JP3610493B2 - Jumper wiring structure - Google Patents

Jumper wiring structure Download PDF

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Publication number
JP3610493B2
JP3610493B2 JP2002186203A JP2002186203A JP3610493B2 JP 3610493 B2 JP3610493 B2 JP 3610493B2 JP 2002186203 A JP2002186203 A JP 2002186203A JP 2002186203 A JP2002186203 A JP 2002186203A JP 3610493 B2 JP3610493 B2 JP 3610493B2
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JP
Japan
Prior art keywords
jumper
circuit board
printed circuit
wires
jumper wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002186203A
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Japanese (ja)
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JP2004031663A (en
Inventor
竜夫 片山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ORION ELECTRIC CO., LTD.
Original Assignee
ORION ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to JP2002186203A priority Critical patent/JP3610493B2/en
Priority to US10/452,584 priority patent/US6899560B2/en
Publication of JP2004031663A publication Critical patent/JP2004031663A/en
Application granted granted Critical
Publication of JP3610493B2 publication Critical patent/JP3610493B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/222Completing of printed circuits by adding non-printed jumper connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00Coupling parts supported only by co-operation with counterpart
    • H01R31/08Short-circuiting members for bridging contacts in a counterpart

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【0001】
【発明の属する技術分野】
本発明はジャンパ線をプリント基板に効率良く配線する構造に関するものである。
【0002】
【従来の技術】
一般には、プリント基板の裏面には所定の導体パターンが設けられ、導体パターンを有していない表側にはCPU、ROM等のIC、又コンデンサー、抵抗、ダイオード、トランジスター等の各種電子部品が取付けられている。そしてこれら各電子部品を接続するジャンパ線が配線されて裏面の導体パターンに接続している。
【0003】
上記各電子部品を導体パターンに接続するにはプリント基板の上に配置し、接続端子を端子穴から下面側へ突出して導体パターンにハンダ付けしている。又、プリント基板を貫通する穴を設け、ジャンパ線の両端部を該穴に挿通して先端を導体パターンにハンダ付けしている。このように、プリント基板上には各電子部品及びジャンパ線が配置されて煩雑化し、部品の配置が制限されると共に一方ではプリント基板の配置面積が大きくなってしまう。
【0004】
そこで、プリント基板上の電子部品及びジャンパ線、これらと交差する方向に配置した飛びジャンパ線とを設けて、これらのジャンパ線を立体配置することにより、高密度実装が出来る為にプリント基板サイズ及び配置面積を小さくし、配線が最短距離で出来る為に電波の輻射及びノイズを低減することが出来るようにしたジャンパ線の立体配置構造が知られている(特開平6−334290号)。
【0005】
すなわち、上記「ジャンパ線の立体配置構造」は「裏面にプリント配線をしたプリント配線基板と、該プリント配線基板の表面上の第1区画から離れた第2区画に配置され電気的に接続する少なくとも1つのジャンパ線と、該ジャンパ線と交差する方向にある第3区画及び第4区画の間を連結し前記ジャンパ線から隔離して立体配置した少なくとも1つの飛びジャンパ線とを備えている。」
【0006】
しかし、上記特開平6−334290号に係る「ジャンパ線の立体配置構造」は、図5(a)に示しているように複数のジャンパ線が平行に並んで配置される場合、ジャンパ線に外力が作用するならば、ジャンパ線同士が互いに接触して電気回路が短絡する虞がある。又図5(b)に示しているように複数の飛びジャンパ線が平行に並んで配置された場合、飛びジャンパ線に外力が作用するならば、飛びジャンパ線同士が接触して電気回路が短絡する虞がある。
【0007】
【発明が解決しようとする課題】
このように、従来のジャンパ線の配線構造には上記のごとき問題がある。本発明が解決しようとする課題はこれら問題点であり、平行に配線された複数のジャンパ線が互いに接触して短絡することがないように、又クロスして配線されたジャンパ線が互いに接触して短絡しないように構成したジャンパ線の配線構造を提供する。
【0008】
【課題を解決する為の手段】
本発明のジャンパ線配線構造は、プリント基板の上面にジャンパ線を配線するのではなく、プリント基板の上面にスリット溝を形成し、このスリット溝にジャンパ線を嵌入して配線する。そこで、複数本のジャンパ線を平行に配線する場合、全てのジャンパ線が嵌るスリット溝を形成する場合、又は交互にスリット溝を形成して嵌入する場合の何れでもよい。
【0009】
そして、交差してジャンパ線を配線する場合には、下側に位置する1本ないし複数本のジャンパ線はスリット溝に嵌入し、上側のジャンパ線はプリント基板の上面に配線する。ここで、上側のプリント基板上面に配線するジャンパ線はシールする場合もある。一方、スリット溝に嵌ったジャンパ線の上側には他の電子部品を取付けることも出来る。以下、本発明に係る実施例を図面に基づいて詳細に説明する。
【0010】
【実施例】
図1は本発明に係るジャンパ線の配線構造を構成する為のプリント基板1を示している実施例であり、(a)は平面図、(b)は断面図である。プリント基板1の下面4には導体パターンが形成され、上面5の所定の位置にはスリット溝2,2…が設けられている。そして該スリット溝2,2…の両端には端子穴3,3…が下面4ヘ貫通している。ここで、スリット溝2,2…の加工方法は限定しないことにするが、一般的にはスリット溝幅のエンドミルを使用して切削加工される。
【0011】
図2は上記スリット溝2,2…にジャンパ線6,6…を嵌めて配線した場合であり、本発明の具体例を示している。ジャンパ線6はその両端部7,7を屈曲してプリント基板1の端子穴3,3に嵌め、先端を夫々内側へ折り曲げて導体パターンにハンダ付けしている。このように各ジャンパ線6,6…がスリット溝2,2…に嵌ることで、外力が作用しても変形することはなく、勿論、隣のジャンパ線6に接して短絡することもあり得ない。
【0012】
同図(b)に示すように、ジャンパ線6,6…はスリット溝2,2…に完全に嵌って配線されているが、上面5側へ一部突出する場合もある。しかし、ジャンパ線6の大部分がスリット溝2に嵌っていれば、変形して隣のジャンパ線6に接触することはない。
【0013】
図3は本発明に係る他の実施例であり、平行に配線されている3本のジャンパ線6a,6b,6cの内、両側の2本のジャンパ線6a,6cはスリット溝2a,2cに嵌っている。しかし中央に位置するジャンパ線6bはプリント基板上面5に直接配線されている。これらジャンパ線6a,6b,6cの間隔がある程度隔たっていると共に、両側のジャンパ線6a,6cがスリット溝2a,2cに完全に嵌っている場合であるならば、中央のジャンパ線6bがスリット溝2に嵌めなくても互いに接触する危険性は少ない。
【0014】
図4は本発明に係るさらに別の実施例を示している。このジャンパ線6a,6bは互いにクロスして配線されている。そして両ジャンパ線6a,6bが接触して短絡しないように、一方のジャンパ線6aはスリット溝2に嵌って配線され、他方のジャンパ線6bはプリント基板1の上面5に載って配線されている。スリット溝2に嵌っているジャンパ線6aは上面5から突出しないようにしているが、上側に配線されるジャンパ線6bが上方から押されてスリット溝2内のジャンパ線6aに接しないように、該ジャンパ線6bの周りにはシール8が設けられている。
【0015】
上記図4に示す実施例では、スリット溝2に嵌っているジャンパ線6aとプリント基板1の上面5に配置されるジャンパ線6bが互いにクロスしている場合であるが、ジャンパ線6bの代わりに他の電子部品をクロスして取付けることも出来る。
【0016】
以上述べたように、本発明に係るジャンパ線の配線構造は、プリント基板の上面に形成したスリット溝にジャンパ線を嵌めたものであり、次のような効果を得ることが出来る。
【0017】
【発明の効果】
プリント基板に複数本のジャンパ線を配線する場合、ジャンパ線はスリット溝に嵌って隣り合うジャンパ線に接触して短絡することはない為に、小さなプリント基板に高密度で配線することが出来る。従って、プリント基板での配線面積を小さくし、プリント基板の縮小を図ることが出来る。その結果、ジャンパ線を最短距離で配線出来る為に、電磁波の輻射を小さくし、ノイズの低減を図ることが可能である。
【0018】
そして、ジャンパ線はスリット溝に嵌ることで、クロスしてジャンパ線を配線する場合に形状の異なる飛びジャンパ線を使う必要がなく、部品の使い分けは必要ない。従って、ジャンパ線の配線作業は簡単となって、作業性は向上する。又、スリット溝に嵌ったジャンパ線の上側には他の電子部品をクロスして取付けることも出来る。
