TWI333431B - Liquid material applying apparatus - Google Patents

Liquid material applying apparatus Download PDF

Info

Publication number
TWI333431B
TWI333431B TW096139447A TW96139447A TWI333431B TW I333431 B TWI333431 B TW I333431B TW 096139447 A TW096139447 A TW 096139447A TW 96139447 A TW96139447 A TW 96139447A TW I333431 B TWI333431 B TW I333431B
Authority
TW
Taiwan
Prior art keywords
nozzle
nozzles
substrate
sub
movable
Prior art date
Application number
TW096139447A
Other languages
English (en)
Chinese (zh)
Other versions
TW200831194A (en
Inventor
Oze Hirokazu
Ueno Masatoshi
Yamamoto Satoshi
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200831194A publication Critical patent/TW200831194A/zh
Application granted granted Critical
Publication of TWI333431B publication Critical patent/TWI333431B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
TW096139447A 2006-12-25 2007-10-22 Liquid material applying apparatus TWI333431B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006347291A JP4737685B2 (ja) 2006-12-25 2006-12-25 塗布装置

Publications (2)

Publication Number Publication Date
TW200831194A TW200831194A (en) 2008-08-01
TWI333431B true TWI333431B (en) 2010-11-21

Family

ID=39656642

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096139447A TWI333431B (en) 2006-12-25 2007-10-22 Liquid material applying apparatus

Country Status (3)

Country Link
JP (1) JP4737685B2 (ja)
KR (1) KR100891780B1 (ja)
TW (1) TWI333431B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6026362B2 (ja) * 2013-07-09 2016-11-16 東京エレクトロン株式会社 基板処理システム、基板処理システムの制御方法、及び記憶媒体
JP6232239B2 (ja) 2013-09-30 2017-11-15 株式会社Screenホールディングス 塗布装置
JP6220693B2 (ja) * 2014-02-14 2017-10-25 株式会社Screenホールディングス 塗布装置
CN115985206B (zh) * 2022-11-28 2023-11-03 江苏卓高广告器材有限公司 一种墙面广告清理安装设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002119908A (ja) 2000-10-13 2002-04-23 Toray Ind Inc ペースト塗布装置
JP3491155B2 (ja) 2000-11-21 2004-01-26 セイコーエプソン株式会社 材料の吐出方法、及び吐出装置、カラーフィルタの製造方法及び製造装置、液晶装置の製造方法及び製造装置、el装置の製造方法及び製造装置
JP2002273869A (ja) 2001-01-15 2002-09-25 Seiko Epson Corp 吐出方法およびその装置、電気光学装置、その製造方法およびその製造装置、カラーフィルタ、その製造方法およびその製造装置、ならびに基材を有するデバイス、その製造方法およびその製造装置
KR100540633B1 (ko) * 2003-06-20 2006-01-11 주식회사 탑 엔지니어링 페이스트 도포기 및 그 제어 방법
JP4506118B2 (ja) 2003-07-02 2010-07-21 セイコーエプソン株式会社 吐出装置、カラーフィルタ基板の製造装置、エレクトロルミネッセンス表示装置の製造装置、プラズマ表示装置の製造装置、配線製造装置、および塗布方法。
JP4679895B2 (ja) * 2003-12-17 2011-05-11 大日本印刷株式会社 パターン形成装置、ヘッドユニット
JP4587816B2 (ja) * 2005-01-27 2010-11-24 大日本スクリーン製造株式会社 基板処理装置
JP2007152164A (ja) * 2005-12-01 2007-06-21 Dainippon Screen Mfg Co Ltd 塗布装置および塗布装置における複数のノズルのピッチの調整方法

Also Published As

Publication number Publication date
JP2008155138A (ja) 2008-07-10
KR20080059500A (ko) 2008-06-30
JP4737685B2 (ja) 2011-08-03
KR100891780B1 (ko) 2009-04-07
TW200831194A (en) 2008-08-01

Similar Documents

Publication Publication Date Title
TWI333431B (en) Liquid material applying apparatus
TWI784832B (zh) 用於製造電子產品的層的設備
TWI545024B (zh) 緊密有機蒸氣噴射印刷列印頭
TWI520854B (zh) 用於有機蒸氣噴射印刷之噴嘴幾何形狀
TWI328840B (ja)
JP5159957B2 (ja) ステージ制御用光学システム
TWI344947B (ja)
WO2007123148A1 (ja) 欠陥修復装置、欠陥修復方法、プログラム及びコンピュータ読み取り可能な記録媒体
TW201437043A (zh) 基於色彩的線性三維擷取系統及方法
CN110272657A (zh) 液体喷射装置和液体喷射方法
US9989862B2 (en) Optical system for producing lithographic structures
TW200818386A (en) Substrate moving apparatus
JP2006170533A (ja) 被加熱体の乾燥方法、加熱炉、及びデバイスの製造方法
TWI339133B (en) Liquid material applying apparatus
US7290489B2 (en) Substrate inspecting apparatus and control method thereof
JP2006261228A (ja) 回路基板用配線パターン形成装置および配線パターンの補修方法
JP4424165B2 (ja) 液滴塗布装置
JP2006177982A (ja) バイオチップ製造器具の画像アライメント方法
CN110429101A (zh) 像素结构及其制作方法、纳米压印模版、显示器件
TWI237131B (en) Color filter substrate, method of manufacturing the same, display device, liquid crystal display device and electronic equipment
JP4876577B2 (ja) カラーフィルタの製造方法
JP2004281983A (ja) 位置決め装置および位置決め方法並びに塗布装置および塗布方法
JP2008298727A (ja) 液滴量測定装置及び液滴量調整装置並びに液滴量測定方法及び液滴量調整方法と、被描画基板の製造方法
US20070281331A1 (en) Method of tracking swimming path of bacterium
JP2017179284A (ja) 水性インク、インクカートリッジ、及びインクジェット記録方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees