JP2006210412A - Printed board with connector terminal, and manufacturing method thereof - Google Patents

Printed board with connector terminal, and manufacturing method thereof Download PDF

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JP2006210412A
JP2006210412A JP2005017125A JP2005017125A JP2006210412A JP 2006210412 A JP2006210412 A JP 2006210412A JP 2005017125 A JP2005017125 A JP 2005017125A JP 2005017125 A JP2005017125 A JP 2005017125A JP 2006210412 A JP2006210412 A JP 2006210412A
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Prior art keywords
plug terminal
circuit board
printed circuit
plug
terminal
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JP4158772B2 (en
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Shinji Tanaka
田中　　慎二
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NEC Corp
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NEC Corp
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Priority to JP2005017125A priority Critical patent/JP4158772B2/en
Priority to KR1020060007136A priority patent/KR20060086296A/en
Priority to CNB2006100062198A priority patent/CN100499960C/en
Priority to TW095102535A priority patent/TW200642538A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed board with a connector terminal, capable of preventing short circuit between adjacent terminals or distortions of the waveform of signal due to burrs or peelings generated in cutting a printed board from a work, and to provide a manufacturing method thereof. <P>SOLUTION: The printed board 1 with a connector terminal is provided with a plurality of connector terminals 2 on its end. In this printed board of plating lead wires 3 for applying electrical plating processing to a portion for forming the connector terminals 2, one for applying electric plating processing to a connector terminal 2 to be used as a signal line is provided on a surface layer, and another, for applying electric plating processing to a connector terminal 2 to be used as a power source line or a grounding line, is provided on a inner layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、接栓端子を備えたプリント基板に関し、特に、隣接する端子同士の短絡が生じにくく、信号波形の劣化が生じにくい接栓端子付きプリント基板及びその製造方法に関する。   The present invention relates to a printed circuit board provided with a plug terminal, and more particularly to a printed circuit board with a plug terminal that is unlikely to cause short circuit between adjacent terminals and a signal waveform that hardly deteriorates, and a manufacturing method thereof.

従来、メモリモジュールのような基板端部に接栓端子（エッジコネクタ用の端子）を有するプリント基板においては、接栓端子に電気めっき処理を施すためにめっきリード線を表面層へ設け、金などのめっき処理の後でワークサイズから所定の基板サイズに切断する。よって、ワークを切断する際には、基板と同時にリード線を切断することとなる。   Conventionally, in a printed circuit board having a plug terminal (edge connector terminal) at the board end such as a memory module, a plating lead wire is provided on the surface layer in order to perform electroplating processing on the plug terminal, gold, etc. After the plating process, the workpiece size is cut to a predetermined substrate size. Therefore, when cutting the workpiece, the lead wire is cut simultaneously with the substrate.

図５に、従来技術による接栓端子付きプリント基板の基となるワークの構成を示す。めっきリード線３は、表面層で各端子のパッド２から図中の矢印方向に向かって配置され、連結されている。
めっきリード線３を介して端子パッド２の部分にめっき処理を施した後、破線部Ａ−Ａ’で切断することによって、図６に示すように接栓端子付きプリント基板が得られる。 FIG. 5 shows the structure of a workpiece that is the basis of a printed circuit board with a plug terminal according to the prior art. The plating lead wires 3 are arranged on the surface layer from the pads 2 of each terminal toward the direction of the arrow in the figure and are connected.
After the plating process is performed on the portion of the terminal pad 2 through the plating lead wire 3, the printed circuit board with a plug terminal is obtained as shown in FIG. 6 by cutting along the broken line portion AA ′.

この際、めっきリード線の切断端部からバリや剥がれが発生することがある。端子のピッチが小さくなると、このバリや剥がれによる切り屑が原因で隣接する端子との短絡が発生しやすくなる。   At this time, burrs and peeling may occur from the cut ends of the plating lead wires. When the terminal pitch is reduced, a short circuit between adjacent terminals is likely to occur due to the burrs and chips from peeling.