【図面の簡単な説明】
【図1】上面にスリット溝を形成したプリント基板。
【図2】スリット溝にジャンパ線を嵌めて取付けた配線構造。
【図3】スリット溝にジャンパ線を嵌めて取付けた配線構造。
【図4】スリット溝にジャンパ線を嵌めて取付けたクロス配線構造。
【図5】従来のジャンパ線の配線構造。
【符号の説明】
1 プリント基板
2 スリット溝
3 端子穴
4 下面
5 上面
6 ジャンパ線
7 端部
8 シール
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a structure for efficiently wiring jumper wires on a printed circuit board.
[0002]
[Prior art]
Generally, a predetermined conductor pattern is provided on the back side of the printed circuit board, and various electronic components such as a CPU, ROM, etc., and capacitors, resistors, diodes, transistors, etc. are attached to the front side that does not have the conductor pattern. ing. Jumper wires connecting these electronic components are wired and connected to the conductor pattern on the back surface.
[0003]
In order to connect each electronic component to the conductor pattern, the electronic component is disposed on a printed circuit board, and the connection terminal protrudes from the terminal hole to the lower surface side and is soldered to the conductor pattern. Also, a hole penetrating the printed circuit board is provided, both ends of the jumper wire are inserted into the hole, and the tip is soldered to the conductor pattern. As described above, the electronic components and jumper wires are arranged on the printed circuit board, which is complicated, restricting the arrangement of the components and increasing the arrangement area of the printed circuit board.
[0004]
Therefore, by providing electronic components and jumper wires on the printed circuit board, jump jumper wires arranged in a direction crossing these, and arranging these jumper wires in three dimensions, the printed circuit board size and There is known a three-dimensional arrangement structure of jumper wires in which the arrangement area is reduced and the wiring can be formed with the shortest distance so that the radiation and noise of the radio waves can be reduced (Japanese Patent Laid-Open No. 6-334290).
[0005]
In other words, the “three-dimensional arrangement structure of jumper wires” includes “a printed wiring board having printed wiring on the back surface, and at least a second wiring section disposed on the front surface of the printed wiring board and distant from the first section and electrically connected. It includes one jumper line and at least one jumper line that is three-dimensionally arranged so as to be separated from the jumper line by connecting the third section and the fourth section in a direction intersecting with the jumper line.
[0006]
However, the “three-dimensional arrangement structure of jumper wires” according to the above-mentioned Japanese Patent Application Laid-Open No. 6-334290 discloses that when a plurality of jumper wires are arranged in parallel as shown in FIG. If this occurs, the jumper wires may come into contact with each other and the electric circuit may be short-circuited. As shown in FIG. 5B, when a plurality of jumping jumper wires are arranged in parallel, if an external force acts on the jumping jumper wires, the jumping jumper wires come in contact with each other and the electric circuit is short-circuited. There is a risk.
[0007]
[Problems to be solved by the invention]
As described above, the conventional jumper wire wiring structure has the above-described problems. The problems to be solved by the present invention are these problems, so that a plurality of jumper wires wired in parallel do not contact each other and short-circuit, and jumper wires wired in a cross manner contact each other. A jumper wiring structure configured to prevent short circuit is provided.
[0008]
[Means for solving the problems]
The jumper wire wiring structure of the present invention does not wire jumper wires on the upper surface of the printed circuit board, but forms slit grooves on the upper surface of the printed circuit board and inserts the jumper wires into the slit grooves for wiring. Therefore, when a plurality of jumper wires are wired in parallel, a slit groove in which all the jumper wires are fitted may be formed, or a slit groove may be alternately formed and fitted.
[0009]
When wiring jumper wires crossing each other, one or more jumper wires positioned on the lower side are fitted into the slit grooves, and the upper jumper wires are wired on the upper surface of the printed circuit board. Here, the jumper wire wired on the upper surface of the upper printed board may be sealed. On the other hand, another electronic component can be mounted on the upper side of the jumper wire fitted in the slit groove. Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.
[0010]
【Example】
FIG. 1 is an embodiment showing a printed circuit board 1 for constituting a wiring structure of jumper lines according to the present invention, wherein (a) is a plan view and (b) is a cross-sectional view. A conductive pattern is formed on the lower surface 4 of the printed circuit board 1, and slit grooves 2, 2... Are provided at predetermined positions on the upper surface 5. Terminal holes 3, 3... Penetrate through the lower surface 4 at both ends of the slit grooves 2, 2. Here, the processing method of the slit grooves 2, 2... Is not limited, but is generally cut using an end mill having a slit groove width.
[0011]
FIG. 2 shows a case where the jumper wires 6, 6... Are fitted in the slit grooves 2, 2,. The jumper wire 6 is bent at both ends 7 and 7 and fitted into the terminal holes 3 and 3 of the printed circuit board 1, and the tips are bent inward to be soldered to the conductor pattern. As described above, the jumper wires 6, 6... Are fitted into the slit grooves 2, 2... So that they are not deformed even when an external force is applied, and of course, they may be short-circuited in contact with the adjacent jumper wires 6. Absent.
[0012]
As shown in FIG. 6B, the jumper wires 6, 6... Are completely fitted in the slit grooves 2, 2,. However, if most of the jumper wire 6 is fitted in the slit groove 2, the jumper wire 6 is not deformed and does not contact the adjacent jumper wire 6.
[0013]
FIG. 3 shows another embodiment of the present invention. Of the three jumper wires 6a, 6b and 6c wired in parallel, the two jumper wires 6a and 6c on both sides are formed in the slit grooves 2a and 2c. It fits. However, the jumper line 6b located at the center is directly wired on the upper surface 5 of the printed board. If the jumper wires 6a, 6b, and 6c are spaced apart to some extent and the jumper wires 6a and 6c on both sides are completely fitted in the slit grooves 2a and 2c, the jumper wire 6b at the center is the slit groove. Even if it does not fit in 2, there is little risk of contact with each other.
[0014]
FIG. 4 shows still another embodiment according to the present invention. The jumper lines 6a and 6b are wired so as to cross each other. One jumper wire 6a is placed in the slit groove 2 and wired so that the two jumper wires 6a and 6b do not come into contact with each other and the other jumper wire 6b is placed on the upper surface 5 of the printed circuit board 1. . The jumper wire 6a fitted in the slit groove 2 is prevented from protruding from the upper surface 5, but the jumper wire 6b wired on the upper side is pushed from above so as not to contact the jumper wire 6a in the slit groove 2. A seal 8 is provided around the jumper wire 6b.
[0015]
In the embodiment shown in FIG. 4, the jumper wire 6a fitted in the slit groove 2 and the jumper wire 6b arranged on the upper surface 5 of the printed circuit board 1 cross each other, but instead of the jumper wire 6b. Other electronic parts can also be mounted in a cross.
[0016]
As described above, the jumper wire wiring structure according to the present invention is obtained by fitting the jumper wire into the slit groove formed on the upper surface of the printed circuit board, and the following effects can be obtained.
[0017]
【The invention's effect】
When wiring a plurality of jumper wires on a printed circuit board, the jumper lines are not short-circuited by contacting the adjacent jumper lines by fitting into the slit grooves, and therefore can be wired at a high density on a small printed circuit board. Accordingly, the wiring area on the printed board can be reduced, and the printed board can be reduced. As a result, since jumper wires can be wired at the shortest distance, radiation of electromagnetic waves can be reduced and noise can be reduced.
[0018]
Then, the jumper lines are fitted in the slit grooves, so that it is not necessary to use jump jumper lines having different shapes when crossing and wiring the jumper lines, and it is not necessary to use different parts. Therefore, the wiring work of the jumper wire is simplified and the workability is improved. Also, other electronic components can be cross mounted on the upper side of the jumper wire fitted in the slit groove.
[Brief description of the drawings]
FIG. 1 is a printed circuit board having slit grooves formed on the upper surface.
FIG. 2 shows a wiring structure in which a jumper wire is fitted in a slit groove.
FIG. 3 is a wiring structure in which a jumper wire is fitted in a slit groove.
FIG. 4 is a cross wiring structure in which a jumper wire is fitted in a slit groove.
FIG. 5 is a wiring structure of a conventional jumper line.
[Explanation of symbols]
1 Printed circuit board 2 Slit groove 3 Terminal hole 4 Lower surface 5 Upper surface 6 Jumper wire 7 End 8 Seal

Claims (1)

プリント基板に複数本のジャンパ線を平行して配線する構造において、該プリント基板の上面にはスリット溝を所定の間隔をおいて形成し、このスリット溝にジャンパ線を嵌めると共に両スリット溝間の上面には別のジャンパ線を配線し、そしてこれらジャンパ線の両端部を屈曲して下面側へ貫通して設けた端子穴に挿通し、下面に形成している導体パターンにハンダ付けしたことを特徴とするジャンパ線の配線構造。In a structure in which a plurality of jumper wires are wired in parallel on a printed circuit board, slit grooves are formed on the upper surface of the printed circuit board at predetermined intervals, and the jumper wires are fitted into the slit grooves and between the two slit grooves. Another jumper wire is wired on the upper surface, and both ends of these jumper wires are bent and inserted into the terminal holes penetrating to the lower surface side, and soldered to the conductor pattern formed on the lower surface. Characteristic jumper wiring structure.
JP2002186203A 2002-06-26 2002-06-26 Jumper wiring structure Expired - Fee Related JP3610493B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002186203A JP3610493B2 (en) 2002-06-26 2002-06-26 Jumper wiring structure
US10/452,584 US6899560B2 (en) 2002-06-26 2003-06-03 Jump wire structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002186203A JP3610493B2 (en) 2002-06-26 2002-06-26 Jumper wiring structure

