TWI335854B - - Google Patents

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Publication number
TWI335854B
TWI335854B TW096135548A TW96135548A TWI335854B TW I335854 B TWI335854 B TW I335854B TW 096135548 A TW096135548 A TW 096135548A TW 96135548 A TW96135548 A TW 96135548A TW I335854 B TWI335854 B TW I335854B
Authority
TW
Taiwan
Prior art keywords
protective layer
layer
metal
abrasive
film
Prior art date
Application number
TW096135548A
Other languages
English (en)
Chinese (zh)
Other versions
TW200902234A (en
Inventor
Tetsuji Yamashita
Naoki Rikita
Takashi Kimura
Masaharu Ogyu
Hiroaki Ashizawa
Hironori Hatono
Masahiro Tokita
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of TW200902234A publication Critical patent/TW200902234A/zh
Application granted granted Critical
Publication of TWI335854B publication Critical patent/TWI335854B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/08—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for close-grained structure, e.g. using metal with low melting point
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW096135548A 2006-09-25 2007-09-21 CMP conditioner and its manufacturing method TW200902234A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006258894A JP4854445B2 (ja) 2006-09-25 2006-09-25 Ｃｍｐコンディショナおよびその製造方法

Publications (2)

Publication Number Publication Date
TW200902234A TW200902234A (en) 2009-01-16
TWI335854B true TWI335854B (OSRAM) 2011-01-11

Family

ID=39230018

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096135548A TW200902234A (en) 2006-09-25 2007-09-21 CMP conditioner and its manufacturing method

Country Status (6)

Country Link
US (1) US20090239454A1 (OSRAM)
JP (1) JP4854445B2 (OSRAM)
KR (1) KR20090074741A (OSRAM)
CN (1) CN101547770A (OSRAM)
TW (1) TW200902234A (OSRAM)
WO (1) WO2008038583A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422466B (zh) * 2011-01-28 2014-01-11 Advanced Surface Tech Inc 鑽石研磨工具及其製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2646973C (en) * 2008-12-18 2015-12-01 Sunnen Products Company Honing tool having enhanced wear resistance properties
US8512098B1 (en) * 2010-09-28 2013-08-20 Jeffrey Bonner Machining technique using a plated superabrasive grinding wheel on a swiss style screw machine
CN203390712U (zh) * 2013-04-08 2014-01-15 宋健民 化学机械研磨修整器
JP5681826B1 (ja) * 2014-06-16 2015-03-11 嘉五郎 小倉 軸芯測定装置
JP6453666B2 (ja) * 2015-02-20 2019-01-16 東芝メモリ株式会社 研磨パッドドレッサの作製方法
CN108237467B (zh) * 2016-12-23 2020-10-02 中芯国际集成电路制造(上海)有限公司 一种研磨垫的处理方法
TWI636854B (zh) * 2017-06-12 2018-10-01 中國砂輪企業股份有限公司 研磨工具及其製造方法
KR102013386B1 (ko) * 2018-01-29 2019-08-22 새솔다이아몬드공업 주식회사 역도금 패드 컨디셔너 제조방법 및 패드 컨디셔너
CN110634776B (zh) * 2019-09-18 2022-03-01 西安奕斯伟材料科技有限公司 一种硅片样品的制备装置及制备方法
CN110782779B (zh) * 2019-11-01 2022-05-13 Oppo广东移动通信有限公司 玻璃件及其表面抛光方法、玻璃壳体和电子设备
TWI806466B (zh) * 2022-03-03 2023-06-21 中國砂輪企業股份有限公司 拋光墊修整器及其製造方法
TWI823456B (zh) * 2022-07-01 2023-11-21 詠巨科技有限公司 修整組件、其製造方法及應用其的組合式修整器
TWI889633B (zh) * 2025-01-23 2025-07-01 日鐵精工股份有限公司 鑽石修整器的製造設備以及鑽石修整器的製造方法

Family Cites Families (16)

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US3334041A (en) * 1964-08-28 1967-08-01 Norton Co Coated abrasives
SE442305B (sv) * 1984-06-27 1985-12-16 Santrade Ltd Forfarande for kemisk gasutfellning (cvd) for framstellning av en diamantbelagd sammansatt kropp samt anvendning av kroppen
US4992082A (en) * 1989-01-12 1991-02-12 Ford Motor Company Method of toughening diamond coated tools
US5206083A (en) * 1989-09-18 1993-04-27 Cornell Research Foundation, Inc. Diamond and diamond-like films and coatings prepared by deposition on substrate that contain a dispersion of diamond particles
SE503038C2 (sv) * 1993-07-09 1996-03-11 Sandvik Ab Diamantbelagt skärande verktyg av hårdmetall eller keramik
US5551959A (en) * 1994-08-24 1996-09-03 Minnesota Mining And Manufacturing Company Abrasive article having a diamond-like coating layer and method for making same
US5688557A (en) * 1995-06-07 1997-11-18 Lemelson; Jerome H. Method of depositing synthetic diamond coatings with intermediates bonding layers
JPH1058306A (ja) * 1996-08-09 1998-03-03 Mitsubishi Materials Corp 研磨布のドレッシング装置および研磨布ドレッシング用砥石
US6054183A (en) * 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
US5921856A (en) * 1997-07-10 1999-07-13 Sp3, Inc. CVD diamond coated substrate for polishing pad conditioning head and method for making same
JP2001210613A (ja) * 2000-01-27 2001-08-03 Allied Material Corp Ｃｍｐ用パッドコンディショナー
JP3609059B2 (ja) * 2002-04-15 2005-01-12 株式会社ノリタケスーパーアブレーシブ Ｃｍｐ加工用ドレッサ
JP4463084B2 (ja) * 2003-11-27 2010-05-12 株式会社オクテック ドレッシング工具
US9624135B2 (en) * 2004-09-23 2017-04-18 Antionette Can Polycrystalline abrasive materials and method of manufacture
JP2007109767A (ja) * 2005-10-12 2007-04-26 Mitsubishi Materials Corp Ｃｍｐコンディショナおよびその製造方法
JP2007260886A (ja) * 2006-03-30 2007-10-11 Mitsubishi Materials Corp Ｃｍｐコンディショナおよびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422466B (zh) * 2011-01-28 2014-01-11 Advanced Surface Tech Inc 鑽石研磨工具及其製造方法

Also Published As

Publication number Publication date
US20090239454A1 (en) 2009-09-24
JP4854445B2 (ja) 2012-01-18
JP2008073825A (ja) 2008-04-03
CN101547770A (zh) 2009-09-30
KR20090074741A (ko) 2009-07-07
TW200902234A (en) 2009-01-16
WO2008038583A1 (en) 2008-04-03

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees