JP2008166471A - Substrate for wiring - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for wiring which is used as a universal substrate, allowing mounting of an IC package and chip component, and capable of setting a ground terminal of a component to be a ground potential in a short distance. <P>SOLUTION: Independent electrodes 12 are formed on a first surface 11a of a wiring substrate 10 at a specified pitch, and a conductor layer 14 is formed on a second surface 11b. The terminal part of an IC package 20 is installed on an independent electrode 12 for soldering. A through hole 15 is formed between the independent electrode 12 to which a grounding terminal 21a is connected and the conductor layer 14. An independent electrode 13 is made conductive to the conductor layer 14 by a conductive wire 26 inserted into the through hole 15. So the grounding terminal 21a is connected to a ground potential part in a short distance. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a general-purpose substrate in which an electronic component is mounted on the surface side and used for an electronic experiment or manufactured as a single product rather than a mass-produced product.

  The following Patent Document 1 discloses a universal substrate used for electronic experiments and the like.

  A large number of through holes are formed in the universal substrate at a pitch of 2.54 mm so as to meet the standard of the connection terminal of the IC chip. This through hole is a so-called through hole having a copper foil pattern on its inner peripheral surface.

Discrete parts such as resistors and capacitors are mounted on the surface side of the universal board, and the leads extending from each discrete part are inserted into the through holes, and the leading ends of the leads are bent on the back side of the universal board, surrounding the through holes. It is soldered to the electrode formed only on. Then, the electrical connection connecting the leads of each electronic component is routed to the back side of the universal substrate, and the leads of the respective components are soldered to the electrical conductivity to constitute an electronic circuit.
Japanese Patent Laid-Open No. 2001-42763

  When an electronic circuit is configured using the universal substrate described in Patent Document 1, all signal transmission lines, power supply lines, and ground lines of the circuit are configured by routing the conductive wires. Therefore, the conductive routing on the back side of the universal substrate is complicated.

  Further, since the ground terminal of the component is set to the ground potential via the conductive wire, a distance is provided between the ground terminal of the component and the ground potential, and the impedance may be higher than necessary. There is. Furthermore, since the conductive wire serving as the signal transmission line and the conductive wire serving as the power supply line coexist on the back surface side of the universal substrate, noise is easily superimposed on the signal transmission line transmitting the high-frequency signal.

  As described above, since the circuit configuration using the conventional universal substrate cannot sufficiently cope with the high frequency characteristics, it is difficult to configure a circuit for trial production of the high frequency circuit and evaluation of the electrostatic breakdown voltage countermeasure component. In order to construct the circuit, it was necessary to manufacture a dedicated circuit board.

  Furthermore, it is difficult to mount a chip component or an IC package to be soldered in a reflow process on a universal substrate in which a through hole is formed. It is also possible to attach a conversion board to the universal board and mount chip parts on this conversion board. However, if the conversion board is used, the high-frequency characteristics will be distorted. Configuration becomes difficult.

  The present invention solves the above-described conventional problems, and can easily mount chip parts, IC packages, etc., and can set the ground terminal of the electronic parts to a ground potential at a short distance, and further to the signal transmission line. An object of the present invention is to provide a wiring board in which noise is hardly superimposed.

The present invention has an insulating substrate body provided with a first surface and a second surface facing away from the first surface,
A plurality of independent electrodes are arranged at intervals on the first surface of the substrate body, and a conductor layer having a total area of the plurality of independent electrodes is provided on the second surface. The body layer is formed directly behind the plurality of independent electrodes.

  In the present invention, the independent electrodes are preferably arranged at a constant pitch in two orthogonal directions. For example, each independent electrode is formed in a square pattern.

  In the wiring substrate of the present invention, electronic components such as chip components and IC packages are installed on the first surface of the substrate body, and the terminal portions and electrode portions of the electronic components are soldered to the respective independent electrodes. Electronic components can be mounted. And a circuit can be comprised by soldering the conducting wire which crosses between independent electrodes in the 1st surface. In addition, a hole penetrating the independent electrode to which the ground terminal is soldered and the conductor layer directly behind it is formed, and the conductor layer is grounded by short-circuiting the independent electrode and the conductor layer through the hole. Can be used as a pattern.

  In this case, since the ground terminal can be set to the ground potential through the shortest path, it is possible to prevent the impedance from being inadvertently changed. Moreover, since the conductor layer is formed over a wide range of the second surface located on the back side of the first surface, the conductor layer is formed on the first surface by setting the conductor layer to the ground potential. The signal transmission line can be shielded by the conductor layer, and noise can be prevented from being superimposed on the signal transmission line.

  The conductor layer is preferably formed on the entire second surface of the wiring board, but a conductor layer having a somewhat large area may be provided only on a part of the second surface. Good.

  Further, the present invention can be configured such that a plurality of extended independent electrodes having a larger area than the independent electrodes arranged at a constant pitch are provided on the first surface.

  The extended independent electrode having a large area can be used as a land for connecting to an external circuit such as a power supply or a land for soldering and fixing a connector. For this purpose, the extended independent electrodes are preferably arranged in a line.

Furthermore, the present invention is provided with a conversion substrate that can be installed on the substrate body,
The conversion board is formed with component mounting electrodes arranged at a pitch narrower than the pitch of the independent electrodes, and external connection portions formed at the same pitch as the pitch of the independent electrodes, and the component electrodes and the It is preferable that the external connection portion is in one-to-one conduction.

  In this case, a concave portion is formed on the side surface of the conversion substrate, and a conductor layer serving as the external connection portion may be provided on the inner side surface of the concave portion.

  In the present invention, by using the conversion substrate, an electronic component such as an IC package having terminal portions with a pitch narrower than the pitch of the independent electrodes can be mounted on the first surface.

  The wiring board of the present invention can be mounted with electronic components such as chip components and IC packages when configuring experimental circuits and low-volume production circuits. In addition, by using the conductor layer on the second surface as a ground pattern and providing a conductor that penetrates the independent electrode provided on the first surface and the conductor layer, a terminal that requires grounding is provided. The ground potential can be set by the shortest path. Further, by setting the conductor layer to the ground potential, this conductor layer can function as a shield layer.

  1 is a partial perspective view of a wiring board according to an embodiment of the present invention, FIG. 2 is a partially enlarged perspective view in which a part of the wiring board is enlarged, and FIG. 3 is a wiring board taken along line II-II in FIG. It is sectional drawing cut | disconnected by.

  The wiring board 10 shown in FIGS. 1 to 3 is used as a universal board for mounting an experimental circuit or a circuit for an electronic device for low-volume production.

  As shown in the cross-sectional view of FIG. 3, the wiring substrate 10 has an insulating substrate body 11. The substrate body 11 is made of a glass composite material such as glass epoxy. The substrate body 11 is formed to a thickness that can be easily cut using a tool such as a scissors. The substrate body 11 has a first surface 11a and a second surface 11b. The first surface 11a is the front surface, and the second surface 11b is the back surface.

  As shown in FIGS. 1 and 2, an independent electrode 12 and extended independent electrodes 13x and 13y are formed on the first surface 11a of the substrate body 11, and a conductor layer 14 is formed on the second surface 11b. Is formed. The independent electrode 12, the extended independent electrodes 13x and 13y, and the conductor layer 14 are formed of a low resistance material such as a copper foil layer, and a tin plating layer or a solder plating layer is formed on the surface thereof. (Solder) has good wettability. Alternatively, a gold flash plating layer may be formed on the surface.

  As shown in FIGS. 1 and 2, the independent electrode 12 has a square pattern in plan view. When the directions orthogonal to each other are taken as the X direction and the Y direction, the arrangement pitch Xp of the independent electrodes 12 in the X direction coincides with the arrangement pitch Yp in the Y direction. The arrangement pitches Xp and Yp match the arrangement pitch of the terminal portions of a general IC package. In this embodiment, Xp and Yp are set to 1.27 mm.

  As shown in FIG. 1, on the first surface 11a of the substrate body 1, a large number of independent electrodes 12 are arranged at a constant pitch in a rectangular region of Lx × Ly. The extended independent electrodes 13x are provided on both sides in the X direction of the Lx × Ly region, and the extended independent electrodes 13x are arranged in a line in the Y direction. The extended independent electrodes 13x have the same Yp as that of the independent electrodes 12 in the Y direction, but have a rectangular shape in which the length dimension Xw in the X direction is longer than that of the independent electrodes 12. Further, extended independent electrodes 13y are provided on both sides of the Lx × Ly region in the Y direction, and the extended independent electrodes 13y are arranged in a line in the X direction. The extended independent electrode 13y has a rectangular shape in which the arrangement pitch in the X direction is the same Xp as that of the independent electrode 12, but the length dimension Yw in the Y direction is longer than that of the independent electrode 12.

  The wiring substrate 10 is provided with a plurality of Lx × Ly rectangular regions in which square independent electrodes 12 are arranged at a constant pitch. The wiring board 10 can be used as a plurality of rectangular regions of Lx × Ly, but it can also be used separately by the cutting line X1 and the cutting line X2 shown in FIG. is there. The wiring substrate, which is a separated small substrate, has a square independent electrode 12 arranged in a Lx × Ly rectangular area on the first surface 11a, and is extended and independent along two long sides of the wiring substrate. The electrode 13x is provided, and the extended independent electrodes 13y are arranged along two short sides of the wiring board.

  The independent electrode 12 and the extended independent electrodes 13x and 13y are formed by etching the copper foil layer formed on the entire surface of the first surface 11a of the substrate body 11 to separate the individual electrodes, and then on the surface of the copper foil layer. It is formed by applying tin plating. Alternatively, a tin plating layer may be formed over the entire surface of the copper foil layer formed on the entire first surface 11a and then etched. Etching may be wet etching, or the copper foil layer may be cut using laser beam energy.

  Further, the first surface 11a of the substrate body 11 having a copper foil layer or the like formed on the entire first surface 11a is machined to separate the independent electrode 12 and the extended independent electrodes 13x and 13y. May be. As shown in FIG. 2, since the independent electrode 12 and the extended independent electrodes 13x and 13y are rectangular, by cutting in the X direction and the Y direction in the first surface 11a, The extended independent electrodes 13x and 13y can be formed.

  The conductive layer 14 formed on the second surface 11b of the substrate body 11 has a width obtained by summing up the areas of the plurality of independent electrodes 12, and in this embodiment, the conductive layer 14 is formed over the entire area of the second surface 11b. A conductor layer 14 is formed. As shown in FIG. 3, the plurality of independent electrodes 12 and the conductor layer 14 are formed so as to overlap in the thickness direction of the substrate body 11.

Next, a method for using the wiring board 10 will be described.
As shown in FIG. 4, the IC package 20 and the chip component 30 can be mounted on the first surface 11 a of the wiring substrate 10. In the IC package 20, an IC bare chip is enclosed in a housing 22, and a plurality of metal terminal portions 21 protrude from a side surface on the long side of the housing 22. The arrangement pitch of the terminal portions 21 is 1.27 mm which is the same as the arrangement pitch Xp, Yp of the independent electrodes 12. When the IC package 20 is disposed on the first surface 11 a of the wiring substrate 10, the terminal portions 21 are disposed on the independent electrodes 12 on a one-to-one basis. And the terminal part 21 and each independent electrode 12 can be joined and fixed with molten metal (solder) in a one-to-one relationship.

  A conductive wire 25 is routed around the first surface 11a of the wiring board 10, and an end of the conductive wire 25 is made of molten metal (solder) on the independent electrode 12 to which the terminal portion 21 of the IC package 20 is soldered. By fixing, a circuit can be configured on the first surface 11a.

  The conductor layer 14 formed on the second surface 11b of the wiring board 10 is used as a ground pattern. As shown in FIG. 5, a through hole 15 is formed in the wiring substrate 10 so as to penetrate the independent electrode 12 on which the grounding terminal portion 21 a of the IC package 20 is installed and the conductor layer 14 directly behind it. The grounding conductor 26 is inserted into the hole 15. One end of the lead wire 26 is joined to the independent electrode 12 together with the grounding terminal portion 21a by the molten metal (solder) 27a, and the other end of the lead wire 26 and the conductor layer 14 are joined by the molten metal (solder) 27b. . As a result, the grounding terminal portion 21a of the IC package can be electrically connected to the conductor layer 14 having the ground potential at the shortest distance. Therefore, the potential of the terminal portion 21a can be made very close to the ground potential, and an increase in impedance can be prevented.

  Further, when the conductor layer 14 on the second surface 11b is used as a ground pattern, there is no need to wire a conductor to be a ground line on the first surface 11a, so that the conductor can be easily routed on the first surface 11a. Can be. Also, as shown in FIG. 4, a signal transmission line is formed by the conductive wire 25 routed to the first surface 11a, but the ground potential conductor layer 14 is formed on the entire back surface. The conductor layer 14 can shield the signal transmission line and prevent noise from being superimposed.

  The wiring board 10 of this embodiment basically has no through-holes 15 at any location, and it is necessary to have a circuit configuration when mounting circuit components on the first surface 11a. Accordingly, the through hole 15 is formed at any place as needed. The through-hole 15 can be manually opened using a pin vise with a small-diameter drill attached thereto. That is, when a circuit is mounted on the first surface 11a, a through hole 15 is formed immediately below a terminal or conductor that needs to be grounded, and a conductor 26 is inserted into the through hole 15 and soldered. The circuit can be grounded with the shortest path.

  The relationship between the pitch P of the terminal portion 21 of the IC package 20 and the arrangement pitch Xp, Yp of the independent electrode 12 is preferably P = Xp, Yp, but the pitch P is an integer of the arrangement pitch Xp, Yp. It may be doubled. Further, one terminal portion 21 may be soldered to two or four plural independent electrodes 12.

  FIG. 4 shows a chip component 30 as an electronic component installed on the first surface 11a. The chip component 30 has functions such as a resistor and a capacitor. Alternatively, the chip component 30 may be a chip inductor, a chip diode, a chip transistor, a three-terminal capacitor, or a chip common mode choke. In this circuit board 10, since the electrode part of each component can be set to the ground potential by the shortest path, a three-terminal capacitor and a chip common mode choke are mounted on the circuit board 10, and mounting evaluation of these noise countermeasure components is performed. It is possible to perform the same as mounting the component on the recommended board.

  The electrode parts 31, 31 provided at both ends of the chip component 30 are installed on the independent electrode 12, and the electrode part 31 and the independent electrode 12 are joined using a molten metal (solder) in a one-to-one relationship. . At this time, an electronic circuit including the chip component 30 can be configured by joining the end portion of the conducting wire 25 routed to the first surface 11 a to the same independent electrode 12 together with the electrode portion 31.

  FIG. 6 shows a case where the chip component 30 is small, and the distance between the electrode portions 31 provided at both ends and the electrode portions 31 substantially match the arrangement pitches Xp and Yp of the independent electrodes 12. In the example of FIG. 6, the electrode portions 31, 31 provided at both ends of the chip component 30 are joined to each of the adjacent independent electrodes 12, 12 by molten metal (solder) 33. Therefore, the electrode parts 31 and 31 do not short-circuit each other. Moreover, an electronic circuit can be comprised by joining the edge part of the conducting wire 25 to the independent electrode 12 to which each electrode part 31 and 31 is joined.

  The chip component 30A shown in FIG. 7 is larger than the chip component 30 shown in FIG. 6, and the pitch between the electrode portions 31 provided at both ends and the electrode portions 31 is the arrangement pitch Xp, Yp of the independent electrodes 12. Longer than. Therefore, the electrode parts 31 and 31 are joined by the molten metal (solder) 33 to each of the independent electrodes 12 and 12 located on both sides of the independent electrode 12 between them. Even in this structure, it is possible to prevent short-circuiting of the electrode portions 31 and 31 of the chip component 30, and the electrode portions 31 and 31 can be joined to individual conductors.

  Further, as shown in FIG. 7, a through hole 15 a penetrating the independent electrode 12 on which one electrode portion 31 of the chip component 30 </ b> A is installed and the conductor layer 14 on the back side thereof is formed. One end of the conducting wire 26a inserted into the through hole 15a is joined to the independent electrode 12 together with the electrode portion 31, and the other end of the conducting wire 26a is joined to the conductor layer 14 with molten metal (solder) 33a. By using the conductor layer 14 as a ground pattern, the electrode portion 31 of the chip component 30A can be set to the ground potential with the shortest distance.

  Further, as shown in FIG. 8, the discrete component 40 can be mounted on the wiring board 10. The discrete component 40 functions as a resistor, a capacitor, a choke coil, or the like.

  A through-hole 17 that penetrates the independent electrode 12 and the conductor layer 14 directly behind it is formed in the wiring substrate 10, and the opening area at the lower end of the through-hole 17 is formed by spotting the second surface 11 b. Thus, a part of the conductor layer 14 is removed around the through hole 17. Then, the discrete component 40 is disposed on the second surface 11 b side, the lead terminal 41 is inserted into the through hole 17, and the lead terminal 41 and the independent electrode 12 are joined by the molten metal (solder) 43. Thus, by removing a part of the conductor layer 14 around the through hole 17, the lead terminal 41 can be connected to the independent electrode 12 without touching the conductor layer 14. When the discrete component 40 has a lead terminal 42 to be grounded, the lead terminal 42 is inserted into the normal through hole 16, and the lead terminal 42 and the conductor layer 14 are joined by a molten metal (solder) 44. By doing so, the lead terminal 42 can be set to the ground potential at the shortest distance.

  Whether the wiring board 10 is used without being cut along the X1 line and the Y1 line shown in FIG. 1 or the wiring board 10 is used after being cut along the X1 line and the Y1 line as shown in FIG. Extended independent electrodes 13x and 13y are provided along the edge.

  Since the extended independent electrodes 13x and 13y have a relatively large area, they can be easily used as lands for connecting the extended independent electrodes 13x and 13y to an external circuit. When the end portion of the conductive wire 25 routed on the first surface 11a is connected to a part of the extended independent electrodes 13x and 13y, the remaining area of the extended independent electrodes 13x and 13y is placed outside the wiring substrate 10 Lead wires extending from can be connected.

  It is also possible to firmly fix the connector by soldering the terminal portion of the connector to the extended independent electrodes 13x and 13y.

  As the conducting wires 25, 26, 26a, tin-plated wires obtained by tin-plating the surface of a low-resistance metal wire such as copper are used. When a relatively long conducting wire 25 is routed around the first surface 11a, the conducting wire 25 is joined by melting metal (solder) in the middle of the conducting wire 25 or a bent portion of the conducting wire 25 to the independent electrode 13 positioned therebelow. Can be wired stably. Further, when the conductors 25 cross each other on the first surface 11a, one conductor may be bent into a three-dimensional shape, and the other conductor may be passed under the bent conductor. Alternatively, a tube made of an insulating material may be put on one of the intersecting wires.

  FIG. 9 shows the conversion board 50 installed on the first surface 11 a of the wiring board 10. The conversion substrate 50 has a small insulating chip substrate 51. Concave portions 51a are formed on both side surfaces of the chip substrate 51, and a conductor layer is formed on the inner peripheral surface of the recess 51a. The layer is an external connection 52. The pitch of the external connection parts 52 coincides with the arrangement pitch Xp, Yp of the independent electrodes 12.

  A plurality of component mounting electrodes 53 are formed on the surface of the chip substrate 51, and the component mounting electrodes 53 are arranged at a shorter pitch than the external connection portions 52. A conductive pattern 54 is formed on the surface of the chip substrate 51 so that the external connection portion 52 and the component mounting electrode 53 are electrically connected to each other.

  The conversion substrate 50 is formed with a plurality of through holes in a substrate having a large area, a conductor layer is formed on the inner peripheral surface of the through hole, and the component mounting electrode 53 and the conductive material in the through holes are formed on the surface of the substrate. A wiring pattern 54 that is electrically connected to the body layer is formed. Then, the substrate is cut such that the cutting line coincides with the center of the through hole, and a plurality of chip substrates 51 are formed. Thus, since the external connection part 52 can be formed by cutting the through hole in half, the conversion substrate 50 can be easily manufactured.

  The external connection portion 52 of the conversion substrate 50 is installed on the independent electrode 13, and the external connection portion 52 and the independent electrode 13 are joined with molten metal (solder). The pitch of the component mounting electrodes 53 is made to coincide with the pitch of the terminal portion 61 protruding from the casing 62 of the small IC package 60, the small IC package 60 is installed on the conversion substrate 50, and the terminal portion 61 is replaced with the component. By joining the mounting electrode 53 with molten metal (solder), an electronic component having terminal portions with a pitch shorter than that of the independent electrode 13 can be mounted on the first surface 11a.

The fragmentary perspective view which shows the board | substrate for wiring of embodiment of this invention, A partially enlarged perspective view of the wiring board, The cross-sectional enlarged view which cut | disconnected the wiring board shown in FIG. 2 by the III-III line | wire, An exploded perspective view showing a mounting state of the electronic component on the wiring board, Partial sectional view showing a state where an IC package is mounted on a wiring board, Sectional drawing which shows the state by which the chip components were mounted in the wiring board, Sectional drawing which shows the state by which the large-sized chip component was mounted in the wiring board, Sectional drawing which shows the state by which discrete components were mounted in the wiring board, An exploded perspective view showing a state in which a conversion board and a small IC package are mounted on a wiring board,

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate for wiring 11 Substrate body 12 Independent electrode 13x, 13y Extended independent electrode 14 Conductor layer 20 IC package 21 Terminal portion 21a Grounding terminal portions 25, 26, 26a Conductor 30 Chip component 31 Electrode portion 40 Discrete component 50 Conversion substrate 51 Chip substrate 52 External connection portion 53 Component mounting electrode 54 Wiring pattern

Claims (7)

An insulating substrate body provided with a first surface and a second surface facing away from the first surface;
A plurality of independent electrodes are arranged at intervals on the first surface of the substrate body, and a conductor layer having a total area of the plurality of independent electrodes is provided on the second surface. The substrate for wiring is characterized in that the body layer is formed directly behind the plurality of independent electrodes.   The wiring board according to claim 1, wherein the independent electrodes are arranged at a constant pitch in two orthogonal directions.   The wiring board according to claim 2, wherein each independent electrode is formed in a square pattern.   4. The wiring board according to claim 2, wherein a plurality of extended independent electrodes having a larger area than the independent electrodes arranged at a constant pitch are provided on the first surface.   The wiring board according to claim 4, wherein the extended independent electrodes are arranged in a line. A conversion board that can be installed on the board body is provided,
The conversion board is formed with component mounting electrodes arranged at a pitch narrower than the pitch of the independent electrodes, and external connection portions formed at the same pitch as the pitch of the independent electrodes, and the component electrodes and the The wiring board according to claim 1, wherein the wiring board is electrically connected to the external connection portion on a one-to-one basis.   The wiring board according to claim 6, wherein a concave portion is formed on a side surface of the conversion substrate, and a conductor layer serving as the external connection portion is provided on an inner side surface of the concave portion.

Images