接栓端子付きプリント基板に関する従来技術としては、特許文献１開示される「カードエッジコネクタ実装基板の端子メッキ方法」、特許文献２に開示される「プリント配線板の製造方法」、特許文献３に開示される「端子メッキ用メッキリード線の構造」、特許文献４に開示される「プリント配線板、および単位配線板の製造方法」などがある。   Prior art relating to a printed circuit board with a plug terminal includes a “terminal plating method for a card edge connector mounting substrate” disclosed in Patent Document 1, a “printed wiring board manufacturing method” disclosed in Patent Document 2, and Patent Document 3. There are disclosed “structure of plated lead wire for terminal plating”, “printed wiring board and method for manufacturing unit wiring board” disclosed in Patent Document 4, and the like.

特許文献１に開示される発明は、図７に示すように、めっきリード線を全て内層に埋設することによって、切断端部から発生するバリや剥がれを抑えている。この方法では、内層にメッキリード線を埋設するため、各端子からスルーホールを介して内層にリード線を配置する。   As shown in FIG. 7, the invention disclosed in Patent Document 1 suppresses burrs and peeling generated from the cut end by embedding all plating lead wires in the inner layer. In this method, in order to embed a plated lead wire in the inner layer, the lead wire is disposed in the inner layer from each terminal through a through hole.

また、特許文献２に開示される発明は、信号配線と電源配線とを同時に形成し、短絡された部分を貫通孔で切断することにより両者を分離するものである。   In the invention disclosed in Patent Document 2, a signal wiring and a power supply wiring are formed at the same time, and a short-circuited portion is cut by a through hole to separate them.

特許文献３に開示される発明は、特許文献１と同様に、めっきリード線を全て内層に埋設することによって、切断端部から発生するバリや剥がれを抑えるものである。
特開平３−２５０６９１号公報 特開昭５７−１６４５９８号公報 特開平９−１６２５０８号公報 In the invention disclosed in Patent Document 3, as in Patent Document 1, all the plating lead wires are embedded in the inner layer to suppress burrs and peeling generated from the cut end.
JP-A-3-250691 JP 57-164598 A JP-A-9-162508

図８に、特許文献１や特許文献３に開示される接栓端子付きプリント基板の基となるワークの構成を示す。めっきリード線３は、パッド２からスルーホール４を介して内層から矢印方向に向かって配置され、連結されている。電極パッド２にめっき処理を施した後、破線部Ａ−Ａ’で切断すると、図のように内層に設けためっきリード線３が露出する。   FIG. 8 shows a configuration of a workpiece that is a basis of a printed circuit board with a plug terminal disclosed in Patent Document 1 and Patent Document 3. The plating lead wire 3 is arranged from the inner layer to the arrow direction through the through hole 4 from the pad 2 and connected. When the electrode pad 2 is plated and then cut along the broken line A-A ′, the plating lead 3 provided in the inner layer is exposed as shown in the figure.

図８中の一点鎖線Ｂ−Ｂ’における断面を図９に示す。図示するように、上記特許文献１や特許文献３に開示される発明では、めっきリード線は基板切削後も分岐配線として残存するため、信号端子の場合には波形の歪みの原因となる。この問題は、特に高速信号において顕著に現れる。   FIG. 9 shows a cross section taken along one-dot chain line B-B ′ in FIG. 8. As shown in the figure, in the inventions disclosed in Patent Document 1 and Patent Document 3, the plating lead wire remains as a branch wiring even after the substrate is cut, which causes waveform distortion in the case of a signal terminal. This problem is particularly noticeable in high-speed signals.

特許文献２に開示される発明は、特許文献１や３と同様の問題の他に、
（１）短絡箇所を切断するための貫通孔加工工事が必要であり、製造リードタイムや製造工数が増大する。
（２）端子同士の間に貫通孔を形成するだけのスペースを確保する必要があるため、端子の狭ピッチ化に対応できない。
という問題がある。 In addition to the same problems as in Patent Documents 1 and 3, the invention disclosed in Patent Document 2
(1) A through hole processing work for cutting the short-circuited portion is necessary, and the manufacturing lead time and the manufacturing man-hour increase.
(2) Since it is necessary to secure a space for forming a through hole between terminals, it is not possible to cope with a narrow pitch of terminals.
There is a problem.

このように、従来の接栓端子付きプリント基板は、ワークからの切り出し時に生じるバリや剥がれによって隣接する端子同士の短絡が生じたり、信号の波形が歪んだりするという問題があった。   As described above, the conventional printed circuit board with a connecting terminal has a problem that a short circuit occurs between adjacent terminals due to burrs or peeling that occurs when cutting out from a workpiece, or a signal waveform is distorted.

本発明はかかる問題に鑑みてなされたものであり、ワークからの切り出し時に生じるバリや剥がれによって隣接する端子同士の短絡が生じたり、信号の波形が歪んだりすることのない接栓端子付きプリント基板及びその製造方法を提供することを目的とする。   The present invention has been made in view of such a problem, and a printed circuit board with a plug terminal that does not cause a short circuit between adjacent terminals or a signal waveform is distorted due to burrs or peeling that occur when cutting out from a workpiece. And it aims at providing the manufacturing method.

上記目的を達成するため、本発明は、第１の態様として、端部に複数の接栓端子を備えた接栓端子付きプリント基板であって、接栓端子を形成する部分に電気めっき処理を施すためのめっきリード線のうち、信号線として用いられる接栓端子に電気めっき処理を施すためのものは表面層に、電源線又は接地線として用いられる接栓端子に電気めっき処理を施すためのものは内層に設けられていることを特徴とする接栓端子付きプリント基板を提供するものである。   In order to achieve the above object, the present invention provides, as a first aspect, a printed circuit board with a plug terminal having a plurality of plug terminals at an end portion, and electroplating treatment is performed on a portion where the plug terminal is formed. Among the lead wires for plating, those for applying electroplating to plug terminals used as signal wires are used for applying electroplating to plug terminals used as power supply lines or ground wires on the surface layer. The present invention provides a printed circuit board with a plug terminal characterized by being provided in an inner layer.

本発明の第１の態様においては、内層に設けられためっきリード線は、スルーホールを介して接栓端子に接続さていることが好ましい。   In the 1st aspect of this invention, it is preferable that the plating lead wire provided in the inner layer is connected to the plug terminal via the through hole.

本発明の第１の態様のいずれの構成においても、接栓端子を表裏両面に備えることが好ましい。   In any configuration of the first aspect of the present invention, it is preferable to provide the plug terminals on both the front and back surfaces.

また、上記目的を達成するため、本発明は、第２の態様として、所定の配線パターンが形成されたワークを切断して、端部に複数の接栓端子を備えた接栓端子付きプリント基板を製造する方法であって、接栓端子を形成する部分に電気めっき処理を施すためのリード線のうち、信号線として用いられる接栓端子に電気めっき処理を施すためのものをワークの表面層に、電源線又は接地線として用いられる接栓端子に電気めっき処理を施すためのものをワークの内層に、各層のめっきリード線同士が有効面外で接続されるように形成し、電気めっき処理によって接栓端子を形成した後に、有効面をワークから切り出すことを特徴とする接栓端子付きプリント基板の製造方法を提供するものである。   Moreover, in order to achieve the said objective, this invention cuts the workpiece | work in which the predetermined | prescribed wiring pattern was formed as a 2nd aspect, and the printed circuit board with a plug terminal which provided the some plug terminal at the edge part Of the lead wire for electroplating the portion forming the plug terminal, and for applying the electroplating to the plug terminal used as the signal wire In addition, the electroplating process is performed so that the plating lead wires of each layer are connected to each other on the inner layer of the work, which is used for electroplating the plug terminal used as a power supply line or a ground line, to the inner layer of the workpiece. The present invention provides a method for manufacturing a printed circuit board with a plug terminal, wherein after the plug terminal is formed, an effective surface is cut out from the workpiece.

本発明の第２の態様においては、ワークの内層に設けるめっきリード線を、接栓端子を形成する部分とはスルーホールを介して接続することが好ましい。   In the 2nd aspect of this invention, it is preferable to connect the plating lead wire provided in the inner layer of a workpiece | work through the through hole with the part which forms a plug terminal.

本発明の第２の態様のいずれの構成においても、接栓端子をワークの表裏両面に形成することが好ましい。   In any configuration of the second aspect of the present invention, it is preferable to form the plug terminals on both the front and back surfaces of the workpiece.

本発明によれば、ワークからの切り出し時に生じるバリや剥がれによって隣接する端子同士の短絡が生じたり、信号の波形が歪んだりすることのない接栓端子付きプリント基板及びその製造方法を提供できる。   According to the present invention, it is possible to provide a printed circuit board with a plug terminal and a method for manufacturing the same without causing a short circuit between adjacent terminals or a signal waveform being distorted due to burrs or peeling that occur when cutting out from a workpiece.

〔発明の原理〕
本発明では、めっきリード線を表面層に設けるか内層に設けるかを、端子のネット属性（信号端子、接地端子、給電端子のいずれであるか）に応じて決定する。 [Principle of the Invention]
In the present invention, whether the plating lead wire is provided on the surface layer or the inner layer is determined according to the net attribute of the terminal (whether it is a signal terminal, a ground terminal, or a power supply terminal).

具体的には、ネットが信号ならば表面層に設け、接地又は給電ならば内層に設ける。このようにすることで、端子数が同じであれば見かけ上は端子ピッチが広がるため、バリや剥がれが発生しても短絡などの不具合が生じにくくなる。   Specifically, if the net is a signal, it is provided on the surface layer, and if it is grounded or powered, it is provided on the inner layer. By doing so, since the terminal pitch is apparently widened if the number of terminals is the same, even if burrs or peeling occurs, problems such as a short circuit are less likely to occur.

しかも、配線途中に無駄な分岐配線が残存しないため、良好な伝送路特性が得られる。   Moreover, since no unnecessary branch wiring remains in the middle of the wiring, good transmission path characteristics can be obtained.

〔実施の形態〕
図１に、本発明の好適な実施の形態にかかるプリント基板の構成を示す。プリント基板１は、基板端部に接栓端子（端子パッド）２を有する。端子パッドに電気めっきを施すためのめっきリード線３は、表面層のみならず、スルーホール４を介して内層にも設けられている。 Embodiment
FIG. 1 shows a configuration of a printed circuit board according to a preferred embodiment of the present invention. The printed circuit board 1 has a plug terminal (terminal pad) 2 at the end of the circuit board. The plating lead wire 3 for electroplating the terminal pad is provided not only on the surface layer but also on the inner layer via the through hole 4.

図２に示すように、表面層に設けられためっきリード線３は、信号端子の端子パッド２を形成する際に用いられたものである。一方、内層に設けられためっきリード線３は、接地又は給電端子を形成する際に用いられたものである。   As shown in FIG. 2, the plating lead wire 3 provided on the surface layer is used when the terminal pad 2 of the signal terminal is formed. On the other hand, the plating lead wire 3 provided in the inner layer is used when a ground or a power supply terminal is formed.

めっきリード線３を表面層と内層とに分けて設けることにより、表面層に設けるめっきリード線３同士の間隔を広げることができる。図３に示すように、接栓端子付きプリント基板は、めっきリード線３を用いてワークに接栓端子２を形成した後に、ワークを所定の位置（Ｃ−Ｃ’）で切断することによって形成されるが、本実施形態にかかるワークではめっきリード線３同士の間隔を広くとれるため、切断する際にめっきリード線３にバリや剥がれが生じたとしても、隣接する端子との短絡は発生しにくい。   By providing the plating lead wires 3 separately for the surface layer and the inner layer, the interval between the plating lead wires 3 provided on the surface layer can be increased. As shown in FIG. 3, the printed circuit board with a plug terminal is formed by forming the plug terminal 2 on the workpiece using the plating lead wire 3 and then cutting the workpiece at a predetermined position (CC ′). However, in the work according to the present embodiment, since the interval between the plating lead wires 3 can be widened, even if the plating lead wire 3 is burred or peeled off when it is cut, a short circuit with an adjacent terminal occurs. Hateful.

また、図３中の一点鎖線Ｄ−Ｄ’における断面を図４に示す。図示するように、信号端子に電気めっき処理を施すために用いる各めっきリード線３は分岐配線として残存することはないため、信号の反射による波形歪みは生じにくい。このため、高速信号が伝送可能であり高速化を図れる。また、微弱な信号を伝送可能となり、省電力化を図れる。   FIG. 4 shows a cross section taken along one-dot chain line D-D ′ in FIG. 3. As shown in the drawing, since each plating lead wire 3 used for performing electroplating processing on the signal terminal does not remain as a branch wiring, waveform distortion due to signal reflection hardly occurs. For this reason, a high-speed signal can be transmitted and the speed can be increased. Further, a weak signal can be transmitted, and power saving can be achieved.

なお、上記実施形態は本発明の好適な実施の一例であり、本発明はこれに限定されることはない。
例えば、上記実施形態ではプリント基板の一方の面のみに信号線として用いるめっきリード線が形成される場合を例としたが、信号端子に電気めっき処理を施すためのめっきリード線はプリント基板の表裏両面に形成されていても良い。換言すると、接栓端子がプリント基板の両面に配置される場合にも本発明は適用可能である。
このように、本発明は様々な変形が可能である。 In addition, the said embodiment is an example of suitable implementation of this invention, and this invention is not limited to this.
For example, in the above embodiment, the case where the plating lead wire used as the signal line is formed only on one surface of the printed circuit board is described as an example. However, the plating lead wire for performing the electroplating process on the signal terminal It may be formed on both sides. In other words, the present invention is also applicable when the plug terminals are arranged on both sides of the printed circuit board.
As described above, the present invention can be variously modified.

本発明の好適な実施の形態にかかる接栓端子付きプリント基板の構成を示す図である。It is a figure which shows the structure of the printed circuit board with a connection terminal concerning suitable embodiment of this invention. 各接栓端子の用途を示す図である。It is a figure which shows the use of each plug terminal. 本発明の好適な実施の形態にかかる接栓端子付きプリント基板の基となるワークの構成を示す図である。It is a figure which shows the structure of the workpiece | work used as the base of the printed circuit board with a connection terminal concerning suitable embodiment of this invention. 本発明の好適な実施の形態にかかる接栓端子付きプリント基板の基となるワークの断面を示す図である。It is a figure which shows the cross section of the workpiece | work used as the base of the printed circuit board with a connection terminal concerning suitable embodiment of this invention. 従来技術による接栓端子付きプリント基板の基となるワークの構成を示す図である。It is a figure which shows the structure of the workpiece | work used as the base of the printed circuit board with a connection terminal by a prior art. 従来技術によるワークを切断して接栓端子付きプリント基板とした状態を示す図である。It is a figure which shows the state which cut | disconnected the workpiece | work by a prior art and made it the printed circuit board with a plug terminal. 従来技術による接栓端子付きプリント基板の構成を示す図である。It is a figure which shows the structure of the printed circuit board with a connection terminal by a prior art. 従来技術による接栓端子付きプリント基板の基となるワークの構成を示す図である。It is a figure which shows the structure of the workpiece | work used as the base of the printed circuit board with a connection terminal by a prior art. 従来技術による接栓端子付きプリント基板の基となるワークの断面を示す図である。It is a figure which shows the cross section of the workpiece | work used as the base of the printed circuit board with a connection terminal by a prior art.

符号の説明Explanation of symbols

１ プリント基板
２ 端子パッド
３ めっきリード線
４ スルーホール 1 Printed circuit board 2 Terminal pad 3 Plating lead wire 4 Through hole

Claims (6)

端部に複数の接栓端子を備えた接栓端子付きプリント基板であって、
前記接栓端子を形成する部分に電気めっき処理を施すためのめっきリード線のうち、信号線として用いられる前記接栓端子に前記電気めっき処理を施すためのものは表面層に、電源線又は接地線として用いられる前記接栓端子に電気めっき処理を施すためのものは内層に設けられていることを特徴とする接栓端子付きプリント基板。 A printed circuit board with a plug terminal having a plurality of plug terminals at the end,
Of the plating lead wires for electroplating the portions forming the plug terminals, those for applying the electroplating to the plug terminals used as signal wires are on the surface layer, power line or ground A printed circuit board with a plug terminal, wherein the plug terminal used as a wire for electroplating is provided in an inner layer. 前記内層に設けられためっきリード線は、スルーホールを介して前記接栓端子に接続さていることを特徴とする請求項１記載の接栓端子付きプリント基板。   2. The printed circuit board with a plug terminal according to claim 1, wherein the plating lead wire provided in the inner layer is connected to the plug terminal through a through hole. 前記接栓端子を表裏両面に備えたことを特徴とする請求項１又は２記載の接栓端子付きプリント基板。   The printed circuit board with a plug terminal according to claim 1 or 2, wherein the plug terminal is provided on both front and back surfaces. 所定の配線パターンが形成されたワークを切断して、端部に複数の接栓端子を備えた接栓端子付きプリント基板を製造する方法であって、
前記接栓端子を形成する部分に電気めっき処理を施すためのリード線のうち、信号線として用いられる前記接栓端子に前記電気めっき処理を施すためのものを前記ワークの表面層に、電源線又は接地線として用いられる前記接栓端子に電気めっき処理を施すためのものを前記ワークの内層に、各層の前記めっきリード線同士が有効面外で接続されるように形成し、
前記電気めっき処理によって前記接栓端子を形成した後に、前記有効面を前記ワークから切り出すことを特徴とする接栓端子付きプリント基板の製造方法。 A method of manufacturing a printed circuit board with a plug terminal having a plurality of plug terminals at an end by cutting a work on which a predetermined wiring pattern is formed,
Of the lead wires for performing electroplating treatment on the portion forming the plug terminal, a lead wire for performing the electroplating treatment on the plug terminal used as a signal wire is used as a power line. Or, to form an electroplating treatment for the plug terminal used as a grounding wire, the inner layer of the workpiece is formed so that the plating lead wires of each layer are connected to each other outside the effective plane,
A method of manufacturing a printed circuit board with a plug terminal, wherein the effective surface is cut out from the workpiece after the plug terminal is formed by the electroplating process. 前記ワークの内層に設けるめっきリード線を、前記接栓端子を形成する部分とはスルーホールを介して接続することを特徴とする請求項４記載の接栓端子付きプリント基板の製造方法。   5. The method for producing a printed circuit board with a plug terminal according to claim 4, wherein a plating lead wire provided in an inner layer of the workpiece is connected to a portion forming the plug terminal through a through hole. 前記接栓端子を前記ワークの表裏両面に形成することを特徴とする請求項４又は５記載の接栓端子付きプリント基板の製造方法。   6. The method of manufacturing a printed circuit board with a plug terminal according to claim 4, wherein the plug terminal is formed on both front and back surfaces of the workpiece.
JP2005017125A 2005-01-25 2005-01-25 Printed circuit board with connector terminal and manufacturing method thereof Expired - Fee Related JP4158772B2 (en)

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KR1020060007136A KR20060086296A (en) 2005-01-25 2006-01-24 Printed substrate with connect-plug terminal, electronic equipment, and method for manufacturing the same
CNB2006100062198A CN100499960C (en) 2005-01-25 2006-01-24 Print substrate with tab terminal, electronic equipment and method of manufacture the same
TW095102535A TW200642538A (en) 2005-01-25 2006-01-24 Printed circuit board attached with connecting plug terminals, electronic equipment and its manufacturing method

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JP5190695B2 (en) * 2008-09-26 2013-04-24 住友電工プリントサーキット株式会社 Flexible printed wiring board sheet and manufacturing method thereof
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JP2012074583A (en) * 2010-09-29 2012-04-12 Casio Comput Co Ltd Flexible printed board manufacturing method and flexible printed board
CN113271726A (en) * 2021-05-18 2021-08-17 广州广合科技股份有限公司 Three-side gold plating method for gold finger
CN113271726B (en) * 2021-05-18 2022-03-04 广州广合科技股份有限公司 Three-side gold plating method for gold finger

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