TWI327637B - - Google Patents

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Publication number
TWI327637B
TWI327637B TW096129520A TW96129520A TWI327637B TW I327637 B TWI327637 B TW I327637B TW 096129520 A TW096129520 A TW 096129520A TW 96129520 A TW96129520 A TW 96129520A TW I327637 B TWI327637 B TW I327637B
Authority
TW
Taiwan
Prior art keywords
heat
hole
heat sink
gap
heat pipe
Prior art date
Application number
TW096129520A
Other languages
English (en)
Chinese (zh)
Other versions
TW200907276A (en
Original Assignee
Ama Precision Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ama Precision Inc filed Critical Ama Precision Inc
Priority to TW096129520A priority Critical patent/TW200907276A/zh
Priority to US12/187,819 priority patent/US20090038777A1/en
Publication of TW200907276A publication Critical patent/TW200907276A/zh
Application granted granted Critical
Publication of TWI327637B publication Critical patent/TWI327637B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW096129520A 2007-08-10 2007-08-10 Heat dissipation device and its fabrication method TW200907276A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096129520A TW200907276A (en) 2007-08-10 2007-08-10 Heat dissipation device and its fabrication method
US12/187,819 US20090038777A1 (en) 2007-08-10 2008-08-07 Heat sink and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096129520A TW200907276A (en) 2007-08-10 2007-08-10 Heat dissipation device and its fabrication method

Publications (2)

Publication Number Publication Date
TW200907276A TW200907276A (en) 2009-02-16
TWI327637B true TWI327637B (ja) 2010-07-21

Family

ID=40345373

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096129520A TW200907276A (en) 2007-08-10 2007-08-10 Heat dissipation device and its fabrication method

Country Status (2)

Country Link
US (1) US20090038777A1 (ja)
TW (1) TW200907276A (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101932221B (zh) * 2009-06-23 2014-08-20 富准精密工业(深圳)有限公司 散热装置
KR200468290Y1 (ko) 2010-05-26 2013-08-12 충-시엔 후앙 냉각 장치
CN102538557B (zh) * 2012-02-07 2014-03-05 魏辉 一种挤压式换热单元及其制作方法
BR112019027865B1 (pt) 2017-06-28 2024-02-06 Basf Corporation Substrato revestido adaptado para adsorção de hidrocarbonetos, sistema de entrada de ar e sistema de controle de emissão por evaporação
CN112513449B (zh) 2018-07-16 2023-07-14 巴斯夫公司 包括活性炭的蒸发排放控制制品
US11624340B2 (en) 2018-07-16 2023-04-11 Basf Corporation Evaporative emission control articles including activated carbon
CN114505411A (zh) * 2022-01-21 2022-05-17 东莞汉旭五金塑胶科技有限公司 成串的散热鳍片组与热导管的紧配铆合结构及铆合方法

Also Published As

Publication number Publication date
US20090038777A1 (en) 2009-02-12
TW200907276A (en) 2009-02-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees