TW200740358A - Three-in-one heat dissipation device and manufacturing method thereof - Google Patents

Abstract

A three-in-one heat dissipation device and its manufacture method are disclosed. The heat dissipation device is attached to the electronic element, and includes a bottom base, a heat pipe and a plurality of heat dissipation fins. The bottom base has a penetrating hole. A plurality of containing grooves are disposed to the end surface of the bottom base. An end of the heat pipe is the heat absorption section, and another end of the heat pipe is the heat dissipation section. The heat absorption section is provided for passing through the penetrating hole of the bottom base. The heat dissipation section is inwardly folded, and formed on top of the bottom base. Through holes corresponding to each other are respectively disposed in each heat dissipation fin. The heat dissipation section of the heat pipe can closely pass through the through hole. The bottom end of each heat dissipation fin is correspondingly inserted into the containing groove of the bottom base. Accordingly, the manufacturing process can be effectively simplified, and the heat transfer rate of the heat dissipation device can be increased substantially, and the heat dissipation efficiency can be improved. Further, the coating of the heat conduction paste can be saved and the environmental pollution generated by the heat conduction paste can also be overcome.