該視覺檢知裂置2係包括係 包括一架體2 1、一運輸裝置2 2、一儲存裝置2 3、 位裝置2 4、-視覺定位裝置25、—定位檢視裝置$ 1-退料儲存裝置2 8。其用以檢知—待檢知物，是否$ 二付合標準之良品’並放置於—該載板9上，而於本實施丫歹 中该待檢知物係為該母板8。 該運輸裝置22其設置於該架體21，該運輸裝置22 Ϊ可為—輪送帶、機械手臂或是其他具有運輸能力之裝置， ”用以傳送該載板9至下一處理步驟。 ，儲存裝置2 3係設置於該架體2丄中，該儲存裝置2 '1及複數個定位桿2 3 2 ’該等定位 =32係可為-L型或平板型之柱狀體。該儲存裝置23 =用以贿複數個母板8，該科板8係上下疊置於該 2二3 等母板8之相鄰兩側邊係凸出於該升降板 側邊，以將該等母板8_於上下移動，意即沿著 2 3將其内剩餘之母板8向上移動-财距離， 持至一定之位置，以方便後續處理。 “移疋位裝置24,其用以搬移該母板8(待檢知物） 12 1337052 及調整該母板8 (待檢知物）之位置，其包括—定㈣2 ^ • 1及—定位部2 4 3，蚊位臂2 4 1係可跨設於該年體2 .· 1之兩相對侧邊’而能使該定位臂24丄延該架體2工之兩 相對側邊移動’意即沿著γ軸方向移動，該定位臂2 4工之 縱長方向係設有滑轨2 4 2，該滑執2 4 2係可供該定位部 .243延該滑執242而移動，意即沿著χ軸方向移動。 ·‘ 該定位部2 4 3係設置於定位臂2 4 1上，該定位部2 4 3係用以吸取該母板8，並能配合該定位臂2 4 i而精細 •的調整該母板8之X軸、γ軸、z軸及方位角。調整該定位 部2 4 3係可包括一移動件2 4 4、一升降件2 4 5、一調 整件2 4 6、-轉動件2 4 7、一吸取件2 4 8。該移動件 2 4 4係設置於該定位臂2 4 1上’並可沿著該定位臂2 4 1之该滑軌2 4 2移動，因而可調整該母板8之乂軸位置。 該升降件2 4 5係可設置於該移動件2 4 4之一側，該升降 件2 4 5係可相對於該移動件2 4 4垂直移動，因而可調整 該母板8之Z軸位置。該調整件2 4 6係設置於該移動件2 _ 4 4之下方，該調整件2 4 Θ係可相對於該升降件2 4 5於 X軸及Y軸方向之水平移動，因而可使該母板8於又軸及γ ' 軸方向作更精細之移動。該轉動件2 4 7係可設置於該移動 件2 4 4之底部，其可相對於該升降件2 4 5而於水平面旋 • 轉，因而可調整該母板8之方向角。而該吸取件2 4 8係設 置於忒轉動件2 4 7之底部。而該吸取件2 4 8係設置有複 數個檢視洞2 4 8 1，該等檢視洞2 4 8 1係貫穿於該吸取 件2 4 8，因而可由該吸取件2 4 8之上方檢視被吸取之該 母板8上表面之定位標誌8 7。 然則以上之該定位臂2 4 1及該定位部2 4 3之設計係 13 1337052 為使該母板8之位置能於χ軸、γ軸、z軸及方位角等方向 . 做一精細的調整，因而針對此目的而針對該定位臂2 4 1及 • 該定位部2 4 3而作的結構上之變化並未超出本發明。 當該搬移定位裝置2 4吸取該母板8時，則該搬移定位 裝置2 4移動該母板8至該視覺定位裝置2 5之間，該視覺 ‘定位裝置2 5係包括一第一視覺定位裝置2 5 1及一第二視 • ‘覺定位裝置2 5 3，該第一視覺定位裝置2 5 1係可固定或 移動地設置於該架體2 1 .，而可檢視該母板§之下表面，該 肇第-視覺定位裝置2 5 1係可包括-攝影機2 5 2，該攝影 機2 5 2係為拍攝該母板8之影像以供該第一視覺定位裝置 2 5 1作一分析處理，該第二視覺定位裝置2 5 3係可固定 或移動地设置於該架體2 1，而可檢視該母板8之上表面， j第二視覺定位裝置2 5 3係可包括一攝影機2 5 4 ,該攝 衫機2 5 4係為拍攝該母板8之影像以供該第二視覺定位裝 置2 5 3作一分析處理。 §亥第一視覺定位裝置2 5 1係控制該搬移定位裝置2 4 鲁移動該母板8之位置’經過一母板檢知步驟，以找尋該母板 8上之該等定位標誌8 7，繼而評估該母板8上之該等子板 • 8 2之彼此相對位置，是否超過一預定數值，若超過，則控 制該搬移定位裝置2 4移動並放置該母板8至一退料儲存^ 置2 8 ’以作回收處理。 亚請參考第二圖’以此實施例為例，該母板檢知步驟之 '細部過程係為該第—視覺定位裝置251移動該搬移定位裝 置2 4，以檢視該母板8上之第一預定位置8 9 1，並判斷 該第-，定位置8 9 ].是否具有—子板，若無，則判斷該位 置為一容置空間，若有，則檢視該第一預定位置8 9 1上之 14 1337052 子板之定位標誌，而於此實施例中因為該第一預定位置8 9 - 1係為一容置空間8 4，因此該第一視覺定位裝置2 5 ；[則 送出一該第一預定位置8 9 1係為一容置空間8 4之訊號至 -舰器7。之後該第-視覺定位裝置2 5 i並移動該搬移 定位裝置2 4至該母板8之第二預定位置8 9 2，重複上述 , 之檢視步驟，於此實施例中，該第二預定位置8 g 2具有一 -第一子板8 2 1，則該第一視覺定位裝置2 5丄則尋找並定 位該第一子板8 2 1上之一第一定位標誌8 7丄及一第二定 •位標誌8 7 2，並傳送該第一子板8 2 1之該第一定位標誌 8 7 1及該第二定位標誌8 7 2之位置座標於該伺服器^ =，而於第三預定位置8 9 3及第四預定位置8 9 4，亦重 複上述步驟，而至最後的第四預定位置8 g 4處理完後，若 則該伺服器7依據所有該第一子板8 2丄、該第二子板8 2 及該第三子板8 2 3之第-定位標諸8 7 1及第二定位標 誌8 7 2之位置座標做一比對判斷’是否超過一預定數值， 若有，則判斷該母板8為具有瑕疵的，則控制該搬移定位裝 • 置2 4移動並放置該母板8至一退料儲存裝置2 8，以作回 收處理，若無則繼續後續處理。 . ⑨舉例而言，該伺服器7可將該第一子板8 2 1之第一定 位標結8 71之位置座標減去該第二子板8 2 2之第-定位 .標諸8 7 1及或該第-子板8 2 1之第二定位標誌、8 7 2之 位置f減去該第二子板8 2 2之第二^位標語8 7 2之位 置座標是否超過—肢數值，若有關斷該母板8為具有瑕 痴的，後，之第二子板8 2 2與第三子板8 2 3及第三子板 8 2 3與Ϊ四子板8 2 4之比對亦比照上述步驟處理。 在此需注意的是，該母板之容置空間及子板之位置及數 15 1337052 目，因不同之母板設計而有不同5因而上述步驟之母板檢知 - 步驟，因此產生之變化，並未超出本發明。 .. 若該母板8經由該第一視覺定位裝置2 5 1檢視通過 . 後，該搬移定位裝置2 4移動該母板8至該第二視覺定位裝 置2 5 3之下方，而針對該母板8之上表面，進行如同該第 . 一視覺定位裝置2 5 1之母板檢知步驟，該母板8之上表面 ； 之定位標誌87並儲存於該伺服器7中，而於此不再贅述。 而其中由於該母板8經由該吸取件2 4 8吸取，因而該母板 • 8上表面之該等定位標誌8 7，被該吸取件2 4 8所覆蓋， 因而該吸取件2 4 8設有該等檢視洞2 4 8 1，而可供該第 二視覺定位裝置2 5 3該等定位標誌8 7。 而於另一實施例，該第一視覺定位裝置2 5 1與該第二 視覺定位裝置2 5 3係可上下相對設置。該第一視覺定位裝 置2 5 1係固定於該架體2 1，該第二視覺定位裝置2 5 3 係可移動地設置於該架體2 1。因而該第二視覺定位裝置2 5 3係可參考該第一視覺定位裝置2 5 1所測之該母板8之 _ 定位標誌8 7之座標，而與該第一視覺定位裝置2 5 1可同 時檢視該母板8。 於上述之母板8之上下表面之定位標誌8 7之座標均測 Γ 完且合於標準後，由於該等定位標誌8 7之座標均已儲存於 該伺服器7之中，因而可將該母板8上表面之定位標誌8 7 之位置分別與其對應之該母板8下表面之定位標誌8 7之位 置作一比較，以判斷是否超過一預定數值，若超過則判斷該 母板8為具有瑕疵的，則控制該搬移定位裝置2 4移動並放 置該母板8至一退料儲存裝置2 8，以作回收處理，若無則 繼續後續處理。 . 16 1337052 舉例而言，可將該母板8之第一子板8 2 1之上表面之 . 第一定位標誌8 7 1之位置座標減去該第一子板8 2 1之下 . 表面之第一定位標誌8 7 1之第一定位標誌8 7 1之位置座 標，若超過一預定數值，則判斷該母板8為具有瑕/疵的，而 該母板8之其他定位座標亦依照上述之判定方法處理，不再 贅述。 . 最後當該母板8經由上述之母板檢知步驟，符合標準 ' 時，該搬移定位裝置2 4可依據該等定位標誌8 7之位置及 • 方向，微調該母板8之X軸、Y軸、Z軸及方位角等方向及 位置於一預定位置，並從該預定位置搬移至該載板9之上表 面，使該母板8與該載板9黏合。 而於本實施例中，該母板8設置於該載板9上之位置可 精由該定位檢視裝置2 7檢視及定位該載板9上之載板定位 標誌9 1，而控制該搬移定位裝置2 4依據該載板定位標誌 9 1之位置而搬移該母板8至該載板9上之一預定位置。該 定位檢視裝置2 7係可設置於該定位部2 4 3，或是該定位 _ 部2 4 3之升降件2 4 5或調整件2 4 6上，該定位檢視裝 置27係可包括一視覺定位攝影機271，該視覺定位攝影 機2 7 1係用以拍攝該載板9影像，以供該定位檢視裝置2 • 7分析及尋找該載板9上之載板定位標誌91。 . 當該母板8黏合於該載板9之後，請參考第六圖，該載 板9即傳送至本創作之植板檢知裝置3，以將植入子板8 5 植入該母板8之容置空間8 4，該植板檢知裝置3之設置如 同該視覺檢知裝置2 (請參考第五圖及第五A圖），包括同樣 結構之一架體3 1、一運輸裝置3 2、一儲存裝置3 3、一 搬移定位裝置3 4、一視覺定位裝置3 5、一定位檢視裝置 1337052 3 7及y退料儲存裴置3 8。而不同之處在於該儲存裝置3 3係I以储存該植入子板8 5，該退料儲存裝置3 8之大小 精t δ彳省存5亥植入子板8 5，而一吸取件3 4 8之設計係適 合吸取该植人子板85，且該吸取件3 4 8之檢視洞348 1之排歹j係配合该植入子板8 5之該子板定位標諸、8 5 1而 ' 設置。Product = Electronic product manufacturer's most of the multiple electronic components are combined into a mother board, in order to facilitate the subsequent setting ==:::=r, in the same - mother board into p, (four) innocent daughter board 'Whether the electronics manufacturer 2, the domain book' is mostly reluctant to accept the daughter board has a daughter board, or the printed circuit board makers cut prices, resulting in an increase in printed circuit board manufacturers. However, it is a common practice to excavate a sub-board having a crucible in the mother board. The excavated sub-board will leave an accommodating space, and then a mold is formed for the mother board, and the mold is provided with a groove. The card can be accommodated and engaged, and a card slot for accommodating the accommodating space is provided for the value of a sub-board to replace the sub-board which has been removed from the original plate, and then the sub-plate is glued. The board is bonded to the motherboard. However, the insertion of the motherboard and the daughterboard is done manually, which is time consuming and labor intensive, but most importantly, since the motherboard and the daughterboard are aligned with the mold, the daughterboard It is impossible to accurately position the sub-board that is excavated, and the position error will cause the electronic component to not correctly set its predetermined position during subsequent production, especially for the increasingly sophisticated circuit design, which will cause the circuit of the electronic product. A situation such as a short circuit that does not work. 1337052 Therefore, it can be seen from the above that the above-mentioned conventional method of planting is obviously inconvenient and in need of improvement, but can be improved. [Invention. Content] The main object of the present invention is to provide a visual detecting device and a plant detecting device and a method thereof, which are used for automatically implanting a mother board into a daughter board The motherboard is repaired into a complete mother board, and the implanted daughter board can accurately implant the housing space of the motherboard. Before the implanted daughter board is implanted into the mother board, it is possible to detect in advance whether the implanted daughter board and the mother board are a good product. In order to achieve the above object, the present invention provides a visual detecting device for detecting a plurality of positioning marks on an upper surface of an object to be inspected, the visual detecting device comprising: a moving positioning device, a position for moving the object to be detected and adjusting the object to be detected; a first visual positioning device for finding and locating a position of the positioning mark on the lower surface of the object to be detected; and a second vision And a positioning device for finding and locating a position of the positioning mark on the surface of the I above the object to be detected; thereby determining whether the coordinate of the position of the positioning mark exceeds a predetermined value. In order to achieve the above object, the present invention further provides a visual detection method, the method comprising: a first visual positioning device for finding and locating a positioning mark on a surface of the object to be inspected; a second visual positioning device for finding and locating a positioning mark on the upper surface of the object to be inspected; and individually determining whether the positioning mark on the upper surface of the object to be detected and the position of the positioning mark on the corresponding lower surface are in conformity with the standard. If the predetermined value is exceeded, the object to be detected is discarded. In order to achieve the above object, the present invention further provides a planting board detecting device for placing an implant sub-board in a housing space of a motherboard, the mother board comprising a plurality of positioning marks, The sub-board includes a plurality of implanted sub-plates tt', the plant-detecting device includes: a moving positioning device for moving the implanted sub-board and adjusting the position of the implanted sub-board; A visual positioning device is used for the position of the implanted sub-board on the lower surface of the upper and lower sides of the sacral implanted sub-board, and the position of the aligning position of the implanted sub-plate is determined.疋 超过 exceeds—a predetermined value; and—a positioning inspection device for finding and positioning a position of the positioning mark of the motherboard; The implanted daughter board is placed in the housing space of the motherboard. In order to achieve the above object, the present invention further provides a method for detecting a planting plate, the method comprising: storing an implanted daughter board in a storage device; and a visual positioning device for finding and positioning a positioning mark on a lower surface of the implanted daughter board Determining whether the positioning mark on the upper surface of the implanted daughter board and the corresponding lower surface of the implanted daughter board respectively exceed a predetermined value, and if so, discarding the implanted daughter board 'a positioning inspection device Finding and locating the positioning mark of the motherboard; and moving the implanted daughter board to the accommodating space of the motherboard. It is beneficial in the present invention that the implanted daughter plate can be accurately implanted into the mother board, and the subsequent yield can be increased. The implanted daughter plate is implanted in the mastering system to increase the productivity. Moreover, before the implanted daughter board is implanted into the mother board, it can be detected in advance whether the implanted daughter board and the mother board are a good product, and the defective product can be removed in advance, thereby saving subsequent production costs. In order to further understand the techniques, means and functions of the present invention in order to achieve the intended purpose, the following detailed description of the invention and the accompanying drawings will be understood. And the present invention is not limited to the invention. [Embodiment] Please refer to FIG. 1 for a visual inspection device and a plate inspection of the present invention. In the automatic planting equipment, the automatic planting equipment, the i and the raft supply device 100, the carrier glue coating device 2, a R, the plate is set to 30 〇, An adhesive device 4 〇 0, a curing device bU. - The unloading device 6〇〇.本发g月# + A The purpose of the king is to make the position of the plurality of positioning flags on the object to be inspected before the subsequent processing, especially the upper surface of the object to be inspected Corresponding positioning, whether it meets the standard 1 or not, if the object to be inspected that does not meet the standard enters the subsequent processing, it forms a bad 22 and the object to be detected can be an item with any positioning, the positioning 2', any pattern printed on the surface of the object to be inspected, or convex or concave, as a structure for the surface of the object to be inspected, for example, the object to be detected may be/printed The circuit board, or, please refer to the second figure and the third figure, the to-be-detected system can be - the mother board 8 with the daughter board 8 2, the single daughter board 8 5 or the bonded implant The mother board 8' of the daughter board 85 is assumed to be provided with an electronic component on the upper and lower surfaces of the object to be identified, and a positioning mark is required on the lower surface of the identification object, and the positioning mark and the located on the upper surface are located. The position marks on the lower surface correspond to each other, but the positioning marks are successively set on the table below the palladium to be determined. Therefore the printed circuit board at the surface corresponding to the predetermined scale such ^ 'may have an error position' if the error is too large, it is determined that the need for the printed circuit board bad board, and discarded. Please refer to the first to third figures. Another object of the present invention is to implant the mother board 8 through the automatic planting equipment of the present invention, and at least implant the 1337052 daughter board 85, and repair it. The method is as follows: first, the mother board 8 is adhered to a carrier board 9', and more than one of the housing spaces 84 of the motherboard 8 respectively fills the previous implanted board. 85, and the implanting daughter board 85 is also adhered to the carrier board 9 and then adheres to the connecting groove 8 8 of the bonding board 86 and the mother board 8 by adhesive. The mother board 8 is formed into a complete mother board 8. Before the implanting daughter board 8 5 is implanted into the mother board 8 , it is necessary to first detect whether the implanted daughter board 8 5 and the mother board 8 meet the standard, and if not, discard it. Planting board processing. The motherboard 8 can be a printed circuit board or a carrier board provided with a plurality of electronic components. The printed circuit board can be a soft board or a hard board. In this embodiment, the motherboard 8 is provided with three sub-boards 8 2' is a first sub-board 8 2 1 , a second sub-board 8 2 2 and a third sub-board 8 2 3, and the sub-boards 8 2 can be integrally formed with the mother board 8 The daughter board 82 can be a printed circuit board used in an electronic product such as a mobile phone or a mouse, or an electronic component. The sub-boards 8 2 are connected to the outer frame 8 1 of the motherboard 8 by a connecting portion 8 3 , and the receiving space 8 4 is originally provided with the same appearance as the sub-boards 8 2 — _ having a plague The daughter board (not shown) 'has been tested as a defective product by a test split (not shown) beforehand and is removed by cutting the joint, paying particular attention to 'the daughter boards 8 2 The number of the sub-boards 8 2 is not limited, and the position and number of the accommodating spaces 804 are not limited. Since the number of sub-boards and the placement position on the motherboard will generally have different designs depending on the requirements of the product, the test device will be tested separately beforehand: Whether each sub-board on a motherboard has a defect 'If the motherboard Any sub-board above has a defect 'is excavated' to form more than one accommodating space, and the location and number of accommodating spaces are also uncertain. 9 1337052 In addition, the scorpion sub-board 85 is provided with a plurality 1 for identification and positioning, and the U U 5 can be simultaneously disposed on the implant sub-board 85:; === system, input sub-board The side of the 8 5 may be provided with a plurality of viscous=boards=the system is provided with the plurality of positioning marks 87, and the first and second sub-boards 8 2 3 also has a first-set of 8 7 2 for identification, positioning (10) Γ second-class first positioning mark 8 7 1 and the second positioning U 7 2 can be respectively set on the motherboard 8 above the lower surface, and can be 2 to each other. The carrier board 9 is provided with a plurality of carrier positioning marks, 9 for use as the carrier board for positioning. The carrier board 9 is further provided with a plurality of dispensing holes 92, and the dispensing holes 9 2 are matched with the carrier board 9 The connecting grooves 8 of the mother board 8 are, however, because the positions of the daughter boards in which each of the mother boards are excavated are not the same, the connecting grooves can be preset for the positions of the connecting grooves of the different mother boards. Referring to the first and fourth figures, the carrier supply device is configured to provide a carrier 9 to the carrier glue applicator 2 for subsequent processing, and the carrier supply device 1 There may be a transport device (not shown) coupled to the carrier glue applicator 200 for transporting the carrier 9 to the carrier glue applicator 200. The structure of the carrier supply device 并不 is not limited in the present invention, and since the carrier supply device 1 is a conventional technique and is not an object of the present invention, it will not be described. Please refer to the fourth figure, which is the first embodiment of the carrier glue application device 2 of the present invention. The carrier glue application device 200 includes a frame body 2, a transportation device 1 2, and a carrier device 2 Adhesive coating device 13. 10 1337052 The transport device 12 is erected on the frame body 1 1 and can be a conveyor belt, a robot arm or other transportable device for transporting the carrier plate 9. The adhesive coating device 13 is disposed on the frame body 1 1 and can be mounted on the side of the frame body 1 1 parallel to the transport device 1 2 . The glue is coated. The device 1 3 can be extended. Parallel to the side of the transport device i 2 is horizontally moved, and the adhesive coating device 13 includes a cantilever 1 3 1 , the cantilever 31 has a function of stretching, and the adhesive coating device One end of the 3 is provided with a two-plate rubber-coated one piece; 1. 3 2 'the carrier-coated element 1 3 2 can control the coating amount of the adhesive' to apply the adhesive to the carrier 9. ^ When the glue is applied to the carrier 9, the transport device 12 controls the carrier 9 to move to the pre-twisting position, and the adhesive coating device 13 moves along the side of the frame And adjusting the length of the cantilever 131 to move the carrier element 1 3 2 to a predetermined position, and then the carrier glue component 133 applies adhesive to the carrier 9, the load The gluing element 丄3 2 can be applied by way of point # or by coating a specific area of the carrier 9. • At the time of coating, the carrier glue component 132 can be moved downward relative to the cantilever 丄 3 1 , close to the carrier 9 to facilitate the application of glue. When the coating is completed, the carrier is coated with 70 pieces. The 1 3 2 system can be moved upward relative to the suspension 3 1 to facilitate the movement of the carrier glue component 1 3 2 to the next glue application position. The present embodiment may further include a viscose screed 14 that can be spanned on opposite sides of the frame 1 1 and the viscose screed i 4 can be moved on opposite sides of the body 1 And the adhesive smoothing device i 4 is provided with an adhesive smoothing element 14 1 , the adhesive smoothing element i 4 can be moved on the adhesive smoothing device 14 and the adhesive is smoothed The component i 4 i can be a rubberized brush. When the adhesive coating device 3 finishes applying the adhesive, the multi-moving adhesive 337052 T device 14 is moved from one side of the carrier 9 to another. On the opposite side, the adhesive smoothing element 141 is smoothed and the film is laid on the carrier plate g in a film form. The fifth and sixth figures of the monthly tea test, which is the first embodiment of the visual detection planting device of the present invention, the visual detection device Bean-Visual inspection device 2 and a planting plate The device 3 is detected. /, Please refer to the fifth figure and the fifth A®, the visual detection split 2 series includes a body 2 1 , a transport device 2 2 , a storage device 2 3 , a bit device 24 , a visual The positioning device 25, the positioning inspection device $1-return storage device 28. It is used to detect whether the object to be inspected, whether it is a good or not, and is placed on the carrier board 9, and in the present embodiment, the object to be detected is the mother board 8. The transport device 22 is disposed on the frame body 21, and the transport device 22 can be a wheel conveyor belt, a robot arm or other transportable device, for conveying the carrier plate 9 to the next processing step. The storage device 2 3 is disposed in the frame body 2, and the storage device 2'1 and the plurality of positioning rods 2 3 2 'the positioning=32 series may be a column type L-type or flat type. The device 23 is used to bribe a plurality of mother boards 8 which are placed one above another on the adjacent sides of the mother board 8 of the 2nd and 3rd sides, and protrude from the side of the lifting board to The board 8_ moves up and down, which means that the remaining mother board 8 is moved upwards along the 2 3, and is held to a certain position for convenient subsequent processing. “The moving position device 24 is used to move the board 8 The mother board 8 (to be inspected) 12 1337052 and the position of the mother board 8 (to be detected), including - (4) 2 ^ • 1 and - positioning part 2 4 3, mosquito bit arm 2 4 1 Between the two opposite