TWI335058B - - Google Patents

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Publication number
TWI335058B
TWI335058B TW095143615A TW95143615A TWI335058B TW I335058 B TWI335058 B TW I335058B TW 095143615 A TW095143615 A TW 095143615A TW 95143615 A TW95143615 A TW 95143615A TW I335058 B TWI335058 B TW I335058B
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TW
Taiwan
Prior art keywords
joined body
joint
holding
probe pin
joined
Prior art date
Application number
TW095143615A
Other languages
Chinese (zh)
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TW200739768A (en
Inventor
Shinjiro Watanabe
Original Assignee
Tokyo Electron Ltd
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Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200739768A publication Critical patent/TW200739768A/en
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Publication of TWI335058B publication Critical patent/TWI335058B/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/70Specific application
    • B06B2201/72Welding, joining, soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Description

1335058 . 1?幹月,奴替換頁 九、發明說明: — ..* 【發明所屬之技術領域】 - 本發明係關於一種利用超音波振動使被接合體彼此之間 接合之接合裝置及接合方法。 【先前技術】1335058 . 1? Dry month, slave replacement page IX, invention description: -..* [Technical field of the invention] - The present invention relates to an engagement device and a bonding method for joining the bodies to be joined by ultrasonic vibration . [Prior Art]

例如形成於半導體晶圓上之IC、LSI等電子電路之電氣 特性檢查,係使用安裝於探針裝置之探針卡來進行。探針 卡,通常包含電路基板及接觸器。在與晶圓相對之接觸器 之下面,,經由連接端子支持有多數之探針銷;藉由使該; 數之探針銷接觸於電子電路之各電極,進行晶圓之電氣特 ί1 生之仏查(參照日本國特開2〇〇4_77242號公報)。 作為使如該探針銷與連接料般之小型元件彼此之間接 合之裝置’已知有進行超音波接合之裝置。該接合裝置包 含抵接㈣針銷之接合構件、及給予接合構件超音波振動 之超音波振動ϋ。進行探針銷與連接端子之接合時,例如 如圖12所示,以設置於接觸器9ι之連接端子92朝向上方之 ,態’載置電路基板93,在連接端子92上載置探針銷%, 藉由接合構件96之前端部從上方壓住探針銷%。,然後,藉 由超音波振動器之振動使接合構件96超音波振動。於是: :由向探針銷95傳遞接合構件96之超音波振動,探針銷% 摩^端Γ92相互摩擦,探針銷%與連接料以間產生 察:H可以使探針銷95料於連接端子%。 之接。裝置,藉由接合構件96給 95容易相對於桩入拔町^木針銷 接&構件96橫向滑動,在該情形下,不能從 116I50-990223.doc 1335058 f|年>月9曰頁 接合構件96向探針銷95有效率地傳遞振動。另外,探針銷 95相對於連接端子92亦容易橫向滑動,在該情形下,不能 將探針銷95接合於正確之位置。因此’需要提高接合構件 96之加壓力,但該情形下,會有連接端子92及探針銷95產 生變形損傷之虞。 【發明内容】 本發明係鑒於該點所完成者’其目的在於提供一種即使 為低之加C力亦可防止被接合體之橫向滑動,可以使被接 合體彼此之間良好地接合之接合裝置及接合方法。 用於解决上述問題之本發明,係一種接合裝置,其特徵 在於:> 其係使接合構件接觸在被載置於第—被接合體上表 面之第一被接合體之上表面,藉由前述接合構件使前述第 二被接合體超音波振動,藉此使之接合前述第—被接合體 與^第二被接合體者;且在前述接合構件上,設置有接 觸前述第二被接合體之接觸部分、及保持 體之保持部分。 亦可在前述接合構件上,設置與設置^前述第二被^ 體上=凹凸㈣合之凹凸’藉由前述接合構件上之凹凸 構成前述接觸部分及前述保持部分。 刖述接合構件之凹凸,亦可Λ & _山 蜡由5又置於前述接合構件4 刖缟邛之平坦面、及從前述平 1十土—面大出之凸部來構成,南 述千坦面作為前述接觸部分,前述凸部 分。前述凸部,亦可設置於,.f ^ ”夺苦ί 平坦面之中央部。另外, 則述凸部亦可設置有複數個。 M6I50-990223.doc 1335058 前之::置::藉_於前述接合構件之 : 作為前述接觸部分,前述凹部作為前述保持部 :广凹部,亦可設置於前述平坦面之中央部。另外, 别述凹部可設置有複數個。 另外For example, electrical characteristics inspection of an electronic circuit such as an IC or an LSI formed on a semiconductor wafer is performed using a probe card attached to the probe device. Probe cards usually contain a circuit board and a contactor. Under the contactor opposite to the wafer, a plurality of probe pins are supported via the connection terminals; by electrically contacting the probe pins of the plurality of electrodes with the electrodes of the electronic circuit, the electrical conductivity of the wafer is performed.仏 ( (refer to Japanese Patent Publication No. 2_77242). As means for bringing the small components such as the probe pin and the connecting material into contact with each other, a device for performing ultrasonic bonding is known. The joining device includes an engaging member that abuts the (four) pin and an ultrasonic vibration 给予 that imparts ultrasonic vibration to the engaging member. When the probe pin and the connection terminal are joined, for example, as shown in FIG. 12, the connection of the contact terminal 92 of the contactor 91 is upward, and the circuit board 93 is placed, and the probe pin is placed on the connection terminal 92. The probe pin % is pressed from above by the front end of the joint member 96. Then, the joint member 96 is ultrasonically vibrated by the vibration of the ultrasonic vibrator. Then: by transmitting the ultrasonic vibration of the joint member 96 to the probe pin 95, the probe pin % friction end 92 rubs against each other, and the probe pin % and the connecting material are generated to observe: H can make the probe pin 95 Connection terminal %. Connected. The device, by means of the joint member 96, is easily slid laterally relative to the pile-in-the-spot pin & member 96, in this case, not from 116I50-990223.doc 1335058 f|year > month 9 page The joint member 96 transmits vibration to the probe pin 95 efficiently. Further, the probe pin 95 is also apt to slide laterally with respect to the connection terminal 92. In this case, the probe pin 95 cannot be joined to the correct position. Therefore, it is necessary to increase the pressing force of the joint member 96, but in this case, the joint terminal 92 and the probe pin 95 may be deformed by deformation. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide an engaging device capable of preventing a joint body from being smoothly joined to each other even if a low C-force is applied to prevent lateral sliding of the joined body. And bonding method. The present invention for solving the above problems is an engaging device characterized in that: the engaging member is brought into contact with the upper surface of the first joined body placed on the upper surface of the first joined body by The joining member ultrasonically vibrates the second joined body, thereby joining the first joined body and the second joined body; and the joining member is provided with the second joined body The contact portion and the holding portion of the holder. Further, the contact member may be provided with the uneven portion on the second member body = the uneven portion (four), and the contact portion and the holding portion may be formed by the unevenness on the joint member. The concavities and convexities of the joint member are described, and the amp & _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The thousand-faced surface serves as the aforementioned contact portion, the aforementioned convex portion. The convex portion may be disposed at the center of the flat surface of the .f ^ ” bitter ί. In addition, the convex portion may be provided with plural numbers. M6I50-990223.doc 1335058 Previous:: Set:: Borrow _ In the contact member, the recessed portion may be provided as the holding portion: the wide recessed portion, or may be provided at a central portion of the flat surface. Further, a plurality of recessed portions may be provided.

動之凹凸,亦可沿前述接合構件之超音波振 振動方向父替地排列設置。前述第一被接合體亦可為 k查被檢查體之電氣特性之探針卡中設置於與被檢查體 ’向之面上之電極’前述第二被接合體為用來接觸 被檢查體之探針銷。 <The moving concave and convex portions may be arranged alternately along the ultrasonic vibration direction of the joint member. The first to-be-joined body may be an electrode that is disposed on the surface of the probe to be inspected in the probe card of the electrical property of the object to be inspected, and the second object to be joined is used to contact the object to be inspected. Probe pin. <

按照其,觀點之本發明’係一種接合方法’其特徵在 於.其係藉由超音波振動使第一被接合體與第二被接合體 炫接而接合者,在前述第一被接合體之上表面載置第:被 接合體’ -邊藉由設置於接合構件上之保持部分保持前述 第-被接合體之上表面’一邊將設置於前述接合構件上之 接觸部分壓抵於前述第二被接合體,並藉由使前述接合構 件超音波振動’使前述第二被接合體超音波振動,而使前 述第一被接合體與第二被接合體熔接。 亦可在使設置於前述接合構件之凹凸與設置於前述第二 被接合體之凹凸相嚙合之狀態下,使前述接合構件超音波 振動。前述第一被接合體亦可為在檢查被檢查體之電氣特 性之探針卡中設置於與被檢查體對向之面上之電極前述 第一被接合體為用來接觸於前述被檢查體之探針銷。 按照本發明,藉由接合構件之保持部分保持第二被接合 116150-990223.doc 1335058 月,,正 珊頁 m Γ场止使接合構件振動時第二被接合體相對於接合 構件横向滑動。因此,可以防止第二㈣合體㈣於第一 被接合體之位置偏移,可提高對第一被接合體之接合位置 之精度3外,猎由使接合構件之接觸部分接觸第二被接 合體’Γ將接合構件之振動確實確實地傳達給第二被接合 體:可稭由不損傷第-被接合體及第二被接合體之安全之 加壓力,防止第二被接合體之位置偏移,有效率地炼接第 二被接合體與連接端子,並得到足夠之接合力。 【實施方式】 ^下,對本發明之較佳實施形態進行說明。圖Η系顯示 包3藉由本發明之接合裝置所接合之探針鎖及連接端子之 探針裝置^之構成。 接鳊子之 在探針裝置1,例如母署右w #丨卜Λ X置有㈣卡2、及載置作為被檢查 體之曰曰0W之載置台3。探針卡2,例如包含用來接觸於晶 圓歡電極之複數之探針銷1〇、將此等複數之探針銷咐 持於其下面之接觸器U、及用於檢查晶圓〜之電氣特性之 印刷布線基板(電路基板)12。接觸器Μ印刷布線基板 12,例如形成為大致長方形之板狀。 接觸器11,包含電氣特性檢查時與晶圓w相對之外面(下 面ma、及安裝於印刷布線基板12之連接面(上表面)iib。 在外面ua上’設置有複數之連接端子(電極)⑴探針銷 10’在各連接端子13上各接合有W。在連接面iib上,^ 置有連接於印刷布線基板12之複數之接觸端子(電4: 及電容器15等。印刷布線基板12,經由接觸端B植接 116150-990223.doc 1335058 .· ??^刀#0¾換頁 *rm— I , Λ -· 盗U可通電地配設’並可以通過接觸器11對探針銷ι〇授受 _. * 電氣信號。 ·.· 各探針銷10,例如藉由鎳合金等金屬之導電性材料形 . 成如圖2所示,包含例如形成細長之大致長方體形狀之 樑部20、及相對於樑部2()以特定之角度彎折之前端部η。 圖2中,在樑部20之下面側之平坦之平面2〇a上設置有 凹部22。凹部22,沿樑部2〇之寬度方向(與長度方向正交 之方向、圖2中從前面側向内側之方向),從樑部20之一側 攀(前面側)之侧面延伸至另一側(内側)之側面,設置為細長 之槽狀。凹部22之縱剖面形狀,成為具有特定寬度(樑部 20之長度方向之寬度;)b、及特定之深度(平面2〇&與凹部22 之底面之間之階差)h之大致矩形形狀。藉由該凹部22、及 在樑部20之長度方向上位於凹部22之兩側之平面2〇a(亦 即,相對於凹部22之凸部),構成有凹凸23 ;在樑部2〇之 長度方向上,形成凹部22與凸部之平面2〇a交替排列設置 φ 之形狀。並且,凹部22内側之兩側面,構成為在藉由後述 之接合裝置30進行探針銷1〇與連接端子13之接合時,相對 於後述之超音波振動之振動方向D1大致垂直、且分別接觸 接合構件31之凸部42之兩側面。 連接端子13 ’藉由金屬等導電性材料所形成。探針銷 1 〇,被支持成樑部20之上表面側之平坦平面2〇b接合於該 連接端子13之下面側之平面i3a,且前端部21朝下方傾斜 之狀態。另外,探針銷1 〇經由連接端子丨3、接觸器丨丨電性 連接於印刷布線基板1 2。 116150-990223.doc 1335058 在對形成於晶圓w上之電子電路之番# 一 电氣特性進行檢杳 時,如圖1所示,將晶圓w載置於載詈一 戰夏口 3上,藉由載置 3使晶圓W上昇至接觸器丨丨側。然後 便日日圓W之各電極接 觸於相對應之探針銷10之前端部21之 士砝* > 卜鸲。卩,並經由印刷 布線基板12、接觸端子14、接觸器丨丨、拿 連接知子13及探針 ㈣,在與晶ilW之間授受電氣信號。藉此,檢查晶圓^ 上之電子電路之電氣特性。 繼之’對本實施形態之接合裝置3G之構成進行說明。圖 二系顯示用於使作為第二被接合體之探針銷1〇接合於作為 第一被接合體之連接端子13之接合裝置3〇。如圖3所示, 接合裝置30包含接合構件(隸元件)31、保持接合構扣 之保持機構32及内藏有使接合構件31振動之超音波振動器 33之本體34。再者,在接合構件31之下方包含:保持安裝 於印刷布線基板12上之前之接觸心之保持_、及載置 保持體35之載置台36。並且’藉由接合裝置3〇使探針㈣ 接合於連接端子13之步驟’係在將接觸器11安裝於印刷布 線基板12之前進行。 保持機構32,以使軸方向沿振動方向(圖3中之左右方 向)D1呈橫向之狀態’藉由接合裝置3〇之本體34來支持。 接合構件31 ’以前端部朝下之狀態安裝於保持機構32之前 端部。超音波振動器33 ’設置於保持機構32之基端部側。 藉由該超音波振動器33之振動,保持機構32在軸方向超音 波振動,接合構件31之前端部在振動方向D1超音波振動。 如圖4所示,在接合構件3 1之前端部,大致水平地設置 J16150-990223.docAccording to the present invention, the present invention is characterized in that it is a joining method in which the first joined body and the second joined body are slidably joined by ultrasonic vibration, and the first joined body is joined. The upper surface mounting portion: the joined body '- while holding the upper surface of the first-joined body by the holding portion provided on the joint member, presses the contact portion provided on the joint member against the second portion The object to be joined is ultrasonically vibrated by the ultrasonic vibration of the joining member, and the first joined body and the second joined body are welded to each other. The joint member may be ultrasonically vibrated while the concavities and convexities provided on the joint member are engaged with the concavities and convexities provided in the second joined body. The first object to be joined may be an electrode provided on a surface facing the object to be inspected in a probe card for inspecting electrical characteristics of the object to be tested, and the first object to be joined may be in contact with the object to be inspected. Probe pin. According to the present invention, the second joined body is laterally slid with respect to the engaging member when the engaging member vibrates by the holding portion of the engaging member holding the second engaged 116150-990223.doc 1335058. Therefore, it is possible to prevent the second (four) joint (4) from being displaced from the position of the first joined body, and the accuracy of the joint position of the first joined body can be improved, and the contact portion of the joint member contacts the second joined body. 'ΓThe vibration of the joint member is surely transmitted to the second joined body: the straw can be safely pressurized without damaging the first joined body and the second joined body, preventing the positional displacement of the second joined body The second joined body and the connecting terminal are efficiently welded and a sufficient bonding force is obtained. [Embodiment] A preferred embodiment of the present invention will be described. The figure shows the configuration of the probe device 3 and the probe device of the connection terminal by the bonding device of the present invention. In the probe device 1, for example, the parent office right w #丨卜Λ X is provided with the (4) card 2, and the mounting table 3 which is the W0W of the object to be inspected is placed. The probe card 2 includes, for example, a plurality of probe pins 1A for contacting the wafer electrodes, a contactor U for holding the plurality of probe pins underneath, and a wafer for inspection A printed wiring board (circuit board) 12 having electrical characteristics. The contactor Μ printed wiring board 12 is formed, for example, in a substantially rectangular plate shape. The contactor 11 includes an outer surface opposite to the wafer w at the time of electrical property inspection (the lower surface ma and the connection surface (upper surface) iib mounted on the printed wiring board 12. The plurality of connection terminals are provided on the outer ua' (electrode) (1) The probe pin 10' is bonded to each of the connection terminals 13. W. On the connection surface iib, a plurality of contact terminals (electricity 4: capacitors 15, etc.) connected to the printed wiring board 12 are disposed. The wire substrate 12 is implanted via the contact end B 116150-990223.doc 1335058.·??^刀#03⁄4 page change *rm-I, Λ -· pirate U can be energized to be configured and can be probed by the contactor 11 Pin 〇 〇 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 20, and bending the front end portion η at a specific angle with respect to the beam portion 2 (). In Fig. 2, a concave portion 22 is provided on the flat surface 2A of the lower surface side of the beam portion 20. The concave portion 22, along the beam The width direction of the part 2〇 (the direction orthogonal to the longitudinal direction, the direction from the front side to the inner side in Fig. 2) The side surface extending from the side of one side of the beam portion 20 (front side) to the side of the other side (inner side) is provided in an elongated groove shape. The longitudinal cross-sectional shape of the recess 22 has a specific width (the length direction of the beam portion 20) The width of the b) and the specific depth (the step between the plane 2〇 & and the bottom surface of the recess 22) h is substantially rectangular. The recess 22 and the recess in the longitudinal direction of the beam 20 are located. The plane 2〇a on both sides of the 22 (i.e., the convex portion with respect to the concave portion 22) is formed with irregularities 23; in the longitudinal direction of the beam portion 2〇, the concave portion 22 is formed alternately with the plane 2〇a of the convex portion The shape of φ is set, and the two side faces on the inner side of the concave portion 22 are configured to be substantially perpendicular to the vibration direction D1 of the ultrasonic vibration to be described later when the probe pin 1 is joined to the connection terminal 13 by the bonding device 30 to be described later. Vertically and respectively contacting both sides of the convex portion 42 of the joint member 31. The connection terminal 13' is formed of a conductive material such as metal. The probe pin 1 is supported as a flat plane 2 on the upper surface side of the beam portion 20. 〇b is bonded under the connection terminal 13 The plane i3a is in a state where the front end portion 21 is inclined downward. Further, the probe pin 1 is electrically connected to the printed wiring board 12 via the connection terminal 丨3 and the contactor. 116150-990223.doc 1335058 When the electrical characteristics of the electronic circuit formed on the wafer w are checked, as shown in FIG. 1, the wafer w is placed on the summer gate 3 of the first battle, and the crystal is placed by placing 3 The circle W rises to the side of the contactor, and then the electrodes of the sundial W are brought into contact with the front end 21 of the corresponding probe pin 10*> Then, an electrical signal is transmitted and received between the printed circuit board 12, the contact terminal 14, the contactor 丨丨, and the contact ferrule 13 and the probe (4). Thereby, the electrical characteristics of the electronic circuit on the wafer are inspected. Next, the configuration of the bonding apparatus 3G of the present embodiment will be described. Fig. 2 shows a joining device 3 for joining the probe pin 1 as the second joined body to the connecting terminal 13 as the first joined body. As shown in Fig. 3, the engaging device 30 includes an engaging member (member) 31, a holding mechanism 32 for holding the engaging member, and a body 34 in which the ultrasonic vibrator 33 for vibrating the engaging member 31 is housed. Further, under the bonding member 31, the contact center holding before mounting on the printed wiring board 12 and the mounting table 36 on which the holder 35 is placed are included. Further, the step of "joining the probe (4) to the connection terminal 13 by the bonding means 3" is performed before the contactor 11 is mounted on the printed wiring board 12. The holding mechanism 32 is supported by the body 34 of the joining device 3 in such a manner that the axial direction is in a lateral direction in the vibration direction (the left-right direction in Fig. 3) D1. The joint member 31' is attached to the front end portion of the holding mechanism 32 with the front end portion facing downward. The ultrasonic vibrator 33' is provided on the base end side of the holding mechanism 32. By the vibration of the ultrasonic vibrator 33, the holding mechanism 32 vibrates in the axial direction, and the front end portion of the joint member 31 vibrates in the vibration direction D1. As shown in Fig. 4, at the front end of the joint member 3 1 , substantially horizontally disposed J16150-990223.doc

1335058 有大致矩形形狀之平坦面40。在振動方向di上於平坦面4〇 之中央部,設置有凸部42。凸部42從接合構件3 1之前端部 朝向下方突出。另外,凸部42形成為細長之大致長方體形 狀’並設置為沿寬度方向D2(與振動方向D1正交之方向、 圖4中從前面側向内側之方向),從接合構件3丨前端部之一 側(前面側)之邊緣部延伸至另一側(内側)之邊緣部。凸部 42之縱剖面形狀,成為具有特定之寬度(振動方向⑴之寬1335058 has a flat face 40 of generally rectangular shape. A convex portion 42 is provided at a central portion of the flat surface 4A in the vibration direction di. The convex portion 42 protrudes downward from the front end portion of the joint member 3 1 . Further, the convex portion 42 is formed in an elongated substantially rectangular parallelepiped shape 'and is provided in the width direction D2 (the direction orthogonal to the vibration direction D1, the direction from the front side to the inner side in FIG. 4), from the front end portion of the joint member 3 The edge portion of one side (front side) extends to the edge portion of the other side (inner side). The longitudinal cross-sectional shape of the convex portion 42 has a specific width (width of the vibration direction (1))

度)b、特定之階差(平坦面40與凸部42之下面之間之階差)h 之大致矩形形狀。凸部42具有分別大致垂直於接合構件31 之振動方向D1之兩側面,且構成為在進行探針銷1〇與連接 端子1 3之接合時,凸部42之兩側面分別沿設置於前述探針 銷10上之凹部22之兩側面與之接觸。如此,則可以將接合 構件3 1之超音波振動從凸部4 2之兩側面有效率地向探針銷 10傳遞。 藉由該凸部42、及位於凸部42之兩側之平坦面4〇(亦 即,相對於凸部42之2個凹部),構成凹凸43。凹凸43,形 成沿振動方向D1,凹部22與凸部之平面2〇a交替排列設置 之形狀。另外,凹凸43可與探針銷1〇之凹凸23嚙合,如圖 5所不,在使凸部42插入凹部22内之狀態下,可使凸部a 之兩側之平坦面40與凹部22之兩側之平面20a相互密合。 在該情形下’凸主要作為用 定 ”分而起作用;凸部42兩側之平坦面4。,主要= 向探針銷10傳遞接合構件31之振動而接觸探針銷^之接觸 部分而起作用。亦即,成為個別地設置有作為保持部分而 116150-990223.doc -11- 1335058Degree) b, a substantially rectangular shape of a specific step (step difference between the flat surface 40 and the lower surface of the convex portion 42) h. The convex portion 42 has two side faces which are respectively substantially perpendicular to the vibration direction D1 of the joint member 31, and is configured such that when the probe pin 1〇 and the connection terminal 13 are engaged, the two side faces of the convex portion 42 are respectively disposed along the aforementioned The two sides of the recess 22 on the pin 10 are in contact therewith. Thus, the ultrasonic vibration of the joint member 31 can be efficiently transmitted from the both side faces of the convex portion 4 2 to the probe pin 10. The uneven portion 43 is formed by the convex portion 42 and the flat surface 4〇 located on both sides of the convex portion 42 (i.e., the two concave portions with respect to the convex portion 42). The unevenness 43 is formed in a shape in which the concave portion 22 and the plane 2〇a of the convex portion are alternately arranged in the vibration direction D1. Further, the concavities and convexities 43 can be engaged with the concavities and convexities 23 of the probe pins 1A, as shown in Fig. 5, in a state where the convex portions 42 are inserted into the concave portions 22, the flat faces 40 and the concave portions 22 on both sides of the convex portion a can be made. The planes 20a on both sides are in close contact with each other. In this case, the 'convex is mainly used as the fixed portion'; the flat surface 4 on both sides of the convex portion 42. Mainly = the vibration of the joint member 31 is transmitted to the probe pin 10 to contact the contact portion of the probe pin Functioning, that is, being individually set as a holding part and 116150-990223.doc -11- 1335058

之部分之構成。並 起作用之部分及作為接觸部分而起作用 且,設置於探針銷H)之凹部22,作為藉由凸部㈣保持之 被保持部分而起作用。另外,凹部22之兩侧之平面2〇&, 作為接觸平坦面40之被接觸部分起作用。The composition of the parts. The functional portion and the concave portion 22 provided as the contact portion of the probe pin H) function as a held portion held by the convex portion (4). Further, the planes 2〇& on both sides of the concave portion 22 function as contact portions of the contact flat surface 40.

保持體35形成大致長方形之托盤狀,在其上面,開口有 具有可以插入接觸器丨丨之連接面Ub側之部分之大小之保 持空間51。保持空間51具有從保持體35之上表面形成至特 定之深度、用於收納接觸端子14及電容器15等之内部空間 5U •,沿該内部空間51a之外周,設置有載置接觸器u之連 接面lib之周緣部之臺階部51b。接觸器u以將連接面工卟 側作為下面、將接觸端子14及電容器15等收納於内部空間 51a、連接面1 lb之周緣部沿臺階部51b之上表面接觸之狀 態,且,外面11a朝向上面側、連接端子13朝向接觸器n 上方之狀態下’插人於保持空間51。如此使接觸保持 於保持體35,將該保持體35載置於載置台%之大致水平之 上表面之狀態下,接觸器丨丨保持為大致水平。另外,構成 為連接^子13之平面13 a成為大致水平,並且,載置於平 面13a之探針銷10之平面2〇a亦成為大致水平。連接面^ 側之接觸端子14及電容器15等,藉由對保持體35以非接觸 狀態被包圍於内部空間51a内而被保護。因此,可以防止 連接面lib側之接觸端子14及電容器15等之損傷。 另外,在保持體35上安裝有複數之壓緊構件53,以壓緊 已插入保持空間51之接觸器11之外面11a之周緣部。各壓 緊構件53 基端部可自由裝卸地安裝於保持體之上表 116150-990223.doc -12- 1335058 面,前端部延伸至保持空間51之 一 件53之前端部可從上方壓緊外:卩#由壓緊構 . 外面lla保持接觸器11。另The holding body 35 is formed in a substantially rectangular tray shape, and a holding space 51 having a size that can be inserted into a portion of the contact surface Ub of the contactor is opened. The holding space 51 has an internal space 5U for accommodating the contact terminal 14 and the capacitor 15 and the like from the upper surface of the holding body 35 to a specific depth. The outer periphery of the internal space 51a is provided with a connection for placing the contactor u. The step portion 51b of the peripheral portion of the surface lib. The contactor u is in a state in which the connection surface of the connection surface is the lower surface, the contact terminal 14 and the capacitor 15 are housed in the internal space 51a, and the peripheral edge portion of the connection surface 11b is in contact with the upper surface of the step portion 51b, and the outer surface 11a is oriented. The upper side and the connection terminal 13 are inserted into the holding space 51 in a state of being above the contactor n. In this manner, the contact is held by the holder 35, and the holder 35 is placed on the upper surface of the substantially horizontal level of the mounting table, and the contactor 丨丨 is kept substantially horizontal. Further, the plane 13a formed as the connecting member 13 is substantially horizontal, and the plane 2〇a of the probe pin 10 placed on the flat surface 13a is also substantially horizontal. The contact terminal 14 on the side of the connection surface, the capacitor 15, and the like are protected by surrounding the holder 35 in the internal space 51a in a non-contact state. Therefore, damage to the contact terminal 14 and the capacitor 15 on the connection surface lib side can be prevented. Further, a plurality of pressing members 53 are attached to the holding body 35 to press the peripheral portion of the outer surface 11a of the contactor 11 into which the holding space 51 has been inserted. The base end portion of each pressing member 53 is detachably attached to the surface of the holding body 116150-990223.doc -12-1335058, and the front end portion extends to one of the holding portions 51 before the end portion can be pressed from above. :卩# by compaction. The outer lla holds the contactor 11. another

外,圖示之例中’在接觸器u之外面u A 臺階部11 c,該臺階部i i c孫钟里. 。、’。卩δ又置有 體35拄/ 、3又成將接觸器11安裝於保持 4低於外面lla之中央部側,壓緊構件In addition, in the illustrated example, 'the outer surface of the contactor u is u A step portion 11 c, which is the step portion i i c. , '.卩δ is further provided with a body 35拄/, and 3 is mounted to mount the contactor 11 on the side of the central portion of the holding 4 which is lower than the outer surface 11a, and the pressing member

之上表面配置,“壓緊構件53之前端I: ,緊外面^之中央部側之側面。各壓緊構件Μ之基端 邛,例如藉由螺釘53a之螺釘緊固等固定於保持體35之上 表面。並且’壓緊構件53,例如亦可對接觸器U之外面 Ua之4個邊部,分別對應設置丨個以上。如此,可以 地保持接觸器11。 貝 繼之,對使用如上構成之接合裝置3〇,使探針銷1〇接合 於連接端子13之方法進行說明。首先,如圖3所示,將接 觸器11插入保持體35之保持空間51,安裝壓緊構件兄,保 持接觸器11之外面lla。插入保持空間51時,接觸器丨丨之The upper surface is disposed, "the front end of the pressing member 53 is I: the side surface on the center side of the outer surface. The base end of each pressing member 邛 is fixed to the holding body 35 by screwing or the like by screws 53a, for example. The upper surface, and the pressing member 53, for example, may be provided correspondingly to the four sides of the outer surface Ua of the contactor U. Thus, the contactor 11 can be held. The bonding device 3A is configured to connect the probe pin 1 to the connection terminal 13. First, as shown in Fig. 3, the contactor 11 is inserted into the holding space 51 of the holding body 35, and the pressing member is mounted. The outer surface 11a of the contactor 11 is held. When the holding space 51 is inserted, the contactor