Publications (2)

Publication Number Publication Date
JP2004031663A JP2004031663A (en) 2004-01-29
JP3610493B2 true JP3610493B2 (en) 2005-01-12

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JP (1) JP3610493B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8087953B2 (en) * 2008-04-01 2012-01-03 Sony Corporation Surface mount device jumper and surface mount device jumper assembly
US8869612B2 (en) 2011-03-08 2014-10-28 Baxter International Inc. Non-invasive radio frequency liquid level and volume detection system using phase shift
CN103338584A (en) * 2013-06-20 2013-10-02 张家港市华为电子有限公司 Crossover line component for PCB

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2389255A (en) * 1941-10-22 1945-11-20 Gen Cable Corp Connector
US4335272A (en) * 1980-07-28 1982-06-15 Zenith Radio Corporation Breakaway circuit board with flexible coupling
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
JPH05218607A (en) * 1992-01-31 1993-08-27 Sony Corp Printed-circuit board
JPH06334290A (en) 1993-05-20 1994-12-02 Funai Electric Co Ltd Multilevel intersection structure of jumper wire
US5446961A (en) * 1993-10-15 1995-09-05 International Business Machines Corporation Method for repairing semiconductor substrates
US5357051A (en) * 1994-01-31 1994-10-18 Hwang Richard H Printed circuit board for reducing radio frequency interferences

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JP2004031663A (en) 2004-01-29
US20040002257A1 (en) 2004-01-01
US6899560B2 (en) 2005-05-31

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