sides of the body 2··1, the positioning arm 24 can be moved to move the two opposite sides of the frame 2 to move along the γ axis direction, and the positioning arm 2 4 The longitudinal direction of the work is provided with a slide rail 2 4 2, which is available for the positioning portion 243 to move along the slide 242, that is, to move along the x-axis direction. The positioning portion 2 4 3 is disposed on the positioning arm 24 1 , and the positioning portion 24 3 is used for sucking the motherboard 8 and can finely adjust the motherboard according to the positioning arm 2 4 i 8 X, γ, z and azimuth. The positioning portion 2 4 3 can be adjusted to include a moving member 24 4 , a lifting member 2 4 5 , an adjusting member 2 4 6 , a rotating member 2 4 7 , and a suction member 2 4 8 . The moving member 24 4 is disposed on the positioning arm 24 1 ' and movable along the sliding rail 2 4 2 of the positioning arm 24 1 , so that the pivot position of the motherboard 8 can be adjusted. The lifting member 24 5 can be disposed on one side of the moving member 24 4 , and the lifting member 24 5 can be vertically moved relative to the moving member 24 4 , thereby adjusting the Z-axis position of the motherboard 8 . The adjusting member 246 is disposed below the moving member 2_4 4, and the adjusting member 24 is horizontally movable relative to the lifting member 2445 in the X-axis and the Y-axis direction, thereby The mother board 8 performs finer movement in the direction of the axis and the γ' axis. The rotating member 24 7 can be disposed at the bottom of the moving member 24 4 , and can be rotated in a horizontal plane with respect to the lifting member 24 5 , so that the direction angle of the motherboard 8 can be adjusted. The suction member 248 is disposed at the bottom of the cymbal rotating member 247. The suction member 24 8 is provided with a plurality of inspection holes 2 4 8 1 , and the inspection holes 2 4 8 1 are penetrated through the suction member 2 4 8 , and thus can be sucked up by the upper inspection of the suction member 2 4 8 The positioning mark of the upper surface of the mother board 8 is 87. However, the design of the positioning arm 2 4 1 and the positioning portion 24 3 is 13 1337052 so that the position of the motherboard 8 can be adjusted in the directions of the x-axis, the γ-axis, the z-axis, and the azimuth. Therefore, the structural changes made to the positioning arm 241 and the positioning portion 243 for this purpose do not go beyond the present invention. When the moving positioning device 24 draws the motherboard 8, the moving positioning device 24 moves the motherboard 8 to the visual positioning device 25. The visual 'positioning device 25 includes a first visual positioning. The device 2 151 and a second visual locating device 253 can be fixedly or movably disposed on the frame 2 1 . The lower surface, the first visual positioning device 251 may include a camera 252 that captures an image of the motherboard 8 for analysis by the first visual positioning device 251 The second visual positioning device 253 can be fixedly or movably disposed on the frame body 2 and can view the upper surface of the motherboard 8. The second visual positioning device 253 can include a camera. 2 5 4 , the camera 2 514 is to take an image of the motherboard 8 for the second visual positioning device 2 5 3 to perform an analysis process. §Hai first visual positioning device 2 1 1 controls the moving positioning device 2 4 to move the position of the mother board 8 'after a mother board detecting step to find the positioning marks 8 7 on the mother board 8 Then, it is evaluated whether the relative positions of the sub-boards 8 2 on the motherboard 8 exceed a predetermined value, and if so, the moving positioning device 24 is controlled to move and the motherboard 8 is placed to a return storage. Set 2 8 ' for recycling. Referring to the second figure, in the example of the embodiment, the detailed process of the mother board detecting step is that the first visual positioning device 251 moves the moving positioning device 24 to view the number of the mother board 8 a predetermined position 8 9 1, and determine whether the first -, fixed position 8 9 ]. has a - sub-board, if not, it is determined that the position is an accommodation space, if any, then the first predetermined position 8 9 1 is a positioning mark of the 14 1337052 daughter board, and in this embodiment, the first predetermined position 8 9 - 1 is an accommodation space 8 4, so the first visual positioning device 2 5; The first predetermined position 8 9 1 is a signal to the space 7 of the accommodating space 8 4 . Then, the first visual positioning device 2 5 i moves the moving positioning device 24 to the second predetermined position 8 9 2 of the motherboard 8 to repeat the above-mentioned viewing step. In this embodiment, the second predetermined position 8 g 2 has a first sub-board 8 2 1 , then the first visual positioning device 25 5 searches for and locates one of the first positioning marks 8 7 and a second on the first sub-board 8 2 1 The position mark 8 7 2 is transmitted, and the position of the first positioning mark 8 7 1 and the second positioning mark 8 7 2 of the first sub-board 8 2 1 is transmitted to the server ^ =, and the third is The predetermined position 8 9 3 and the fourth predetermined position 8 9 4 are also repeated, and after the last fourth predetermined position 8 g 4 is processed, if the server 7 is based on all the first daughter boards 8 2 The position coordinates of the second sub-board 8 2 and the third sub-plate 8 2 3 of the first positioning mark 807 and the second positioning mark 807 are compared to determine whether the value exceeds a predetermined value. If yes, if it is determined that the motherboard 8 is defective, then the moving positioning device is controlled to move and the motherboard 8 to a return storage device 2 8 are disposed for recycling. Li, if not then continue with the subsequent process. For example, the server 7 can subtract the position coordinates of the first positioning label 8 71 of the first sub-board 8 2 1 from the first position of the second sub-board 8 2 2 . 