”年项)日修正替换頁 外面11a朝向上方,連接面llb之周圍部載置於臺階部 51b,接觸端子14及電容器15等配置於内部空間5u内。將 如此地保持接觸器11之保持體35固定於載置台36上後,如 圖5所示,在接觸器U上所安裝之1個連接端子13上定位 載置探針銷1 〇。亦即’以作為樑部20下面之平面2〇b接觸 於作為連接端子13上表面之平面i3a之狀態,載置探針銷 10 ° 在連接端子13上載置樑部20後,使接合構件31從樑部2〇 之上方下降’接合構件31之凹凸43從上方接近作為樑部2〇 116150-990223.doc 1335058 月巧对正替換頁 上表面之平面20a之凹凸23。此時’成為接合構件3i之振 動方向D1與樑部2〇之長度方向一致’接合構件“之寬度方 向D2與樑部2〇之寬度方向一致之狀態。然後,接合構件η 之凸部42從上方插入樑部2〇之凹部22。藉此,凹凸υ與凹 凸43相互响合,凸部42之兩側之平坦面40沿凹部22之兩側 之平面20a分別密合,樑部2〇藉由接合構件31從上方壓 緊。 如此,在凹凸23與凹凸43相互嚙合,接合構件Η壓緊樑 部汕,且樑部20之平面2〇b與連接端子13之平面ua密合之 、二下從超曰波振動器3 2振動超音波振動,接合構件3 i 沿振動方向D1超音波振動。超音波振動器32之超音波振 動、、二由保持機構32、接合構件3丨傳遞給樑部2〇。藉此, 探針銷ίο沿振動方向D1振動,樑部2〇之平面2〇b與連接端 子13之平面13a相互摩擦。藉由該摩擦熱,平面2〇b、 分別熔解,相互熔接。特別係,凸部42之兩側面與凹部^ 之兩側面相互密接,同時相對於振動方向⑴分別大致垂 直,藉此接合構件31之振動係從凸部42之兩側面有效地向 採針銷10傳遞。如此,藉由接合構件31給予超音波振動, 藉此探針銷10接合於連接端子13。然後,接合構件31從探 針銷10上升,凸部42從凹部22退出。如上所述,藉由接合 裝置30之接合結束。如此接合有探針銷ι〇之接觸器丨丨,從 接合裝置30搬出後,安裝於印刷布線基板12上。藉此,探 針卡2完成。 右依肊以上之實施形態,探針銷丨〇於分別設置於探針銷 116150-990223.doc •14- 1335058 10、接合構件31之凹凸23、凹凸43相互嚙合之狀態下,探 針銷1 0被接合構件3 1壓緊,藉此確實地保持探針銷丨〇。接 -· 合構件3 1 ’即使給予探針銷1 〇振動,凸部42亦不會從凹部 22脫出,凸部42確實地繼續保持凹部22,故可以防止探針 銷1 0從接合構件3 1橫向滑動。因此,可以防止探針銷1 〇相 對於接合構件3 1及連接端子13之探針銷1 〇之位置偏移,可 以相對於連接端子13將探針銷1〇高精度地接合於正確之位 φ 置。特別係’藉由在接合構件31及探針銷1〇之振動方向D1 上排列有凹部及凸部,可以有效地防止接合構件3丨與探針 銷10在振動方向D1上相互之位置偏移。另外,即使接合構 件3 1降低壓緊探針銷丨〇之加壓力而振動,亦可確實地防止 探針銷10之位置偏移。亦即,可以藉由無損傷接合構件 31、探針銷10、及連接端子13之虞之適當之加壓力,安全 地進行探針銷10之接合。 另外,藉由防止探針銷10相對於接合構件31探針銷1〇之 # 杈向滑動,接合構件3 1之振動能量確實地向探針銷10傳 遞,有效率地轉換成探針銷10與連接端子13之間之摩擦 熱。因此,可以有效率地進行藉由超音波振動之接合。 另外,雖係藉由凸部42保持凹部22,但藉由在凸部42、 凹部22之兩側’平面2〇a被平坦面扣分別壓緊之構成,可 更穩定地保持探針銷10,並且接合構件31之振動亦可向探 針銷ίο確實地傳遞。再者,接合構件3ι與探針銷1〇之接觸The "year" correction replacement page outer surface 11a faces upward, the peripheral portion of the connection surface 11b is placed on the step portion 51b, and the contact terminal 14 and the capacitor 15 are disposed in the internal space 5u. The holder of the contactor 11 is thus held. After being fixed to the mounting table 36, as shown in FIG. 5, the probe pin 1 is placed on one of the connection terminals 13 mounted on the contactor U. That is, 'as the plane 2 below the beam portion 20 〇b is in contact with the plane i3a which is the upper surface of the connection terminal 13, and the probe pin 10 is placed. After the beam portion 20 is placed on the connection terminal 13, the joint member 31 is lowered from above the beam portion 2'. The unevenness 43 is close to the unevenness 23 of the plane 20a which is the surface of the upper surface of the replacement page as the beam portion 2〇116150-990223.doc 1335058. At this time, the vibration direction D1 of the joint member 3i and the length of the beam portion 2〇 are formed. The direction in which the direction of the 'joining member' is in the width direction D2 coincides with the width direction of the beam portion 2'. Then, the convex portion 42 of the joint member η is inserted into the concave portion 22 of the beam portion 2 from above. Thereby, the concavo-convex and the concavities 43 resonate with each other, and the flat surfaces 40 on both sides of the convex portion 42 are respectively adhered to each other along the plane 20a on both sides of the concave portion 22, and the beam portion 2 is pressed from above by the joint member 31. Thus, the concavo-convex 23 and the concavities and convexities 43 are in mesh with each other, the joint member Η is pressed against the beam portion 汕, and the plane 2〇b of the beam portion 20 is in close contact with the plane ua of the connection terminal 13 and the second is from the super-chopper vibrator 3 2 The vibration ultrasonic vibration causes the joint member 3 i to vibrate in the vibration direction D1. The ultrasonic vibration of the ultrasonic vibrator 32 is transmitted to the beam portion 2 by the holding mechanism 32 and the joint member 3''. Thereby, the probe pin ίο vibrates in the vibration direction D1, and the plane 2〇b of the beam portion 2〇 and the plane 13a of the connection terminal 13 rub against each other. By the frictional heat, the planes 2〇b are respectively melted and welded to each other. In particular, both side faces of the convex portion 42 and the side faces of the concave portion are in close contact with each other while being substantially perpendicular to the vibration direction (1), whereby the vibration of the engaging member 31 is effectively directed from the both sides of the convex portion 42 toward the picking pin 10. transfer. In this manner, ultrasonic vibration is given by the joint member 31, whereby the probe pin 10 is joined to the connection terminal 13. Then, the engaging member 31 ascends from the probe pin 10, and the convex portion 42 is withdrawn from the recess 22. As described above, the joining by the joining device 30 ends. The contactor 接合 to which the probe pin 接合 is bonded is carried out from the bonding device 30, and then mounted on the printed wiring board 12. Thereby, the probe card 2 is completed. According to the above embodiment, the probe pins are respectively disposed on the probe pins 116150-990223.doc • 14-1335058 10, the concavo-convex 23 of the joint member 31, and the concavities and convexities 43 are meshed with each other, and the probe pin 1 The member to be joined 3 1 is pressed, thereby reliably holding the probe pin. When the probe member 3 1 'is vibrated, the convex portion 42 does not come out of the concave portion 22, and the convex portion 42 surely continues to hold the concave portion 22, so that the probe pin 10 can be prevented from the joint member 3 1 slide horizontally. Therefore, it is possible to prevent the position of the probe pin 1 〇 from being displaced with respect to the joint member 3 1 and the probe pin 1 连接 of the connection terminal 13 , and the probe pin 1 可以 can be accurately engaged with the correct position with respect to the connection terminal 13 . φ set. In particular, by arranging the concave portion and the convex portion in the vibration direction D1 of the joint member 31 and the probe pin 1〇, the positional displacement of the joint member 3丨 and the probe pin 10 in the vibration direction D1 can be effectively prevented. . Further, even if the engaging member 31 lowers the pressing force of the pressing probe pin and vibrates, the positional displacement of the probe pin 10 can be surely prevented. That is, the bonding of the probe pins 10 can be performed safely by the appropriate pressing force of the undamaged joint member 31, the probe pin 10, and the connecting terminal 13. Further, by preventing the probe pin 10 from sliding relative to the probe pin 1 of the engaging member 31, the vibration energy of the engaging member 31 is surely transmitted to the probe pin 10, and is efficiently converted into the probe pin 10. Friction heat between the connection terminal 13. Therefore, the bonding by ultrasonic vibration can be performed efficiently. Further, although the concave portion 22 is held by the convex portion 42, the flat surface fastener is pressed on both sides of the convex portion 42 and the concave portion 22, and the probe pin can be held more stably. 10, and the vibration of the engaging member 31 can also be reliably transmitted to the probe pin. Furthermore, the contact member 3ι is in contact with the probe pin 1〇

面積(參照圖6),較先前$ # $ , A 元則之裝置之接合構件與探針銷之接觸 面積(參照圖11)更大,可料抑力L ^ J對铋針銷1 〇在較大範圍給予加壓 116150-990223.doc -15- 1335058 。該情形’在平面20b與平面l3a之間產生 擦熱之面積增大,藉㈣接而接合之接合n 此’平面20b與平面13a之間之接合力提高,探針 固地安裝於連接端子13。 · ’.可牢 以上之實施形態中,令第一被接合體為連接端子13、第 -被接合體為探針銷1G,但第_被接合體及第 二非限定於此。另外,本發明並非限定於使探針銷接: 木針卡之連接端子者,亦可適用於各種電子元件等之接 合,例如,亦可適用於半導體晶片之接合裝置。亦即 一被接合體亦可為半導體晶片之連接電極,第二被接合 亦可為接合導線。 在以上之實施形態中,係採用接合構件31沿橫向之振動 方向D1超音波振動,但本發明亦可適用於振動方向為縱向 清I亦即,在藉由接合構件3 1使探針銷1 〇沿上下方向 超音波振動之情形時,亦可藉由被保持於凸部42插入於凹 部22之狀態,而確實地防止探針銷1〇之位置偏移。 以上之實施形態中’進行探針銷1〇與連接端子13之接合 時,係使接合構件31之接觸部分之平坦面4〇與探針銷1〇之 被接觸部分之平面20相互接觸,但保持部分之凸部42與被 保持部分之凹部22亦可不必接觸。例如如圖7所示,亦可 形成為相對於平坦面40之凸部42之階差h,較凹部22之深度 h小。該構成中’在凸部42之下面與凹部22之底面之間形 成有間隙之狀態下,平坦面40分別接觸各探針銷1〇。如 此’則可以使平坦面40確實地接觸平面20a,使接合構件 H6I50-990223.doc -16· 1335058 _ . 日修正替換頁 '· 31之振動從平坦面40確實地傳遞。另外,未嚴格要求凹部 22及凸部42之加工精度,故加工容易。 .. 另外,凹部22、凸部42等之形狀,並非限定於以上實施 形匕、中所揭示者。例如凸部42之兩侧面及凹部22之兩側 面,係相對於振動方向D1分別大致垂直之平面,但例如如 圖8所示,凸部42、凹部22,亦可構成為具有振動方向di 之寬度愈往下愈變窄之大致梯形狀之縱剖面形狀,且凸部 42之兩側面及凹部Μ之兩側面相對於振動方向m傾斜。該 攀情形下,可以防止向凹部22插入插出凸部42時,在凸部心 之外面與凹部22之内面之間產生摩擦,有易於順暢地進行 插入插出之優點。 以上之實施形態中,凹凸43藉由i個凸部42及其兩側之 平坦面4〇(亦即,2個凹部)所構成,凹占23藉由i個凹部22 及其兩側之平面20a(亦即,2個凸部)所構成,合計3對之凹 部與凸部相互喷合,但包含於各凹凸43、23之凹部及凸部 φ 之個數並非限定於該形態,亦可構成為4對以上之凹部與 Λ部嚙合。例如,亦可在平坦面4〇上沿振動方向m排列設 置複數之凸部42,此等之凸部42分別逐個插入在平面2〇a 上沿長度方向排列設置之複數之凹部22中。 另外,在以上之實施形態中’對在接合構件31之平坦面 40設置凸部42,在探針銷10之平面2〇a設置凹部^之情形 進订了說明’但例如如圖9所示,亦可構成為在接合構件 31之平坦面40之中央部設置從平坦面4〇向上方陷沒之凹部 61,在探針銷1〇之平面2〇a設置從平面2〇a向上方突出之凸 116150-990223.doc 1335058 ??命月相狂替換頁 # 62 °玄形悲中,藉由設置於中央部之凹部6丨及設置於凹 σρ 61之兩側之平坦面4〇(亦即,相對於凹部6丨之2個凸部), 構成凹凸63另外,藉由設置於中央部之凸部62及設置於 凸4 62兩側之平面2〇a(亦即,相對於凸部62之2個凹部), 構成凹凸64。並且’構成為凹凸63之凹部61作為保持部分 而起作用,凸部62作為被保持部分而起作用,凹部61之兩 側之平坦面40作為接觸部分起作用,凸部Q之兩側之平面 2〇a作為被接觸部分起作用。進行接合時,在凸部“插入 凹部61之狀態下,凹部61與凸部62之兩側之平坦面4〇與平 面20a相互接觸。在該情形下,亦可藉由凸部以插入凹部 ,防止探針銷10相對於接合構件31之位置偏移,可以確 實地保持探針銷1 〇。 凹。卩6 1之深度(凹部6丨之上表面與平坦面⑽之間之階 差)h3、與凸部62之高度(凸部62之上表面與平面2〇a之間之 階差)h4,亦可彼此幾乎相同,但如圖1〇所示,深度…較 高度h4大亦可。亦即,亦可構成為在凸部Q之上表面與凹 部61之上表面之間形成有適度之間隙之狀態下,使平坦面 40接觸探針銷1G。如此,則可以使平坦⑽確實地接觸平 面20a使接合構件3 1之振動從平坦面4〇確實地傳遞。 外,未嚴格要求凹部22及凸部42之加工精产:,=二 易。 2上,一邊參照附圖一邊對本發明之較佳實施形態進行 了說明’但本發明並非限定於此例。本行業者,當得明白 在5己載於申請專利範圍内之技術思想之範内,可想到各 116150-990223 .doc 1335058 V私月%修正替換頁The area (refer to Fig. 6) is larger than the contact area of the joint member of the device and the probe pin (refer to Fig. 11) compared with the previous $#$, A element, and the force L ^ J is opposite to the pin pin 1 A larger range is given a pressure of 116150-990223.doc -15-1335058. In this case, the area where the heat is generated between the plane 20b and the plane l3a is increased, and the joint between the plane 20b and the plane 13a is increased by the joint of the (4) joint, and the probe is fixedly mounted to the connection terminal 13 . In the above embodiment, the first to-be-joined body is the connection terminal 13, and the first to-be-joined body is the probe pin 1G. However, the first to-be-joined body and the second are not limited thereto. Further, the present invention is not limited to the case where the probe is pinned: the connection terminal of the wood pin card can be applied to the connection of various electronic components or the like, and can be applied to, for example, a bonding device of a semiconductor wafer. That is, a bonded body may be a connection electrode of a semiconductor wafer, and the second bonded body may be a bonding wire. In the above embodiment, the joint member 31 is ultrasonically vibrated in the lateral direction of vibration D1, but the present invention is also applicable to the longitudinal direction of the vibration, that is, the probe pin 1 is made by the joint member 31. When the ultrasonic wave is vibrated in the vertical direction, the position of the probe pin 1〇 can be surely prevented from being displaced by being held in the state in which the convex portion 42 is inserted into the concave portion 22. In the above embodiment, when the probe pin 1 is joined to the connection terminal 13, the flat surface 4 of the contact portion of the joint member 31 and the flat surface 20 of the contact portion of the probe pin 1 are brought into contact with each other, but The convex portion 42 of the holding portion and the concave portion 22 of the held portion may not necessarily be in contact. For example, as shown in Fig. 7, the step h with respect to the convex portion 42 of the flat surface 40 may be formed to be smaller than the depth h of the concave portion 22. In this configuration, in a state where a gap is formed between the lower surface of the convex portion 42 and the bottom surface of the concave portion 22, the flat surface 40 contacts the respective probe pins 1A. Thus, the flat surface 40 can be surely brought into contact with the flat surface 20a, so that the vibration of the joint member H6I50-990223.doc -16·1335058_.day correction replacement page '·31 is reliably transmitted from the flat surface 40. Further, since the processing accuracy of the concave portion 22 and the convex portion 42 is not strictly required, the processing is easy. Further, the shape of the concave portion 22, the convex portion 42, and the like is not limited to those disclosed in the above embodiments. For example, both side surfaces of the convex portion 42 and the two side surfaces of the concave portion 22 are substantially perpendicular to the vibration direction D1. However, as shown in FIG. 8, for example, the convex portion 42 and the concave portion 22 may be configured to have a vibration direction di. The longitudinal cross-sectional shape of the substantially trapezoidal shape is narrower as the width becomes smaller, and both side faces of the convex portion 42 and both side faces of the concave portion are inclined with respect to the vibration direction m. In the case of this climbing, it is possible to prevent friction between the outer surface of the convex portion and the inner surface of the concave portion 22 when the insertion convex portion 42 is inserted into the concave portion 22, and it is easy to smoothly insert and insert. In the above embodiment, the concavities and convexities 43 are formed by i convex portions 42 and flat surfaces 4 〇 (i.e., two concave portions) on both sides, and the concave portion 23 is formed by i concave portions 22 and planes on both sides thereof 20a (that is, two convex portions), the total of three pairs of concave portions and convex portions are sprayed together, but the number of concave portions and convex portions φ included in each of the irregularities 43 and 23 is not limited to this form, and may be Four or more pairs of recesses are engaged with the jaws. For example, a plurality of convex portions 42 may be arranged in the vibration direction m on the flat surface 4, and the convex portions 42 are respectively inserted into the plurality of concave portions 22 which are arranged in the longitudinal direction on the plane 2〇a. Further, in the above embodiment, the description has been made of the case where the convex portion 42 is provided on the flat surface 40 of the joint member 31 and the concave portion ^ is provided on the plane 2〇a of the probe pin 10, but for example, as shown in FIG. Further, a concave portion 61 that is recessed upward from the flat surface 4〇 may be provided at a central portion of the flat surface 40 of the joint member 31, and the flat surface 2〇a of the probe pin 1〇 may be provided to protrude upward from the plane 2〇a. The convex 116150-990223.doc 1335058 ?? 命月相狂 replacement page # 62 ° 形 悲 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , In other words, the convex portion 63 is formed on the central portion and the flat surface 2〇a provided on both sides of the convex portion 4 62 with respect to the two convex portions of the concave portion 6丨 (that is, with respect to the convex portion) The two recesses 62 are configured to constitute the unevenness 64. Further, the concave portion 61 configured as the concave-convex portion 63 functions as a holding portion, and the convex portion 62 functions as a held portion, and the flat surface 40 on both sides of the concave portion 61 functions as a contact portion, and the planes on both sides of the convex portion Q 2〇a acts as a part to be touched. At the time of joining, in a state where the convex portion "inserted into the concave portion 61, the flat surface 4A on both sides of the concave portion 61 and the convex portion 62 is in contact with the flat surface 20a. In this case, the concave portion may be inserted by the convex portion. Preventing the position of the probe pin 10 from being displaced with respect to the engaging member 31, the probe pin 1 可以 can be surely held. The depth of the concave 卩6 1 (the step difference between the upper surface of the concave portion 6 与 and the flat surface (10)) h3 The height of the convex portion 62 (the step difference between the upper surface of the convex portion 62 and the plane 2〇a) h4 may be almost the same as each other, but as shown in FIG. 1A, the depth...the height h4 may be large. In other words, the flat surface 40 may be brought into contact with the probe pin 1G in a state in which a moderate gap is formed between the upper surface of the convex portion Q and the upper surface of the concave portion 61. Thus, the flat surface (10) can be surely The contact plane 20a reliably transmits the vibration of the joint member 31 from the flat surface 4. In addition, the processing of the recess 22 and the projection 42 is not strictly required: 2 = 2, and the present invention is described with reference to the drawings. The preferred embodiment has been described. However, the present invention is not limited to this example. When have been appreciated at 5 contained in the range of the technical idea within the scope of the patent application, it is conceivable for each 116150-990223 .doc 1335058 V% correction replaced monthly private page

種之變更例或修正例, 術範圍。 此等亦理所當然地屬於本發明之技 本發明者們’為了比較使用實施形態所說明之接合裝置 30進行探針銷1〇與連接端子13之接合時之接合力(平面2〇b 與平面13a之間之接合力)、與使用先前之接合裝置進行探 針銷10與連接端子13之接合時之接合力,進行了如下之實 驗 1、2 〇 (實驗1) ® 使用接合裝置3〇,製作46個如圖11所示之接合有細長之 大致為長方體形狀之探針銷7〇與連接端子13之試製品。用 於此等試製品之探針銷70,在基端側具有與樑部2〇同樣之 凹凸23。探針銷70之前端側,在將基端側接合於連接端子 13之平面13a之狀態下,呈延設於連接端子13之外侧之狀 恕。將該試製品以探針銷7 〇朝向連接端子丨3之上方之狀熊 載置,從上方加壓探針銷70之前端,並使探針銷7〇彎曲。A modified example or a modified example, the scope of the technique. It is a matter of course that the present inventors have made the joining force (plane 2〇b and plane 13a) when the probe pin 1〇 and the connection terminal 13 are joined by the bonding device 30 described in the embodiment. The bonding force between the bonding force and the bonding force between the probe pin 10 and the connection terminal 13 using the prior bonding device was as follows: 1. Experiment 1) (Experiment 1) ® Using the bonding device 3〇, Forty-six specimens having the elongated substantially rectangular parallelepiped probe pin 7 and the connection terminal 13 as shown in FIG. The probe pin 70 of the prototype used has the same unevenness 23 as the beam portion 2'' on the proximal end side. The front end side of the probe pin 70 is extended to the outer side of the connection terminal 13 in a state where the base end side is joined to the flat surface 13a of the connection terminal 13. The prototype was placed with the probe pin 7 〇 facing the bear above the connection terminal 丨 3, and the front end of the probe pin 70 was pressed from above, and the probe pin 7 was bent.

φ 該探針銷70之加壓,進行直至探針銷70之前端下部接觸位 於其下方之接觸器U之外面Ua(圖u中用鏈線表示之狀 態)、或直至探針銷70之基端側從連接端子13剝離為止。 如此,對各試製品,確認探針銷7〇是否從連接端子丨3剝 離,並比較探針銷70與連接端子13之間之接合力。表丄顯 示其實驗結果。並且,表1中,接合力之大小,係以將某 基準值定為1時之相對於基準值之比率來表示(在後述之表 2中亦同樣表示)。如表1所示,46個試製品中,3個試製品 發生了探針銷70與連接端子13之剝離。亦即,剝離之發Z U6150-990223.doc 1335058 _ fl年>月_正替換頁 率約為6.5[%]。另外,46個試製品之接合力,最小值(Min) 為13、最大值(Max)為21、平均值(Ave)約為19.8、3σ(σ : 標準偏差)為約4.1。 表1 試製品 編號 接合 力 剝離 1 13 發生 2 19 3 19 4 19 5 19 6 18 7 20 8 19 9 19 10 19 11 21 12 20 13 20 14 20 15 20 16 21 發生 17 20 18 20 19 20 20 20 21 20 22 20 23 19 24 20 25 20 26 21 27 20 28 20 29 20 30 21 31 20 32 21 33 20 116150-990223.doc -20- 1335058φ Pressurization of the probe pin 70 is performed until the lower end of the front end of the probe pin 70 contacts the outer surface Ua of the contactor U located below it (the state indicated by the chain line in Fig. u), or until the base of the probe pin 70 The end side is peeled off from the connection terminal 13. In this manner, it is confirmed whether or not the probe pin 7 is peeled off from the connection terminal 对3 for each of the prototypes, and the bonding force between the probe pin 70 and the connection terminal 13 is compared. The table shows the results of the experiment. Further, in Table 1, the magnitude of the joining force is expressed by a ratio with respect to the reference value when a certain reference value is set to 1 (the same is also shown in Table 2 to be described later). As shown in Table 1, among the 46 prototypes, the peeling of the probe pin 70 and the connection terminal 13 occurred in the three prototypes. That is, the peeling hair Z U6150-990223.doc 1335058 _ fl year > month _ positive replacement page rate is about 6.5 [%]. Further, the joining force of 46 prototypes had a minimum value (Min) of 13, a maximum value (Max) of 21, an average value (Ave) of about 19.8, and a third value (σ: standard deviation) of about 4.1. Table 1 Prototype number joint force peeling 1 13 occurs 2 19 3 19 4 19 5 19 6 18 7 20 8 19 9 19 10 19 11 21 12 20 13 20 14 20 15 20 16 21 occurs 17 20 18 20 19 20 20 20 21 20 22 20 23 19 24 20 25 20 26 21 27 20 28 20 29 20 30 21 31 20 32 21 33 20 116150-990223.doc -20- 1335058

开年>月4日修正替換頁I 34 20 35 16 發生 36 20 37 21 38 20 39 21 40 20 41 20 42 21 43 21 44 20 45 21 46 20 剝離發生數 3 剝離發生率[%] 6.5 接合力Min 13 接合力Max 21 接合力Avg 19.76087 接合力3σ 4.107787Opening Year > 4th Day Correction Replacement Page I 34 20 35 16 Occurrence 36 20 37 21 38 20 39 21 40 20 41 20 42 21 43 21 44 20 45 21 46 20 Peeling Number 3 Peeling Rate [%] 6.5 Bonding Force Min 13 joint force Max 21 joint force Avg 19.76087 joint force 3σ 4.107787

(實驗2)(Experiment 2)

使用先前之接合裝置,製作46個接合有探針銷70與連接 端子1 3之試製品。然後,對各試製品,與實驗1同樣,以 探針銷70朝向連接端子13之上方之狀態,加壓探針銷70之 前端,進行調查接合力之試驗。表2顯示該實驗結果。如 表2所示,46個試製品中,43個試製品發生了探針銷70之 剝離。亦即,剝離之發生率約為93.5 [%]。另外,對46個 試製品所施加之最高載荷,最小值(Min)為約0、最大值 (Max)為19、平均值(Ave)約為9.5、3 σ為約15.0。 表2 試製品編號 接合力 剝離 1 4 發生 2 6 發生 3 13 發生 116150-990223.doc -21 1335058 11年厶月4日修王替換頁 4 0 發生 5 12 發生 6 5 發生 7 5 發生 8 10 發生 9 12 發生 10 0 發生 11 12 發生 12 4 發生 13 12 發生 14 12 發生 15 1 發生 16 15 發生 17 9 發生 18 7 發生 19 16 發生 20 4 發生 21 13 發生 22 2 發生 23 13 發生 24 13 發生 25 13 發生 26 9 發生 27 8 發生 28 12 發生 29 5 發生 30 4 發生 31 0 發生 32 11 發生 33 5 發生 34 10 發生 35 19 36 19 37 7 發生 38 10 發生 39 12 發生 40 13 發生 41 17 116150-990223.doc -22· 1335058 介年,曰修正替換頁 42 12 發生 43 13 發生 44 10 發生 45 13 發生 46 16 發生 生率『❼ 接合力Max 接合力Avg 93.5 19 接合力3σ 9.521739 15.04313 藉由以上之實驗丨、2之結果,可確認藉由使用實施形態 之接合裝置30進行接合,可以較使用先前之接合裝置進行 接σ之情形’探針銷7〇更難以從連接端子丨3剝離;另外, 即使對彳采針銷70之前端部施加力,亦可抵抗更大之力而維 持接合之狀態。因此,可確認藉由使用接合裝置3〇可以提 向接合力。 Α另外,本發明者們,為了比較使用實施形態所說明之接 合裝置30進行探針銷1〇與連接端子13之接合時之位置精度 (相對於連接端子13之探針銷1〇之接合位置之位置偏移之 大小)、與使用先前之接合裝置進行探針銷1〇與連接端子 13之接合時之位置精度,進行了如下之實驗3、4。 (實驗3) 使用接合裝置30’製作48個接合有探針銷Μ與連接端子然後,對各試製品’在探針銷10之寬度方向 ㈣方向)及長度方向(Υ軸方向)上測 之探針銷1〇之從正規位置之偏移(位置偏移 測量’應用影像識別技術進行。表3顯示其結果。並且之 H6150-990223.doc •23· ^58 W年ι月如沒正替換頁 表3中’位置偏移之大小,以將某基準值定 钓1盼之相對於 基準值之比率來表示(後述之表4亦同樣表示如表3所 示’ X軸方向之位置偏移之平均值(Ave)約為4.6、Y軸方向 之位置偏移之平均值(Ave)約為48.9。另外,X軸方向之位 置偏移之3σ約為7.4、Y軸方向之位置偏移之3σ約為 31.1 〇 表3 试製品編號 位置偏移 X軸 Y軸 1 4 41 2 2 41 3 -2 29 4 5 23 5 1 25 6 4 43 7 4 51 8 4 39 9 3 39 10 7 57 11 7 54 12 7 50 13 8 51 14 5 52 15 6 56 16 7 43 17 4 60 18 4 63 19 5 50 20 5 64 21 2 24 22 2 34 23 6 51 24 7 50 25 8 47 26 2 35 27 4 45 28 9 55 1161.50-990223.doc -24- 1335058Using the prior joining device, 46 prototypes to which the probe pins 70 and the connection terminals 13 were joined were fabricated. Then, in the same manner as in Experiment 1, the probe pin 70 was pressed against the tip end of the connection terminal 13 in the same manner as in Experiment 1, and the test of the joint force was examined. Table 2 shows the results of this experiment. As shown in Table 2, out of the 46 prototypes, peeling of the probe pins 70 occurred in 43 prototypes. That is, the incidence of peeling is about 93.5 [%]. Further, for the highest load applied to the 46 prototypes, the minimum value (Min) was about 0, the maximum value (Max) was 19, the average value (Ave) was about 9.5, and the third σ was about 15.0. Table 2 Prototype No. Joint Force Peeling 1 4 Occurrence 2 6 Occurrence 3 13 Occurrence 116150-990223.doc -21 1335058 11th of the next month 4th Renovation Replacement Page 4 0 Occurrence 5 12 Occurrence 6 5 Occurrence 7 5 Occurrence 8 10 Occurrence 9 12 occurs 10 0 occurs 11 12 occurs 12 4 occurs 13 12 occurs 14 12 occurs 15 1 occurs 16 15 occurs 17 9 occurs 18 7 occurs 19 16 occurs 20 4 occurs 21 13 occurs 22 2 occurs 23 13 occurs 24 13 occurs 25 13 Occurrence 26 9 occurrence 27 8 occurrence 28 12 occurrence 29 5 occurrence 30 4 occurrence 31 0 occurrence 32 11 occurrence 33 5 occurrence 34 10 occurrence 35 19 36 19 37 7 occurrence 38 10 occurrence 39 12 occurrence 40 13 occurrence 41 17 116150-990223. Doc -22· 1335058 Intermediary, 曰Revision replacement page 42 12 Occurrence 43 13 Occurrence 44 10 Occurrence 45 13 Occurrence 46 16 Occurrence rate ❼ Engagement force Max Engagement force Avg 93.5 19 Joint force 3σ 9.521739 15.04313 With the above experiment丨As a result of 2, it can be confirmed that the bonding is performed by using the bonding device 30 of the embodiment, and the sigma can be used in comparison with the previous bonding device. Pins 7〇 more difficult to peel off from the connection terminal 3 Shu; Further, even when the distal end portion 70 of the pin on the needle applies a force pick left foot, can resist a greater force to maintain the state of engagement. Therefore, it can be confirmed that the joining force can be lifted by using the joining device 3〇. In addition, the inventors of the present invention have compared the positional accuracy (the position of the probe pin 1〇 with respect to the connection terminal 13) when the probe pin 1 is joined to the connection terminal 13 by using the bonding apparatus 30 described in the embodiment. Experiments 3 and 4 were carried out in accordance with the positional accuracy when the probe pin 1 〇 and the connection terminal 13 were joined using the previous bonding apparatus. (Experiment 3) 48 joint probe pins and connection terminals were produced by using the bonding apparatus 30', and then tested on each of the prototypes 'in the width direction (four) direction of the probe pin 10) and the length direction (axis direction). The probe pin 1〇 is offset from the normal position (position offset measurement 'applied by image recognition technology. Table 3 shows the result. And H6150-990223.doc •23· ^58 W year ○ month is not replaced In Table 3, the magnitude of the positional offset is expressed by the ratio of the reference value to the reference value (the table 4 described later also shows the positional shift in the X-axis direction as shown in Table 3). The average value (Ave) is about 4.6, and the average value (Ave) of the positional shift in the Y-axis direction is about 48.9. In addition, the positional deviation of the X-axis direction is about 7.4, and the positional shift in the Y-axis direction is 3σ is approximately 31.1 〇 Table 3 Prototype number position offset X-axis Y-axis 1 4 41 2 2 41 3 -2 29 4 5 23 5 1 25 6 4 43 7 4 51 8 4 39 9 3 39 10 7 57 11 7 54 12 7 50 13 8 51 14 5 52 15 6 56 16 7 43 17 4 60 18 4 63 19 5 50 20 5 64 21 2 24 22 2 34 23 6 51 24 7 50 25 8 47 2 6 2 35 27 4 45 28 9 55 1161.50-990223.doc -24- 1335058

