1330049 九、發明說明： 【發明所屬之技術領域】 本發明係關於具備連接插 是關於附連接插頭端子之印刷 接之端子與端子間難以產生短 化。 【先前技術】 傳統上，如記憶體模組在 (邊緣連接器用的端子）的印刷 插頭端子實施電鍍處理而在表 金等進行電鍍處理之後按照工 尺寸。因此，當切斷工件之際 • 斷。 • 此外，此處的所謂工件， 有必要大小的基板，而可將該 爲胚料尺寸。 第5圖係顯示以先前技術 路板作爲基材之工件的結構， 各端子的連接插頭端子2起朝 結。 在經由電鍍導線3對連接 處理之後，藉由切斷虛線部A-之附連接插頭端子的印刷電路 此時，會有從電鍍導線的 情形，隨著端子的節距縮小時 頭端子之印刷電路板1特別 電路板及其製造方法，其鄰 路，且信號波形難以產生劣 基板端部具有連接插頭端子 電路板之中，係爲了對連接 面層設置電鍍導線，並在以 件尺寸切斷成爲規定的基板 ，會與基板同時地將導線切 是指在某一步驟中製造時具 大小稱爲工件尺寸、或是稱 中附連接插頭端子之印刷電 電鍍導線3係在表面層上由 向圖中的箭頭方向配置並連 插頭端子2的部份實施電鍍 -A’便能夠得到如第6圖所示 板。 切斷端部發生毛邊及剝落的 ’這種因毛邊及剝落而造成 -5- 1330049 切屑而容易與鄰接端子間發生短路。 多種關於附連接插頭端子之印刷電路板的先前技術已 經被提出，諸如：日本特開平3-250691號公報（以下稱爲專 利文獻1)所揭露的「卡片邊緣連接器組裝基板的端子電鍍 方法」、日本特開昭57- 1 64598號公報（以下稱爲專利文獻 2)所揭露的「印刷配線板之製造方法j 、日本特開平 9- 1 62508號公報（以下稱爲專利文獻3)所揭露的「端子電鍍 用電鍍導線之構造」等。 專利文獻1所揭露的發明，如第7圖所示，藉由將電 鍍導線全部埋設於內層，便能夠抑制由切斷端部所發生的 毛邊及剝落。在此方法中，爲了將電鍍導線埋設於內層， 而從各端子經由穿孔將導線配置於內層。 再者，專利文獻2所掲露的發明，係同時形成信號配 線及電源配線，並將短路的部份利用貫通孔切斷使得兩者 分離。 專利文獻3所掲露的發明，與專利文獻1相同，係藉 由將電鍍導線全部埋設於內層，而抑制由切斷端部所發生 的毛邊及剝落。 第8圖顯示以專利文獻1及專利文獻3所揭露的附連 接插頭端子之印刷電路板作爲基材之工件的結構，電鍍導 線3係由連接插頭端子2開始經由穿孔4而在內層中朝向 箭頭方向（板端的方向）配置並連結，在對連接插頭端子2 實施電鍍處理之後，一切斷虛線部A-A’便會如第7圖所示 般露出設置於內層的電鍍導線3。 第9圖係爲沿第8圖中破折線B-B’所示的斷面圖，如 -6- 1330049 圖所示，在專利文獻1及專利 由於電鍍導線3係基板切削後 此在信號端子的情況下便成爲 特別在高速信號的情況下更爲 專利文獻2所揭露的發明 相同的問題之外，更具有下列 (1) 用以切斷短路部位的貫 製造前置時間及製造工時也會 (2) 由於必須確保足以在i 空間，因此端子的節距狹窄化 如此，傳統的附連接插頭 因爲由工件切出時所產生之毛 與端子間發生短路，而且電鍍 歧配線的方式殘存，因此對於 來說，會有波形發生歪斜的問 【發明内容】 鑑於以上的相關問題，本 接插頭端子之印刷電路板及其 工件切出時所產生之毛邊及剝 間發生短路以及信號的波形會 本發明提供一種附連接插 於端部具備複數個連接插頭端 插頭端子的部份實施電鍍處理 信號線用的連接插頭端子實施 在外層；而對作爲電源線或接 文獻3所揭露的發明之中， 以分歧配線的方式殘存，因 波形歪斜的原因。這個問題 顯著》 除了具有與專利文獻1及3 問題： 通孔加工步驟是必要的，而 增加。 詰子與端子間形成貫通孔的 便無法對應。 端子之印刷電路板，不但會 邊及剝落而使得鄰接的端子 導線亦會在基板切削後以分 作爲信號端子而使用的情況 題。 發明之目的爲提供一種附連 製造方法，其並不具有…-由 落而使得鄰接的端子與端子 發生歪斜---等缺點。 頭端子之印刷電路板，其係 子，其特徵在於：對形成連接 用的電鍍導線當中，對作爲 電鍍處理用的電鍍導線係設 也線用的連接插頭端子實施 -7- 1330049 電鍍處理用的電鍍導線係設在內層。 本發明之電子機器，係具備附連接插頭端子之印刷電 路板的電子機器，該印刷電路板的端部具備複數個連接插 頭端子，其特徵在於：對形成連接插頭端子的部份實施電鍍 處理用的電鍍導線當中，對作爲信號線用的連接插頭端子 實施電鍍處理用的電鍍導線係設在印刷電路板的外層；而 對作爲電源線或接地線用的連接插頭端子實施電鍍處理用 的電鍍導線係設在印刷電路板的內層》 本發明更提供一種附連接插頭端子之印刷電路板的製 造方法，其係藉由切斷形成有規定之配線圖案的工件 (work)，而製造在端部具備複數個連接插頭端子之附連接 插頭端子的印刷電路板，其特徵在於：形成對連接插頭端子 的部份實施電鍍處理用的電銨導線當中，對作爲信號線用 的連接插頭端子實施電鍍處理用的導線係在工件之表面 層，而對作爲電源線或接地線用的連接插頭端子實施電鍍 處理用的導線係在工件之內層，各層的電鍍線連接於有效 面之外；以及在藉由電鍍處理形成連接插頭端子後，由工 件切出有效面。 本發明的效果爲能夠提供一種附連接插頭端子之印刷 電路板及其製造方法，其並不具有---由工件切出時所產生 毛邊及剝落會使得鄰接的端子與端子間發生短路以及在以 電鍍導線作爲信號端子的情形下波形會發生歪斜-…等缺 點。 其理由在於，對作爲信號線用的該連接插頭端子實施 電鍍處理用的電鍍導線係設置於外層，而對作爲電源線或 -8- 1330049 接地線用的連接插頭端子實施電鍍處理用的電鍍導線係設 置於內層之故。 【實施方式】 [發明原理] 在本發明中，將電鍍導線設置於外層（表面層或裏面層 或是設置於內層，係因應端子的對象屬性（連接的屬性）---亦即對象（net)是信號端子、接地端子、供電端子中的哪一 種---而決定。 具體來說，對象若是信號則設置於外層、若是接地或 供電則設置於內層，藉由這種作爲’端子數若是相同則由 於外觀上端子節距變寬，因此即使發生毛邊及剝落也難以 產生短路等不良情形。 此外，由於不會使得無用的分歧配線殘存在配線中 途，因此能夠得到良好的傳送路徑特性。 [第1實施例] 第1圖係爲關於本發明之較佳實施例之印刷電路板的 結構示意圖，印刷電路板1在基板端部具有連接插頭端子 2。用以對連接插頭端子實施電鑛處理而設置的電鍍導線3 不僅被設置於外層、還經由穿孔4而被設置於內層。 在印刷電路板被裝設於圖中未示之連接器的外殼的狀 態下，連接插頭端子2係藉由與連接器的導線端子機械地 接觸而產生電性連接，藉由對這種電性連接實施電鍍可確 實地提高其可靠度。 如第2圖所示，被設置於外層（第2圖的情形下爲表面 層）的電鍍導線3係被使用於欲形成信號端子的連接插頭端 .9- 1330049 子2之時者。另一方面，被設置於內層的電鍍導線3係被 使用於欲形成接地或供電端子之時者。 藉由將電鍍導線3分開設置於外層及內層，便能夠加 寬設置於外層的電鍍導線3彼此之間的間隔。如第3圖所 示，附連接插頭端子之印刷電路板係於使用電鍍導線3而 在工件上形成連接插頭端子2之後、藉由在工件上切斷規 定之位置（C-C’）而形成。在本實施例的工件之中，爲了要讓 電鍍導線3彼此之間的間隔變寬，因此即使於切斷之時會 在電鍍導線3處產生毛邊及剝落，也難以與鄰接的端子發 生短路。 再者，第4圖係爲第3圖中沿破折線D-D’的斷面示意 圖，如圖所示，因爲用以對信號端子實施電鍍處理的各電 鍍導線3並不會以分歧配線的方式殘存，所以難以發生因 信號的反射所造成的波形歪斜。是故，便能夠達成高速信 號的傳送而實現高速化，此外，還能夠達成微弱信號的傳 送而實現省電化。 此外，具備本發明之印刷電路扳的電子機器或電子機 器全體亦具有相同的效果。 另外，上述實施例爲本發明之較佳實施例的其中一種 而已，也就是說本發明並非僅限定於此，上述的外層可以 是表面層、也可以是裏面層》 [第2實施例] 上述第1實施例中雖然僅係在印刷電路板的其中一面 上形成當作信號線使用的電鏤導線之情況作爲例子，但用 以對信號端子實施電鍍處理的電鍍導線也可以同時形成於 -10- 1330049 印刷電路板的表面及裏面等兩面《換句話說，本發明還可 以適用於連接插頭端子被同時配置於印刷電路板之兩面的 情形。以下將這種情形當作第2實施例並藉由參考第1 0圖 及第1 1圖來進行說明。 第1 0圖係爲本發明第2實施例之印刷電路板1 A之結 構以及各連接插頭端子之用途的示意圖。印刷電路板1A的 表面層11上的基板端部具有連接插頭端子21、22、23、24、 25、26、27、28。用以對這些連接插頭端子實施電鍍的電 鍍導線，不只是表面層的電鍍導線35、36、37、38，內層 上還分別經由穿孔42、44、46、48而設置了電鍍導線31、 32 、 33 、 34 ° 如第10圖所示，設置於表面層的電鍍導線35、36、37、 38係用來形成信號端子的連接插頭端子21、23、25、27。 另一方面，設置於內層的電鍍導線31、32、33、34係在形 成接地端子22、24、26或供電端子28的時候被使用。 第11圖係由與第10圖同方向開始·--亦即由斜上方開 始---穿過表面層1 1及基板1 A之內部進行透視所見印刷電 路板1A之裏面層12的結構示意圖。印刷電路板ία之裏面 層12上的基板端部具有連接插頭端子21A、22A、23A、24A、 25 A、26 A、27 A、28A，關於用以對連接插頭端子實施電鍍 的電鍍導線，不只是裏面層的電鍍導線35A、36A、37A' 38A，內層上還分別經由穿孔42、44、46、48而設置了電 鍍導線 31、32、33、34(第 10 圖）。 信號用的連接插頭端子21、23、25、27係經由能夠避 免分別與穿孔41、42、43、44、45、46、47、48接觸的導 1330049 線 35B、36B ' 37B、38B 而分別與穿孔 49、50、51、52 連 接。 如第11圖所示，設置於裏面層的電鍍導線35A、3 6A、 37A、38A係用來形成每個信號端子的連接插頭端子21A、 23A、25A、27A。另一方面，設置於內層的電鍍導線31、 32、33、34係分別經由穿孔42、44、46、48而連接於接地 端子22A、24A、26A及供電端子28A、並在形成該等端子 的時候被使用。 與第1實施例相同的是，藉由將電鍍導線分開設置於 外層及內層，便能夠加寬設置於表面層及裏面層的導線 35~38、35A〜38A彼此之間的間隔。因此，即使於切斷工件 之時在導線3處產生毛邊及剝落，也不易與鄰接的端子發 生短路。 此外，存在於同一垂直線（與表面層11及裏面層12垂 直之線）上的連接插頭端子…諸如連接插頭端子27及27A 之中，由於每條電鍍導線在表面層11及裏面層12上係彼 此分離而存在，因此在切斷時即使電鍍導線上會發生毛邊 及剝落也不會有互相短路的疑慮。 再者，與第1實施例相同的是，由於並沒有將用以對 信號端子實施電鍍處理的各電鏟導線配置於內層，因此電 鍍導線35~38、35A~38A並不會以分歧配線的方式殘存，因 信號的反射所造成的波形歪斜亦難以產生，而能夠實現高 速化的目標。 與第1實施例相比，由於分配於信號的連接插頭端子 變成兩倍，因此具有能夠分配兩倍的信號的效果》 -12- 1330049 如此，本發明具有各式各樣不同實施例的可能性。 雖然本發明已參照說明用實施例而說明，但此說明書 並無限制性之意。熟習此技藝者參考本文後，可進行許多 說明性實施例之修改與變更。因此，所附申請專利範圍應 涵蓋諸如此類之修改或實施例。 又，即使申請專利範圍在保護期間被修改時，本發明 人亦保留申請專利發明之所有均等性。 【圖式簡單說明】 根據上文對本發明各方面的詳細描述倂結合附圖，可更容 易理解本發明的這些和其他特點與優點，在附圖中： 第1圖係爲關於本發明之第1實施例之附連接插頭端 子之印刷電路板的結構示意圖； 第2圖係爲各連接插頭端子之用途的示意圖； 第3圖係爲關於本發明之較佳實施例之以附連接插頭 端子之印刷電路板作爲基材之工件的結構示意圖； 第4圖係爲關於本發明之較佳實施例之以附連接插頭 端子之印刷電路板作爲基材之工件的斷面示意圖； 第5圖係爲先前技術中以附連接插頭端子之印刷電路 板作爲基材之工件的結構示意圖； 第6圖係爲先前技術中工件切斷後附連接插頭端子之 印刷電路板的狀態示意圖； 第7圖係爲先前技術中附連接插頭端子之印刷電路板 的結構示意圖； 第8圖係爲先前技術中以附連接插頭端子之印刷電路 板作爲基材之工件的結構示意圖； 1 i；l -13- 1330049 第9圖係爲先前技術中以附連接插頭端子之印刷電路 板作爲基材之工件的斷面示意圖； 第10 _圖係爲關於本發明之第2實施例之附連接插頭端 子之印刷電路板之結構以及各連接插頭端子之用途的示意 圖；及 第11圖係爲本發明之第2實施例中由斜上方開始穿過 表面層1 1及基板1 A之內部進行透視所見印刷電路板1 A 之裏面層12的結構示意圖。 【主要元件符號說明】 1 印刷電路板 1 A 印刷電路板 2 連接插頭端子 21-28 連接插頭端子‘ 22 ' 24 ' 26 接地端子 28 供電端子 21A-28A 連接插頭端子 22A、24A、26A接地端子 28A 供電端子 3 電鍍導線 31-38 電鍍導線 35A-38A 電鍍導線 35B〜38B 電鍍導線 4 穿孔 41-52 穿孔 11 表面層 12 裏面層 1 -14-[Technical Field] The present invention relates to a connection with a plug which is difficult to be shortened between a terminal and a terminal for a printed connection of a connection plug terminal. [Prior Art] Conventionally, a memory module is subjected to a plating process at a printed plug terminal (a terminal for an edge connector) and is subjected to a plating process after a gold plating or the like. Therefore, when the workpiece is cut off, it is broken. • In addition, the so-called workpiece here is a substrate of the necessary size, which can be the size of the billet. Fig. 5 is a view showing the structure of a workpiece having a prior art road board as a base material, and the connection plug terminals 2 of the respective terminals are directed toward each other. After the connection processing via the plating wire 3, the printed circuit of the connection plug terminal is cut by cutting the broken line portion A- at this time, there is a case where the wiring is turned off, and the printed circuit of the head terminal is reduced as the pitch of the terminal is reduced. The board 1 special circuit board and the manufacturing method thereof, the adjacent circuit, and the signal waveform is difficult to produce a poor substrate end portion having a connection plug terminal circuit board, in order to provide a plating wire for the connection surface layer, and to cut it in the piece size The specified substrate, which is cut at the same time as the substrate, refers to a printed electroplated wire 3 having a size called a workpiece size or a connection plug terminal in a certain step. The plate is arranged in the direction of the arrow and the portion of the plug terminal 2 is plated-A' to obtain the plate as shown in Fig. 6. The cutting edge is burred and peeled off. This is caused by burrs and flaking -5- 1330049 chips and is easily short-circuited with the adjacent terminals. A variety of prior art techniques for attaching a printed circuit board to a plug terminal have been proposed, such as the "terminal plating method for a card edge connector assembly substrate" disclosed in Japanese Laid-Open Patent Publication No. Hei-3-250691 (hereinafter referred to as Patent Document 1). Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. "Structure of plating wire for terminal plating". According to the invention disclosed in Patent Document 1, as shown in Fig. 7, by embedding all of the electroplated wires in the inner layer, it is possible to suppress burrs and peeling which are caused by the cut ends. In this method, in order to embed the electroplated wires in the inner layer, the wires are arranged in the inner layer via the perforations from the respective terminals. Further, in the invention disclosed in Patent Document 2, the signal wiring and the power supply wiring are simultaneously formed, and the short-circuited portion is cut by the through hole to separate the two. According to the invention disclosed in Patent Document 3, in the same manner as in Patent Document 1, the burrs and peeling occurring at the cut ends are suppressed by embedding all of the plating wires in the inner layer. 8 is a view showing the structure of a workpiece having a printed circuit board with a plug terminal as a base material disclosed in Patent Document 1 and Patent Document 3, and the plated wire 3 is oriented from the connection plug terminal 2 via the through hole 4 in the inner layer. The direction of the arrow (the direction of the board end) is arranged and connected. After the connection of the connection plug terminal 2, the dashed line portion A-A' is cut, and the electroplated wire 3 provided on the inner layer is exposed as shown in Fig. 7. Fig. 9 is a cross-sectional view taken along the broken line B-B' in Fig. 8, as shown in Fig. 6-1330049, in the patent document 1 and the patent, after the cutting of the electroplated wire 3 series substrate, the signal terminal In the case of the high-speed signal, in addition to the same problem as the invention disclosed in Patent Document 2, the following (1) the manufacturing lead time and the manufacturing man-hour for cutting the short-circuited portion are also Yes (2) Since it is necessary to ensure that it is sufficient in the i space, the pitch of the terminals is narrowed. The conventional connection plug is short-circuited between the terminals and the terminals due to the cutting out of the workpiece, and the manner of plating the wiring remains. Therefore, there is a problem that the waveform is skewed. [Invention] In view of the above related problems, the printed circuit board of the plug terminal and the workpiece and the workpiece are short-circuited and the signal waveform is generated when the workpiece is cut out. The present invention provides a connection plug terminal for connecting a plurality of connection plug end plug terminals with a plurality of connection plug end plug terminals, and is implemented on the outer layer; Among the source line or ground Document 3 disclosed invention, as to the remaining divided wiring, for reasons waveform skew. This problem is significant except for the problems with patent documents 1 and 3: Through-hole processing steps are necessary, but increased. The through hole is not formed between the die and the terminal. The printed circuit board of the terminal is not only edged and peeled off, but also the adjacent terminal wires are used as signal terminals after the substrate is cut. SUMMARY OF THE INVENTION It is an object of the invention to provide an attachment manufacturing method which does not have the disadvantage that the adjacent terminals are skewed to the terminals. A printed circuit board of a head terminal, which is characterized in that, for a plating lead wire for forming a connection, a plating plug wire for a plating process is provided for a connection plug terminal for wire bonding, and a plating process for the plating is performed -7-1330049. The plated wire is attached to the inner layer. An electronic device according to the present invention includes an electronic device having a printed circuit board connected to a plug terminal, the end portion of the printed circuit board having a plurality of connection plug terminals, wherein the portion for forming the connection plug terminal is subjected to a plating treatment Among the electroplated wires, a plating wire for performing a plating process on a connection plug terminal for a signal line is provided on an outer layer of the printed circuit board, and a plating wire for electroplating is used as a connection plug terminal for a power supply line or a ground line. The present invention provides a method of manufacturing a printed circuit board with a plug terminal attached thereto, which is manufactured at the end by cutting a work piece in which a predetermined wiring pattern is formed. A printed circuit board having a plurality of connection plug terminals to which a plug terminal is connected, wherein a portion of the electric ammonium lead wire for performing a plating process on a portion to which the plug terminal is connected is formed, and a connection plug terminal for a signal wire is plated. The wire used is attached to the surface layer of the workpiece, and the connection is used as a power or ground wire. The lead terminal is subjected to a plating process for the inner layer of the workpiece, and the plating line of each layer is connected outside the effective surface; and after the connection plug terminal is formed by the plating process, the effective surface is cut by the workpiece. The effect of the present invention is to provide a printed circuit board with a connection plug terminal and a method of manufacturing the same, which does not have a burr and peeling when the workpiece is cut out, which causes a short circuit between the adjacent terminal and the terminal and In the case where a plated wire is used as a signal terminal, the waveform may be skewed. The reason for this is that a plating wire for performing plating treatment on the connection plug terminal for a signal line is provided on the outer layer, and a plating wire for plating treatment is used as a connection plug terminal for a power supply line or a -8-1330049 grounding wire. It is set in the inner