1 or or the second positioning mark of the first sub-board 8 2 1 , the position f of the 807 minus the position coordinates of the second slogan 872 of the second sub-board 8 2 2 exceeds the limb value If the mother board 8 is broken, the ratio of the second sub-board 8 2 2 and the third sub-board 8 2 3 and the third sub-board 8 2 3 to the fourth sub-board 8 2 4 The pair is also treated as described above. It should be noted here that the location of the accommodating space and the sub-board of the motherboard and the number of 15 1337052 meshes are different due to different motherboard designs. Therefore, the mother board detection-steps of the above steps are changed. Without departing from the invention. After the motherboard 8 is viewed through the first visual positioning device 251, the moving positioning device 24 moves the motherboard 8 below the second visual positioning device 253, and for the mother The upper surface of the board 8 is subjected to a mother board detecting step like the first visual positioning device 251, the upper surface of the mother board 8; and the positioning mark 87 is stored in the server 7, but not Let me repeat. Wherein, since the motherboard 8 is sucked through the suction member 248, the positioning marks 87 of the upper surface of the motherboard 8 are covered by the suction member 248, and thus the suction member 2 4 8 is provided. There are such viewing holes 2 4 8 1 and the second visual positioning device 2 5 3 can position the positioning marks 87. In another embodiment, the first visual positioning device 251 and the second visual positioning device 253 are vertically disposed opposite each other. The first visual positioning device 251 is fixed to the frame body 2, and the second visual positioning device 253 is movably disposed on the frame body 21. Therefore, the second visual positioning device 253 can refer to the coordinates of the _ positioning mark 87 of the motherboard 8 measured by the first visual positioning device 251, and the first visual positioning device 251 can be The motherboard 8 is also viewed at the same time. After the coordinates of the positioning marks 87 on the lower surface of the above-mentioned mother board 8 are all measured and matched to the standard, since the coordinates of the positioning marks 87 are stored in the server 7, the The position of the positioning mark 87 on the upper surface of the motherboard 8 is compared with the position of the corresponding positioning mark 87 of the lower surface of the motherboard 8 to determine whether it exceeds a predetermined value. If it exceeds, the motherboard 8 is judged to be If there is a defect, the moving positioning device 24 is controlled to move and the mother board 8 to a return storage device 2 8 are disposed for recycling processing, and if not, the subsequent processing is continued. 16 1337052 For example, the surface of the first sub-board 8 2 1 of the motherboard 8 may be offset from the position of the first sub-board 8 2 1 . If the position coordinate of the first positioning mark 807 of the first positioning mark 807 is greater than a predetermined value, it is determined that the motherboard 8 has 瑕/疵, and other positioning coordinates of the motherboard 8 are also in accordance with The above-mentioned determination method processing will not be described again. Finally, when the motherboard 8 passes the above-mentioned motherboard detecting step and conforms to the standard ', the moving positioning device 24 can finely adjust the X axis of the motherboard 8 according to the position and the direction of the positioning marks 87, The Y-axis, the Z-axis, and the azimuth are oriented and positioned at a predetermined position, and are moved from the predetermined position to the upper surface of the carrier 9 to bond the motherboard 8 to the carrier 9. In this embodiment, the position of the motherboard 8 on the carrier 9 can be used to view and locate the carrier positioning mark 9 1 on the carrier 9 by the positioning inspection device 27 to control the positioning. The device 24 moves the motherboard 8 to a predetermined position on the carrier 9 in accordance with the position of the carrier positioning mark 91. The positioning inspection device 27 can be disposed on the positioning portion 243 or the lifting member 245 or the adjusting member 246 of the positioning _ portion 243. The positioning inspection device 27 can include a visual The positioning camera 271 is configured to capture the image of the carrier 9 for the positioning and viewing device 2 to analyze and find the carrier positioning mark 91 on the carrier 9. After the mother board 8 is adhered to the carrier board 9, please refer to the sixth figure, the carrier board 9 is transferred to the board detecting device 3 of the present invention to implant the implant board 8 5 into the motherboard. 8 accommodating space 8 4, the plant detecting device 3 is arranged as the visual detecting device 2 (please refer to the fifth figure and the fifth A picture), and includes a frame body 3 1 of the same structure, a transport device 3, a storage device 3 3, a moving positioning device 3 4, a visual positioning device 3 5, a positioning viewing device 1337052 3 7 and a y return storage device 38. The difference is that the storage device 3 3 is used to store the implanted daughter board 85, and the size of the return storage device 38 is fine δ 彳 saves the 5 hai implanted daughter board 85, and a suction member The design of the 3 4 8 is suitable for sucking the implanted sub-board 85, and the access hole 348 1 of the suction member 348 is matched with the sub-board positioning of the implanted sub-board 85, 8 5 1 and 'set.
V ； 本Λ祕例之檢知步驟如下，該植板檢知裝置3之該搬移 定位裝置3 4係從該儲存裝置3 3搬移該植入子板8 5至該 # 視覺定位裝置3 5之間，該視覺定位裝置3 5之一第一視覺 定位裝置3 5 1係檢視該植入子板8 5下表面之子板定位標 德8 5 1 ’ 一第二視覺定位裝置3 5 3係檢視該植入子板8 5上表面之子板定位標誌8 5 1 ’並將該等子板定位標誌8 5 1之座標傳送至該伺服器7，進而判斷將該植入子板8 5 上表面之子板定位標諸8 5 1之位置座標減去該植入子板8 5下表面相對應之子板定位標誌8 5 1之位置座標是否超過 一預定數值’若超過’則判斷該植入子板8 5為具有瑕疵的， 而控制違搬移定位裝置3 4搬移該植入子板8 5至該退料儲 • 存裝置3 8，若未超過，則進行後續之植板步驟。 當前述之檢知步驟確認該植入子板8 5為一良品後，該 * 搬移定位裝置3 4可依據該等子板定位標誌8 5 1之位置及 ‘ 方向，微調該植入子板8 5之X軸、Υ軸、Ζ軸及方位角等 方向及位置於一預定位置，並從該預定位置搬移至該母板8 之容置空間8 4内。 而於本實施例中，由於該母板8之該等子板8 2位於該 母板8之位置均可能會有不同之位置誤差，而可藉由該伺服 器7中該母板8之該等子板8 2之所有該等定位標諸8 7作 (S ) 18 1337052 一平均計算後，而得出該植入子板8 5設置於該容置空間8 - 4上之精確位置，因而可避免僅依據其中之一該等子板8 2，造成對其他之該等子板§ 2，而造成之誤差。 另外，該搬移定位裝置3 5移動設置於其上之該定位檢 視裝置3 7檢視該母板8上之定位標誌、8 7，以確定該母板 1 8之位置及方向角之正確位置，故而依據該母板8之正確位 / 置，而移動該植入子板8 5至該容置空間8 4内之預定位 置，進而與該載板9黏合。 # 本發明可更進—步設置-壓板裝置2 9，當該植入子板 8 5人n亥母板8黏合於该載板q時，則驅動該運輪带琶？ 2,移動該載板9至該壓板裝置2 9之下方，使 2 9下壓該植入子板8 5與該母板8，使得該植入子板8 5、該母板8與該載板9更緊密之黏合。該壓板裝置2 9係 包括-升降部2 9 1及-壓板2 9 2 ’該壓板裝置2 9係以 該升降部29 1與該架體2 1之頂部及該壓板2 9 2連接， 因此可控制該壓板2 9 2之升降，而使板2 9 2下壓該 母板8與該植入子板8 5 ,壓完後係可抬起。該壓板2 9 2 係可$—平板，其底部為一柔軟材質，以防止當該壓板2 9 2下壓時，壓壞該母板8及該植入子板8 5，該壓板2 9 2 之面積可與該載板9之面積相當。 並請.参考第五圖，於另一實施例中該壓板裝置2 9，亦 可設J於該？覺檢知裝置2中，以壓密該母板8於該載板9。 %芩考第七圖，其為本發明之視覺檢知植板裝置3 〇 〇 .，二實施例，本實施例結合了該視覺檢知裝置及該植板檢知 裴置於同一裝置’與第一實施例不同之處在於，該儲存裝置 係具有兩個，-為儲存裝置2 3其用以儲存該母板8，另— 19 亦2其用以儲存該植人子板8 5 ’而退料儲存裝置 :^^退料儲存裝置28其用以回收該S 而該吸取^ 2 4 Λ裝置3 8，其㈣回收該植人子板8 5， 入子板8S ^ 計可_吸取及配合該母板8及該植 在於，讀：二步驟亦與第一實施例相同，其不同之處 Ξ 定位裝置24，搬移該母板8至該載板9上之 又移该植入子板8 5於該母板8之容置空間8 4。 盆為太恭=述考第Λ、圖，旅請*考第五圖及第五A圖， 二儲知方法之步驟’其包括儲存該待檢知物 3 咬二^ 3，而该待檢知物係可為一印刷電路板，或 疋另δ月參考第二圖及第三圖，該待檢知物係可為一且有子 ^ 2之母板8、單—之植人子板8 5或是黏合有植二子板 之母板8 ( S 1 〇 2 );控制該搬移定位裝置2 4從該儲 ΐ裝f23搬，檢知物至該視覺定位裝置25 疋位裝置2 5尋找及定位該待檢知物之上下表面之定位標誌 8 7、8 5 1，該視覺定位裝置2 5係括一第—視覺定位裝 =2 5 1其用以尋找及定位該待檢知物之下表面之定位標 誌8I、8 5 1，及一第二視覺定位裝置2 5 3，其用以尋 找及定位該待檢知物之上表面之定位標誌8 7、8 5丄(s 1 0 4 )，分別比對判斷該待檢知物之上表面或下表面定位標 誌之位置座標是否超過一預定數值，若超過則進入步驟s工 1 0 ’若不超過則進入步驟S 1 1 2 ( s 1 〇 8 );捨棄該 待檢知物至一退料儲存裝置2 8，並重新執行步驟s 1〇2 (S 1 1 〇 );個別判斷該待檢知物之上表面之定位標誌與 相對應之下表面之定位標誌位置座標是否超過一預定數值， 20 1337052 若超過則進入步驟s 1 1 Ο，若不超過則進入步驟s i 2〇 (S 1 1 8 );該搬移定位裝置2 4移動設置於該搬移定位 裝置24之該定位檢視裝置27至一載板9之上方，該定位 檢視裝置2 7檢視該載板9之載板定位標誌9 1，該搬移定 位裝置2 4依據該載板定位標誌、9 1移動該待檢知物設置於 5亥載板9 ( S 1 2 0 );該壓板裝置2 9壓密該載板g與該 待檢知物，使之與該載板9黏合的更為緊密（s丄2 2)。 請參考第九圖.，並請參考第六圖，其為本發明之植板檢 知方法之步驟，其包括儲存一子板於該儲存裝置3 3 ($ 2 0 2 )’控制該搬移定位裝置3 4從該儲存裝置3 3搬移該植 入子板8 5至該視覺定位裝置3 5，該視覺定位裝置3 5尋 找及定位該植入子板8 5上下表面之定位標誌8 5 1 ，該 視覺定位裝置3 5係包括一第一視覺定位裝置3 5丄及—第 二視覺定位裝置3 5 3 ’該第-視覺定位裝置3 5丄，盆用 以尋找及定位雜人子板8 5之下表面之子板定位標諸8' 5 ϋ位置’該第二視覺定位裝置3 5 3，其用以尋找及定位 以植入子板8 5之上表面之子板定位標誌8 5工之位置 (S 2 0 4);㈣比較判斷該植人子板8 5之上表面之子 =位標誌、8 5 1與相對應之下表面之子板定位標誌位8 5 疋否起過一預定數值，若超過則進入步驟$ 2 進入步驟S212 (S2〇6);捨棄該植入子板 85至-退料儲存裝置38，並重新執行步驟s2 f 1 0 )，《移疋位裝置3 4移動設置於該搬移定位褒置3 ==置3 7至該母板8之上方，該定 号找及疋位该母板8之定位標誌8 7(s 搬移定位裝置3 4依據該定位標誌8 7搬移該植入子板8 ^The detection step of the present invention is as follows. The moving positioning device 34 of the plant detecting device 3 moves the implanting sub-board 85 to the # visual positioning device 35 from the storage device 33. The first visual positioning device 315 of the visual positioning device 35 is configured to view the sub-board positioning of the lower surface of the implant sub-plate 85. The second visual positioning device 3 5 3 is to view the The sub-board positioning mark 8 5 1 ' on the upper surface of the sub-board 8 5 is transferred to the servo 7 and the sub-board of the upper surface of the implant sub-board 8 5 is determined. Positioning the coordinates of the position of the 521 minus the position coordinates of the sub-board positioning mark 851 corresponding to the lower surface of the implant sub-board 85, whether the position exceeds a predetermined value 'if exceeded', the implanted daughter board is judged to be 8 5 In order to have a flaw, the control shifting positioning device 34 moves the implanted daughter board 85 to the return storage device 3, and if not, performs a subsequent step of planting. After the foregoing detecting step confirms that the implant sub-board 85 is a good product, the *-moving positioning device 34 can fine-tune the implant sub-board 8 according to the position and the direction of the sub-board positioning marks 851. The X-axis, the x-axis, the x-axis, and the azimuth are at a predetermined position, and are moved from the predetermined position into the accommodating space 84 of the motherboard 8. In this embodiment, since the sub-boards 8 2 of the motherboard 8 are located at the position of the motherboard 8, there may be different positional errors, and the motherboard 8 of the server 7 may be used. After the average calculation of all the positioning marks of the equalizing plate 8 2 is performed as (S ) 18 1337052 , the precise position of the implanting sub-board 8 5 on the accommodating space 8 - 4 is obtained. It is possible to avoid the error caused by § 2 on the other sub-boards based on only one of the sub-boards 8 2 . In addition, the positioning and positioning device 3 5 moves the positioning inspection device 3 7 disposed thereon to view the positioning marks on the motherboard 8 and 8 7 to determine the correct position of the position and direction angle of the motherboard 18. According to the correct position of the motherboard 8, the implanted daughter board 85 is moved to a predetermined position in the accommodating space 84, and is further bonded to the carrier 9. # The present invention can be further advanced - the platen device 2, 9 when the implanted daughter board 8 5 n the mother board 8 is bonded to the carrier q, then drive the wheel belt? 2, moving the carrier 9 to the underside of the platen device 29, causing the implanted daughter board 8 5 and the motherboard 8 to be depressed, such that the implanted daughter board 85, the mother board 8 and the carrier Plate 9 is more tightly bonded. The platen device 2 9 includes a lifting portion 2 9 1 and a pressure plate 2 9 2 '. The plate pressing device 29 is connected to the top of the frame body 21 and the pressure plate 2 9 2 by the lifting portion 29 1 , thereby The lifting and lowering of the pressure plate 2 9 2 is controlled, and the mother plate 8 and the implanting daughter plate 8 5 are pressed down by the plate 2 9 2 , and can be lifted after being pressed. The pressure plate 2 9 2 can be a flat plate, and the bottom thereof is a soft material to prevent the mother plate 8 and the implant daughter plate 8 5 from being crushed when the pressure plate 2 9 2 is pressed. The pressure plate 2 9 2 The area may be comparable to the area of the carrier 9. Please refer to the fifth figure. In another embodiment, the plate pressing device 2 9 can also be set to J? In the sensing device 2, the mother board 8 is pressed against the carrier board 9. % is the seventh diagram, which is the visual detection planting device 3 of the present invention. In the second embodiment, the embodiment combines the visual detection device and the plant detection detection device in the same device' with The first embodiment differs in that the storage device has two storage units, which are used to store the motherboard 8, and the other is used to store the implanted sub-board 8 5 ' The material storage device is: ^^ the material storage device 28 for recovering the S and the suction device 24 8 , (4) recovering the implanted board 8 5 , the input board 8S ^ can be _ sucked and In conjunction with the mother board 8 and the implant, the second step of reading is the same as that of the first embodiment, and the difference is that the positioning device 24 moves the mother board 8 to the carrier board 9 and then moves the implant board. 8 5 is in the housing space 8 of the motherboard 8. The basin is too pleasing = the reference to the first Λ, the picture, the travel request * the fifth picture and the fifth picture A, the second storage method step 'which includes storing the object to be inspected 3 bite two ^ 3, and the to be inspected The knowledgeable system can be a printed circuit board, or the second and third figures can be referred to in another month. The object to be detected can be a mother board with a child 2 and a single daughter board. 8 5 or a mother board 8 (S 1 〇 2 ) to which the second seed board is bonded; control the moving positioning device 24 to move from the storage unit f23, and the detecting object to the visual positioning device 25 And positioning the positioning mark 8 7 , 8 5 1 on the upper surface of the object to be detected; the visual positioning device 25 includes a first visual positioning device=2 5 1 for searching and positioning the object to be detected a positioning mark 8I, 8 5 1 on the lower surface and a second visual positioning device 2 5 3 for finding and positioning the positioning mark on the upper surface of the object to be detected 8 7 , 8 5 丄 (s 1 0 4 And respectively determining whether the position coordinate of the upper surface or the lower surface positioning mark of the object to be detected exceeds a predetermined value, and if it exceeds, the process proceeds to step s 1 0 'If not, the process proceeds to step S 1 1 2 (s 1 〇 8 ); discarding the object to be detected to a material return storage device 2 8 and re-executing step s 1 〇 2 (S 1 1 〇); individually determining the positioning mark on the upper surface of the object to be detected If the positional coordinate of the positioning mark corresponding to the surface exceeds a predetermined value, 20 1337052 if it exceeds, the process proceeds to step s 1 1 Ο, if not, the process proceeds to step si 2〇 (S 1 18); the moving positioning device 2 4 is disposed above the positioning inspection device 27 of the moving positioning device 24 to a carrier board 9 , wherein the positioning inspection device 27 views the carrier positioning mark 9 1 of the carrier 9 , and the moving positioning device 24 The carrier positioning mark, 9 1 moves the to-be-detected object to the 5-well carrier 9 (S 1 2 0 ); the platen device 29 presses the carrier g and the object to be inspected to make the load The plate 9 is bonded more closely (s丄2 2). Please refer to the ninth figure, and refer to the sixth figure, which is a step of the method for detecting the planting board according to the present invention, which comprises storing a sub-board in the storage device 3 3 ($ 2 0 2 )' to control the moving positioning. The device 3 4 moves the implant sub-board 85 from the storage device 33 to the visual positioning device 35, and the visual positioning device 35 finds and locates the positioning mark 8 5 1 of the upper and lower surfaces of the implant sub-board 85. The visual positioning device 35 includes a first visual positioning device 3 5 and a second visual positioning device 3 5 3 'the first visual positioning device 3 5 丄, the basin is used to find and locate the hybrid sub-board 8 5 The sub-board of the lower surface is positioned at 8' 5 ϋ position 'the second visual positioning device 353 for finding and positioning the position of the sub-board positioning mark for implanting the upper surface of the sub-board 85 ( S 2 0 4); (4) Comparing and judging whether the sub-bit mark on the upper surface of the implanted sub-board 8 5 and the sub-plate positioning mark 8 5 1 of the corresponding lower surface have a predetermined value, if Then proceed to step $2 to proceed to step S212 (S2〇6); discard the implant daughter board 85 to the material return storage device 38, and perform the step s again. 2 f 1 0 ), the moving position device 34 is moved to the moving positioning device 3 == set to 3 7 above the mother board 8 , and the fixed number is used to locate the positioning mark 8 of the motherboard 8 7 (s moving positioning device 3 4 moves the implanted daughter board 8 according to the positioning mark 8 ^
C 2! 1337052 至該母板8之容置空間8 4 (S2 1 4);該壓板裝置29 -壓密該母板8與該植人子板8 5，使之與該載板9黏合的更 ·· 為緊密（S216)。 • 而當該植入子板8 5與該母板8黏合於該載板9上時， 則進入本發明之黏合裝置4 0 0之步驟（請參考第一圖），而 1該黏合裝置4◦◦係包括一佈膠裝置4 (請參考第十圖）盥 -一點膠裝置5 (請參考第十一圖）。 ” 請參考第十圖，其為本發明之佈膠裝置4之實施例，該 •佈膠裝置4其包括-架體4 χ、一運輸裝置4 2，一佈膠單 元4 3。 / 該運輸裝置4 2係架設於該架體4 1上，係可為一輸送 帶、機械手臂或是其他具有運輸能力之裝置，其用以傳送該 載板9。 該佈膠單元4 3係設置於該架體4 1上，其可架設於該 木體4 1平行該運輸裝置4 2之一側邊上，該佈膠單元4 3 係^延著平行該運輸裝置42之該側邊作水平移動，而該佈 •，單元4 3係包括一懸臂4 3 1、一佈膠件4 3 2及一視覺 义位裝置4 3 3，該懸臂4 3 1係具有伸縮之功能，該佈勝 件4^ 2係設置於該佈膠單元4 3之一端，其用以將黏膠塗 布於該植入子板8 5之黏接部8 6與該母板8之連接凹槽8 8之間，以防止該點膠裝置5 (請參考第十一圖）點膠時滲 漏，而該佈膠單元4 3所塗布之黏膠係可為一紫外光膠（υ V膠），該視覺定位裝置4 3 3設置於該懸臂4 3 !或該佈膠 件4 3 2之一側，其用以檢視該母板8及該植入子板 位置。 其處理步驟為，控制該運輸裝置4 2將該載板9運送至 22 1337052 預疋位置，該佈膠單元4 3移動該視覺定位裝置4 3 3至 • 該母板8之上方，該視覺定位裝置4 3 3尋找該母板8之定 • 位標誌87及或該植入子板8 5之子板定位標誌§ 5 1，以 §丁出该母板8及該植入子板8 5之位置，而後控制該佈膠單 ，兀4 3於該植入子板8 5之黏接部8 Θ與該母板8之連接凹 .槽8 8之間塗膠，而後以一紫外光源（圖未示）照射，以將 - 該紫外光膠固化。 明參考第Η圖，並請參考第十圖，於上述之紫外光膠 馨固化後，則進人點膠裝置5，該點膠裝置5之設置與該佈膠 裝置4之結構相同，其包括同樣架構之一架體5 i、一運輸 A置5 2，其不同之處在於該佈勝單元4 3以一點膠單元5 3取代，該點膠單元5 3係包括一點膠件5 3 2、一懸臂5 3 1及一視覺定位裝置5 3 3，該懸臂5 3丄及該視覺定位 裂置5 3 3與該懸臂4 3 1及該視覺定位裝置4 3 3結構相 同二於進入該點膠裝置5之前，該載板9需於予以翻面，而 將该載板9之該等點膠洞9 2朝上，以利該點膠單元5 3透 • 過該等點膠洞92 ’而於該植入子板85之黏接部86與該 母板8之連接凹槽8 8之間點膠。而經由該點膠單元5 3點 膠之後，即完成該母板8及該植入子板8 $之連結。 凊麥考第一圖、第十圖及第十一圖，該黏合裝置4〇〇 之第二實施例，其可將該佈膠裝置4與該點膠裝置5整合為 一裝置，意即，將該點膠裝置5之點膠件5 3 2設置於該佈 勝裝置4之該佈谬單S4 3上，而於該佈膠單元4 3之塗膠 件4 3 2塗布完勝料’經由翻轉該載板9而可由該點膠件 5 3 2點膠。 請參考第-®、第十ϋ及第十—圖，該黏合裝置4 〇 〇 1337052 可省略該佈膠裝 入子板8 5之黏 膠，而此時該載 之第三實施例，該黏合裝置4 0 0之步驟， 置4，而直接由該點膠裝置5直接針對該植 接部8 6與該母板8之連接凹槽8 8之間點 板9不需翻轉，意即，該母板8及該植入子板8 5朝上，『 該載板9亦不需設置該等點膠洞92。 而 ； 請參考第U二圖及第三圖’經由上述該黏合裳置 -4 0 0處理之後’將该載板9送進該固化袈置5 〇 〇，以將 黏膠固化，而該固化裝置5 0 0可為一烤箱，最後再將該母 馨 板8、該植入子板8 5及該載板9送至一却載裝置6 〇 〇 以將該載板9.與該母板8及該植入子板8 5分離，而此時即 ’形成該完整母板8’ 。 惟，以上所述，僅為本發明最佳之一的具體實施例之詳 細說明與圖式，惟本發明之特徵並不侷限於此，並非用以限 制本發明，本發明之所有範圍應以下逑之申請專利範圍為 準’凡合於本發明申請專利範圍之精神與其類似變化之實施 例，皆應包含於本發明之範疇中，任何熟悉該項技藝者在本 φ 發明之領域内’可輕易思及之變化或修飾皆可涵蓋在以下本 案之專利範圍。 【圖式簡單說明】 • 第一圖係本發明之自動植板生產設備的流程圖； 第二圖係本發明之母板、植入子板及載板的俯視圖； 第三圖係本發明之完整之母板及載板的俯視圖 第四圖係本發明之載板塗膠裝置的立體圖； 第五圖係本發明之視覺檢知植板裝置之視覺檢知裝置之第一 實施例的立體圖； 24 1337052 第五A圖係第九圖A部份之局部放大圖； - 第六圖係本發明之視覺檢知植板裴置之植板檢知壯罢_ _ 施例的立體圖； 衣弟一貫 第七圖係本發明之視覺檢知植板裝置之第二實施例的立體 圖； 第八圖係本發明之視覺檢知方法之步驟流程圖； • 第九圖係本發明之植板檢知方法之步驟流程圖； 第十圖係本發明之黏合裝置之佈膠裝置之立體圖；以及 鲁 第十一圖係本發明之黏合裝置之點膠裝置之立體圖。 【主要元件符號說明】 載板供給裝置1〇〇 載板塗膠裝置2 0〇 架體1 1 運輸裴置1 2 黏膠塗布裝置13 懸臂1 3 1 黏膠抹平裝置14 載板塗膠元件13 黏膠抹平元件14 視覺檢知植板裝置3 0 0 視覺檢知裝置2 - 架體2 1 運輸裝置2 2 儲存裝置2 3 升降板2 3 1 搬移定位裝置2 4 定位桿2 3 2 定位臂2 4 1 1337052 定位部2 4 3 滑軌2 4 2 移動件2 4 4 升降件2 4 5 調整件2 4 6 轉動件2 4 7 吸取件2 4 8 吸取件2 4 8 b 檢視洞2 4 8 1 視覺定位裝置2 5 第一視覺定位裝置2 5 1 攝影機2 5 2 第二視覺定位裝置2 5 3 攝影機2 5 4 定位檢視裝置2 7 退料儲存裝置2 8 視覺定位攝影機2 7 1 壓板裝置2 9 升降部2 9 1 壓板2 9 2 植板檢知裝置3 架體3 1 運輸裝置3 2 儲存裝置3 3 搬移定位裝置3 4 吸取件3 4 8 檢視洞3 4 8 1 視覺定位裝置3 5 第一視覺定位裝置3 5 1 第二視覺定位裝置3 5 3 定位檢視裝置3 7 退料儲存裝置3 8 26 1337052 黏合裝置4 0 0 佈膠裝置4 架體4 1 運輸裝置4 2 佈膠單元4 3 懸臂4 3 1 佈膠件4 3 2 視覺定位裝置4 3 3 • 點膠裝置5 架體5 1 運輸裝置5 2 點膠單元5 3 點膠件5 3 2 懸臂5 3 1 視覺定位裝置5 3 3 固化裝置5〇0 卸載裝置6〇◦ 伺服器7 母板8 完整之母板8’ 外框8 1 子板8 2 第一子板8 2 1 第二子板8 2 2 第三子板8 2 3 連接部8 3 容置空間8 4 (S ) 27 1337052 植入子板8 5 子板定位標誌、8 5 1 黏接部8 6 定位標諸8 7 第一定位標誌8 7 1 連接凹槽8 8 第一預定位置8 9 1 第二預定位置8 9 2 第三預定位置8 9 3 第四預定位置8 9 4 第二定位標諸8 7 2 載板9 載板定位標誌91 點膠洞9 2 5C 2! 1337052 to the accommodating space 8 4 of the mother board 8 (S2 1 4); the platen device 29 - presses the mother board 8 and the implanting board 8 5 to be bonded to the carrier board 9 More · · is tight (S216). • When the implant sub-board 85 and the mother board 8 are bonded to the carrier board 9, the step of entering the bonding apparatus 400 of the present invention (please refer to the first figure), and the bonding apparatus 4 The tanning system consists of a rubberizing device 4 (please refer to the tenth figure) 盥-a little glue device 5 (please refer to the eleventh figure). Please refer to the tenth embodiment, which is an embodiment of the rubberizing device 4 of the present invention, which comprises a frame body 4, a transport device 4 2, and a cloth glue unit 43. / The transport The device 4 2 is mounted on the frame body 4 1 and can be a conveyor belt, a robot arm or other transporting device for transporting the carrier board 9. The glue unit 4 3 is disposed on the frame. The frame body 4 is erected on the side of one side of the transport device 42, and the cloth unit 4 is horizontally moved parallel to the side of the transport device 42. The unit 4 3 includes a cantilever 4 3 1 , a rubber member 4 3 2 and a visual position device 4 3 3 , and the cantilever 4 3 1 has a function of stretching and contracting, and the cloth member 4^ 2 is disposed at one end of the rubberizing unit 43 to apply adhesive between the bonding portion 86 of the implanting daughter board 85 and the connecting groove 8 8 of the mother board 8 to prevent The dispensing device 5 (please refer to FIG. 11) leaks when dispensing, and the adhesive layer coated by the adhesive unit 43 can be an ultraviolet glue (υV glue), and the visual positioning device 4 3 3 settings On the side of the cantilever 4 3 or the rubber member 433, which is used to view the position of the mother board 8 and the implant daughter board. The processing step is to control the transport device 42 to the carrier board 9 Carrying to the pre-twisting position of 22 1337052, the glue unit 4 3 moves the visual positioning device 4 3 3 to the top of the motherboard 8, the visual positioning device 433 searches for the fixed mark 87 of the motherboard 8 and Or the daughter board positioning mark § 5 1 of the implanting daughter board 8 5 is used to sing out the position of the mother board 8 and the implanting board 8 5, and then controlling the cloth sheet, the 兀 4 3 is in the implant The bonding portion 8 of the board 8 5 is glued to the connecting recess 8 of the mother board 8 and then irradiated with an ultraviolet light source (not shown) to cure the ultraviolet light. Referring to the tenth figure, and referring to the tenth figure, after the above-mentioned ultraviolet light gelatinization is solidified, the dispensing device 5 is inserted, and the dispensing device 5 is disposed in the same structure as the rubberizing device 4, and includes the same structure. A body 5 i and a transport A are placed 5 2 , except that the cloth win unit 4 3 is replaced by a glue unit 5 3 , which includes a piece of rubber 5 3 2 . a cantilever 5 3 1 and a visual positioning device 5 3 3, the cantilever 5 3丄 and the visual positioning protrusion 5 3 3 are identical in structure to the cantilever 4 3 1 and the visual positioning device 43 3 to enter the dispensing device Before 5, the carrier 9 needs to be turned over, and the dispensing holes 9 2 of the carrier 9 are directed upwards, so that the dispensing unit 53 passes through the dispensing holes 92'. The adhesive portion 86 of the implant sub-board 85 is dispensed with the connecting groove 8 8 of the mother board 8. After the dispensing unit 53 is dispensed, the mother board 8 and the implant are completed. Board 8 $ link. The second embodiment of the adhesive device 4, which can integrate the rubber device 4 and the dispensing device 5 into a device, that is, The dispensing member 5 3 2 of the dispensing device 5 is disposed on the fabric sheet S4 3 of the cloth win device 4, and the rubber coating member 4 3 2 of the cloth rubber unit 43 is coated with the winning material 'via flipping The carrier 9 can be dispensed by the dispensing member 523. Referring to the -, the tenth and the tenth - the figure, the bonding device 4 〇〇1337052 can omit the adhesive of the cloth loading into the sub-board 85, and at this time, the third embodiment, the bonding The step of the device 400 is set to 4, and the point plate 9 directly between the planting portion 86 and the connecting groove 8 8 of the motherboard 8 is directly turned by the dispensing device 5, that is, the The mother board 8 and the implant daughter board 85 are facing upwards, and the carrier board 9 does not need to be provided with the dispensing holes 92. And; refer to FIG. U and FIG. 3 'after the adhesion is set to -4 0 0, and then the carrier 9 is fed into the curing device 5 to cure the adhesive, and the curing The device 500 can be an oven, and finally the mother board 8, the implant board 85 and the carrier board 9 are sent to a load carrying device 6 to the carrier board 9. 8 and the implant daughter board 85 is separated, and at this time, the complete mother board 8' is formed. However, the above description is only a detailed description of the preferred embodiments of the present invention, and the present invention is not limited thereto, and is not intended to limit the present invention. The scope of the patent application is intended to be in the scope of the present invention, and any one skilled in the art may be included in the field of the invention. Any changes or modifications that are easily thought of can be covered in the scope of the patents in this case below. BRIEF DESCRIPTION OF THE DRAWINGS: The first drawing is a flow chart of the automatic planting equipment of the present invention; the second drawing is a top view of the mother board, the seeding board and the carrier board of the present invention; 4 is a perspective view of a carrier plate gluing device of the present invention; and a fifth view is a perspective view of a first embodiment of a visual inspection device for a visual inspection planting device of the present invention; 24 1337052 The fifth A is a partial enlarged view of the ninth part of the ninth figure; - the sixth picture is the visual inspection of the planting device of the present invention, the detection of the planting plate _ _ the perspective view of the example; 7 is a perspective view of a second embodiment of the visual detection planting device of the present invention; the eighth diagram is a flow chart of the steps of the visual detection method of the present invention; FIG. 10 is a perspective view of a bonding device of the bonding device of the present invention; and a perspective view of a dispensing device of the bonding device of the present invention. [Description of main component symbols] Carrier supply device 1 〇〇 Carrier glue applicator 2 0 truss body 1 1 Transport device 1 2 Adhesive coating device 13 Cantilever 1 3 1 Adhesive screed device 14 Carrier rubber component 13 Viscose smoothing element 14 Visual inspection of the planting device 3 0 0 Visual inspection device 2 - Frame 2 1 Transport device 2 2 Storage device 2 3 Lifting plate 2 3 1 Moving positioning device 2 4 Positioning rod 2 3 2 Positioning Arm 2 4 1 1337052 Positioning part 2 4 3 Slide rail 2 4 2 Moving part 2 4 4 Lifting piece 2 4 5 Adjusting piece 2 4 6 Rotating part 2 4 7 Absorbing part 2 4 8 Absorbing part 2 4 8 b Viewing hole 2 4 8 1 Visual positioning device 2 5 First visual positioning device 2 5 1 Camera 2 5 2 Second visual positioning device 2 5 3 Camera 2 5 4 Positioning inspection device 2 7 Material storage device 2 8 Visual positioning camera 2 7 1 Platen device 2 9 Lifting section 2 9 1 Pressing plate 2 9 2 Planting detection device 3 Frame 3 1 Transporting device 3 2 Storage device 3 3 Moving and positioning device 3 4 Suction part 3 4 8 Viewing hole 3 4 8 1 Visual positioning device 3 5 First visual positioning device 3 5 1 second visual positioning device 3 5 3 positioning inspection device 3 7 return storage device 3 8 26 1337052 Adhesive device 4 0 0 Cloth device 4 Frame 4 1 Transport device 4 2 Laminating unit 4 3 Cantilever 4 3 1 Dispensing member 4 3 2 Visual positioning device 4 3 3 • Dispensing device 5 Frame 5 1 Transport device 5 2 Dispensing unit 5 3 Dispensing part 5 3 2 Cantilever 5 3 1 Vision positioning device 5 3 3 Curing device 5〇0 Unloading device 6〇◦ Server 7 Mother board 8 Complete mother board 8' Frame 8 1 Board 8 2 first daughter board 8 2 1 second daughter board 8 2 2 third daughter board 8 2 3 connection portion 8 3 accommodation space 8 4 (S ) 27 1337052 implant daughter board 8 5 daughter board positioning mark, 8 5 1 Adhesive part 8 6 Positioning mark 8 7 First positioning mark 8 7 1 Connecting groove 8 8 First predetermined position 8 9 1 Second predetermined position 8 9 2 Third predetermined position 8 9 3 Fourth predetermined position 8 9 4 Second positioning standard 8 7 2 Carrier board 9 Carrier positioning mark 91 Dispensing hole 9 2 5