(實驗 4)(Experiment 4)

奶時正替換頁Milk replacement page

48個接合有探針銷10與 對各試製品’與實驗3同 上測買相對於連接端子1 3 使用先前之接合裝置,製作 連接蠕子1 3之試製品。然後, 樣’在X軸方向及Y軸方向 之探針銷1 0之位置偏移。位置偏移之測量係應用影像識 別技術進行。表4顯示其結果。如表4所示,X軸方向 之位置偏移之平均值(Ave)約為8.3、Y軸方向之位置偏 移之平均值(Ave)約為51.3。另外,X軸方向之位置偏移 之3 σ約為27·7、γ軸方向之位置偏移之3 σ約為 146.8。 I16150-990223.doc -25- 1335058 1年>承> ⑽二替換頁 表4 試製品編 位置偏移 號 X軸 Y軸 1 22 38 2 2 38 3 2 56 4 3 112 5 22 90 6 -8 31 7 25 93 8 17 103 9 8 27 10 11 49 11 15 31 12 6 20 13 8 41 14 20 88 15 11 74 16 11 -76 17 11 69 18 2 65 19 2 33 20 1 26 21 2 6 22 7 33 23 20 126 24 4 22 25 2 37 26 4 148 27 24 41 28 9 31 29 2 33 30 10 -13 31 -2 73 32 -2 30 33 13 166 34 -6 -84 35 -4 6 36 16 9 37 13 23Forty-eight specimens were joined with the probe pins 10, and the test pieces were attached to the respective test articles' and the test 3, and the previous joint device was used with respect to the connection terminals 13 to make a test piece for connecting the creepers 13. Then, the position of the probe pin 10 in the X-axis direction and the Y-axis direction is shifted. The measurement of positional offset is performed using image recognition techniques. Table 4 shows the results. As shown in Table 4, the average value (Ave) of the positional shift in the X-axis direction is about 8.3, and the average value (Ave) of the positional shift in the Y-axis direction is about 51.3. Further, 3 σ of the positional shift in the X-axis direction is about 27·7, and 3 σ of the positional shift in the γ-axis direction is about 146.8. I16150-990223.doc -25- 1335058 1 year>> (10) Two replacement page Table 4 Prototype position offset number X axis Y axis 1 22 38 2 2 38 3 2 56 4 3 112 5 22 90 6 - 8 31 7 25 93 8 17 103 9 8 27 10 11 49 11 15 31 12 6 20 13 8 41 14 20 88 15 11 74 16 11 -76 17 11 69 18 2 65 19 2 33 20 1 26 21 2 6 22 7 33 23 20 126 24 4 22 25 2 37 26 4 148 27 24 41 28 9 31 29 2 33 30 10 -13 31 -2 73 32 -2 30 33 13 166 34 -6 -84 35 -4 6 36 16 9 37 13 23

116150-990223.doc -26- 1335058 38 9 116 39 -6 44 40 3 60 41 16 103 42 16 64 43 35 ^ 107 44 9 50 45 -4 60 46 12 27 47 -2 2 48 5 -------- 134 Min -8 -84 Max 35 166 Avg 8.3 51.3 3 σ 27.7 146.8 頁 藉由以上之實驗3、4之結果,可知使用接合裝置3〇進行 接合,較使用先前之接合裝置進行接合之情形,位置偏移 之大小減小;關於3σ,X軸方向及¥轴方向上分別成為約 1/3以下,位置偏移之偏差減小。因此,可確認藉由使用 接&襞置30,可以有效地改善接合之位置精度。 【圖式簡單說明】116150-990223.doc -26- 1335058 38 9 116 39 -6 44 40 3 60 41 16 103 42 16 64 43 35 ^ 107 44 9 50 45 -4 60 46 12 27 47 -2 2 48 5 ----- --- 134 Min -8 -84 Max 35 166 Avg 8.3 51.3 3 σ 27.7 146.8 By the results of Experiments 3 and 4 above, it is known that the joining is performed using the joining device 3〇, which is the case of joining with the previous joining device. The magnitude of the positional shift is reduced. With respect to 3σ, the X-axis direction and the ¥axis direction are respectively about 1/3 or less, and the deviation of the positional deviation is reduced. Therefore, it can be confirmed that the positional accuracy of the joint can be effectively improved by using the joint & [Simple description of the map]

圖1係顯示探針裝置之構成之概略之側視圖。 圖2係放大顯示探針銷及連接端子之構成之立體圖。 圖3係顯示接合裝置之構成之概略之側視圖。 圖4係顯示接合構件之前端部之立體圖。 圖5係顯示將探針銷接合於連接端子之狀態之說明圖。 圖6係顯示接觸面積及接合面積之說明圖。 圖7係使ά置於接合構件之凸部之階差小於設置於探針 銷之凹。卩之洙度之實施形態之說明圖。 圖8係將設置於接合構件之凸部之剖面形狀構造成大致 116150-990223.doc •27- 1335058 梯形之實施形態之說明圖。 ^ 圖9係在接合構件設置作為保持部分之凹部,在探針銷 設置作為被保持部分之凸部之實施形態之說明圖。 圖ίο係使設置於接合構件之凹部之深度大於設置於探 針銷之凸部之階差之實施形態之說明圖。 圖11係。兑明Λ驗1、2之連接端子及探針銷之位置關係 及使探針銷變形之狀態之說明圖。Fig. 1 is a schematic side view showing the configuration of a probe device. Fig. 2 is a perspective view showing the configuration of the probe pin and the connection terminal in an enlarged manner. Fig. 3 is a side view showing the outline of the configuration of the joining device. Fig. 4 is a perspective view showing the front end portion of the joint member. Fig. 5 is an explanatory view showing a state in which the probe pin is joined to the connection terminal. Fig. 6 is an explanatory view showing a contact area and a joint area. Fig. 7 is such that the step of placing the crucible on the convex portion of the joint member is smaller than the recess provided in the probe pin. An explanatory diagram of the implementation form of the 洙 洙 。. Fig. 8 is an explanatory view showing an embodiment in which the cross-sectional shape of the convex portion provided in the joint member is substantially 116150-990223.doc • 27-1335058 trapezoidal. Fig. 9 is an explanatory view showing an embodiment in which a concave portion is provided as a holding portion in a joint member, and a convex portion as a held portion is provided in a probe pin. Fig. ui is an explanatory view showing an embodiment in which the depth of the concave portion provided in the joint member is larger than the step of the convex portion provided on the probe pin. Figure 11 is a series. The positional relationship between the connection terminal and the probe pin of the test 1 and 2 and the state in which the probe pin is deformed.

圖12係顯示藉由先前之接合構件將探針銷接合於連接 端子之狀態之說明圖。 【主要元件符號說明】 1 探針裝置 2 探針卡 3 載置台 10、 70、95 探針銷 11 ' 91 接觸器 11a 外面(下面) lib 連接面(上表 面) 11c 臺階部 12 布線基板 13 ' 92 連接端子(電 極) 13a 平面 14 接觸端子(電極) 15 電容器 20 樑部 116150-990223.doc •28- 1335058 ”烊 >月4曰修正替換頁Fig. 12 is an explanatory view showing a state in which the probe pin is joined to the connection terminal by the prior engagement member. [Main component symbol description] 1 Probe device 2 Probe card 3 Mounting table 10, 70, 95 Probe pin 11 '91 Contactor 11a Outside (lower) lib Connecting surface (upper surface) 11c Step portion 12 Wiring board 13 ' 92 Connection terminal (electrode) 13a Plane 14 Contact terminal (electrode) 15 Capacitor 20 Beam part 116150-990223.doc •28- 1335058 ”烊>Month 4曰Revision replacement page

20a ' 20b 平面 21 前端部 22 ' 61 凹部 23 ' 43 、 63 ' 64 凹凸 30 接合裝置 31、96 接合構件 32 保持機構 33 超音波振動 34 本體 35 保持體 36 載置台 40 平坦面 42、62 凸部 51 保持空間 51a 内部空間 51b 臺階部 53 壓緊構件 53a 螺釘 b 寬度 D1 振動方向 D2 寬度方向 h 階差 W 晶圓 116150-990223.doc -29-20a ' 20b plane 21 front end 22 ' 61 recess 23 ' 43 , 63 ' 64 concave and convex 30 engagement means 31, 96 engagement member 32 holding mechanism 33 ultrasonic vibration 34 main body 35 holding body 36 mounting table 40 flat surface 42, 62 convex portion 51 holding space 51a inner space 51b step portion 53 pressing member 53a screw b width D1 vibration direction D2 width direction h step difference W wafer 116150-990223.doc -29-

Claims (1)

1335058 私叫日修正替換頁I 、申請專利範圍: t 1. -種接合裝置’其係使接合構件接觸被载置於第—被接 合體之上表面之第二被接合體之上表面,並藉由前述接 合構件使前述第二被接合體超音波振動’藉此使前述第 一被接合體與前述第二被接合體接合者,·且 在前述接合構件上,設置有接觸前述第二被接合體之 接觸部分、及保持前述第二被接合體之保持部分; 在前述接合構件上,設置有與設置於前述第二被接合 體之凹凸相嗤合之凹凸;且藉由前述接合構件之凹凸來 構成前述接觸部分及前述保持部分。 2. =清求項i之接合裝置,其中前述接合構 由設置於前述接合楳杜夕1w U保藉 扫面办 則鸲部之平坦面、及從前述平 坦面犬出之凸部. 丁 分,前$几立,斤構成,且别述平坦面為前述接觸部 述凸。卩為前述保持部分。 3. 如請求項2之接合 面之中央部。、置、中前述凸部設置於前述平垣 5.如請求項二。二置,其中前述四部設置有複數個。 由設一二二=:述接合構件…係藉 述平坦面之凹部所 月之平坦面、及設置於前 分,前述凹部,且前述平坦面為前述接觸部 6如請求:述保持部分。 • 衣項5之接合穿罟,甘上、 面之中央部。 、 八中前述凹部設置於前述平坦 7·如請求項5之接合裝 χ置其中前述凹部設置有複數個。 116150-990223.doc 1335058 8. 9. ”年咖日修正替換頁 ,:項1之接合裝置,其中前述接合構件之凹凸係沿前 述:合構件之超音波振動之振動方向交替地排列設置。 么求項1之接合裝置,其中前述第一被接合體係設置 ;-被檢查體之電氣特性之探針卡中與被檢查體對向 之面上之電極; /述第二被接合㈣用來接觸於前述被檢査趙之探針 10’種接合方法’其係藉由超音波振動來熔接而接合第一 被接合體與第二被接合體者;且 在刖述第一被接合體之上表面載置第二被接合體; 一邊藉由設置於接合構件之保持部分保持前述第二被 接合體之上表面’一邊將設置於前述接合構件之接觸部 分壓抵於前述第二被接合體; 糟由使前述接合構件超音波振動,而使前述第二被接 合體超音波振動’使前述第—被接合體與第二被接合體 熔接 在使設置於前述接合構件之凹凸與設置於前述第二被 接合體之凹凸相嚙合之狀態下’使前述接合構件超音波 振動。 11.如請求項10之接合方法,苴 /、中則述第一被接合體係設置 於檢查被檢查體之電氣转,1_4$:^^1_上_^1&1 弘札符改之探針卡中與被檢查體對向 之面上之電極; 前述第二被接合體係用來接觸於前述被檢查體之探針銷。 116150-990223.doc 1335058 巧)〉〇二,換頁 七、指定代表圖: (一)本案指定代表圖為 :第(3)圖。 (二)本代表圖之元件符號簡單說明: 10 探針銷 11 接觸器 11a 外面(下面) lib 連接面(上表面) 11c 臺階部 13 連接端子(電極) 13a 平面 14 接觸端子(電極) 15 電容器 30 接合裝置 31 接合構件 32 保持機構 33 超音波振動器 34 本體 35 保持體 36 載置台 51 保持空間 51a 内部空間 51b 臺階部 53 壓緊構件 53a 螺釘 D1 振動方向 、本案若有化學式時, 請揭示最能顯示發明特徵的化學式 (無) 116150-990223.doc1335058 Private Calling Day Correction Replacement Page I, Patent Application Range: t 1. - Type of engaging means 'which causes the engaging member to contact the upper surface of the second joined body placed on the upper surface of the first joined body, and The second joined body is ultrasonically vibrated by the joining member to thereby engage the first joined body and the second joined body, and the second engaging member is provided on the engaging member. a contact portion of the bonded body and a holding portion for holding the second joined body; the joint member is provided with an unevenness that is coupled to the unevenness of the second joined body; and the joint member is The concavities and convexities constitute the aforementioned contact portion and the aforementioned holding portion. 2. = the bonding device of claim i, wherein the joint structure is provided by a flat surface provided on the joint portion of the joint 楳 夕 w w 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及 及, the first $ a few stands, the pound is composed, and the flat surface is the aforementioned contact portion.卩 is the aforementioned holding part. 3. As in the central part of the joint of claim 2. The aforementioned convex portion is disposed in the aforementioned flat portion 5. As claimed in claim 2. Two sets, wherein the foregoing four parts are provided with plural numbers. The joint member is a flat surface of the concave portion of the flat surface, and the concave portion is provided in the front portion, and the flat surface is the contact portion 6 as described in the request. • The joint of the clothing item 5 is worn, and it is on the center of the face. The above-mentioned concave portion is provided in the above-mentioned flat portion. The joint device according to claim 5, wherein the plurality of concave portions are provided. 116150-990223.doc 1335058 8. 9. The year of the Japanese version of the replacement page, the joining device of item 1, wherein the concavities and convexities of the engaging members are alternately arranged along the vibration direction of the ultrasonic vibration of the engaging member. The bonding device of claim 1, wherein said first bonded system is disposed; - an electrode of a probe card having electrical characteristics of the object to be inspected on a surface opposite to the object to be inspected; / said second being joined (four) for contact In the above-mentioned inspection Zhao's probe 10' kind bonding method', which is welded by ultrasonic vibration to join the first joined body and the second joined body; and the surface of the first joined body is described Mounting the second joined body; pressing the contact portion provided on the joining member against the second joined body while holding the upper surface of the second joined body by the holding portion provided in the joining member; Ultrasonic vibration of the joint member causes ultrasonic vibration of the second joined body to weld the first joined body and the second joined body to a concave portion provided in the joint member The engaging member is ultrasonically vibrated in a state of being engaged with the unevenness of the second joined body. 11. The joining method of claim 10, wherein the first joined system is set in the inspection Check the electrical connection of the body, 1_4$: ^^1_上_^1&1 the electrode on the opposite side of the probe card to the object to be inspected; the second joined system is used to contact The probe pin of the above-mentioned object to be inspected. 116150-990223.doc 1335058 巧)〉〇二, 换页七, designated representative figure: (1) The representative representative of the case is: (3). (2) The representative figure Brief description of component symbols: 10 Probe pin 11 Contactor 11a Outside (below) lib Connection surface (upper surface) 11c Step portion 13 Connection terminal (electrode) 13a Plane 14 Contact terminal (electrode) 15 Capacitor 30 Engagement device 31 Engagement member 32 Holding mechanism 33 Ultrasonic vibrator 34 Main body 35 Holding body 36 Mounting table 51 Holding space 51a Internal space 51b Step portion 53 Pressing member 53a Screw D1 Vibration direction, if there is a chemical formula in this case, Please reveal the chemical formula that best shows the characteristics of the invention (none) 116150-990223.doc
TW095143615A 2005-11-25 2006-11-24 Bonding apparatus and bonding method TW200739768A (en)

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8289885B2 (en) * 2006-10-27 2012-10-16 Alcatel Lucent Third party charging for SIP sessions
US9038688B2 (en) 2009-04-29 2015-05-26 Covidien Lp System and method for making tapered looped suture
DE102010016415A1 (en) * 2010-04-09 2011-10-13 Schunk Sonosystems Gmbh Method for welding flat components
JP5577161B2 (en) * 2010-06-09 2014-08-20 日立オートモティブシステムズ株式会社 Connection structure and manufacturing method thereof
JP2013226580A (en) * 2012-04-26 2013-11-07 Mitsubishi Electric Corp Ultrasonic vibration joining apparatus
JP6567957B2 (en) * 2015-11-12 2019-08-28 京セラ株式会社 Power semiconductor module manufacturing method
JP6793388B2 (en) * 2016-07-12 2020-12-02 株式会社アルテクス Joining method
JP6707052B2 (en) * 2017-03-29 2020-06-10 三菱電機株式会社 Method of manufacturing semiconductor device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562822A (en) * 1969-03-07 1971-02-16 Doughboy Ind Inc Swimming pool with lock-on rails
JPS5778720A (en) * 1980-10-31 1982-05-17 Matsushita Electric Works Ltd Method of welding contact with supersonic wave
US4726480A (en) * 1987-03-25 1988-02-23 Mckesson Corporation Fail safe ultrasonically welded container and process
JPH0636852A (en) 1992-07-15 1994-02-10 Matsushita Electric Works Ltd Method for connecting terminal to printed wiring board
JP2697411B2 (en) 1991-03-27 1998-01-14 日本電気株式会社 TAB inner lead joining method
JPH05322463A (en) * 1992-05-19 1993-12-07 Furukawa Electric Co Ltd:The Sealing structure of heat pipe
JPH0636582A (en) 1992-07-21 1994-02-10 Oki Micro Design Miyazaki:Kk Read circuit
JPH08309562A (en) * 1995-05-15 1996-11-26 Nippondenso Co Ltd Ultrasonic tool
JP2000079486A (en) 1998-09-02 2000-03-21 Toyota Motor Corp Ultrasonic welding method and joining member used therefor
JP2001205452A (en) * 2000-01-24 2001-07-31 Toshiba Corp Ultrasonic welding equipment, ultrasonic welding method, closed battery and producing method thereof
JP4088121B2 (en) 2002-08-14 2008-05-21 富士通株式会社 Contactor manufacturing method
TW200405839A (en) 2002-10-03 2004-04-16 Ultex Corp Ultrasonic bonding machine
JP4269638B2 (en) 2002-10-22 2009-05-27 株式会社村田製作所 Ultrasonic welding method of resin package
JP2004309441A (en) * 2003-02-18 2004-11-04 Yamaha Corp Probe head, its assembling method, and probe card
JP2004317162A (en) * 2003-04-11 2004-11-11 Masaki Esashi Probe card, probe pin, and manufacturing method thereof

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KR20070055410A (en) 2007-05-30
US20070119535A1 (en) 2007-05-31
JP4927391B2 (en) 2012-05-09
US20110121057A1 (en) 2011-05-26
JP2007144449A (en) 2007-06-14
KR100846404B1 (en) 2008-07-16
US7896052B2 (en) 2011-03-01
TW200739768A (en) 2007-10-16

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