layer. [Embodiment] [Invention Principle] In the present invention, an electroplated wire is disposed on an outer layer (a surface layer or an inner layer or an inner layer, which is an object property of a terminal (a property of a connection) - that is, an object ( Net) is determined by which of the signal terminal, the grounding terminal, and the power supply terminal. Specifically, if the signal is a signal, it is placed on the outer layer, and if it is grounded or powered, it is placed in the inner layer, and this is used as the 'terminal. If the number is the same, the terminal pitch of the terminal is widened. Therefore, even if burrs and peeling occur, it is difficult to cause a short circuit or the like. Further, since unnecessary wiring is not left in the middle of the wiring, good transmission path characteristics can be obtained. [First Embodiment] Fig. 1 is a schematic view showing the structure of a printed circuit board according to a preferred embodiment of the present invention. The printed circuit board 1 has a connection plug terminal 2 at the end of the substrate for electrically connecting the connector terminals. The electroplated wire 3 provided by the ore treatment is provided not only on the outer layer but also on the inner layer via the perforations 4. The printed circuit board is mounted in the figure and is not shown In the state of the outer casing of the connector, the connection plug terminal 2 is electrically connected by mechanical contact with the lead terminal of the connector, and the reliability can be surely improved by electroplating the electrical connection. As shown in Fig. 2, the plated wire 3 which is provided on the outer layer (the surface layer in the case of Fig. 2) is used for the connection plug end of the signal terminal to be formed. 9-1330049 sub 2 . The plating wire 3 provided on the inner layer is used for the purpose of forming the grounding or power supply terminal. By separately arranging the plating wire 3 on the outer layer and the inner layer, the plating wires 3 provided on the outer layer can be widened from each other. As shown in Fig. 3, the printed circuit board with the plug terminal attached is used to cut the specified position on the workpiece after forming the plug terminal 2 on the workpiece using the plated wire 3 (C-C) In the workpiece of the present embodiment, in order to widen the interval between the plated wires 3, even if burrs and flaking occur at the plated wires 3 at the time of cutting, it is difficult to be adjacent thereto. End A short circuit occurs. Further, Fig. 4 is a schematic cross-sectional view along the broken line D-D' in Fig. 3, as shown in the figure, since each of the plating wires 3 for performing plating treatment on the signal terminals does not Since the method of the branch wiring remains, the waveform skew caused by the reflection of the signal is less likely to occur, so that the high-speed signal can be transmitted and the speed can be increased, and the transmission of the weak signal can be achieved to achieve power saving. The electronic device or the electronic device having the printed circuit board of the present invention has the same effect. The above embodiment is one of the preferred embodiments of the present invention, that is, the present invention is not limited thereto. The outer layer may be a surface layer or an inner layer. [Second Embodiment] In the first embodiment, the case where the electric wire used as the signal line is formed on one side of the printed circuit board is taken as an example. However, the electroplated wire used for electroplating the signal terminals can also be formed on both sides of the surface of the -10- 1330049 printed circuit board and inside. Words, the present invention is also applicable to the case in order to connect the plug terminal are simultaneously disposed on both surfaces of the printed circuit board. Hereinafter, this case will be described as a second embodiment and will be described with reference to Figs. 10 and 11. Fig. 10 is a view showing the structure of the printed circuit board 1 A of the second embodiment of the present invention and the use of each of the connection plug terminals. The substrate end portion on the surface layer 11 of the printed circuit board 1A has connection plug terminals 21, 22, 23, 24, 25, 26, 27, 28. The electroplated wires for electroplating these connection plug terminals are not only the plated wires 35, 36, 37, 38 of the surface layer, but also the plated wires 31, 32 are provided on the inner layer via the perforations 42, 44, 46, 48, respectively. 33, 34 ° As shown in Fig. 10, the plating wires 35, 36, 37, 38 provided on the surface layer are used to form the connection plug terminals 21, 23, 25, 27 of the signal terminals. On the other hand, the plating wires 31, 32, 33, 34 provided on the inner layer are used when forming the ground terminals 22, 24, 26 or the power supply terminal 28. Fig. 11 is a schematic view showing the structure of the inner layer 12 of the printed circuit board 1A as seen from the inside of the surface layer 1 1 and the substrate 1 A starting from the same direction as Fig. 10, that is, starting from the oblique upper side. . The end portion of the substrate on the inner layer 12 of the printed circuit board has connection plug terminals 21A, 22A, 23A, 24A, 25 A, 26 A, 27 A, 28A, with respect to the plating wire for plating the connection plug terminal, Only the inner layer of the plating wires 35A, 36A, 37A' 38A, and the inner layers are provided with the plating wires 31, 32, 33, 34 via the perforations 42, 44, 46, 48, respectively (Fig. 10). The signal connector terminals 21, 23, 25, and 27 are respectively connected to the lead 1330049 lines 35B, 36B' 37B, 38B that are in contact with the through holes 41, 42, 43, 44, 45, 46, 47, 48, respectively. The perforations 49, 50, 51, 52 are connected. As shown in Fig. 11, the plating wires 35A, 3A, 37A, 38A provided on the inner layer are used to form the connection plug terminals 21A, 23A, 25A, 27A of each signal terminal. On the other hand, the plating wires 31, 32, 33, 34 provided on the inner layer are connected to the ground terminals 22A, 24A, 26A and the power supply terminal 28A via the through holes 42, 44, 46, 48, respectively, and the terminals are formed. It is used when it is. As in the first embodiment, by providing the plating wires separately in the outer layer and the inner layer, it is possible to widen the interval between the wires 35 to 38 and 35A to 38A provided on the surface layer and the back layer. Therefore, even if burrs and peeling occur at the wire 3 at the time of cutting the workpiece, it is difficult to cause a short circuit with the adjacent terminal. In addition, there are connection plug terminals on the same vertical line (the line perpendicular to the surface layer 11 and the inner layer 12), such as the connection plug terminals 27 and 27A, since each of the plated wires is on the surface layer 11 and the inner layer 12. Since they are separated from each other, there is no doubt that even if burrs and peeling occur on the plated wires at the time of cutting. Further, in the same manner as in the first embodiment, since the shovel wires for performing the plating treatment on the signal terminals are not disposed on the inner layer, the plating wires 35 to 38 and 35A to 38A are not branched. The method remains, and the waveform skew caused by the reflection of the signal is hard to generate, and the object of high speed can be achieved. Compared with the first embodiment, since the connection plug terminal assigned to the signal becomes twice, there is an effect of being able to distribute twice the signal" -12 - 1330049. Thus, the present invention has the possibility of various embodiments. . Although the present invention has been described with reference to the embodiments, the description is not intended to be limited. Modifications and variations of the illustrative embodiments can be made by those skilled in the art. Therefore, the scope of the appended claims should cover such modifications or embodiments. Moreover, the inventors retain all equality of the patented invention even if the scope of the patent application is modified during the protection period. BRIEF DESCRIPTION OF THE DRAWINGS These and other features and advantages of the present invention will be more readily understood from the aspects of the appended claims. 1 is a schematic view showing the structure of a printed circuit board with a plug terminal; FIG. 2 is a schematic view showing the use of each of the plug terminals; FIG. 3 is a connection plug terminal according to a preferred embodiment of the present invention. A schematic structural view of a workpiece of a printed circuit board as a substrate; FIG. 4 is a schematic cross-sectional view of a workpiece having a printed circuit board with a plug terminal as a substrate as a preferred embodiment of the present invention; A schematic view of a prior art in which a printed circuit board with a plug terminal is attached as a substrate; FIG. 6 is a schematic view showing a state in which a printed circuit board having a plug terminal attached to a workpiece is cut off in the prior art; A schematic diagram of a printed circuit board with a plug terminal attached to the technology; FIG. 8 is a prior art printed circuit board with a plug terminal attached as a base Schematic diagram of the workpiece; 1 i; l -13- 1330049 Figure 9 is a schematic cross-sectional view of a prior art workpiece with a printed circuit board with a plug terminal as a substrate; 10th - Figure is for the present invention 2 is a schematic view showing the structure of a printed circuit board with a plug terminal and the use of each of the plug terminals; and FIG. 11 is a perspective view of the second embodiment of the present invention. And a schematic structural view of the inner layer 12 of the printed circuit board 1 A as seen from the inside of the substrate 1 A. [Main component symbol description] 1 Printed circuit board 1 A Printed circuit board 2 Connecting plug terminal 21-28 Connecting plug terminal ' 22 ' 24 ' 26 Grounding terminal 28 Power supply terminal 21A-28A Connecting plug terminal 22A, 24A, 26A Grounding terminal 28A Power supply terminal 3 plating wire 31-38 plating wire 35A-38A plating wire 35B~38B plating wire 4 perforation 41-52 perforation 11 surface layer 12 inner layer 1 -14-